KR101303796B1

KR101303796B1 - Molding apparatus for manufacturing semi-conductor package

Info

Publication number: KR101303796B1
Application number: KR1020110133854A
Authority: KR
Inventors: 목철규; 유기서
Original assignee: 티에스테크놀로지 주식회사
Priority date: 2011-12-13
Filing date: 2011-12-13
Publication date: 2013-09-04
Also published as: KR20130067030A

Abstract

The mold apparatus for manufacturing a semiconductor package according to the present invention includes a first mold having a storage space in which a package semifinished product is fixed; A second mold disposed on an upper surface of the first mold and having a space therein; A lifting block which is installed to be capable of lifting up and down in the space part and adjusts a height of a cavity into which a molding resin is injected, by adjusting a relative height with the first mold; And a plurality of pillar members configured to support the second mold to a mold apparatus, and to be coupled to the lifting block to perform a height adjustment function for adjusting the height of the cavity. It is provided to have different lengths according to the height of the cavity, when changing the height of the cavity, by changing the filler member formed according to the cavity height, characterized in that for changing the height of the cavity.

Description

Mold device for manufacturing semiconductor package {MOLDING APPARATUS FOR MANUFACTURING SEMI-CONDUCTOR PACKAGE}

The present invention relates to a mold apparatus for manufacturing a semiconductor package by completing a semiconductor package by molding a package semi-finished product in which a semiconductor chip is mounted on a substrate and completing wire bonding using a molding resin.

In the semiconductor package manufacturing process, the molding process is a package in which a semiconductor chip is mounted on a substrate such as a lead frame or a printed circuit board (PCB) and thus electrical connection is completed by wire bonding. The process of sealing semi-finished chips and electrical connections to protect semi-finished products from physical or chemical external environment.

Most of these molding processes are mainly used for the transfer molding method using an epoxy molding compound (EMC), which is a molding resin having excellent economical efficiency, mass productivity, and excellent water absorption.

In the transfer molding method, a tablet of a solid epoxy molding compound is heated to be melted to have a constant viscosity, and then injected into a cavity of a molding die in which a package semifinished product is inserted and cured to remove a portion of the semifinished product package. It is a way of sealing.

1 is a cross-sectional view showing a mold apparatus for manufacturing a semiconductor package according to the prior art.

The mold apparatus for manufacturing a semiconductor package according to the related art shown in FIG. 1 is an example of a molding apparatus of a transfer molding method, in which a semiconductor package 120 is mounted on a printed circuit board 110, and a package semi-finished product is electrically connected with a bonding wire ( A mold apparatus for sealing the upper surface of one surface 100 with a molding resin, that is, an epoxy molding compound 310.

The conventional mold apparatus includes a first mold 200 and an upper mold 300 through which the package semifinished product 100 is interposed. An accommodating space 210 is formed in the first mold 200 to accommodate the printed circuit board 110, and a cavity 320 in which the epoxy molding compound 310 is injected is formed in the upper mold 300.

In addition, a runner 410 and a gate 412 are formed on the side surfaces of the upper mold 300 and the first mold 200, and the epoxy molding compound 310 is injected into the cavity 320. In the upper mold 300, an eject pin 400 for separating the package semifinished product 100 from the lower mold 200 after completion of molding of the package semifinished product 100 is installed to be able to lift up and down.

Looking at the operation of the mold apparatus for manufacturing a conventional semiconductor package, the epoxy molding compound 310 is runner 410 and the gate in a state in which the package semi-finished product 100 is accommodated in the storage space 210 formed in the first mold 200. It is injected into the cavity 320 of the upper mold 300 through 412.

After the molding of the package semifinished product 100 is completed, the upper mold 300 and the first mold 200 are separated up and down, and the ejection pin 400 is raised to lift the package semifinished product 100 from the first mold 200. Isolate.

In the mold apparatus for manufacturing a semiconductor package according to the related art as described above, the molding thickness of the epoxy molding compound to be molded is changed due to the thickness of the semiconductor package. To this end, it is necessary to prepare a plurality of upper molds having different widths of the cavity, and to change the molding thickness of the epoxy molding compound, the upper mold needs to be replaced.

As such, there is a problem in that the mold replacement work must be performed according to the molding thickness, and the manufacturing process is complicated and the cost is increased because a plurality of molds having different cavity thicknesses must be prepared.

The present invention provides a mold apparatus for manufacturing a semiconductor package that can vary the thickness of the cavity to more easily control the molding thickness, thereby improving productivity and reducing manufacturing costs.

In addition, the present invention provides a mold apparatus for manufacturing a semiconductor package that can reduce the safety accidents do not need to replace the mold in the hot state when mass-producing a semiconductor package having a different thickness.

The technical object of the present invention is not limited to the above-mentioned technical objects and other technical objects which are not mentioned can be clearly understood by those skilled in the art from the following description will be.

The pillar member may include a first body having a length corresponding to the height of the cavity; A second body formed to have a width wider than the width of the first body and fixing the second mold to a package device; A through hole formed in a center of the first and second bodies; And a fastening member coupled to the through hole.

The fastening member is provided with a bolt member having a head, and the through hole may have a head seating groove in which the head is seated.

The fastening member may include a tab forming portion formed on an outer circumferential surface of the fastening member to protrude out of the first body to be fastened to the lifting block.

An end surface contacting the lifting block of the first body and a stepped portion to which the first and second bodies are connected are formed flat, and the end surface and the lifting block, the stepped portion and the second mold are fastened to each other. When the members are engaged with the lifting block, it is preferable that they are in surface contact with each other.

The second mold has a diameter larger than the diameter of the first body and has a filler hole shorter than the length of the first body so that the first body is coupled through.

The pillar hole may further include an elastic member inserted into and coupled to the first body, one end of which is in contact with the lifting block, and the other end of which is in contact with the stepped portion of the second body.

It is preferable that the said 2nd metal mold | die has a guide side wall which guides the rising and falling direction of the said lifting block.

The guide side wall preferably has a locking step for regulating a maximum rising height of the lifting block.

According to another aspect of the present invention, there is provided a mold apparatus for manufacturing a semiconductor package, the mold including a first mold provided with a first space therein; A second mold disposed on an upper surface of the first mold and having a second space therein; A first elevating block disposed in the first space so as to be movable up and down and fixed to a semi-finished product on an upper side thereof; A second elevating block installed on the space of the second mold in a vertical direction to adjust a height of a cavity into which a molding resin is injected, by adjusting a relative height with the first mold; And a plurality of filler members for fixing the first and second molds to the package device and adjusting the lifting height of the lifting block through length adjustment.

The pillar member may include a first body having a length corresponding to the height of the cavity; A second body formed to have a width wider than the width of the first body and fixing the second mold to a package device; A through hole formed in a center of the first and second bodies; And a fastening member coupled to the through hole, wherein the fastening member is provided with a bolt member having a head, and the through hole has a head seating groove in which the head is seated.

The fastening member may include a tab forming portion formed on an outer circumferential surface of the fastening member to protrude out of the first body and to be fastened to the first and second lifting blocks.

According to the mold apparatus for manufacturing a semiconductor package of the present invention, the elevating plate is arranged to elevate in the vertical direction to adjust the height of the cavity, so that the thickness of the molding resin can be adjusted without changing the mold, thereby making it easy to use and improving productivity. You can.

In addition, it is possible to move up and down the base as well as the lifting plate, if necessary, it is possible to perform the packaging operation of the type of the printed circuit board having a different thickness without replacing the mold.

In addition, when moving the elevating plate or the base, the height of the cavity can be determined by fixing the elevating plate or the base to the mold apparatus by using the filler members separately provided so that the heights correspond to the elevating height. It is easy and convenient to adjust.

In addition, when mass-producing semiconductor packages having different thicknesses, safety accidents can be reduced because only the filler member provided according to the thickness of the cavity is replaced without removing the hot mold from the equipment.

1 is a cross-sectional view showing a mold apparatus for manufacturing a semiconductor package according to the prior art,
2 is a cross-sectional view schematically showing a mold apparatus for manufacturing a semiconductor package according to a first embodiment of the present invention;
3 is a view showing a state in which a package semi-finished product is placed on a mold apparatus for manufacturing a semiconductor package of FIG. 2;
4 is a view illustrating a state in which a molding compound is injected into a semi-packaged product by the mold apparatus for manufacturing a semiconductor package of FIG. 2;
5 is an enlarged view of a portion A of FIG. 4;
6 is a view showing a filler member according to the present invention, and
7 is a schematic cross-sectional view of a mold apparatus for manufacturing a semiconductor package according to a second embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The sizes and shapes of the components shown in the drawings may be exaggerated for clarity and convenience. In addition, terms defined in consideration of the configuration and operation of the present invention may be changed according to the intention or custom of the user, the operator. Definitions of these terms should be based on the content of this specification.

[First Embodiment]

2 is a cross-sectional view schematically showing a mold apparatus for manufacturing a semiconductor package according to a first embodiment of the present invention, FIG. 3 is a view showing a state in which a package semifinished product is placed on the mold apparatus for manufacturing a semiconductor package of FIG. Figure 2 is a view showing a state in which the molding compound is injected into the package semi-finished product by the mold apparatus for manufacturing a semiconductor package of Figure 2, Figure 5 is an enlarged view of a portion A of Figure 4, Figure 6 shows a filler member according to the present invention Drawing.

The mold apparatus for manufacturing a semiconductor package according to an embodiment of the present invention includes a first mold 10 to which the package semifinished product 100 is fixed, and a second mold 20 and a filler having a cavity 25 having a variable height. And a member 30.

The package semifinished product 100 is a semiconductor chip 120 is mounted on the substrate 110, the electrical connection is completed by wire bonding. Bonding is performed between the wires of the semiconductor chip 120 and the internal leads of the substrate 110 using wires, thereby making electrical connections.

The substrate 110 may be a lead frame or a printed circuit board (PCB), and the wire bonding process is performed through the wire bonder after the semiconductor chip 120 is attached to the chip mounting plate of the substrate 110. That is, the package semifinished product 100 refers to a state in which the semiconductor chip 120 is bonded to the substrate 110 through the wire 130. The molding process is performed to protect the package semifinished product 100 from the outside, and to use the mold apparatus according to an embodiment of the present invention to perform this molding process.

An upper surface of the first mold 10 is formed with an accommodating space 15 in which the package semifinished product 100 is accommodated, and the accommodating space 15 has a package semifinished product for fixing the semifinished product 100 to the receiving space 15. A vacuum hole (not shown) for vacuum adsorption may be formed.

The molding thickness of the epoxy molding compound 310 is determined by the height of the cavity 25 formed in the second mold 20. The molding thickness of the epoxy molding compound 310 (see FIG. 5) varies according to the product type of the package semifinished product 100.

To this end, the present invention is to provide a second mold 20 that can adjust the molding thickness of the epoxy molding compound 310 by allowing the height of the cavity 25 can be adjusted.

The second mold 20 includes an elevating block 21 which is lifted up and down to adjust the height of the cavity 25, and a plurality of filler members 30 which fix the elevating block 21 to the second mold 20. ) Is provided.

To this end, the space 20a is provided inside the second mold 20, and the lifting block 21 is preferably provided in a shape corresponding to the shape of the space 20a.

According to a preferred embodiment of the present invention, the elevating block 21 is provided in a substantially rectangular parallelepiped, the side wall surface of the space portion 20a is formed to be parallel to the direction of gravity, so that the elevating block 21 Guide the ascending and descending movements side by side in the direction of gravity.

On the other hand, as shown in Figure 5, one of the side wall surface, it is preferable that the locking step 23 for regulating the maximum lift position of the lifting block 21 is provided. However, this locking step 23 may be omitted.

The filler member 30 is provided to raise and lower the lifting block 21 and to fix the lifting block 21 to the second mold 20, which is a main part of the present invention. That is, the filler member 30 is standardized to have a different size according to the height of the cavity 25, and when the height of the cavity 25 is to be changed, the filler member 30 is to be changed to the cavity 25. By adjusting the height and height of the elevating block 21 by replacing the filler member 30 of the standard corresponding to the height.

The filler member 30 includes a first body 31, a second body 32, and a through hole 33, and a fastening member 40 such as a bolt is inserted into and coupled to the through hole 33.

The first body 31 is formed with a length H1 to correspond to the height of the cavity 25. When the length H1 of the first body 31 is formed longer, the height of the cavity 25 is lowered. On the contrary, when the length H1 of the first body 31 is shorter, the cavity 25 is formed. ) Increases the height.

The second body 32 is formed to have a width wider than that of the first body 31, and fixes the second mold 20 to the package device 1. At this time, the length (H2) of the second body 32 is preferably fixed.

In addition, the first and second bodies 31 and 32 are preferably formed in one body. Of course, it may be formed by other members, it may be configured by combining them, but when the repetitive load is applied, there is a possibility that the connection portion may be broken, it is good to form the same parts by processing.

The through hole 33 is formed through the center of the first and second body 31, 32, the head seating groove 33a that can support the head of the bolt used as the fastening member 40 on the upper side Is preferably provided.

On the other hand, as shown in Figure 5, the end surface 34 in contact with the lifting block 21 of the first body 31, the first and second body 31, 32 is connected The stepped part 35 is formed flat, so that the end face 34 and the lifting block 21, and the stepping part 35 and the second mold 20, the fastening member 40 is the lifting block ( When engaged with 21), it is desirable to be in surface contact with each other.

In addition, the second mold 20 has a diameter larger than the diameter of the first body 31 and shorter than the length of the first body 31 so that the first body 31 is coupled through. It is preferable to have the filler hole 22. On the other hand, although not shown, the filler hole 22 is inserted and coupled to the first body 31, one end is in contact with the lifting block 21, the other end stepped portion (2) It may further comprise an elastic member in contact with 35). The elastic member, so that the lifting and lowering operation of the lifting block 21 can be performed more smoothly.

On the other hand, the fastening member 40, the tab forming portion 41 formed on the outer peripheral surface of the first body 31 is protruded to the outside, it is preferable that the lifting block 21 is fastened. To this end, it is preferable that a fastening hole having a female screw formed complementary to the tab forming part 41 is provided at a position corresponding to the fastening member 40 of the elevating block 21.

According to the present invention, as shown in Figure 3, in order to form a cavity 25 having a first height, a filler member 30 having a height (H1) of the first body 31 suitable for this Performing a packaging operation in the installed state, when it is necessary to form a cavity 25 having a second height, the filler member 30 is removed, and as shown in FIG. 4, at the second height By replacing with a filler member 30 'having a height H1 of a suitable first body 31, the lifting block 21 can be easily raised or lowered to form a cavity 25 having a second height. .

In other words, when the cavity 25 having the first height is formed, the pillar member 30 is fastened to the lifting block 21. Then, the tab forming portion of the fastening member 40 is screwed until the end surface 34 of the filler member 30 is in contact with the surface facing the lifting block 21.

On the other hand, the stepped portion 35 formed in the connecting portion of the first and second body 31, 32 is the filler hole (a) until the surface contact with the upper surface of the second mold (20) as shown 22 is inserted and coupled. At this time, the stepped portion 35 of the filler member 30 is in surface contact with the upper side surface of the second mold 20 before the end surface 34 as the tab forming portion 41 is screwed. Thus, the fastening member 40 is a support point for screwing.

Therefore, the filler member 30 is supported by the surface contact portion of the upper side of the step portion 35 and the second mold 20 as the fastening member 40 is fastened, so that the second mold 20 ), The elevating block 21 can be pulled up in a state interposed therebetween. In this case, the lifting block 21 may be fastened to the point where the tab forming portion 41 is fastened and the end surface 34 and the lifting block 21 are in surface contact. That is, as described above, the length of the first body 31 is formed longer than the length of the filler hole 22, but is formed shorter than the lifting distance of the lifting block 21, the first body 31 When appropriately adjusting the length of, it is possible to freely adjust the height of the cavity (25).

[Second Embodiment]

7 is a schematic cross-sectional view of a mold apparatus for manufacturing a semiconductor package according to a second embodiment of the present invention.

As shown, the first mold 10 may also be formed in a structure that can be elevated like the second mold 20. As such, when the first mold 10 is formed to be liftable, the printed circuit board 110 having different thicknesses may be used without replacing the mold.

That is, the 1st space part 10a is formed in the inside of the said 1st metal mold | die 10, the 1st lifting block 11 is provided in this 1st space part 10a so that it can be elevated, and this 1st elevation is carried out. By the lifting and lowering operation of the block 11, it is possible to adjust the depth of the seating groove in which the printed circuit board 110 is seated. In this case, the principle of elevating the first elevating block 11 may be implemented in the same manner as moving the elevating block 21 described above.

The first mold 10 is formed with a first filler hole 12 into which the filler member 30 configured as described above may be inserted, and the diameter of the first filler hole 12 is the filler member 30. It is preferable to form larger than the first body 31 of), and the length of the first pillar hole 12 is formed shorter than the length of the first body (31).

Meanwhile, the space 20a may be provided inside the second mold 20, and the second lifting block 21 may be provided in a shape corresponding to the shape of the space 20a. At this time, the second elevating block 21 is provided in a substantially rectangular parallelepiped, and the side wall surface of the space portion 20a is formed to be parallel to the direction of gravity, so as to raise and lower the second elevating block 21. Guide them so that they can run side by side in the direction of gravity. The lifting structure of the second mold 20 is the same as that of the first embodiment described above, and thus redundant description is omitted.

The pillar member 30 is configured to raise and lower the first and second elevating blocks 11 and 21 and the first and second elevating blocks 11 and 21 to respectively form the first and second molds 10. While fixing to) 20, the thickness of the printed circuit board 110 and the epoxy molding compound 310 may be changed, which is the same as the first embodiment described above.

Therefore, when the filler member 30 is standardized to have a different size according to the height of the accommodation space 15 and the cavity 25, and the height of the accommodation space 15 and the cavity 25 is to be changed, By simply replacing the filler member 30 with the filler member 30 having a size corresponding to the height of the accommodation space 15 and / or the cavity 25 to be changed, the height of the elevating block 21 can be easily adjusted. Can be.

According to the present invention, by providing a standardized filler member 30, by simply replacing the filler member 30, simply adjusting the height of the accommodation space 15 and / or cavity 25, one mold The height of various semiconductor packages can be adjusted.

In addition, in order to fix the first and second molds 10 and 20 to the packaging equipment, a filler member 30 is necessary, and the role of the filler member 30 serves as the first and second molds 10. Rather than performing only the fixing of the 20, it can be further configured to perform the height adjustment function of the epoxy molding compound 310 formed through the packaging operation, thereby providing a reliable packaging equipment while simplifying the structure of the equipment. It is possible to.

In addition, the filler member 30 is a rigid rigid body such as steel, and adjusts the movement of the elevating block 30 through the surface contact of the end surface 34 and the stepped portion 35, iterative Even with the production process, it is always possible to produce a packaged product of constant height without defects.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

10; First mold 11; First lifting block
20; Second mold 21; 2nd lifting block
22; Filler ball 30; Filler member
31; First body 32; Second body
33; Through 33a; Head seating groove
34; End face 35; Stepped portion
40; The fastening member

Claims

A first mold having a receiving space to which the package semi-finished product is fixed;
A second mold disposed on an upper surface of the first mold and having a space therein;
A lifting block which is installed to be capable of lifting up and down in the space part and adjusts a height of a cavity into which a molding resin is injected, by adjusting a relative height with the first mold; And
And a plurality of pillar members coupled to the lifting block to support the second mold to the mold apparatus and performing a height adjustment function for adjusting the height of the cavity.
The filler member,
It is provided to have different lengths according to the height of the cavity, when changing the height of the cavity, by changing the filler member formed according to the cavity height, by changing the height of the cavity,
A first body having a length corresponding to the height of the cavity;
A second body formed to have a width wider than the width of the first body and fixing the second mold to a package device;
A through hole formed in a center of the first and second bodies; And
Mold device for manufacturing a semiconductor package comprising; a fastening member coupled to the through hole.

delete

The method of claim 1,
The fastening member is provided as a bolt member having a head,
The through hole is a mold apparatus for manufacturing a semiconductor package having a head seating groove in which the head is seated.

The method of claim 1, wherein the fastening member,
A mold apparatus for manufacturing a semiconductor package, wherein a tab forming portion formed on an outer circumferential surface protrudes out of the first body and is engaged with the lifting block.

The method of claim 1,
An end surface contacting the lifting block of the first body and a stepped portion to which the first and second bodies are connected are formed flat;
The end surface and the lifting block, the stepped portion and the second mold is a semiconductor device manufacturing mold apparatus for making a surface contact with each other when the fastening member is fastened with the lifting block.

The method of claim 1, wherein the second mold,
Mold apparatus for manufacturing a semiconductor package having a filler hole having a diameter larger than the diameter of the first body, the filler hole is formed shorter than the length of the first body so that the first body is coupled through.

The method of claim 6, wherein the filler hole,
And a resilient member inserted into and coupled to the first body, the one end of which is in contact with the lifting block, and the other end of which is in contact with the stepped portion of the second body.

The method of claim 1, wherein the second mold,
Mold device for manufacturing a semiconductor package having a guide side wall for guiding the lifting and lowering direction of the lifting block.

The method of claim 8, wherein the guide side wall,
Mold device for manufacturing a semiconductor package having a locking step for limiting the maximum height of the lifting block.

A first mold provided with a first space therein;
A second mold disposed on an upper surface of the first mold and having a second space therein;
A first elevating block disposed in the first space so as to be movable up and down and fixed to a semi-finished product on an upper side thereof;
A second elevating block installed on the space of the second mold in a vertical direction to adjust a height of a cavity into which a molding resin is injected, by adjusting a relative height with the first mold; And
And a plurality of filler members for fixing the first and second molds to the package device and adjusting the lifting height of the lifting block through length adjustment.
The filler member,
A first body having a length corresponding to the height of the cavity;
A second body formed to have a width wider than the width of the first body and fixing the second mold to a package device;
A through hole formed in a center of the first and second bodies; And
Mold device for manufacturing a semiconductor package comprising; a fastening member coupled to the through hole.

delete

11. The method of claim 10,
The fastening member is provided as a bolt member having a head,
The through hole is a mold apparatus for manufacturing a semiconductor package having a head seating groove in which the head is seated.

The method of claim 10, wherein the fastening member,
A tab forming part formed on an outer circumferential surface protrudes out of the first body, the mold apparatus for manufacturing a semiconductor package is fastened to the first and second lifting blocks.