KR101237248B1

KR101237248B1 - Molding apparatus for manufacturing semi-conductor package

Info

Publication number: KR101237248B1
Application number: KR1020110055680A
Authority: KR
Inventors: 윤두석
Original assignee: 티에스테크놀로지 주식회사
Priority date: 2011-06-09
Filing date: 2011-06-09
Publication date: 2013-03-25
Also published as: KR20120136634A

Abstract

A lower mold having an accommodating space for fixing a package semi-finished product, and an upper mold disposed on an upper surface of the lower mold and having a cavity into which a molding resin is injected, wherein the upper mold is lifted up and down and A height adjusting plate, and a lifting plate having a first inclined surface formed on an upper surface thereof; A slide plate disposed on an upper surface of the elevating plate, on which a second inclined surface corresponding to the first inclined surface is formed and linearly moved; A guide unit preventing the lifting plate and the slide plate from being spaced apart from each other by a predetermined distance, and guiding a linear movement path of the slide plate; And an operating part for linearly moving the slide plate.

Description

Mold device for manufacturing semiconductor package {MOLDING APPARATUS FOR MANUFACTURING SEMI-CONDUCTOR PACKAGE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold apparatus for manufacturing a semiconductor package by completing a semiconductor package by molding a semi-finished product, in which a semiconductor chip is mounted on a substrate and completed with wire bonding, using a molding resin.

In the semiconductor package manufacturing process, the molding process is a package semi-finished product in which a semiconductor chip is mounted on a substrate such as a leadframe or a printed circuit board (PCB) and the electrical connection is completed by wire bonding. Is a process of sealing semiconductor chips and electrical connections for protection from physical or chemical external environments.

Most of these molding processes are mainly used for the transfer molding method using an epoxy molding compound (EMC), which is a molding resin having excellent economical efficiency, mass productivity, and excellent water absorption.

In the transfer molding method, a tablet of a solid epoxy molding compound is heated and melted to have a constant viscosity, and then injected into a cavity of a molding die in which a package semifinished product is inserted and cured by a portion of the semifinished product package. It is a way to seal.

1 is a cross-sectional view showing a mold apparatus for manufacturing a semiconductor package according to the prior art.

The mold apparatus for manufacturing a semiconductor package according to the related art shown in FIG. 1 is an example of a molding apparatus of a transfer molding method, in which a semiconductor chip 120 is mounted on a printed circuit board 110, and the package semifinished product 100 is electrically connected with a bonding wire. It is a mold apparatus for sealing the upper surface of one side with a molding resin, that is, epoxy molding compound (310).

The conventional mold apparatus includes a lower mold 200 and an upper mold 300 through which the package semifinished product 100 is interposed. The lower mold 200 is provided with an accommodating space 210 for accommodating the printed circuit board 110, and a cavity 320 into which the epoxy molding compound 310 is injected is formed in the upper mold 300.

In addition, a runner 410 and a gate 412 in which the epoxy molding compound 310 is injected into the cavity 320 are formed on side surfaces of the upper mold 300 and the lower mold 200. In the upper mold 300, an eject pin 400 for separating the package semifinished product 100 from the lower mold 200 after completion of molding of the package semifinished product 100 is installed to be able to lift up and down.

Looking at the operation process of the mold apparatus for manufacturing a conventional semiconductor package, the epoxy molding compound 310 is runner 410 and the gate (with the package semi-finished product 100 is accommodated in the receiving space 210 formed in the lower mold 200) It is injected into the cavity 320 of the upper mold 300 through 412.

After the molding of the package semifinished product 100 is completed, the upper mold 300 and the lower mold 200 are separated up and down, and the eject pin 400 is lifted to separate the package semifinished product 100 from the lower mold 200. .

In the mold apparatus for manufacturing a semiconductor package according to the prior art as described above, the molding thickness of the epoxy molding compound to be molded is changed due to the thickness of the semiconductor package. To this end, it is necessary to prepare a plurality of upper molds having different widths of the cavity, and to change the molding thickness of the epoxy molding compound, it is necessary to replace the upper mold.

As such, there is a problem in that the mold replacement work must be performed according to the molding thickness, and the manufacturing process is complicated and the cost is increased because a plurality of molds having different cavity thicknesses must be prepared.

The present invention provides a mold apparatus for manufacturing a semiconductor package that can vary the thickness of the cavity so that the molding thickness can be more easily adjusted, thereby improving productivity and reducing manufacturing costs.

In addition, the present invention provides a mold apparatus for manufacturing a semiconductor package that can reduce the safety accidents do not need to replace the mold in the hot state when mass-producing a semiconductor package having a different thickness.

The technical object of the present invention is not limited to the above-mentioned technical objects and other technical objects which are not mentioned can be clearly understood by those skilled in the art from the following description will be.

The mold apparatus for manufacturing a semiconductor package according to the present invention for achieving the above object includes a lower mold having a storage space for fixing a package semi-finished product, and a cavity disposed on an upper surface of the lower mold and in which a molding resin is injected. A lifting plate including an upper mold, wherein the upper mold adjusts the height of the cavity while being lifted in an up and down direction, and a first inclined surface formed on an upper surface thereof; A slide plate disposed on an upper surface of the elevating plate, on which a second inclined surface corresponding to the first inclined surface is formed and linearly moved; A guide unit preventing the lifting plate and the slide plate from being spaced apart from each other by a predetermined distance, and guiding a linear movement path of the slide plate; And an operating part for linearly moving the slide plate.

According to a preferred embodiment of the present invention, the guide unit, a locking step protruding symmetrically formed on both sides of the slide plate; And a locking jaw guide member fixed to a cover plate provided in the upper mold and provided in a shape corresponding to the locking jaw, and engaging the locking jaw.

The locking jaw is formed to be parallel to the first inclined surface and has a traveling surface in contact with the guide member, wherein the guide member is formed to be parallel to the first inclined surface and is in contact with the traveling surface. It is preferable to have a guide contact surface.

According to another embodiment of the present invention, one end is connected to the lifting plate, the other end is fixed to the upper mold, at least a pair of elastic units for pulling the lifting plate in close contact with the slide plate; It may include.

The elastic unit may include a lifting pin penetratingly coupled to a plurality of through holes formed in the cover plate of the upper mold and fixedly coupled to a coupling hole formed in the lifting plate; A spring seating groove formed inside the through hole; And a tension spring having one end seated in the spring seating groove and the other end connected to a head coupled to the end of the lift pin to pull the lift pin to closely contact the lift plate with the slide plate. desirable.

The operation unit, the adjustment screw is screwed to the screw groove formed on one side of the slide plate; A protective cover protecting the adjusting screw; A moving rod having one end fixed to the slide plate and the other end positioned inside the protective cover; And a gauge block fitted in a gap between an end of the movable rod and an inner surface of the protective cover to determine a thickness of the cavity.

According to the mold apparatus for manufacturing a semiconductor package of the present invention, the elevating plate is arranged to be elevated in the vertical direction to adjust the height of the cavity, so that the thickness of the molding resin can be adjusted without changing the mold, which is convenient for use and productivity. Can be improved.

In addition, the gauge block is provided, the gauge block is provided in plurality so that the thickness thereof corresponds to the height of the cavity, the cavity height adjustment is made easy and convenient because the height of the cavity is determined by sandwiching the gauge block in the gap.

In addition, when mass-producing semiconductor packages with different thicknesses, safety accidents can be reduced because only the gauge block needs to be replaced without removing the hot mold from the equipment.

In addition, since the slide plate and the elevating plate are kept in close contact by the guide unit, the lifting plate and the slide plate are spaced apart during the reciprocating movement of the slide plate, thereby preventing the inaccurate height adjustment of the cavity.

1 is a cross-sectional view showing a mold apparatus for manufacturing a semiconductor package according to the prior art.
2 is a cross-sectional view showing a mold apparatus for manufacturing a semiconductor package according to an embodiment of the present invention.
3 is a top view of a slide plate according to an embodiment of the present invention.
4 is a side view of a slide plate according to an embodiment of the present invention.
5 is a partial cross-sectional view of a mold apparatus showing an operating part according to an embodiment of the present invention.
6 and 7 is an operating state diagram showing an operating state of the upper mold according to an embodiment of the present invention.
8 and 9 are operating state diagrams of a mold apparatus for manufacturing a semiconductor package according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. The sizes and shapes of the components shown in the drawings may be exaggerated for clarity and convenience. In addition, terms defined in consideration of the configuration and operation of the present invention may be changed according to the intention or custom of the user, the operator. Definitions of these terms should be based on the content of this specification.

2 is a cross-sectional view showing a mold apparatus for manufacturing a semiconductor package according to an embodiment of the present invention.

The mold apparatus for manufacturing a semiconductor package according to an embodiment of the present invention includes a lower mold 20 to which the package semifinished product 10 is fixed, and an upper mold 30 having a cavity 40 having a variable height. .

In the package semifinished product 10, a semiconductor chip 12 is mounted on a substrate 14, and electrical connection is completed by wire bonding. Bonding is performed using wires between each lead of the semiconductor chip 12 and an internal lead of the substrate 14, thereby making an electrical connection.

The substrate 14 may be a lead frame or a printed circuit board (PCB). The semiconductor chip 12 is attached to the chip mounting plate of the substrate 14, and then a wire bonding process is performed through the wire bonder. That is, the package semifinished product 10 refers to a state in which the semiconductor chip 12 is bonded to the substrate 14 through the wire 130. The molding process is performed to protect the package semifinished product 10 from the outside, and to use the mold apparatus according to an embodiment of the present invention to perform this molding process.

The upper surface of the lower mold 20 is formed with an accommodating space 22 in which the package semifinished product 10 is accommodated. The accommodating space 22 includes a package semifinished product for fixing the package semifinished product 10 to the accommodating space 22. A vacuum hole (not shown) for vacuum adsorption may be formed.

The molding thickness of the molding resin 42 is determined by the height T1 of the cavity 40 formed in the upper mold 30. The molding thickness of the molding resin 42 is changed according to the product type of the semiconductor package 10.

To this end, the present invention is to provide an upper mold 30 that can adjust the molding thickness of the molding resin 42 by allowing the height (T1) of the cavity 40 can be adjusted.

The upper mold 30 includes an elevating plate 32 elevating in the vertical direction to adjust the height of the cavity 40, a slide plate 34 disposed on the upper surface of the elevating plate 32 so as to be linearly movable, and A guide unit 100 which prevents the elevating plate 32 and the slide plate 34 from being spaced apart from each other by a predetermined distance, and guides a linear movement path of the slide plate 34; And an operation unit 50 for linearly moving the slide plate 34.

The lifting plate 32 has a bottom surface of which forms a bottom surface of the cavity 40, and a first slope surface 52 that is in contact with the slide plate 34 is formed on the top surface of the lifting plate 32.

In addition, the front end key 36 and the rear end key 38 are disposed at the front and rear of the elevating plate 32 to guide the elevating plate 32 to elevate and form an inner surface of the cavity 40. do.

The front entry key 36 is formed with a gate 46 into which an epoxy molding compound, which is a molding resin 42, is injected into the cavity 40.

As shown in FIGS. 3 and 4, the slide plate 34 has a second inclined surface 54 corresponding to the first inclined surface 52 and an operating part 50 connected to one side thereof. The screw groove 60 and the fixing groove 62 are formed. As described above, since the elevating plate 32 and the slide plate 34 are in contact with the first inclined plane 52 and the second inclined plane 54, the elevating plate 32 moves up and down when the slide plate 34 is linearly moved. do.

The cover plate 64 is installed on the upper surface of the slide plate 34 to support the slide plate 34 to be linearly moved. The cover plate 64 is fixed at the upper end of the front end key 36 and the rear end key 38 to form an inner space 66 in which the slide plate 34 is linearly moved.

Since the slide plate 34 is in a state where the cover plate 64 is in contact with the upper surface, the slide plate 34 does not flow vertically, and only linear movement.

The upper mold 30 is provided with an eject pin 70 for separating the package semifinished product 10 from the lower mold 20 after completion of molding of the package semifinished product 10. In addition, the slide plate 34 is formed with a slot 56 through which the eject pin 70 passes. Here, the length of the slot 56 is formed to be equal to or greater than the maximum length that the slide plate 34 is linearly moved so that the eject pin 70 does not interfere with the linear movement of the slide plate 34.

Actuator 50, as shown in Figure 5, a protective cover 72 mounted on the outer surface of the front end key 36, and disposed inside the protective cover 72 and formed on the slide plate 34 It comprises a screw 74 is screwed to the screw groove 60 is rotatably supported by the front end key (36).

The screw 74 is screwed into the screw groove 60 of the slide plate 34, passes through the support hole 88 formed in the front end key 36, and the screw head 90 is inside the protective cover 72. Is placed on. In addition, a snap ring 86 is installed on an outer circumferential surface of the screw 74 positioned at both side surfaces of the support hole 88 to prevent the screw 74 from linearly moving in the support hole 88.

In addition to the snap ring, any structure may be applied as long as the structure is supported so that the screw 74 is not linearly moved to the support hole 88.

The protective cover 72 has an inner space 76 formed therein, and at one side thereof, a through hole 84 through which a tool for adjusting the screw 74 passes is formed.

When the operating unit 50 rotates the screw 74 in the forward or reverse direction, the slide plate 34 screwed with the screw 74 is linearly moved.

The operation part 50 is coupled to the fixing groove 62 formed at one side of the slide plate 34, and the other side is the operation rod 78 is located in the inner space 76 of the protective cover 72, this operation It further includes a gauge block 82 fitted in the gap between the end of the rod 78 and the inner surface of the protective cover 72 to determine the height T1 of the cavity 40.

The gauge blocks 82 are provided in plurality having different thicknesses, and the thicknesses T2 of the gauge blocks 82 correspond to the height T1 of the cavity 40. That is, for example, when the thickness of the molding resin 42 is determined, the screw 74 is rotated to move the lifting plate 32 upward or downward, and corresponds to the height T1 of the cavity 40. When the gauge block 82 having the thickness T2 is fitted into the gap between the actuating rod 78 and the protective cover 72, the height T1 of the cavity 40 is determined as the desired height.

As described above, the operation of the mold apparatus for manufacturing a semiconductor package according to the embodiment of the present invention constituted will be described below.

First, the process of adjusting the molding thickness of the molding resin will be described.

6 and 7 is an operating state diagram showing controlling the molding thickness of the molding resin according to an embodiment of the present invention.

First, as shown in FIG. 6, when the screw 74 is rotated in the forward direction, the screw 74 is tightened to the screw groove 60. Then, the slide plate 34 is linearly moved in the direction of the arrow A, and thus the lifting plate 32 is moved upward in the direction of the arrow B, thereby increasing the height of the cavity 40 and molding resin as the cavity height is increased. The thickness of 42 is increased.

And, as the operation rod 78 fixed to the slide plate 34 is moved to the inside of the protective cover 72, the gap between the operating rod 78 and the inner surface of the protective cover 72 is reduced. Then, the gauge block 82 having a small thickness is fitted into this gap. At this time, the thickness of the gauge block 82 corresponds to the height of the cavity 40, and when the thickness of the gauge block 82 is checked, the height of the cavity can be known.

On the contrary, as shown in FIG. 7, when the screw 74 is rotated in the reverse direction, the screw 74 is loosened to the screw groove 60. Then, the slide plate 34 is linearly moved in the direction of arrow C. Accordingly, the height of the cavity 40 is lowered while the lifting plate 32 is moved downward in the direction of the arrow D. FIG. Therefore, the thickness of the molding resin is reduced as the cavity height is lowered.

At this time, a gap between the working rod 78 fixed to the slide plate 34 and the inner surface of the protective cover 72 is opened, and the gauge block 82 having a large thickness is fitted into the gap. In this case, the thickness of the gauge block 82 corresponds to the height of the cavity, and when the thickness of the gauge block 82 is checked, the height of the cavity can be known.

As such, when the elevating plate is elevated in the vertical direction by rotating the screw in the forward or reverse direction, the height of the cavity can be adjusted, and the height of the cavity can be determined by checking the thickness of the gauge block. It is possible to control the thickness of the molding resin without replacement.

8 and 9 are operating state diagrams of a mold apparatus for manufacturing a semiconductor package according to an embodiment of the present invention.

As described above, when the height adjustment of the cavity is completed, as shown in FIG. 8, after separating the upper mold and the lower mold, the storage space of the lower mold is fixed, and the upper mold and the lower mold are coupled to each other, As shown in FIG. 2, molding semi-finished product is molded by injecting a molding resin into the cavity through the gate.

When the molding of the package semifinished product 100 is completed, as illustrated in FIG. 9, the upper and lower molds 30 and 20 are separated up and down, and the eject pin 40 is raised to raise the package semifinished product 10. Is separated from the lower mold 20.

On the other hand, in the mold apparatus for manufacturing a semiconductor package of the present invention, the lower surface of the upper mold 30 and the upper surface of the lower mold 20 coincide with each other as the lower mold 20 is fixed and lifted up and down. The package semi-finished product 10 may be molded after contact and pressurization, and the package semi-finished product 10 may be molded by lowering the lower die 20 while the upper die 30 is fixed. That is, in any case, any mold apparatus provided with the features of the present invention will be said to belong to the scope of the present invention.

On the other hand, according to another embodiment of the present invention, in addition to the above-described configuration, it may further configure the guide unit 100 and / or elastic unit 200.

The guide unit 100 includes a locking jaw 110 and a guide member 120 so that the slide plate 34 and the lifting plate 32 are not separated by a predetermined distance or more.

Hanging jaw 110 is formed to protrude symmetrically on both sides of the slide plate 34, as shown in Figure 10 to 13, the cross section perpendicular to the longitudinal direction of the slide plate 34 is iron ( It may be provided to have a shape such as iii). The locking projection 110 has a running surface 111 having an inclination angle parallel to the first inclined surface 52 formed on the elevating plate 32 and the second inclined surface 54 of the slide plate 34. Prepared.

The guide member 120 is formed to be parallel to the first inclined surface 52 and has a guide contact surface 121 in contact with the running surface 111. The guide member 120 is fixed to the cover plate 64 of the upper mold 30, as shown, is configured to guide only a portion of the entire section of the locking step 110. The guide contact surface 121 is provided in a shape complementary to each other so as to be in surface contact with the locking step 110. Preferably, the guide contact surface 121 is provided so as to have a cross-section having a '-' shape, the individual parts in a position corresponding to the locking step 110 protruding symmetrically on both sides of the elevating plate (32) It is good to be fixed. According to this configuration, according to the forward and backward reciprocating motion of the slide plate 34, while the lifting plate 32 is raised and lowered, the lifting plate 32 and the slide plate 34 is always in close contact with I can keep it.

In addition, as shown, the elastic unit 200 may be further provided to more smoothly perform the lifting operation of the elevating plate (32). The elastic unit 200 is configured to forcibly pull the elevating plate 32 when the elevating plate 32 is raised in accordance with the reciprocating movement of the slide plate 34.

The elastic unit 200 includes a lifting pin 210, a spring seating groove 220, a tension spring 230.

Lift pin 210 passes through the through-hole formed in the slide plate 34, the end is coupled / fixed to the coupling holes (32a) 32b formed in the lifting plate (32). The elevating pin 210 also serves to guide the vertical movement of the elevating plate 32.

The spring seating groove 220 is provided inside the plurality of through holes 66 formed through the cover plate 64 of the upper mold 30, and the tension spring 230 is installed. At this time, one end of the tension spring 230 is connected to the lifting pin 210, the other end is coupled to the head 211 portion of the lifting pin 210, pulling the elastic force of the tension spring 230 By acting on the lifting pin 210, the lifting plate 32 coupled with the lifting pin 210 is in close contact with the slide plate (34).

According to such an elastic unit 200, even during the reciprocating movement of the slide plate 34, since the elevating plate 32 can always be in close contact, it is possible to adjust the height of the cavity 40 more accurately It is possible.

On the other hand, according to a preferred embodiment of the present invention, the guide unit 100 and the elastic unit 200 may be one of the two, it is preferable to use the guide unit 100 and the elastic unit 200 at the same time if possible. Do.

If only the elastic unit 200 is used, when the mold is used for a long time, the elastic force of the tension spring 230 is gradually weakened, and a gap is gradually generated between the elevating plate 34 and the slide plate 32. As a result, it is difficult to control the height of the precision cavity 40. On the contrary, when only the guide unit 100 is used, the lifting operation of the elevating plate 32 is not smoothly performed. Because it can.

The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

10: package semi-finished product 12: semiconductor chip
14: substrate 20: lower mold
22: storage space 30: upper mold
32: elevating plate 34: slide plate
36: front end key 38: rear end key
40: cavity 50: operating part
52: first inclined plane 54: second inclined plane
60: screw groove 62: fixing groove
64: cover plate 70: eject pin
72: protective cover 74: screw
78: working rod 82: gauge block
100; Guide unit 110; Jaw
111; Running surface 120; The guide member
200; Elastic unit 210; Lifting pin
220; Seating groove 230; Tension spring

Claims

A lower mold having an accommodating space to which the package semi-finished product is fixed, and an upper mold disposed on an upper surface of the lower mold and having a cavity into which molding resin is injected;
The upper mold is elevated in the vertical direction to adjust the height of the cavity, the lifting plate is formed with a first slope on the upper surface;
A slide plate disposed on an upper surface of the elevating plate, on which a second inclined surface corresponding to the first inclined surface is formed and linearly moved;
A guide unit preventing the lifting plate and the slide plate from being spaced apart from each other by a predetermined distance, and guiding a linear movement path of the slide plate; And
Molding apparatus for manufacturing a semiconductor package comprising a; operating portion for linearly moving the slide plate.

The apparatus according to claim 1,
Engaging jaws protruding symmetrically on both sides of the slide plate; And
And a locking jaw guide member which is fixed to the cover plate provided in the upper mold and is formed in a shape corresponding to the locking jaw and engaged with the locking jaw.

The method of claim 2, wherein the locking jaw,
And a traveling surface formed to be parallel to the first inclined surface and in contact with the guide member.

The method of claim 3, wherein the guide member,
And a guide contact surface formed to be parallel to the first inclined surface and in contact with the traveling surface.

The method of claim 1,
At least one pair of elastic units, one end of which is connected to the lifting plate and the other end of which is fixed to the upper mold, and which pulls the lifting plate in close contact with the slide plate. Mold apparatus.

The method of claim 5, wherein the elastic unit,
A lift pin penetrately coupled to a plurality of through holes formed in the cover plate of the upper mold and fixedly coupled to a coupling hole formed in the lift plate;
A spring seating groove formed inside the through hole; And
One end is seated in the spring seating groove, the other end is connected to the head coupled to the end of the lifting pin, the tension spring for pulling the lifting pin, the lifting plate in close contact with the slide plate; Mold apparatus for manufacturing a semiconductor package.

The method of claim 1, wherein the operating unit,
A control screw screwed to a screw groove formed on one side of the slide plate;
A protective cover protecting the adjusting screw;
A moving rod having one end fixed to the slide plate and the other end positioned inside the protective cover; And
And a gauge block fitted into a gap between an end of the movable rod and an inner surface of the protective cover to determine a thickness of the cavity.