JPH051367A - Copper alloy material for electric and electronic equipment - Google Patents
Copper alloy material for electric and electronic equipmentInfo
- Publication number
- JPH051367A JPH051367A JP15200291A JP15200291A JPH051367A JP H051367 A JPH051367 A JP H051367A JP 15200291 A JP15200291 A JP 15200291A JP 15200291 A JP15200291 A JP 15200291A JP H051367 A JPH051367 A JP H051367A
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- Prior art keywords
- copper alloy
- plating
- plated
- alloy material
- electric
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Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は、各種電気・電子機器
部品の接点・端子材料に用いられる電気・電子機器用銅
合金材料に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper alloy material for electric / electronic equipment used as a contact / terminal material for various electric / electronic equipment parts.
【0002】[0002]
【従来の技術】現在、各種電気・電子機器部品の接点・
端子材料には、素材の有する強度,ばね性のほか、接触
部分における信頼性として、耐食性,耐熱性,はんだ付
け性,低接触抵抗,成形加工性等が必要とされ、その用
途,機能,使用環境等に見合った各種銅合金材料が用い
られている。2. Description of the Related Art Currently, contacts for various electric and electronic equipment parts
In addition to the strength and spring properties of the material, the terminal material is required to have corrosion resistance, heat resistance, solderability, low contact resistance, molding workability, etc. as reliability in the contact area. Various copper alloy materials suitable for the environment are used.
【0003】一方、近年の電気・電子機器部品の小型化
と高密度実装化に伴い、電導性と実装性に優れた銅合金
材料が求められているが、この要請に銅合金材料単体で
は十分に応えられない分野では、各種のめっきを施した
銅合金材料が用いられている。On the other hand, with the recent miniaturization and high-density mounting of electric / electronic equipment parts, a copper alloy material excellent in electrical conductivity and mountability has been demanded, and the copper alloy material alone is sufficient for this request. In fields that cannot meet these requirements, various plated copper alloy materials are used.
【0004】すなわち、接点の高信頼性に対する要求の
強い産業用コネクタ等の分野では、接触抵抗の低位安定
性に優れた、金めっきを施した銅合金材料が主流であ
る。また、民生用コネクタ等の低コスト化に対する要求
の強い分野では、高価な金めっきの代わりに安価な、す
ずあるいはすず合金(はんだ)を施した銅合金材料が一
般的に用いられている。また、装飾性,耐食性,耐熱信
頼性の向上を目的として、Niめっきを施した銅合金材
料が実用に供されている。In other words, in the field of industrial connectors and the like where there is a strong demand for high reliability of contacts, gold-plated copper alloy materials, which are excellent in low stability of contact resistance, are the mainstream. Further, in fields where there is a strong demand for cost reduction of consumer connectors and the like, inexpensive copper alloy materials coated with tin or tin alloy (solder) are generally used instead of expensive gold plating. Further, a Ni alloy-plated copper alloy material has been put into practical use for the purpose of improving decorativeness, corrosion resistance, and heat resistance reliability.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、従来の
銅合金材料には、下記の問題点があるため、電気・電子
機器の一層の高信頼性化と低コスト化に対する要求を満
たすことができなかった。However, since the conventional copper alloy materials have the following problems, the requirements for higher reliability and cost reduction of electric / electronic devices cannot be satisfied. It was
【0006】(1)銅合金材料単体では、一部洋白・キ
ュプロニッケルといったNiを多量に含む銅合金を除
き、黄銅をはじめ一般的に耐食性,耐熱信頼性に乏し
く、接触不良の原因となる。(1) Copper alloy materials alone, except for copper alloys containing a large amount of Ni such as nickel silver and cupronickel, generally have poor corrosion resistance and heat reliability, including brass, and cause poor contact. .
【0007】(2)耐食性や耐熱信頼性の向上を目的と
して施されるNiめっき層は、硬く展伸性に乏しいた
め、めっき後、プレス等の成形加工を施した場合、曲げ
加工部に割れやめっき層の欠落などを生じやすい。成形
加工後にめっきを施してもよいが、管理が煩雑となり、
前めっきより割高となる。(2) Since the Ni plating layer applied for the purpose of improving the corrosion resistance and the heat resistance reliability is hard and lacks in malleability, when the forming processing such as pressing is performed after plating, the bending portion is cracked. And the plating layer is likely to be lost. Plating may be applied after molding, but management becomes complicated,
It is more expensive than pre-plating.
【0008】(3)すずおよびすず合金(はんだ)めっ
きを施した銅合金材料の場合、めっき中のすずと銅合金
母材中の銅により金属間化合物が形成される。この金属
間化合物は、時間の経過とともに脆化する。また、この
脆化は、材料に連続的または断続的に熱が加えられた場
合、一層促進され、めっき層が母材から剥離する原因と
なる。また、黄銅等のZnを多量に含む合金系では、時
間の経過とともに、Znがめっき層を通り表面に酸化物
となって堆積されるので、はんだ付け性が著しく劣化す
る。(3) In the case of a copper alloy material plated with tin and tin alloy (solder), the intermetallic compound is formed by the tin in the plating and the copper in the copper alloy base material. This intermetallic compound becomes brittle over time. Further, this embrittlement is further promoted when heat is applied to the material continuously or intermittently, which causes the plating layer to peel from the base material. Further, in an alloy system containing a large amount of Zn such as brass, Zn passes through the plating layer and is deposited as an oxide on the surface with the lapse of time, so that the solderability is significantly deteriorated.
【0009】(4)金めっきを施した銅合金材料の場
合、金は、時間の経過とともに、銅合金母材中の銅の表
面へ拡散し、母材内部に取り込まれるので、接触抵抗が
増し、接触不良の原因となる。一方、このような拡散現
象を防止する目的で、下地めっきとしてNiが広く用い
られているが、(2)項と同様の理由で、めっき後の成
形加工性が悪くなる。(4) In the case of a copper alloy material plated with gold, gold diffuses over time into the surface of copper in the copper alloy base material and is taken into the base material, so that the contact resistance increases. It may cause poor contact. On the other hand, Ni is widely used as the undercoat for the purpose of preventing such a diffusion phenomenon, but for the same reason as in (2), the formability after plating deteriorates.
【0010】この発明は、上記のような問題点を解消す
るためになされたもので、銅合金材料単体より良好な耐
食性および耐熱性を有し、かつ成形加工性良好で安価な
電気・電子機器用銅合金材料を得ることを目的とし、ま
た、各種メッキの経時劣化を防止し、接触抵抗を低位に
保持することができる電気・電子機器用銅合金材料を得
ることを目的としている。The present invention has been made in order to solve the above-mentioned problems, and has better corrosion resistance and heat resistance than a single copper alloy material, and also has good moldability and is inexpensive electrical and electronic equipment. The purpose of the present invention is to obtain a copper alloy material for electric use, and also to obtain a copper alloy material for electric / electronic equipment capable of preventing deterioration of various platings over time and maintaining a low contact resistance.
【0011】[0011]
【課題を解決するための手段】(1)この発明に係る電
気・電子機器用銅合金材料は、銅合金の表面に、Niめ
っきを0.01〜0.5μmの厚さで施した後、これを
熱処理により母材中に拡散させたれものである(以下、
第1の銅合金材料という)。Niめっきの厚さを上記範
囲に限定したのは、0.01μm未満であると、薄すぎ
て、Niの有する効果が充分に得られなくなるためであ
り、0.5μmを超えると、コスト高につき実用性に欠
けるためである。(1) In the copper alloy material for electric / electronic equipment according to the present invention, after Ni plating is applied to the surface of the copper alloy to a thickness of 0.01 to 0.5 μm, This is a product that is diffused in the base material by heat treatment (hereinafter,
The first copper alloy material). The reason for limiting the thickness of the Ni plating to the above range is that if it is less than 0.01 μm, it is too thin and the effect of Ni cannot be sufficiently obtained. If it exceeds 0.5 μm, the cost is high. This is because it lacks practicality.
【0012】(2)また、この発明に係る電気・電子機
器用銅合金材料は、Niを拡散させた上記銅合金材料
に、金,すず,すず合金(はんだ)のいずれかのめっき
を施したものである(以下、第2の銅合金材料とい
う)。(2) In the copper alloy material for electric / electronic equipment according to the present invention, the above copper alloy material having Ni diffused is plated with any one of gold, tin, and tin alloy (solder). (Hereinafter referred to as the second copper alloy material).
【0013】[0013]
【作用】(1)Niは、銅合金の耐食性と耐熱性を改善
する金属として知られているが、この改善効果はめっき
のように単独層を形成しなくても、銅合金中にある濃度
以上含有されていれば得られる。第1の銅合金材料にお
いては、銅合金の表面にNiが拡散されて合金化されて
いるので、上記改善効果を期待することができる。ま
た、Ni単独層では、成形加工性に乏しいが第1の銅合
金材料では、Niが母材中に拡散され、合金化されてい
るので、成形加工性は改善される。さらに、従来のNi
めっき付銅合金と比較し、薄メッキで加工費が易く、成
形加工後の煩雑なめっきを省略できるので、低コストで
済む。(1) Ni is known as a metal that improves the corrosion resistance and heat resistance of copper alloys. The effect of this improvement is that even if a single layer such as plating is not formed, the concentration in the copper alloy is If it is contained above, it can be obtained. In the first copper alloy material, since Ni is diffused and alloyed on the surface of the copper alloy, the above-mentioned improvement effect can be expected. Further, in the Ni single layer, the formability is poor, but in the first copper alloy material, since Ni is diffused in the base material and alloyed, the formability is improved. Furthermore, conventional Ni
Compared with plated copper alloys, thin plating is easier to process, and complicated plating after molding can be omitted, resulting in low cost.
【0014】(2)Niは、銅合金母材中のCuあるい
はZnとめっき成分の金,すずとの間の原子拡散を抑制
する効果を有し、めっきの経時劣化を防止し、接触抵抗
を低位に保持する効果を有する。この効果は、めっきの
ように単独層を形成しなくても銅合金中にある濃度以上
のNiが含有されていれば得られる。第2の銅合金材料
においては、銅合金の表面にNiが拡散されて合金化さ
れているので、上記効果を期待することができる。(2) Ni has an effect of suppressing atomic diffusion between Cu or Zn in the copper alloy base material and the gold or tin of the plating component, prevents deterioration of the plating over time, and improves contact resistance. It has the effect of holding it at a low level. This effect can be obtained even if a single layer is not formed unlike plating, as long as the copper alloy contains Ni at a certain concentration or higher. In the second copper alloy material, since Ni is diffused and alloyed on the surface of the copper alloy, the above effect can be expected.
【0015】[0015]
【実施例】りん青銅および黄銅の代表的な銅合金を母材
とし、表1の工程で表2に示す実施例1〜16と比較例
17〜28の銅合金材料を作製した。Example Using the representative copper alloys of phosphor bronze and brass as the base material, the copper alloy materials of Examples 1 to 16 and Comparative Examples 17 to 28 shown in Table 2 were prepared in the process of Table 1.
【0016】[0016]
【表1】
上記工程により、作製した銅合金について、次の試験を
行った。
(1)耐熱密着性試験:〔試験条件〕 試験温度:1
00℃
耐熱時間:500,1000Hr
密着性試験:180°密着曲げ
耐熱密着性は、N=20実施し、剥離発生数により評価
した。[Table 1] The following test was performed about the copper alloy produced by the above process. (1) Heat-resistant adhesion test: [Test conditions] Test temperature: 1
00 ° C. Heat resistance time: 500, 1000 Hr Adhesion test: 180 ° adhesion Bending heat resistance Adhesion was evaluated by performing N = 20 and by the number of occurrences of peeling.
【0017】(2)成形加工性試験:〔試験条件〕 評価方
法:90°V曲げ0.2R
成形加工性は、曲げ部外観のクラックあり、なしにて評
価した。(2) Molding workability test: [Test conditions] Evaluation method: 90 ° V bending 0.2 R Molding workability was evaluated with and without cracks in the appearance of the bent portion.
【0018】(3)接触抵抗試験:〔試験条件〕
試験温度:85℃
試験湿度:85%RH
試験時間:350Hr
測定荷重:50gf
接触抵抗は、N=5測定を行い、平均値で評価した。(3) Contact resistance test: [Test conditions]
Test temperature: 85 ° C. Test humidity: 85% RH Test time: 350 Hr Measuring load: 50 gf Contact resistance was measured by N = 5 and evaluated by an average value.
【0019】(4)耐食性(アンモニア応力腐食性)試
験:〔試験条件〕
雰囲気:12.5%アンモニア試薬
最大曲げ応力:引張強さ×0.8
時間:20Hr
耐食性は、試験前後の引張強さの比で評価した。(4) Corrosion resistance (ammonia stress corrosion resistance) test: [Test conditions] Atmosphere: 12.5% Ammonia reagent maximum bending stress: Tensile strength x 0.8 hours: 20Hr Corrosion resistance is the tensile strength before and after the test. The ratio was evaluated.
【0020】表2は、以上の試験結果をまとめて示した
ものである。各試験結果は次のように評価することがで
きる。Table 2 summarizes the above test results. Each test result can be evaluated as follows.
【0021】[0021]
【表2】
(1)耐熱密着性:実施例1〜16の銅合金材料では、
いずれも1000Hr耐熱後でも母材の表面層または母
材とめっきの境界層における剥離は発生していない。こ
れに対し、比較例20,21,23,24のすずおよび
すず合金(はんだ)めっき材においては、1000Hr
における剥離が顕著に認められる。これは、銅合金母材
中のCuめっき中のSnによる金属間化合物の形成・成
長に伴うめっき界面の脆化によるものである。実施例
6,7,8,9,10の銅合金材料には、同じすずおよ
びすず合金(はんだ)めっき材であっても、剥離が発生
していない。これはNiによる拡散抑制効果によるもの
と考えられる。[Table 2] (1) Heat resistance adhesion: In the copper alloy materials of Examples 1 to 16,
In both cases, no peeling occurred in the surface layer of the base material or the boundary layer between the base material and the plating even after heat resistance of 1000 hours. On the other hand, in the tin and tin alloy (solder) plated materials of Comparative Examples 20, 21, 23 and 24, 1000 Hr
The peeling is markedly observed. This is due to the embrittlement of the plating interface accompanying the formation and growth of the intermetallic compound due to Sn during Cu plating in the copper alloy base material. Even if the copper alloy materials of Examples 6, 7, 8, 9, and 10 were the same tin and tin alloy (solder) plated materials, peeling did not occur. This is considered to be due to the diffusion suppressing effect of Ni.
【0022】(2)成形加工性:比較例25,26の銅
合金材料に見られるように、従来のNiめっきを施した
ものは、成形加工性に乏しいのに対し、実施例1,2の
銅合金材料では、Niを銅合金母材中に拡散させている
ため、クラックの発生はなく、成形加工性は良好であ
る。なお、比較例27,28の銅合金単体では、クラッ
ク発生は認められないが、比較例25,26のNiめっ
き材にはクラックの発生が認められる。これはNiめっ
きの成形加工性の乏しさに起因するものであると考えら
れる。(2) Formability: As can be seen from the copper alloy materials of Comparative Examples 25 and 26, the conventional Ni-plated ones have poor formability, while those of Examples 1 and 2 are poor. In the copper alloy material, since Ni is diffused in the copper alloy base material, cracks are not generated and the moldability is good. It should be noted that cracks are not observed in the copper alloys of Comparative Examples 27 and 28 alone, but cracks are observed in the Ni plated materials of Comparative Examples 25 and 26. This is considered to be due to the poor formability of Ni plating.
【0023】(3)接触抵抗:母材とめっき(2)の条
件が同一である、例えば、実施例5,8と比較例19の
銅合金材料を比較した場合、実施例の方が比較例よりも
接触抵抗が低位となっている。また、実施例1,2,
3,4の銅合金材料は、Niの銅合金材料への拡散処理
がなされているので、比較例27,28の銅合金材料単
体と比較した場合、接触抵抗が著しく改善され、Niめ
っきを施したものに近いことが分かる。これは、元来耐
食性に富むNiが、めっきのような単一層でなく、母材
中に拡散した場合においても、その効果を示しているこ
とに他ならない。なお、比較例17,18に見られるよ
うに、Niのめっき厚が薄すぎる場合には、効果は表れ
ない。また、銅合金材料にめっきを施した場合には、N
iはCu,Znの母材成分と金,すずのめっき成分との
間の拡散現象を抑制し、接触抵抗を低位に保つことが分
かる。(3) Contact resistance: When the base material and plating (2) conditions are the same, for example, when comparing the copper alloy materials of Examples 5 and 8 and Comparative Example 19, the Example is the comparative example. The contact resistance is lower than that. In addition, Examples 1, 2,
Since the copper alloy materials 3 and 4 have been subjected to the diffusion treatment of Ni into the copper alloy material, the contact resistance is remarkably improved and the Ni plating is applied when compared with the copper alloy material alone of Comparative Examples 27 and 28. You can see that it is close to what you did. This is nothing but the fact that Ni, which is originally rich in corrosion resistance, shows its effect even when it diffuses into the base material instead of a single layer like plating. In addition, as seen in Comparative Examples 17 and 18, if the Ni plating thickness is too thin, the effect is not exhibited. When a copper alloy material is plated, N
It can be seen that i suppresses the diffusion phenomenon between the base material components of Cu and Zn and the plating components of gold and tin and keeps the contact resistance low.
【0024】(4)応力腐食性:(3)と同様、実施例
1,2,3,4と比較例17,18,27,28との比
較から分かるように、母材にNiの拡散処理を施した銅
合金材料は、銅合金材料単体に比べ、耐食性が著しく改
善されていることが分かる。(4) Stress corrosion resistance: As in (3), as can be seen from the comparison between Examples 1, 2, 3, 4 and Comparative Examples 17, 18, 27, 28, Ni base diffusion treatment was applied to the base material. It can be seen that the copper alloy material subjected to is significantly improved in corrosion resistance as compared with the copper alloy material alone.
【0025】なお、上記実施例では、最終圧延後、Ni
めっきおよび拡散処理を施しているが、これらの処理
は、銅合金の製造工程における最終圧延以前の工程で実
施しても同様の効果が得られる。In the above embodiment, after the final rolling, the Ni
Although the plating and diffusion treatments are performed, the same effect can be obtained even if these treatments are performed before the final rolling in the copper alloy manufacturing process.
【0026】また、拡散処理を目的とした熱処理は、上
記実施例の条件以外の条件、例えば、高温短時間、低温
長時間の熱処理でも同様の拡散効果が得られ、熱処理雰
囲気についても、例えば、ブタン不完全焼鈍ガス等の他
の還元性雰囲気であってもよい。さらに、熱処理後、表
面のNi拡散層を損なわない程度の酸洗、化研処理は、
表面活性度を保持するために有用である。In the heat treatment for the purpose of diffusion treatment, the same diffusion effect can be obtained under conditions other than the above-mentioned conditions, for example, heat treatment at high temperature for a short time and at low temperature for a long time. Other reducing atmosphere such as butane incomplete annealing gas may be used. Furthermore, after the heat treatment, pickling and chemical polishing treatment to the extent that the Ni diffusion layer on the surface is not damaged,
Useful for retaining surface activity.
【0027】[0027]
【発明の効果】以上説明したように、請求項1に記載の
発明によれば、銅合金の表面に、Niめっきを施した
後、これを熱処理により母材中に拡散させてあるので、
銅合金単体より著しく耐食性と耐熱性に富み、かつ良好
な成形加工性を有する安価な電気・電子機器用銅合金材
料を得ることができる、また、請求項2に記載の発明に
よれば、請求項1に記載の銅合金材料に、金,すず,す
ず合金(はんだ)のいずれかのめっきを施してあるの
で、めっきの経時劣化が防止され、したがって、接触抵
抗の低位安定性に優れた電気・電子機器用銅合金材料を
得ることができる。As described above, according to the invention described in claim 1, since the surface of the copper alloy is plated with Ni, it is diffused in the base material by heat treatment.
It is possible to obtain an inexpensive copper alloy material for electric / electronic devices, which is significantly richer in corrosion resistance and heat resistance than a copper alloy alone, and has good formability, and according to the invention of claim 2, The copper alloy material according to item 1 is plated with gold, tin, or a tin alloy (solder), so that deterioration of the plating over time is prevented, and therefore, the electrical resistance is excellent in low stability of contact resistance. -A copper alloy material for electronic devices can be obtained.
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【手続補正書】[Procedure amendment]
【提出日】平成3年10月25日[Submission date] October 25, 1991
【手続補正1】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】0009[Correction target item name] 0009
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【0009】(4)金めっきを施した銅合金材料の場
合、金は、時間の経過とともに、銅合金母材中の銅が表
面へ拡散し、母材内部に取り込まれるので、接触抵抗が
増し、接触不良の原因となる。一方、このような拡散現
象を防止する目的で、下地めっきとしてNiが広く用い
られているが、(2)項と同様の理由で、めっき後の成
形加工性が悪くなる。[0009] (4) When the copper alloy material subjected to gold plating, gold, over time, copper of the copper alloy base material is diffused into the front <br/> surface, since incorporated therein preform However, the contact resistance increases, which causes poor contact. On the other hand, Ni is widely used as the undercoat for the purpose of preventing such a diffusion phenomenon, but for the same reason as in (2), the formability after plating deteriorates.
Claims (2)
〜0.5μmの厚さで施した後、これを熱処理により母
材中に拡散させてなる電気・電子機器用銅合金材料。1. The surface of a copper alloy is plated with Ni to 0.01
A copper alloy material for electric / electronic devices, which is applied to a thickness of 0.5 μm and then diffused in a base material by heat treatment.
金材料に、金,すず,すず合金(はんだ)のいずれかの
めっきを施してなる電気・電子機器用銅合金材料。2. A copper alloy material for electric / electronic devices, which is obtained by plating the copper alloy material for electric / electronic devices according to claim 1 with gold, tin, or tin alloy (solder).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15200291A JPH051367A (en) | 1991-06-24 | 1991-06-24 | Copper alloy material for electric and electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15200291A JPH051367A (en) | 1991-06-24 | 1991-06-24 | Copper alloy material for electric and electronic equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH051367A true JPH051367A (en) | 1993-01-08 |
Family
ID=15530923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15200291A Pending JPH051367A (en) | 1991-06-24 | 1991-06-24 | Copper alloy material for electric and electronic equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH051367A (en) |
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---|---|---|---|---|
JPH0790674A (en) * | 1993-09-27 | 1995-04-04 | Mitsubishi Shindoh Co Ltd | Plated cu or cu alloy sheet for producing electical connector and production thereof |
JPH087960A (en) * | 1994-06-16 | 1996-01-12 | Sumitomo Electric Ind Ltd | Terminal material |
KR100277614B1 (en) * | 1996-10-30 | 2001-01-15 | 야자키 야스히코 | Terminal materials and terminals |
EP1325964A1 (en) * | 2000-07-25 | 2003-07-09 | The Furukawa Electric Co., Ltd. | Copper alloy material for electronic or electric equipment parts |
US6893514B2 (en) | 2000-12-15 | 2005-05-17 | The Furukawa Electric Co., Ltd. | High-mechanical strength copper alloy |
US7090732B2 (en) | 2000-12-15 | 2006-08-15 | The Furukawa Electric, Co., Ltd. | High-mechanical strength copper alloy |
JP2007231407A (en) * | 2006-03-03 | 2007-09-13 | Hitachi Cable Ltd | Solder plating conductor and its manufacturing method |
WO2009157456A1 (en) * | 2008-06-24 | 2009-12-30 | 古河電気工業株式会社 | Composite material for electrical/electronic component and electrical/electronic component using the same |
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1991
- 1991-06-24 JP JP15200291A patent/JPH051367A/en active Pending
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---|---|---|---|---|
JPH0790674A (en) * | 1993-09-27 | 1995-04-04 | Mitsubishi Shindoh Co Ltd | Plated cu or cu alloy sheet for producing electical connector and production thereof |
JPH087960A (en) * | 1994-06-16 | 1996-01-12 | Sumitomo Electric Ind Ltd | Terminal material |
KR100277614B1 (en) * | 1996-10-30 | 2001-01-15 | 야자키 야스히코 | Terminal materials and terminals |
US6451449B2 (en) | 1996-10-30 | 2002-09-17 | Yazaki Corporation | Terminal material and terminal |
EP1325964A1 (en) * | 2000-07-25 | 2003-07-09 | The Furukawa Electric Co., Ltd. | Copper alloy material for electronic or electric equipment parts |
EP1325964A4 (en) * | 2000-07-25 | 2003-07-30 | Furukawa Electric Co Ltd | Copper alloy material for electronic or electric equipment parts |
US7172662B2 (en) | 2000-07-25 | 2007-02-06 | The Furukawa Electric Co., Ltd. | Copper alloy material for parts of electronic and electric machinery and tools |
US6893514B2 (en) | 2000-12-15 | 2005-05-17 | The Furukawa Electric Co., Ltd. | High-mechanical strength copper alloy |
US7090732B2 (en) | 2000-12-15 | 2006-08-15 | The Furukawa Electric, Co., Ltd. | High-mechanical strength copper alloy |
JP4626542B2 (en) * | 2006-03-03 | 2011-02-09 | 日立電線株式会社 | Method for producing solder-plated conductor |
JP2007231407A (en) * | 2006-03-03 | 2007-09-13 | Hitachi Cable Ltd | Solder plating conductor and its manufacturing method |
EP2295618A1 (en) * | 2008-06-24 | 2011-03-16 | The Furukawa Electric Co., Ltd. | Composite material for electrical/electronic component and electrical/electronic component using the same |
WO2009157456A1 (en) * | 2008-06-24 | 2009-12-30 | 古河電気工業株式会社 | Composite material for electrical/electronic component and electrical/electronic component using the same |
EP2295618A4 (en) * | 2008-06-24 | 2011-07-27 | Furukawa Electric Co Ltd | Composite material for electrical/electronic component and electrical/electronic component using the same |
JP4748550B2 (en) * | 2008-06-24 | 2011-08-17 | 古河電気工業株式会社 | Composite material for electric and electronic parts and electric and electronic parts using the same |
US8337997B2 (en) | 2008-06-24 | 2012-12-25 | The Furukawa Electric Co., Ltd. | Composite material for electrical/electronic part and electrical/electronic part using the same |
KR101370137B1 (en) * | 2008-06-24 | 2014-03-05 | 후루카와 덴키 고교 가부시키가이샤 | Composite Material for Electrical/Electronic Component and Electrical/Electronic Component Using the Same |
TWI449809B (en) * | 2008-06-24 | 2014-08-21 | Furukawa Electric Co Ltd | Electrical and electronic components for the use of composite materials and electrical and electronic components |
US10668555B2 (en) | 2013-05-03 | 2020-06-02 | Magna International Inc. | Aluminum spot welding method |
US20140374470A1 (en) * | 2013-06-25 | 2014-12-25 | Fuji Electric Co., Ltd. | Soldering method and method of manufacturing semiconductor device |
US9434028B2 (en) * | 2013-06-25 | 2016-09-06 | Fuji Electric Co., Ltd. | Soldering method and method of manufacturing semiconductor device |
JP2018129226A (en) * | 2017-02-09 | 2018-08-16 | 三菱マテリアル株式会社 | Copper terminal material and method for manufacturing the same |
CN113012890A (en) * | 2019-12-20 | 2021-06-22 | 株式会社村田制作所 | Electronic component |
CN111501044A (en) * | 2020-04-24 | 2020-08-07 | 上海泠控科技有限公司 | Anti-corrosion treatment method for heat sink surface |
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