CN111501044A - Anti-corrosion treatment method for heat sink surface - Google Patents
Anti-corrosion treatment method for heat sink surface Download PDFInfo
- Publication number
- CN111501044A CN111501044A CN202010336659.XA CN202010336659A CN111501044A CN 111501044 A CN111501044 A CN 111501044A CN 202010336659 A CN202010336659 A CN 202010336659A CN 111501044 A CN111501044 A CN 111501044A
- Authority
- CN
- China
- Prior art keywords
- heat sink
- reaction
- transition film
- treatment
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/74—Methods of treatment in inert gas, controlled atmosphere, vacuum or pulverulent material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a heat sink surface anti-corrosion treatment method, which comprises the following steps: (1) generating a transition film of alloy elements on the surface of the heat sink; and (2) diffusion reaction treatment, wherein the alloy element is a metal element which has eutectic reaction or peritectic reaction with the heat sink material, and the thickness of the transition film is 1-30 μm.
Description
Technical Field
The invention belongs to the field of surface treatment of heat sinks, and particularly relates to a heat sink surface anti-corrosion treatment method.
Background
High performance water-cooled heat sinks generally require relatively small water flow channels and relatively large flow rates to achieve a high heat transfer coefficient at the solid-liquid interface.
In terms of heat transfer science, Nusselt Number (Nusselt Number) is often used to describe the heat transfer characteristics of a flowing liquid, with the following formula:
where Nu is the Nusselt number, h is the heat transfer coefficient of the solid-liquid interface, DhIs the hydraulic diameter of the channel in which the flowing liquid is located (equal to 4 times the channel cross-sectional area divided by the perimeter), and k is the thermal conductivity of the liquid. In the case of a stationary laminar flow regime, the nusselt number is a constant whose value is determined by the geometry of the channel cross-section. The nusselt number is approximately 4.12 when the aspect ratio of the channel is 2. Under turbulent conditions, the nusselt number is a complex function of the liquid flow rate. The Dittus-Boelter formula is one of the expressions:
Nu＝0.023Re0.8Prn
where Re is the Reynolds number, which is proportional to the average flow rate of the liquid, and Pr is the Plantt number, which is a constant describing the properties of the liquid, because of the small hydraulic diameter of the channels in the microchannel heat sink, the flow of the cooling liquid can generate a large heat transfer coefficient at the liquid-solid interface, Altoz indicates that in a microchannel with a cross-section of 254 μm × 50.8.8 μm, the heat transfer coefficient can reach 4.3 × 104W/m2Altoz, "Thermal Management", Chapter2in, "Electronic Packaging and Interconnection Handbook", ed.C.A.Harper, McGraw-Hill, New York, (1991), p.2.89), Roy and Avanic tested experimentally a microchannel cross-section of 1295 μm × 508 μm to a heat transfer coefficient of water equivalent to 5 × 105W/m2℃(S.K.Roy and B.L.Avanic，“A Very High HeatFlux Microchannel Heat Exchanger for Cooling of Semiconductor Laser DiodeArrays”，IEEE Trans.on Components，Packaging，and Manufacturing Technology PartB，19(1996) (No. 2): 444-51.) Salem et al found that in a microchannel Heat sink having a Heat dissipating surface of 25.4 mm × 25.4.4 mm with a three-dimensional channel structure, the Thermal resistance was less than 0.15 ℃/W (T.E.Salem, D.Porschet, S.B.Bayne, Y.Chen; "Thermal Performance of Water-Cooled Heat Sinks" in Applied Power Electronics Conference And discharge, Austin, Texas, March 6-10, 2005) at a flow rate of 7 liters/min.
However, since the engineering material such as red copper commonly used for heat sinks has low mechanical strength and is not corrosion-resistant, the channel surface of the heat sink is easily corroded by water flow during use, which results in performance reduction and even failure of the heat sink. Therefore, the surface treatment of the channel of the heat sink has significant meaning for prolonging the service life of the heat sink and enhancing the stability of the performance of the heat sink.
Disclosure of Invention
It is therefore an object of the present invention to provide a method of improving the erosion resistance of the channel surface of a heat sink to improve the performance of the heat sink.
In order to achieve the purpose of the invention, the invention provides a method for anti-corrosion treatment of the surface of a heat sink, which comprises the following steps: firstly, generating a transition film of alloy elements on the surface of a heat sink; secondly, diffusion reaction treatment.
Further, the alloy element is a metal element which performs eutectic reaction or peritectic reaction with the heat sink material, and includes, but is not limited to, tin, zinc, nickel and silver. Further, the heat sink material is red copper.
Further, the thickness of the transition thin film is 1 to 30 μm, preferably 1 to 10 μm.
Further, the transition film is prepared by methods including, but not limited to, vacuum sputtering, physical or chemical vapor deposition, electroplating, and electroless plating.
Further, the diffusion reaction treatment is performed in a vacuum state or in a reducing atmosphere.
Detailed Description
The present invention is further described in detail below with reference to specific embodiments in order to make objects, technical solutions and advantages of the present invention more apparent to those skilled in the art.
There are two ways in which the heat sink channel surface can erode. One is simple mechanical stripping. When the stress applied to the surface of the heat sink channel by the flowing liquid exceeds the mechanical strength of the heat sink material, the solid on the surface of the channel is gradually stripped, and the process is like cutting. Second, corrosion accelerated mechanical stripping. In this case, the liquid exerts a stress that is less than the mechanical strength of the heat sink material. However, since the boundaries between grains in the polycrystalline material have a high chemical activity, corrosion starts from the grain boundaries. As the corrosion progresses, the grain-to-grain adhesion is weakened. Under the action of the water flow, the crystal grains are dug out from the surface of the channel and are carried away by the water flow. In high performance heat sinks, both of these erosion pathways may occur, and the second pathway is more hazardous.
Therefore, the inventors of the present invention have proceeded from two points to improve the erosion resistance, i.e., the improvement of the mechanical strength and the passivation of the grain boundaries of the heat sink material. Alloying is a common method for improving the mechanical strength of heat sink materials in the engineering field. For example, bronze, brass, and cupronickel are alloyed products of copper, with additional alloying elements including, but not limited to, tin, zinc, nickel, and silver, among others. For example, the mechanical strength of silver-copper alloys can be up to 3 times that of red copper. Due to the higher chemical activity of the grain boundaries, the diffusion resistance of the atoms at this point is less. During the diffusion process, the alloying element is concentrated at the grain boundaries, reducing its chemical activity. Therefore, the method of the invention improves the mechanical strength of the superficial layer of the heat sink surface on one hand and passivates the chemical activity of the grain boundary on the other hand by local alloy treatment of the superficial layer of the surface, thereby achieving the purpose of improving the erosion resistance.
Specifically, in one embodiment of the present invention, the present invention provides a method for anti-corrosion treatment of a heat sink surface, comprising: firstly, generating a transition film of alloy elements on the surface of a heat sink; secondly, diffusion reaction treatment.
The transition film material may be selected from metal elements such as silver, tin, zinc, etc. that have eutectic or peritectic reactions with a heat sink material such as copper. The preparation method of the transition film comprises the processes of vacuum sputtering, physical or chemical vapor deposition, electroplating, chemical plating and the like. The thickness of the transition film may be in the range of 1 to 30 μm, preferably 1 to 10 μm.
The diffusion reaction treatment is carried out in a vacuum state or in a reducing atmosphere, the workpiece is heated to a temperature higher than the eutectic reaction or peritectic reaction temperature, the temperature is kept for 10-300 minutes, then the heating is stopped, and the workpiece is cooled to room temperature along with the furnace. During the diffusion reaction, the film material is completely melted and gradually penetrates into the heat sink material. When the film material is fully infiltrated into the heat sink material, the surface of the heat sink material resolidifies. This reaction process is also known as a transient liquid phase diffusion reaction. This reaction process can also be used for welding of two workpieces. At this point, the two workpieces are brought together and a certain pressure is applied to both sides of the workpieces, so that their surfaces with the transitional film are tightly attached to each other, and the two workpieces are joined together by a diffusion reaction. If the two workpieces are of the same material, the weld seam will disappear.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (6)
1. A method of erosion resistant treatment of a heat sink surface, the method comprising the steps of:
(1) generating a transition film of alloy elements on the surface of the heat sink; and
(2) the treatment of the diffusion reaction is carried out,
the heat sink film is characterized in that the alloy elements are metal elements which perform eutectic reaction or peritectic reaction with a heat sink material, and the thickness of the transition film is 1-30 mu m.
2. The method of claim 1, wherein the heat sink material is copper.
3. The method of claim 1, wherein the transition film has a thickness of 1-10 μm.
4. The method of claim 1, wherein the transition film is prepared by a method selected from the group consisting of vacuum sputtering, physical or chemical vapor deposition, electroplating, and electroless plating.
5. The method of claim 1, wherein the alloying element is selected from the group consisting of tin, zinc, nickel, and silver.
6. The method according to claim 1, wherein the diffusion reaction treatment is performed in a vacuum state or in a reducing atmosphere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010336659.XA CN111501044B (en) | 2020-04-24 | 2020-04-24 | Anti-corrosion treatment method for heat sink surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010336659.XA CN111501044B (en) | 2020-04-24 | 2020-04-24 | Anti-corrosion treatment method for heat sink surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111501044A true CN111501044A (en) | 2020-08-07 |
| CN111501044B CN111501044B (en) | 2023-01-10 |
Family
ID=71873070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010336659.XA Active CN111501044B (en) | 2020-04-24 | 2020-04-24 | Anti-corrosion treatment method for heat sink surface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111501044B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121264A (en) * | 1983-12-06 | 1985-06-28 | Nippon Mining Co Ltd | Manufacture of radiator having fin with superior corrosion resistance |
| JPS61166987A (en) * | 1985-01-17 | 1986-07-28 | Hitachi Cable Ltd | Fin material for radiator |
| JPS62284062A (en) * | 1986-06-03 | 1987-12-09 | Hitachi Cable Ltd | Fin material for radiator and its production |
| JPS6468459A (en) * | 1987-09-08 | 1989-03-14 | Furukawa Electric Co Ltd | Heat-exchanger fin material |
| JPH051367A (en) * | 1991-06-24 | 1993-01-08 | Mitsubishi Electric Corp | Copper alloy material for electric and electronic equipment |
| US6159543A (en) * | 1995-11-12 | 2000-12-12 | Charmilles Technologies Sa | Processes for manufacturing wires with a brass surface |
| JP2015051443A (en) * | 2013-09-06 | 2015-03-19 | Ｊｆｅスチール株式会社 | Continuous casting mold and continuous casting method for steel |
| CN110952065A (en) * | 2019-12-23 | 2020-04-03 | 祝珍珍 | Copper foil for lithium battery and preparation method thereof |
-
2020
- 2020-04-24 CN CN202010336659.XA patent/CN111501044B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121264A (en) * | 1983-12-06 | 1985-06-28 | Nippon Mining Co Ltd | Manufacture of radiator having fin with superior corrosion resistance |
| JPS61166987A (en) * | 1985-01-17 | 1986-07-28 | Hitachi Cable Ltd | Fin material for radiator |
| JPS62284062A (en) * | 1986-06-03 | 1987-12-09 | Hitachi Cable Ltd | Fin material for radiator and its production |
| JPS6468459A (en) * | 1987-09-08 | 1989-03-14 | Furukawa Electric Co Ltd | Heat-exchanger fin material |
| JPH051367A (en) * | 1991-06-24 | 1993-01-08 | Mitsubishi Electric Corp | Copper alloy material for electric and electronic equipment |
| US6159543A (en) * | 1995-11-12 | 2000-12-12 | Charmilles Technologies Sa | Processes for manufacturing wires with a brass surface |
| JP2015051443A (en) * | 2013-09-06 | 2015-03-19 | Ｊｆｅスチール株式会社 | Continuous casting mold and continuous casting method for steel |
| CN110952065A (en) * | 2019-12-23 | 2020-04-03 | 祝珍珍 | Copper foil for lithium battery and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111501044B (en) | 2023-01-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5224430B2 (en) | Power semiconductor module | |
| JP4964009B2 (en) | Power semiconductor module | |
| WO2018161416A1 (en) | Liquid metal thermal interface material with melt-back property and preparation method thereof | |
| JP5549118B2 (en) | Manufacturing method of semiconductor device | |
| CN104347429B (en) | Micro channel heat sink manufacturing method | |
| ATE338737T1 (en) | BRAZLED METALIZATIONS FOR DIAMOND COMPONENTS | |
| JP2017172871A (en) | Process of manufacture of vapor chamber | |
| Ishizaki et al. | Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion | |
| Shen et al. | SiC power device die attach for extreme environments | |
| CN111501044B (en) | Anti-corrosion treatment method for heat sink surface | |
| Bashir et al. | Grain size stability of interfacial intermetallic compound in Ni and Co nanoparticle-doped SAC305 solder joints under electromigration | |
| WO2018135490A1 (en) | Method for producing ceramic circuit board | |
| Xin et al. | Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging | |
| JP2009038162A (en) | Heat radiation component and manufacturing method thereof, and power module | |
| Humpston et al. | Diffusion soldering for electronics manufacturing | |
| CN113894460A (en) | Self-propagating brazing film and preparation method thereof | |
| JP2016027633A (en) | Method for manufacturing ceramic/aluminum assembly, method for manufacturing substrate for power module, ceramic/aluminum assembly, and substrate for power module | |
| JP2015155108A (en) | Metal conjugate, waveguide for antenna, and semiconductor device | |
| Wu et al. | Bonding silicon chips to aluminum substrates using Ag–In system without flux | |
| He et al. | Study of effects of corrosion temperature on corrosion resistance of Cu-C alloys to liquid Ga | |
| US5031822A (en) | Methods of joining components | |
| JP4543275B2 (en) | Aluminum-ceramic bonding substrate and manufacturing method thereof | |
| US11527458B2 (en) | Power electronics assemblies with CIO bonding layers and double sided cooling, and vehicles incorporating the same | |
| JP2004193546A (en) | Copper alloy sputtering target for forming semiconductor device interconnect line seed layer | |
| Sangha et al. | Development of the copper-tin diffusion-brazing process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |