JP7129079B2 - substrate support - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board support for supporting a board such as a circuit board on a member such as a chassis or a case.

As a technology for supporting a substrate on a member such as a chassis or a case of an electronic device (hereinafter referred to as a chassis), for example, substrate supports have been proposed in Patent Documents 1 and 2. The technique of Patent Document 1 is a technique in which a fixture is attached to a substrate, and the fixture is supported by being fitted into a guide pin having a truncated cone shape provided upright on a housing such as a chassis. The technique of Patent Document 2 is a technique in which a locking member having a claw portion is soldered to a substrate, and a boss provided on a chassis or the like is locked to the claw portion for support.

JP-A-8-139470 JP 2016-119794 A

The technique of Patent Literature 1 requires manual work by an operator to fix the fixture to the board, which complicates the work of supporting the board. In addition, a process for erecting the truncated cone-shaped portion on the chassis is required, which complicates the machining work of the chassis. Furthermore, it is difficult to support the board at a predetermined height on the surface of the chassis, and it is difficult to support it in a stable state.

The technique of Patent Document 2 solders the locking member to the board, so it is effective in simplifying the work of supporting the board by automating it. Work is required for that. In addition, since the hook portion of the locking member bites into the boss of the chassis or the like to lock the board, it is difficult to release the locking, and it is difficult to remove the board from the chassis or the like during maintenance of the board.

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate support that does not require a truncated conical portion or a boss to stand upright on the chassis, simplifies the processing of the chassis, and facilitates attachment and detachment of the substrate to and from the chassis.

The present invention is a substrate support for supporting a substrate on a chassis, comprising: a fixing portion fixed to the substrate; and a locking portion protruding from the fixing portion toward the back surface of the substrate and engaged with the chassis. The locking portion is bent from the edge of the fixing portion to the back side thereof, and further bent into a wedge shape at the tip side thereof to have a locking claw that engages with the edge of the chassis. and a piece extending from the locking claw to the surface side of the fixed portion, and when operated, the locking piece is tilted about the connection portion with the fixed portion as a fulcrum, thereby disengaging the locking claw and the chassis . A releasing piece for releasing is provided.

As a preferred embodiment of the present invention, a position regulating portion protruding from the back side of the substrate is provided, and this position regulating portion is inserted into a regulation hole opened in the chassis. In another preferred form, the chassis includes a support piece for supporting the board, the locking claws of the board support are engaged with the edge of the support piece, and the regulation hole is opened in the support piece. .

According to the present invention, the board can be supported by the chassis by engaging the locking claws provided on the locking portion of the board support with the edge of the chassis, and the board can be removed from the chassis by the release piece. can. For example, the locking claw can be engaged with a support piece obtained by cutting and raising a part of the chassis, thereby simplifying the machining of the chassis.

1 is a partially exploded external perspective view of a substrate support according to Embodiment 1 of the present invention. FIG. (a) A front view, (b) a plan view, and (c) a right side view of the substrate support of Embodiment 1. FIG. 4A and 4B are cross-sectional views showing a housed state and a pick-up state of the substrate support according to the first embodiment; Sectional drawing which shows the process which adheres a board|substrate support to a circuit board. FIG. 4 is a cross-sectional view showing a process of supporting the circuit board on the chassis or the like; FIG. 8 is a partially exploded external perspective view of the substrate support of Embodiment 2; FIG. 8 is a cross-sectional view of the circuit board supported on the chassis by the board support of the second embodiment;

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a partially exploded external perspective view of a substrate support 1 according to Embodiment 1 of the present invention. In addition, in the following description, the "vertical direction" represents the direction based on FIG. 1 for convenience. The substrate support 1 is formed by punching an elastic plate material, here, a springy metal plate, into a desired shape and then bending it. The board support 1 is attached to a position near the edge of the circuit board 2 to be supported, and the circuit board 2 is supported by the chassis 3 .

In FIG. 1, a chassis 3 for supporting the circuit board 2 has a support piece 31 which is partly cut into a rectangular shape and bent into an L shape in the thickness direction, i.e., the surface direction of the chassis 3. is formed. A tip region 31a of the support piece 31 extends parallel to the chassis surface, and two slit-like guide holes 32 penetrate the tip region 31a in the thickness direction. As will be described later, the board support 1 attached to the circuit board 2 can support the circuit board 2 on the chassis 1 by being engaged with the edge portions 33 of the support pieces 31. It is said that

FIG. 2 is a trihedral view of the substrate support 1, that is, (a) a front view, (b) a plan view, and (c) a right side view. As shown in FIG. 2, the substrate support 1 is composed of three parts, that is, a fixing portion 11, a locking portion 12, and a position regulating portion 13. The fixing portion 11 has a required area. and shaped flat plate. Here, it is formed as a substantially square or rectangular flat plate, and the fixing part 11 is used for fixing the substrate support 1 to the circuit board 2 on the back surface facing downward, as will be described later. , the surface facing upward is used for gripping, transporting, and fixing the substrate support 1 by an automatic mounting machine.

The position regulating portion 13 has projecting pieces 14 each protruding from two opposite edges of the fixing portion 11 toward the rear surface of the fixing portion 11 to have a required length. These two protruding pieces 14 are formed by bending two opposite edges of the fixing portion 11 at right angles in the plate thickness direction, and protrude parallel to each other.

The locking portion 12 is connected to one side edge of the fixing portion 11 sandwiched between the two projecting pieces 14 of the position regulating portion 13, and is composed of a locking piece 15 and a releasing piece 16. ing. The former engaging piece 15 is bent at a right angle from the side edge of the fixing portion 11 to the rear surface direction, and the latter releasing piece 16 is bent upwardly outward from the lower end of the engaging piece 15 by approximately 360 degrees. It is folded back and bent in the direction of

The locking piece 15 is formed by cutting out tongue-like portions along both sides of the portion near the folded tip, and then bending the locking piece 15 inward into a generally wedge shape to form a locking claw. 17. These engaging claws 17 are set so that the distance from the rear surface of the fixing portion 11 is the sum of the thickness of the circuit board 2 and the thickness of the chassis 3. .

The release piece 16 extends so that its upper end is higher than the surface of the fixed portion 11 by a required dimension. Further, the upper end portion 16a of the release piece is bent into a roll shape so as not to damage the operator's fingertip during release, which will be described later.

The board support 1 having this configuration is fixed in advance to the circuit board 2 to be supported. A circuit pattern (not shown) made of a conductive film is present on the surface of the circuit board 2, and a fixed land 21 is formed using a part of this circuit pattern. A pair of slit-like insertion holes 22 are formed in the circuit board 2 with the fixing land 21 interposed therebetween. The fixing land 21 is formed to have a shape and area substantially equal to the planar shape of the fixing portion 11 of the substrate support 1, and the insertion hole 22 has a shape corresponding to the two projecting pieces 14 of the position regulating portion 13. and positions.

The board support 1 is mounted on the circuit board 2 in the same manner as when various electronic components for forming a required circuit are mounted on the circuit board 2 by an automatic mounting machine (not shown). As shown in the schematic cross-sectional view of FIG. 3, the substrate support 1 is housed in each of a plurality of recesses arranged in series on the embossed carrier tape CT, which is usually in the form of a belt, and sealed by a top cover C. stored in . When the board support 1 is mounted on the circuit board 2, the vacuum nozzle N, which is a part of the automatic mounting machine, is brought into contact with the surface of the fixing portion 11 while the top cover C is sequentially peeled off by the automatic mounting machine. , is removed from the recess by vacuum suction.

4A and 4B are diagrams showing the process of mounting the board support 1 on the circuit board 2. As shown in FIG. transported to the top. Then, the substrate supporter 1 is mounted on the circuit board 2 by lowering the nozzle N to insert the projecting piece 14 into the insertion hole 22 and then releasing the adsorption of the nozzle N to retract the nozzle N.

In the mounted substrate support 1, the rear surface of the fixing portion 11 is brought into close contact with the fixing land 21, and the two protruding pieces 14 of the position regulating portion 13 are inserted through the insertion holes 22 and protrude to the rear surface side of the circuit board 2. be done. Further, the locking claw 17 of the locking portion 12 protrudes toward the back side at the outer position of the edge of the circuit board 2 . After that, various electronic components are mounted on the circuit pattern by reflow using brazing material such as solder.

When the circuit board 2 is supported on the chassis 3, referring to the supporting process diagram of FIG. 5, first, as shown in FIG. are inserted into the two regulation holes 32 of the support piece 31 of the chassis 3, respectively. As a result, the circuit board 2 is positioned with respect to the support piece 31 . Also, by this positioning, the engaging portion 12 of the substrate support 1 is positioned at a position corresponding to the edge portion 33 of the support piece 31 .

In this state, when the circuit board 2 is pushed down toward the support piece 31 as shown in FIG. It is moved to the lower surface side of the support piece 31 over the edge portion 33 , and the locking claw 17 is engaged with the edge portion 33 . As described above, the locking claw 17 is formed at a position separated from the back surface of the fixing portion 11 by the sum of the thickness dimension of the circuit board 2 and the thickness dimension of the chassis 3. and the locking claw 17 sandwich the support piece 31 at the edge portion 33 in the plate thickness direction. As a result, the substrate support 1 is integrally connected to the support pieces 31 , and the circuit board 2 can be supported by the support pieces 31 .

In this way, the circuit board 2 is supported on the chassis 3 by the board support 1. In this state, the projection of the position regulating portion 13 and the regulating hole 32 are fitted to the circuit board 2 against the supporting piece 31. The position is restricted, and the circuit board 2 is not moved in the plane direction on the upper surface of the support piece 31 . Therefore, the locking claw 17 does not come out of engagement with the edge portion 33 of the support piece 31, and a stable supported state is maintained.

When removing the circuit board 2 from the chassis 3, the operator presses the releasing piece 16 in the direction of the arrow D1, ie, in the direction of the fixing portion 11, with a finger or a jig, as shown in FIG. 5(c). As a result, the engaging piece 15 is tilted in the direction of arrow D 2 with the connecting portion to the fixing portion 11 as a fulcrum, and the engaging claw 17 is released from the engagement with the edge portion 33 of the supporting piece 31 . Therefore, if the circuit board 2 is lifted while maintaining this state, the circuit board 2 can be removed from the supporting piece 31 .

As described above, the substrate support 1 of Embodiment 1 can be constructed by processing a single metal plate, so that it can be constructed with a minimum number of parts. Further, the substrate support 1 is fixed to the circuit board 2 at the fixing portion 11. Since this fixing can be fixed by reflow soldering or the like, the fixing work to the circuit board 2 can be automated and the number of man-hours is small. done. When the circuit board 2 is supported on the chassis 3, the circuit board 2 is simply pushed down while inserting the projecting piece 14 of the position regulating portion 13 into the regulating hole 32 provided in the supporting piece 31 from above. work is also easy. Further, the engagement of the locking claws 17 with the support pieces 31 can be released only by operating the release pieces 16, so that the circuit board 2 can be easily removed from the chassis 3, and the circuit board 2 can be reused. becomes valid.

On the other hand, the chassis 3 only needs to be partially cut up and bent to form the support piece 31, and the truncated conical portion and bosses, which are separate members from the chassis as in Patent Documents 1 and 2, are unnecessary. Moreover, the work of attaching them to the chassis 3 becomes unnecessary. Therefore, the chassis 3 can be manufactured at low cost. In addition, as in Patent Documents 1 and 2, it is possible to prevent backlash caused by dimensional errors between the fixing bracket or mounting member and the truncated conical portion or boss.

In Embodiment 1, the substrate support 1 is made of a metal plate, that is, a conductive plate. can function as a ground terminal. Therefore, the ground pattern of the circuit board 2 can be grounded to the chassis 3 when the locking claws 17 of the board support portion 1 and the protruding pieces 14 of the position regulating portion 13 are in electrical contact with the support pieces 31 . .

FIG. 6 is a partially exploded perspective view of the substrate support 1A of Embodiment 2, and parts equivalent to those of the substrate support 1 of Embodiment 1 are assigned the same reference numerals. In the substrate support 1A of Embodiment 2, a position regulating portion 13 is formed by bending one projecting piece 14 on one side edge of a generally rectangular fixing portion 11 so as to protrude to the back side. . A pair of locking portions 12 are formed on the opposite side edges of the fixing portion 1 .

The projecting piece 14 of the position restricting portion 13 has the same configuration as the projecting piece of the first embodiment. Also, the configuration of the two locking portions 12 is the same as that of the first embodiment. It consists of Each locking piece 15 is provided with a locking claw 17 , and these locking claws 17 face inward so as to face each other with the fixing portion 11 interposed therebetween.

On the other hand, in the circuit board 2 of Embodiment 2, one slit-like insertion hole 22 is formed along one side of the fixing land 21 into which the projecting piece 14 of the position regulating portion 13 is inserted. Two window holes 23 into which the locking pieces 15 and releasing pieces 16 of the two locking portions 12 are inserted are formed on both sides of the fixing land 21 . These two window holes 23 are formed to be slightly larger than the planar dimension of each locking portion 12 , and the locking portion 12 can be tilted within the window holes 23 .

The operation of mounting the board support on the circuit board is performed by an automatic mounting machine as in the first embodiment. At this time, the board support 1A is positioned with respect to the circuit board 2 by inserting one protruding piece 14 into the insertion hole 22 . When the fixing portion 11 of the substrate support 1A is fixed to the fixing land 21 of the circuit board 2 by soldering or the like, the projecting piece 14 of the position regulating portion 13 protrudes from the insertion hole 22 toward the back side, and the two engaging portions 12 of the locking portion 12 are engaged. The stop pieces 15 protrude from the window holes 23 to the rear side.

In the chassis 3 of the second embodiment that supports the circuit board 2, support pieces 31 are formed by cutting and bending as in the first embodiment. The width dimension of the support piece 31 is substantially equal to the interval dimension between the two locking pieces 15 of the substrate support 1A. In addition, one slit-like regulation hole 32 corresponding to one projecting piece 14 of the substrate support 1A is opened in the support piece 31. As shown in FIG.

Since the process of mounting the board support 1A on the circuit board 2 is the same as that of the first embodiment, the description is omitted here. When the circuit board 2 on which the board support 1A is mounted is supported on the chassis 3, the protruding piece 14 of the board support 1 is inserted into the regulation hole 32 in the same manner as in the first embodiment, and the supporting piece 31 is pressed against the support piece 31. The board support 1A and the circuit board 2 are positioned. After that, when the circuit board 2 is pushed down toward the support piece 31, as shown in the sectional view of FIG. Overcoming the side edge portions 34 on both sides and moving to the lower surface side of the support piece 31 , the locking claw 17 is engaged with the side edge portions 34 . As a result, the board supporter 1A is in a state in which the two locking pieces 15 are engaged so as to sandwich the support piece 31 from both sides, and the circuit board 2 is supported on the upper surface of the support piece 31 and the support piece 31 is held. supported by

When removing the circuit board 2 from the chassis 3, the operator picks up the two releasing pieces 16 with fingers or the like from both outer sides and elastically deforms them in the D3 direction in FIG. As a result, both locking pieces 15 are tilted inward with respect to each other, and the locking claw 17 is released from engagement with the side edge portion 34 of the support piece 31 . If the circuit board 2 is lifted while maintaining this state, the circuit board 2 can be removed from the supporting piece 31 .

Also in the second embodiment, the substrate support 1A can be constructed by processing one metal plate, so that it can be constructed with a minimum number of parts. Further, since the substrate support 1A can be fixed by reflow, the fixing operation to the circuit board 2 can be automated and the number of man-hours can be reduced. Furthermore, since the chassis 3 can be formed by cutting and raising the support pieces 31, there is no need for processing work or mounting work using separate members. When the circuit board 2 is supported on the chassis 3, it is only necessary to position the circuit board 2 with respect to the chassis 3 and then press the circuit board 2 against the surface of the chassis 3, and the work for supporting the circuit board 2 is also easy. Further, the circuit board 2 can be easily removed from the chassis 3 simply by operating the releasing piece 16 of the board support 1A, which is effective in reusing the circuit board 2. FIG.

In addition, in the second embodiment, the two locking portions 12 are provided facing each other, and the two locking pieces 15 support the circuit board 2 while holding the support piece 31 from both sides. The mechanical strength of the support can be increased, and the reliability of the support can be improved. In particular, the support strength can be increased in the direction in which the support piece 31 is sandwiched. This Embodiment 2 is preferably applied when supporting a large-sized circuit board 2 with a relatively large weight.

The present invention is not limited to the configurations and shapes of the first and second embodiments. For example, the position regulating part may be omitted if the board is not required to be positioned with respect to the chassis. If the substrate support does not require a conductive function such as grounding, the substrate support may be made of an insulating material such as resin. In this case, the board support may be fixed to the circuit board at the fixing portion with an adhesive.

The supporting piece in the present invention does not necessarily have to have a cut-and-raised shape as in the first and second embodiments. For example, if the chassis has a stepped portion in the plate thickness direction, the engaging portion of the substrate support may be engaged with the edge of the stepped portion. Further, in the case where the chassis is molded with a conductive member, the supporting pieces may be integrally molded. Furthermore, in the case of a support structure that does not require a space between the chassis and the substrate, the locking portion of the substrate support may be engaged with the edge of the chassis.

The chassis in the present invention may be configured as a case in which the board is housed or a case called a housing.

1, 1A Board support 2 Circuit board 3 Chassis 11 Fixing part 12 Locking part 13 Position regulating part 15 Locking piece 16 Release piece 17 Locking claw 21 Fixing land 22 Insertion hole 23 Window hole 31 Supporting piece 32 Regulating hole 33 End edge 34 side edge

Claims (5)

A substrate support for supporting a substrate on a chassis, comprising: a fixing portion made of an elastic member and fixed to the substrate; The locking portion is bent from the edge of the fixing portion to the rear side thereof, and the tip side of the locking portion is bent back into a wedge shape to be attached to the edge of the chassis. a locking piece having a locking claw to be engaged, and a locking piece extending from the locking claw to the surface side of the fixing portion, and when operated, the connecting portion of the locking piece with the fixing portion is used as a fulcrum. A substrate support comprising a releasing piece that is tilted to release the engagement between the locking claw and the chassis . 2. The substrate support according to claim 1, wherein said substrate support includes a position regulating portion projecting to the back side of said substrate, said position regulating portion being inserted into a regulation hole opened in said chassis. 3. The chassis according to claim 2, wherein the chassis includes a support piece for supporting the substrate, the locking claws of the substrate support are engaged with the edge of the support piece, and the regulation hole is opened in the support piece. substrate support. 4. The circuit board according to claim 3, wherein said locking claw is formed at a portion of said locking piece facing said fixing portion, and is engaged with the edge of said supporting piece from the outside by the elastic force of said locking piece. support. 5. A substrate support according to claim 2, wherein said fixing portion, said engaging portion and said position regulating portion are integrally formed by processing a conductive plate material.

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