JP2019134102A - Substrate support - Google Patents

Abstract

To provide a substrate support that does not have a frustoconical portion or a boss standing on a chassis, simplifies processing of the chassis, and allows a substrate to be easily attached to and detached from the chassis.SOLUTION: A substrate support 1 for supporting a substrate 2 on a chassis 3 includes a fixing part 11 fixed to the substrate 2 and a locking portion 12 protruding to the back side of the substrate 2 and engaged with the chassis 3. The locking portion 12 includes a locking piece 15 having a locking claw 17 that is engages with an edge 33 of a support piece 31 of the chassis 3, and a release piece 16 that partially extends to the surface side of the substrate 2 and releases the engagement state of the locking claw 17. The substrate support 1 further may include a position restricting portion 13 having a protruding piece 14 protruding on the back surface side of the substrate 2.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a board support for supporting a board such as a circuit board on a member such as a chassis or a case.

  As a technique for supporting a substrate on a member (hereinafter referred to as a chassis) such as a chassis or a case of an electronic device, for example, a substrate support in Patent Documents 1 and 2 has been proposed. The technique of Patent Document 1 is a technique in which a fixing bracket is attached to a substrate, and the fixing bracket is fitted to and supported by a guide pin of a truncated cone-shaped portion standing on a housing such as a chassis. The technique of Patent Document 2 is a technique in which a locking member having a claw portion is soldered to a substrate, and a boss provided on a chassis or the like is locked to the claw portion and supported.

JP-A-8-139470 JP-A-2006-119794

  The technique of Patent Document 1 requires a manual operation by an operator to fix the fixing bracket to the substrate, and the support operation of the substrate becomes complicated. In addition, a process for erecting the frustoconical portion on the chassis is required, and the processing work of the chassis becomes complicated. Furthermore, it is difficult to support the substrate at a predetermined height position on the surface of the chassis, and it is difficult to support the substrate in a stable state.

  The technique of Patent Document 2 is effective in simplifying the support operation of the substrate by soldering the locking member to the substrate, but a process of providing a boss on the chassis or the like is necessary. The work for that is needed. Further, since the claw portion of the locking member bites into and locks the boss such as the chassis, it is difficult to release this locking, and it is difficult to remove the board from the chassis or the like during the maintenance of the board.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate support that does not have a truncated cone portion or a boss standing on a chassis, simplifies the processing on the chassis, and allows easy attachment / detachment of the substrate to / from the chassis.

  The present invention is a substrate support for supporting a substrate on a chassis, and a fixing portion fixed to the substrate, and a locking portion protruding from the fixing portion to the back side of the substrate and engaged with the chassis. The locking portion has a locking piece having a locking claw that engages with the edge of the chassis, and a part of the locking portion extends to the surface side of the substrate to release the engagement state of the locking claw. A release piece is provided.

  As a preferred embodiment of the present invention, a position restricting portion protruding to the back side of the substrate is provided, and this position restricting portion is inserted into a restricting hole opened in the chassis. As another preferred embodiment, the chassis includes a support piece for supporting the board, the locking claw of the board support is engaged with the edge of the support piece, and the restriction hole is opened in the support piece. .

  According to the present invention, the latching claw provided on the latching portion of the board support can be engaged with the edge of the chassis to support the board on the chassis, and on the other hand, the release piece can be removed from the chassis. it can. For example, the latching claw can be engaged with the support piece obtained by cutting and raising a part of the chassis, thereby simplifying the processing on the chassis.

The partial disassembled external appearance perspective view of the board | substrate support tool of Embodiment 1 of this invention. (A) Front view of substrate support figure of Embodiment 1, (b) Top view, (c) Right side view. Sectional drawing which shows the accommodation state and pick-up state of the board | substrate support tool of Embodiment 1. FIG. Sectional drawing which shows the process of adhering a board | substrate support tool to a circuit board. Sectional drawing which shows the process of supporting a circuit board in a chassis. FIG. 6 is a partially exploded external perspective view of a substrate support according to a second embodiment. Sectional drawing which supported the circuit board in the chassis with the board | substrate support tool of Embodiment 2. FIG.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a partially exploded external perspective view of a substrate support 1 according to Embodiment 1 of the present invention. In the following description, for convenience, the “vertical direction” represents a direction with reference to FIG. The substrate support 1 is formed by punching an elastic plate material, here a metal plate having a spring property, into a required shape and then bending it. The board support 1 is attached in the vicinity of the edge of the circuit board 2 to be supported, and the circuit board 2 is supported by the chassis 3.

  In FIG. 1, a chassis 3 for supporting the circuit board 2 is partly cut and raised in a rectangular shape and bent into an L shape in the thickness direction, that is, the surface direction of the chassis 3. Is formed. The tip region 31a of the support piece 31 extends in parallel with the chassis surface, and two slit-shaped guide holes 32 are penetrated in the thickness direction in the tip region 31a. Then, as will be described later, the substrate support 1 attached to the circuit board 2 can be supported by the chassis 1 by being engaged with the edge 33 of the support piece 31. It is said that.

  FIG. 2 is a three-side view of the substrate support 1, that is, (a) a front view and (b) a plan view (c) a right-side view. As shown in FIG. 2, the substrate support 1 includes three parts, that is, a fixing part 11, a locking part 12, and a position regulation part 13. The fixing part 11 has a required area. And a flat plate having a shape. Here, it is formed as a generally square or rectangular flat plate, and the fixing portion 11 is used for fixing the substrate support 1 to the circuit board 2 with the back surface directed downward as described later. The surface facing upward is used when the substrate support 1 is gripped, transported, and fixed by an automatic mounting machine.

  The position restricting portion 13 includes projecting pieces 14 that protrude from the two opposing edges of the fixing portion 11 to the required length in the back surface direction of the fixing portion 11. These two projecting pieces 14 are formed by bending two opposing edges of the fixing portion 11 at right angles toward the plate thickness direction, and projecting in parallel.

  The locking portion 12 is connected to one side edge of the fixing portion 11 sandwiched between the two projecting pieces 14 of the position restricting portion 13, and includes a locking piece 15 and a release piece 16. ing. The former locking piece 15 is bent at a right angle from the side edge of the fixing portion 11 in the back surface direction, and the latter releasing piece 16 is approximately 360 ° from the lower end position of the locking piece 15 outwardly upward. It is folded in the direction of.

  The locking piece 15 is bent into a generally wedge shape inwardly after the portions along both sides of the folded portion near the tip are cut out in a tongue shape. 17. These locking claws 17 are set so that the distance from the back surface of the fixing portion 11 is separated by the dimension obtained by adding the thickness dimension of the circuit board 2 and the thickness dimension of the chassis 3. .

  The release piece 16 extends so that the upper end thereof is higher than the surface of the fixing part 11 by a required dimension. Further, the upper end portion 16a of the release piece is bent into a roll shape so that the fingertip of the operator is not damaged when the release is described later.

  The substrate support 1 having this configuration is fixed in advance to the circuit substrate 2 to be supported. A circuit pattern (not shown) made of a conductive film exists on the surface of the circuit board 2, and a fixed land 21 is formed using a part of the circuit pattern. In addition, a pair of slit-shaped insertion holes 22 are opened in the circuit board 2 with the fixed land 21 interposed therebetween. The fixed land 21 is formed in a shape and area substantially equal to the planar shape of the fixed portion 11 of the substrate support 1 described above, and the insertion hole 22 has a shape corresponding to the two projecting pieces 14 of the position restricting portion 13. And is opened at a position.

  The substrate support 1 is mounted on the circuit board 2 in the same manner as when various electronic components for configuring a required circuit are mounted on the circuit board 2 by an automatic mounting machine (not shown). As shown in a schematic cross-sectional view in FIG. 3, the substrate support 1 is normally housed in a plurality of recesses arranged in series on a belt-like embossed carrier tape CT and sealed by a top cover C. Saved in. When the substrate support 1 is mounted on the circuit board 2, the vacuum cover N that is a part of the automatic mounting machine is brought into contact with the surface of the fixing portion 11 while the top cover C is sequentially peeled off by the automatic mounting machine. And take out from the recess by vacuum suction.

  FIG. 4 is a diagram showing a process of mounting the board support 1 on the circuit board 2. As shown in FIG. 4A, the board support 1 adsorbed by the nozzle N is fixed to the fixed land 21 of the circuit board 2. It is conveyed to the top. Then, the substrate support 1 is mounted on the circuit board 2 by lowering the nozzle N and inserting the protruding piece 14 into the insertion hole 22 and then releasing the suction of the nozzle N and retracting the nozzle N.

  In the mounted substrate support 1, the back surface of the fixing portion 11 is in close contact with the fixing land 21, and the two projecting pieces 14 of the position restricting portion 13 are inserted through the insertion holes 22 and protrude to the back surface side of the circuit board 2. Is done. Further, the locking claw 17 of the locking portion 12 protrudes to the back surface side at a position outside the edge of the circuit board 2. At the same time, various electronic components are mounted on the circuit pattern by reflow using a brazing material such as solder, and at the same time, the fixing portion 11 of the substrate support 1 is fixed to the fixing land 23.

  When the circuit board 2 is supported by the chassis 3, referring to the supporting process diagram of FIG. 5, first, as shown in FIG. 5A, the position restricting portion 13 protruding to the back side of the circuit board 2 is used. The two projecting pieces 14 are inserted into the two restricting holes 32 of the support piece 31 of the chassis 3, respectively. As a result, the circuit board 2 is positioned with respect to the support piece 31. Further, by this positioning, the locking portion 12 of the substrate support 1 is positioned at a position corresponding to the end edge portion 33 of the support piece 31.

  In this state, as shown in FIG. 5B, when the circuit board 2 is pushed down toward the support piece 31, the locking claw 17 of the support piece 31 is caused by elastic deformation of the locking piece 15 and the release piece 16. It moves over the end edge portion 33 to the lower surface side of the support piece 31, and the locking claw 17 is engaged with the end edge portion 33. As described above, the latching claw 17 is formed at a position separated from the back surface of the fixing portion 11 by a dimension obtained by adding the plate thickness dimension of the circuit board 2 and the board thickness dimension of the chassis 3. And the locking claw 17 sandwich the support piece 31 at the end edge portion 33 in the plate thickness direction. Thereby, the board | substrate support tool 1 will be in the state integrally couple | bonded with the support piece 31, and the circuit board 2 can be supported by the support piece 31. FIG.

  In this way, the circuit board 2 is supported by the chassis 3 by the board support 1, but in this state, the circuit board 2 is supported with respect to the support piece 31 by fitting the protruding piece of the position restricting portion 13 and the restricting hole 32. The position is restricted, and the circuit board 2 is not moved in the planar direction on the upper surface of the support piece 31. Therefore, the latching claw 17 is not disengaged from the engagement with the end edge portion 33 of the support piece 31, and a stable support state is maintained.

  When removing the circuit board 2 from the chassis 3, as shown in FIG. 5C, the operator presses the release piece 16 in the direction of the arrow D <b> 1, that is, in the direction of the fixing portion 11 with a finger or a jig. As a result, the locking piece 15 is tilted in the direction of the arrow D <b> 2 with the connection portion with the fixing portion 11 as a fulcrum, and the locking claw 17 is released from the engagement with the end edge portion 33 of the support piece 31. Therefore, it is possible to remove the circuit board 2 from the support piece 31 by lifting the circuit board 2 upward while maintaining this state.

  As described above, the substrate support 1 according to the first embodiment can be configured by processing one metal plate, and thus can be configured with a minimum number of parts. In addition, the substrate support 1 is fixed to the circuit board 2 at the fixing portion 11. Since this fixing can be fixed by reflowing of solder or the like, the fixing operation to the circuit board 2 can be automated and the number of steps is reduced. I'll do it. Further, when the circuit board 2 is supported by the chassis 3, it is only necessary to push down the circuit board 2 while inserting the protruding piece 14 of the position restricting portion 13 into the restriction hole 32 provided in the support piece 31 from above. This is also easy. Further, the engagement with the support piece 31 by the locking claw 17 can be released simply by operating the release piece 16, the circuit board 2 can be easily removed from the chassis 3, and the circuit board 2 can be reused. It becomes effective.

  On the other hand, the chassis 3 only needs to be partly cut and bent to form the support piece 31, and there is no need for a truncated cone-shaped part or boss which is a separate member from the chassis as in Patent Documents 1 and 2. And the operation | work which attaches these to the chassis 3 becomes unnecessary. Therefore, the chassis 3 can be manufactured at low cost. Further, as in Patent Documents 1 and 2, it is possible to prevent backlash due to a dimensional error that occurs between the fixture or the mounting member and the truncated cone portion or the boss.

  In the first embodiment, the substrate support 1 is formed of a metal plate, that is, a conductive plate. Therefore, if the fixed land 21 of the circuit board 2 is formed as a part of the ground pattern, the substrate support 1 Can function as a ground terminal. Therefore, the ground pattern of the circuit board 2 can be grounded to the chassis 3 when the locking claw 17 of the board support part 1 and the protruding piece 14 of the position restricting part 13 are in electrical contact with the support piece 31. .

  FIG. 6 is a partially exploded perspective view of the substrate support 1 </ b> A of the second embodiment, and the same reference numerals are given to the parts equivalent to the substrate support 1 of the first embodiment. In the substrate support 1 </ b> A of the second embodiment, a position restricting portion 13 is formed by bending one protruding piece 14 so as to protrude to the back surface side on one side edge of the substantially rectangular fixing portion 11. . In addition, a pair of locking portions 12 are formed at opposite edges of the fixing portion 1.

  The protruding piece 14 of the position restricting portion 13 has the same configuration as the protruding piece of the first embodiment. The configuration of the two locking portions 12 is also the same as that of the first embodiment. The locking piece 15 extends from the side edge of the fixing portion 11 and is bent, and the release piece 16 continuous thereto. It consists of and. Each locking piece 15 is provided with a locking claw 17, and these locking claw 17 are directed inward so as to face each other with the fixing portion 11 interposed therebetween.

  On the other hand, in the circuit board 2 of the second embodiment, one slit-like insertion hole 22 into which the protruding piece 14 of the position restricting portion 13 is inserted is opened along one side of the fixed land 21. Further, two window holes 23 into which the respective locking pieces 15 and release pieces 16 of the two locking portions 12 are inserted are opened at both side positions sandwiching the fixed land 21. These two window holes 23 are formed to be somewhat larger than the planar dimensions of the respective locking portions 12, and the locking portions 12 can be tilted in the window holes 23.

  The operation of mounting the substrate support on the circuit board is performed by an automatic mounting machine as in the first embodiment. At this time, the positioning of the board support 1 </ b> A with respect to the circuit board 2 is performed by inserting one protruding piece 14 into the insertion hole 22. When the fixing portion 11 of the substrate support 1A is fixed to the fixing land 21 of the circuit board 2 by soldering or the like, the projecting piece 14 of the position restricting portion 13 protrudes from the insertion hole 22 to the back side, and the two engagement portions 12 are engaged. Each stop piece 15 protrudes from the window hole 23 to the back side.

  In the chassis 3 of the second embodiment that supports the circuit board 2, a support piece 31 is formed by cutting and raising as in the first embodiment. The width of the support piece 31 is substantially the same as the distance between the two locking pieces 15 of the substrate support 1A facing each other. The support piece 31 has one slit-like restriction hole 32 corresponding to one protrusion 14 of the substrate support 1A.

  Since the process of mounting the board support 1A on the circuit board 2 is the same as that of the first embodiment, the description thereof is omitted here. Further, when the circuit board 2 on which the board support 1 </ b> A is mounted is supported by the chassis 3, the protruding piece 14 of the board support 1 is inserted into the restriction hole 32 as in the first embodiment, The substrate support 1A and the circuit board 2 are positioned. Then, when the circuit board 2 is pushed down toward the support piece 31, as shown in a sectional view in FIG. It moves over the side edge portions 34 on both sides to the lower surface side of the support piece 31, and the locking claw 17 is engaged with the side edge portion 34. As a result, the substrate support 1 </ b> A is in a state where the two locking pieces 15 are engaged so as to sandwich the support pieces 31 from both sides, and the circuit board 2 is supported on the upper surface of the support pieces 31. Supported by

  When the circuit board 2 is removed from the chassis 3, the operator picks the two release pieces 16 from both outsides with fingers or the like, and elastically deforms them in the direction D3 in FIG. As a result, the locking pieces 15 are tilted inward from each other, and the locking claw 17 is released from the engagement with the side edge 34 of the support piece 31. If the circuit board 2 is lifted upward while maintaining this state, the circuit board 2 can be removed from the support piece 31.

  Also in the second embodiment, the substrate support 1A can be configured by processing one metal plate, and therefore can be configured with the minimum number of parts. In addition, since the substrate support 1A can be fixed by reflow, the fixing operation to the circuit board 2 can be automated and the number of steps can be reduced. Furthermore, since the chassis 3 can be formed by cutting and raising the support piece 31, processing work and attachment work by separate members are not required. When the circuit board 2 is supported on the chassis 3, it is only necessary to position the circuit board 2 with respect to the chassis 3 and then press the circuit board 2 against the surface of the chassis 3. Furthermore, the circuit board 2 can be easily detached from the chassis 3 simply by operating the release piece 16 of the board support 1A, which is effective in reusing the circuit board 2.

  Further, in the second embodiment, since the two locking portions 12 are arranged opposite to each other and the two locking pieces 15 support the circuit board 2 with the support pieces 31 sandwiched from both sides, the support is provided. The mechanical strength of the support can be increased and the reliability of the support can be improved. In particular, the support strength can be increased in the direction in which the support piece 31 is sandwiched. The second embodiment is preferably applied when a large circuit board 2 having a relatively large weight is supported.

  The present invention is not limited to the configurations and shapes of the first and second embodiments. For example, when the accuracy of positioning the substrate with respect to the chassis is not required, the position restricting portion may be omitted. When the substrate support is not required to have a conductive function such as grounding, the substrate support may be formed of an insulating material such as resin. In this case, the board supporter may fix the fixing part to the circuit board with an adhesive.

  The support piece in the present invention does not necessarily have the cut and raised shape as in the first and second embodiments. For example, when there is a step portion in the plate thickness direction in the chassis, the engaging portion of the substrate support may be engaged with the edge portion of the step portion. When the chassis is molded with a conductive member, the support piece may be integrally molded. Furthermore, in the case of a support structure that does not require a space between the chassis and the substrate, the locking portion of the substrate support may be engaged with the edge of the chassis.

  The chassis in the present invention may be configured as a case in which a substrate is housed or a housing called a housing.

1, 1A Substrate support 2 Circuit board 3 Chassis 11 Fixing part 12 Locking part 13 Position restricting part 15 Locking piece 16 Release piece 17 Locking claw 21 Fixing land 22 Insertion hole 23 Window hole 31 Supporting piece 32 Restriction hole 33 End Edge 34 Side edge

Claims (5)

  A substrate support for supporting a substrate on a chassis, comprising: a fixing portion fixed to the substrate; and a locking portion protruding from the fixing portion to the back side of the substrate and engaged with the chassis. The locking portion includes a locking piece having a locking claw that engages with an edge of the chassis, and a part of the locking portion extends to the front surface side of the substrate so that the locking claw is engaged. A substrate support comprising a release piece for release.   The substrate support according to claim 1, wherein the substrate support includes a position restricting portion that protrudes toward a back side of the substrate, and the position restricting portion is inserted into a restricting hole that is opened in the chassis.   The said chassis is provided with the support piece which supports the said board | substrate, The latching claw of the said board | substrate support tool is engaged with the edge of the said support piece, The said control hole is opened to the said support piece. Substrate support.   The substrate according to claim 3, wherein the locking claw is formed at a portion of the locking piece facing the fixing portion, and is engaged with an edge of the support piece from outside by an elastic force of the locking piece. Support tool. 5. The substrate support according to claim 2, wherein the fixing portion, the locking portion, and the position restricting portion are integrally formed by processing a conductive plate material.

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