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JP6461822B2 - 半導体装置の実装方法および実装装置 - Google Patents

半導体装置の実装方法および実装装置 Download PDF

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Publication number
JP6461822B2
JP6461822B2 JP2015556832A JP2015556832A JP6461822B2 JP 6461822 B2 JP6461822 B2 JP 6461822B2 JP 2015556832 A JP2015556832 A JP 2015556832A JP 2015556832 A JP2015556832 A JP 2015556832A JP 6461822 B2 JP6461822 B2 JP 6461822B2
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Japan
Prior art keywords
substrate
thermosetting resin
semiconductor device
mounting
plate
Prior art date
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Expired - Fee Related
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JP2015556832A
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English (en)
Japanese (ja)
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JPWO2015105149A1 (ja
Inventor
昇 朝日
昇 朝日
芳範 宮本
芳範 宮本
敏史 竹上
敏史 竹上
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Toray Engineering Co Ltd
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Toray Engineering Co Ltd
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    • H—ELECTRICITY
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
JP2015556832A 2014-01-08 2015-01-08 半導体装置の実装方法および実装装置 Expired - Fee Related JP6461822B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014001890 2014-01-08
JP2014001890 2014-01-08
PCT/JP2015/050380 WO2015105149A1 (ja) 2014-01-08 2015-01-08 半導体装置の実装方法および実装装置

Publications (2)

Publication Number Publication Date
JPWO2015105149A1 JPWO2015105149A1 (ja) 2017-03-23
JP6461822B2 true JP6461822B2 (ja) 2019-01-30

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JP2015556832A Expired - Fee Related JP6461822B2 (ja) 2014-01-08 2015-01-08 半導体装置の実装方法および実装装置

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Country Link
JP (1) JP6461822B2 (zh)
KR (1) KR20160105415A (zh)
TW (1) TWI656582B (zh)
WO (1) WO2015105149A1 (zh)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3791431B2 (ja) * 2002-02-26 2006-06-28 セイコーエプソン株式会社 実装構造体の製造装置
JP4832107B2 (ja) * 2006-02-23 2011-12-07 ソニーケミカル＆インフォメーションデバイス株式会社 実装方法
JP2008294396A (ja) * 2007-04-23 2008-12-04 Hitachi Chem Co Ltd 接続方法、接続装置及び接続方法を用いて得られる接続構造体
JP5417751B2 (ja) * 2008-06-30 2014-02-19 株式会社ニコン 接合装置および接合方法
JP2010114208A (ja) * 2008-11-05 2010-05-20 Nikon Corp 冷却装置および接合システム
JP2010245195A (ja) * 2009-04-02 2010-10-28 Nec Corp 半導体装置の製造装置及び半導体装置の製造方法
JP5602439B2 (ja) * 2010-01-22 2014-10-08 デクセリアルズ株式会社 加熱装置および実装体の製造方法
JP5401709B2 (ja) 2010-02-02 2014-01-29 アピックヤマダ株式会社 半導体装置の接合装置及び接合方法
JP5892682B2 (ja) * 2011-04-27 2016-03-23 アピックヤマダ株式会社 接合方法

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Publication number Publication date
KR20160105415A (ko) 2016-09-06
WO2015105149A1 (ja) 2015-07-16
TW201532161A (zh) 2015-08-16
TWI656582B (zh) 2019-04-11
JPWO2015105149A1 (ja) 2017-03-23

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