JP6213134B2 - Elastic support plate, breaking device and dividing method - Google Patents

Description

  The present invention relates to an elastic support plate, a breaking device, and a cutting method used when cutting a composite substrate in which a resin layer is coated on a brittle material substrate such as a semiconductor substrate or a ceramic substrate.

  A semiconductor chip is manufactured by dividing an element region formed on a semiconductor wafer at a boundary position of the region. Conventionally, when a wafer is divided into chips, a dicing blade is rotated by a dicing apparatus, and the semiconductor wafer is cut into small pieces by cutting.

  However, when using a dicing machine, water is required to discharge the waste generated by cutting, and the semiconductor chip is protected so that the water or the discharged waste does not adversely affect the performance of the semiconductor chip. In addition, a pre- and post-process for cleaning the discharged waste is required. Therefore, the process is complicated, and there is a disadvantage that cost reduction and processing time cannot be shortened. In addition, there is a problem that the film is peeled off or chipped by cutting using a dicing blade. Further, in the MEMS substrate having a minute mechanical structure, the structure is broken by the surface tension of water, so that water cannot be used, and there is a problem that it cannot be divided by dicing.

  Patent Documents 1 and 2 propose a substrate breaker that breaks a semiconductor wafer on which a scribe line is formed by pressing it perpendicularly to the surface along the scribe line from the back surface on which the scribe line is formed. Has been. Hereinafter, an outline of the break by such a break device will be described. It is assumed that a number of functional regions are formed in alignment on a semiconductor wafer to be broken. When dividing, first, scribe lines are formed in the vertical direction and the horizontal direction at equal intervals between the functional areas on the semiconductor wafer. And it breaks with a break device along this scribe line. FIG. 1A shows a cross-sectional view of a semiconductor wafer placed on a breaking device before cutting. As shown in this figure, functional regions 101a, 101b and scribe lines S1, S2, S3,... In the case of dividing, an adhesive tape 102 is attached to the back surface of the composite substrate 101, and a protective film 103 is attached to the surface. In the case of a break, a scribe line to be broken, in this case a scribe line S2, is arranged just in the middle of the receiving blades 105 and 106 as shown in FIG. The composite substrate 101 is pressed. In this way, a break by three-point bending between the pair of receiving blades 105 and 106 and the blade 104 has been performed.

JP 2004-39931 A JP 2010-149495 A

  In the break device having such a configuration, when the blade 104 is pushed down and pressed at the time of the break, the composite substrate 101 is slightly bent, so that the composite substrate 101 and the front edges of the receiving blades 105 and 106 are in contact with each other. Stress is concentrated. For this reason, when the receiving blades 105 and 106 of the breaking device are in contact with the functional areas 101a and 101b as shown in FIG. 1A, force is applied to the functional area at the time of the break. Therefore, there is a problem that the functional area on the semiconductor wafer may be damaged.

  As a substrate to be cut using a break device, there is a composite substrate in which a ceramic resin is coated on a ceramic substrate. The composite substrate may have a functional region such as a lens protruding from the resin layer in each functional region. In such a composite substrate, there is a problem that when the resin layer is directly pressed by a break bar after the ceramic substrate is broken, the resin layer is easily deformed and damaged. In order to solve this problem, there is a problem that if the laser beam is used to divide the laser beam, the laser beam may be damaged by the influence of heat or the scattered objects may adhere to the periphery after the laser irradiation. there were. Further, if the area of the lens or the like protruding from the surface is set downward and brought into contact with the receiving blade, there is a problem that damage may occur when the resin layer is broken.

  The present invention has been made paying attention to such problems, and an object of the present invention is to be able to break a composite substrate on which a brittle material substrate has already been broken without damage.

  In order to solve this problem, the elastic support plate of the present invention is formed by coating a resin on a brittle material substrate having a large number of functional regions formed on one surface and aligned in the longitudinal direction and the lateral direction. An elastic support plate for supporting the composite substrate when dividing the composite substrate having a streaky break line formed in a lattice shape so as to divide the functional region into the material substrate, and at least the same as the composite substrate It is a flat plate made of an elastic member having a shape, and has a protective hole provided at the center position of each of the regions surrounded by the lattice-like break lines.

  In order to solve this problem, the dividing method of the present invention is a method in which a composite substrate in which a resin is coated on a brittle material substrate having a functional region on one surface and a break line is formed so as to divide the functional region. A dividing method for dividing, on an elastic support plate having a protective hole at the center position of each of the regions surrounded by the grid-like break lines, and aligning so that the functional regions of the composite substrate correspond to the protective holes, respectively. Then, the composite substrate is arranged, and the resin layer is broken by pressing the expand bar along the broken line.

  In order to solve this problem, in the breaking device of the present invention, a resin is coated on a brittle material substrate having a functional region on one side, and a break line is formed on the brittle material substrate so as to divide the functional region. A breaking device for breaking a resin layer of a composite substrate, which is a flat plate made of a table and an elastic member having at least a width in the plane direction equivalent to that of the composite substrate, and surrounded by the grid-like break lines An expander having a protective hole provided at the center of each of the regions, an elastic support plate disposed on the table and holding the composite substrate with a surface on which a break line is formed as an upper surface, and an expand bar And a moving mechanism for moving the table along the surface, and a composite on the elastic support plate while keeping the composite substrate and the expanding bar in parallel. Those comprising an elevating mechanism for elevating the expander towards the surface of the plate, the.

  According to the present invention having such a feature, the composite substrate is disposed on the elastic support plate having an opening including the protruding portion of each functional region, and the lowermost line of the streaky expand bar corresponds to the break line. Align and break as you do. Therefore, the effect that the resin layer can be broken along the break line without damaging the functional region is obtained.

FIG. 1 is a cross-sectional view showing a state of a conventional semiconductor wafer during break. FIG. 2 is a front view and a side view of a substrate to be divided according to the embodiment of the present invention. FIG. 3 is a perspective view showing an example of a resin layer breaking device used at the time of breaking according to the present embodiment. FIG. 4 is a perspective view showing an example of an expander used at the time of breaking according to the present embodiment. FIG. 5 is a perspective view showing an elastic support plate according to the embodiment of the present invention. FIG. 6 is a schematic view showing the process of dividing the composite substrate according to this embodiment. FIG. 7 is a schematic view showing the process of breaking the resin layer according to this embodiment.

Next, embodiments of the present invention will be described. FIG. 2 shows a front view and a side view of a composite substrate 10 on which a rectangular semiconductor element is formed as an example of such a substrate. In this embodiment, the composite substrate 10 to be divided is a composite substrate 10 in which a ceramic layer 11 is coated with a resin layer, for example, a silicon resin 12. Here, the division of only the ceramic substrate 11 of the composite substrate 10 is expressed as “break” because the scribe penetrates perpendicularly to the substrate and the division proceeds at a stretch. The division of the silicon resin layer 12 is performed by applying force to the resin layer. Since the cracks of the are gradually spread and tear, it is expressed as “breaking”. Further, the entire division of the composite substrate 10 is expressed as “division”. In the manufacturing process of the composite substrate 10, a large number of functional regions 13 are formed in a lattice shape so as to be aligned vertically and horizontally along lines parallel to the x-axis and y-axis. The functional area 13 is, for example, an LED. Each functional region has a structure 14 such as a lens that protrudes from the surface of the composite substrate 10. Then, in order to divide each functional area into semiconductor chips, as shown by alternate long and short dash lines, scribe lines S _{y1 to} S _yn are arranged at equal intervals in the vertical direction, and scribe lines are arranged at equal intervals in the horizontal direction. S _{x1 to} S _xm are set so that the functional area component is located at the center of the square surrounded by the scribe lines.

  Next, the breaking device 20 used for breaking the resin layer 12 of this embodiment will be described. As shown in FIG. 3, the breaking device 20 has a table 21 that can move and rotate in the y direction. The breaking device 20 is provided below the table 21 with a moving mechanism for moving the table 21 along the surface in the y-axis direction and further rotating along the surface. Then, the composite substrate 10 to be divided is placed on the table 21 via an elastic support plate 40 described later. A U-shaped horizontal fixing member 22 is provided on the upper portion of the table 21, and a servo motor 23 is held on the upper portion. A ball screw 24 is directly connected to the rotation shaft of the servo motor 23, and the lower end of the ball screw 24 is supported so that it can be rotated by another horizontal fixing member 25. The upper moving member 26 is provided with a female screw 27 screwed into the ball screw 24 at the center, and support shafts 28a and 28b from both ends thereof downward. The support shafts 28 a and 28 b pass through a pair of through holes of the horizontal fixing member 25 and are connected to the lower moving member 29. An expander 30 which will be described later is attached to the lower surface of the lower moving member 29 in parallel to the surface of the table 21. As a result, when the ball screw 24 is rotated by the servo motor 23, the upper moving member 26 and the lower moving member 29 move up and down together, and the expander 30 moves up and down simultaneously. Here, the servo motor 23, the horizontal fixing members 22, 25, and the upper and lower moving members 26, 29 constitute an elevating mechanism for elevating the expander 30.

  Next, the expander 30 used when the silicon resin layer is broken will be described. For example, as shown in a perspective view in FIG. 4, the expander 30 includes a large number of streak-like expanded bars 32 a to 32 n that are parallel to the planar base 31. All the ridge lines of each expanding bar constitute one plane. The interval between the expanded bars is constant and may be an integer multiple of 2 or more than the interval between the scheduled scribe lines. In the present embodiment, the interval is twice. The section of each expanded bar is not particularly limited as long as it has a shape having a protrusion that can be pressed along the break line, but is preferably a curved arc as described later. In FIG. 4, the expanded bars 32 a to 32 n are shown to be on the upper surface in order to clearly show them. However, when used, the expanded bars 32 a to 32 n are attached to the lower moving member 29 so as to be downward.

In the present embodiment, the elastic support plate 40 is used when the resin layer of the composite substrate 10 is broken. As shown in the perspective view of FIG. 5, the elastic support plate 40 is a rectangular flat plate made of rubber or the like, and has the same size as the composite substrate 10. For example, the thickness is about several millimeters. To do. The elastic support plate 40 has a large number of circular protective holes 41 aligned vertically and horizontally along lines in the x and y directions at positions corresponding to the regions including the functional regions of the composite substrate 10. The pitches of these protective holes 41 are made to exactly coincide with the pitches of the scribe planned lines S _{x1 to} S _xm and S _{y1 to} S _yn of the composite substrate 10 to be broken, and the scribe planned lines S _{x1 to} S _xm , each protection hole 41 mentioned above the center of each region surrounded by S _y1 to S _yn is formed so as to be located. The protective hole 41 is for preventing a force from being applied to the structure 14 such as a lens of the composite substrate 10 at the time of breakage.

Next, a method for dividing the composite substrate 10 will be described. FIG. 6 is a diagram showing a process of dividing, and FIG. 6A shows a part of the composite substrate 10. First, as shown in FIG. 6B, the scribing wheel 50 is moved by a scribing device (not shown) with the surface of the ceramic substrate 11 as the upper surface, and scribing is performed along the planned scribe line. Then, scribe lines S _{x1 to} S _{xm in} the x direction and scribe lines S _{y1 to} S _yn in the y direction are formed as shown in FIG.

  Next, in the breaking process of the ceramic substrate 11, as shown in FIG. 6C, the composite substrate 10 is first reversed. Then, the break bar 51 is positioned directly above the scribe line already formed using a break device (not shown), and only the ceramic substrate 11 is broken by pushing down the break bar 51.

This ceramic substrate 11 only scribe line S _x1 to S _xm, in a state of being break along the S _y1 to S _yn. FIG. 6D shows a part of the composite substrate 10 that is broken along the scribe lines in the x and y directions. Since the scribe lines S _{x1 to} S _xm and S _{y1 to} S _yn are all broken, they are hereinafter referred to as break lines B _{x1 to} B _xm and B _{y1 to} B _yn .

  Next, a method for completing the division of the substrate 10 by allowing the break line formed on the ceramic substrate 11 to penetrate the silicon resin layer as shown in FIG. 7 will be described. FIG. 7 is a diagram showing a process of breaking the resin layer, and FIG. 7A shows a part of the composite substrate. First, the elastic support plate 40 is disposed on the table 21 of the breaking device 20 described above, and the composite substrate 10 is disposed on the upper surface thereof. At this time, it arrange | positions so that the silicon resin layer 12 may contact | abut to the elastic support plate 40, as shown to Fig.7 (a). At this time, the composite substrate 10 is arranged by positioning so that the structure 14 of the functional region 13 of the composite substrate 10 is completely included in the protective hole 41 of the elastic support plate 40. The cross-sectional view at this time is as shown in FIG. 7A, and all the structures 14 are in positions corresponding to the protective holes 41 and do not directly contact the elastic support plate 40.

The break line of the ceramic substrate 11, for example, S _x1 is the upper surface. Next, the expansion bar of any one of the expanders 30, for example, the lowermost ridge line of 32a is positioned so as to be aligned with the break line.

Next, the servo motor 23 is driven, and the upper moving member 26 and the lower moving member 29 are lowered at the same time, and the expanding bar of the expander 30 is gradually lowered while being kept parallel to the table 21. Then, as shown in FIG. 7B, the expanded bar 32a is pressed against the ceramic substrate 11 from directly above the break line _Bx1 . If it carries out like this, as shown in FIG.7 (c), the ceramic substrate 11 will be pushed and deform | transformed by the expand bar 32a, will sink, and the elastic support plate 40 will similarly deform | transform into a V shape. At this time, as shown in FIG. 7 (b), the composite substrate 10 slightly sinks when the expand bar 32a is pushed in, but protective holes 41 are provided in portions corresponding to the left and right functional regions 13. Therefore, the resin layer 12 of the composite substrate 10 can be broken without the structure 14 projecting from the functional region 13 directly contacting the elastic support plate 40. At this time, the left and right sides of the ceramic substrate are uniformly deformed in response to the pushing of the expand bar 32a, so that the crack can penetrate downward along the break line. Here, the shape of the cross section below the expand bar is not particularly limited. However, for example, in the case of a triangular shape, the necessity of highly accurately positioning the apex to the break line becomes relatively high. Therefore, in order to deform the ceramic substrate 11 and the silicon resin 12 in a balanced manner as described above, the lower cross section of each expanding bar has an arc shape. Thereby, the tolerance | permissible_range of the positioning accuracy which aligns the ridgeline of an expanded bar with a break line is relatively wide. Then, by sufficiently lowering the expanding bar, a crack in the resin progresses and a force to push left and right is applied, and the fracture is completed. When the breakage is completed, the servo motor 23 is reversed to raise the expander 30.

  At this time, the expander 30 has a large number of expanded bars formed in parallel, and the distance between them is twice that of the scribe line. Therefore, the silicon resin 12 can be simultaneously broken along a plurality of break lines. it can.

  Then, by moving the table 21 in the y-axis direction by the break line pitch and lowering the expander 30 in the same manner, the breakage of the resin layer can be completed for the other adjacent break lines. Here, since the interval between the expanded bars is twice the pitch of the scribe lines, all the breaks in the x-axis direction of the composite substrate 10 can be completed by shifting the table 21 once and breaking. When the interval between the expanded bars is three times the pitch of the scribe lines, all the breaks in the x-axis direction can be completed by moving the table 21 twice and breaking.

  Then, the table 21 is rotated by 90 °, and the expander 30 is similarly lowered with respect to the break line of the y-axis to break the resin layer. Then, the table 21 is moved in the y-axis direction by the break line pitch, and the expander 30 is lowered similarly. By doing so, the entire surface is broken, and the resin can be torn along the break lines to divide the square-shaped functional region to form a large number of LED chips.

  In this embodiment, the functional region can be protected by using a large number of protective holes 41 of the elastic support plate 40 as through-holes. However, it is sufficient that the structure 14 of the composite substrate 10 does not contact at the time of breakage. It is good also as a hole of the depth which is not a hole but the structure 14 contacts.

  In this embodiment, the ceramic substrate is described as the base substrate. However, the present invention can also be applied to various brittle material substrates such as a semiconductor substrate and a glass substrate.

  Furthermore, in this embodiment, silicon resin is described as the resin to be applied to the ceramic substrate. However, layers of various other materials, for example, a layer such as a polarizing plate as a layer laminated on a glass substrate may be used. Good.

  Since the present invention can be ruptured without damaging the area to be protected when scribing and dividing the brittle material substrate having the area to be protected, the invention is effectively applied to a substrate breaking apparatus in which the functional area is formed. can do.

DESCRIPTION OF SYMBOLS 10 Composite substrate 11 Ceramic substrate 12 Silicon resin 13 Functional area 14 Structure 20 Breaking device 21 Table 22, 25 Horizontal fixing member 23 Servo motor 24 Ball screw 26, 29 Moving member 30 Expander 31 Base 32a-32n Expand bar 40 Elastic support plate 41 Protection hole

Claims (3)

Resin was coated on a brittle material substrate having a large number of functional regions formed on one surface in alignment in the vertical and horizontal directions, and the brittle material substrate was formed in a lattice shape so as to divide the functional regions. An elastic support plate for supporting the composite substrate when dividing the composite substrate having a streaky break line,
An elastic support plate which is a flat plate made of an elastic member having the same shape as at least the composite substrate, and has a protective hole provided at the center position of each region surrounded by the lattice break lines. A cutting method for dividing a composite substrate in which a resin is coated on a brittle material substrate having a functional region on one side and a break line is formed so as to divide the functional region,
The composite substrate is disposed on an elastic support plate having a protective hole at the center position of each of the regions surrounded by the lattice break lines so that the functional regions of the composite substrate correspond to the protective holes, respectively. ,
A cutting method in which a resin layer is broken by pressing an expanding bar along a broken line. A breaker that breaks a resin layer of a composite substrate in which a resin is coated on a brittle material substrate having a functional region on one side and a break line is formed on the brittle material substrate so as to divide the functional region. ,
Table,
It is a flat plate made of an elastic member having a width in the plane direction equivalent to at least the composite substrate, and has a protective hole provided at the center position of each region surrounded by the lattice-like break line, An elastic support plate that holds the composite substrate with the surface on which the break line is formed as an upper surface;
An expander having an expanded bar;
A moving mechanism for moving the table along its surface;
A breaking device comprising: an elevating mechanism that elevates and lowers the expander toward the surface of the composite substrate on the elastic support plate while keeping the composite substrate and the expanding bar in parallel.