KR20150044374A - Spring supportplate, fracture device and dividing method - Google Patents

Abstract

multi-functional composite substrate has a plurality of functional areas formed and arranged in both longitudinal and traverse directions on one side of it and is coated with resin layers. The present invention allows rupture of the resin layers on the composite substrate whose substrate area is already broken along the break line. The composite substrate (10) is installed with structures (14) protruded to each functional area. The elastic support plate (40) has bigger protective holes (41) than those of other functional areas in the center of the grid-like scribe line pitch and the same-shaped pitch. When rupturing the resin layers of the composite substrate (10), one must align the functional area′s structures (14) to the elastic support plate′s (40) protective holes (41). And then the expand bar is screwed down from above. In this way one can rupture the resin layers (12) without damaging the functional areas (13).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an elastic supporting plate,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an elastic supporting plate, a breaking device, and a cutting method used when a composite substrate on which a resin layer is coated on a brittle material substrate such as a semiconductor substrate or a ceramics substrate is divided.

A semiconductor chip is manufactured by dividing an element region formed on a semiconductor wafer at a boundary position of the region. Conventionally, when dividing the wafer into chips, the dicing blade is rotated by the dicing device, and the semiconductor wafer is cut into small pieces.

However, in the case of using the dicing device, water is required to discharge the discharge layer (residue) discharged by cutting, and the semiconductor chip is protected so that the water and the discharged residue do not adversely affect the performance of the semiconductor chip, A back and forth process is required to clean the water and the discharged debris. Thus, there is a disadvantage that the process becomes complicated and the cost reduction and the processing time are not shortened. Further, there arises a problem that the film is peeled or broken by cutting using the dicing blade. Further, in the MEMS substrate having a fine mechanical structure, since the structure is not broken due to the surface tension of water, water can not be used, and a problem that it can not be divided by dicing has occurred.

Patent Documents 1 and 2 propose a substrate brake apparatus in which a semiconductor wafer on which a scribe line is formed is pressed from the rear surface of the surface on which the scribe line is formed to the surface vertically along the scribe line to break. Hereinafter, the outline of the brake by this brake apparatus is shown. It is assumed that a plurality of functional areas are aligned and formed on a semiconductor wafer to be subjected to braking. In the case of dividing, first, scribe lines are formed on the semiconductor wafer in the longitudinal direction and the transverse direction with the same interval between the functional regions. Then, the braking device is divided along the scribe line. Fig. 1 (a) shows a cross-sectional view of a semiconductor wafer mounted on a brake device before it is divided. As shown in the figure, functional areas 101a and 101b and scribe lines S1, S2, S3, ... are formed on the composite substrate 101. [ In the case of dividing, the adhesive tape 102 is attached to the back surface of the composite substrate 101, and a protective film 103 is attached to the surface. 1 (b), a scribe line, in this case a scribe line S2, to be broken is arranged in the middle of the lower blades 105 and 106, and the blade 104 is scribed from the upper side thereof, And then the composite substrate 101 is pressed. In this way, braking was performed as the pair of lower blades 105 and 106 and the blade 104 were bent.

Patent Document 1: JP-A-2004-39931 Patent Document 2: JP-A-2010-149495

In the brake apparatus having such a configuration, when the blade 104 is pressed and pressed at the time of braking, the composite substrate 101 is slightly bent, so that the front edge of the composite substrate 101 and the lower edges 105, Stress concentrates on the tangent part. Therefore, when the bottom edges 105 and 106 of the braking device are in contact with the functional areas 101a and 101b as shown in Fig. 1 (a), a force is applied to the functional area at the time of braking. Therefore, there is a problem that the functional region on the semiconductor wafer may be damaged.

Further, there is a multifunction device plate in which a silicone resin is coated on a ceramics substrate as a substrate to be divided using a braking device. The composite substrate may have a functional region such as a lens projecting from the resin layer in each functional region. In such a composite substrate, there is a problem that when the resin layer is directly pressed against the brake lever after breaking the ceramic substrate, the resin layer is deformed and easily damaged. Further, if the laser beam is used to separate the laser beam to solve the problem, there is a problem that the laser beam is damaged due to the influence of the laser or the non-product is adhered to the periphery after the laser beam is irradiated. Further, when the area of the lens or the like protruding from the surface is brought into contact with the lower edge with the downward direction, there is a problem that damage may occur at the time of breakage of the resin layer.

SUMMARY OF THE INVENTION The present invention has been made in view of such a problem, and an object thereof is to make it possible to break a composite substrate on which a brittle material substrate is already broken without damaging it.

In order to solve this problem, the elastic support plate of the present invention is characterized in that a resin is coated on a brittle material substrate having a plurality of functional areas formed on one side in the longitudinal direction and in the transverse direction, Wherein the elastic support plate for supporting the composite substrate when dividing the composite substrate having the stripe-shaped break line formed in a lattice shape as divided is a flat plate made of an elastic member at least having the same shape as the composite substrate, And a protection hole provided at a central position of each of the regions surrounded by the break line.

In order to solve this problem, the dividing method of the present invention is a dividing method in which a resin is coated on a brittle material substrate having a functional region on one side, and a composite substrate on which a break line is formed is divided as if dividing the functional region , Arranging the composite substrate so that the functional regions of the composite substrate correspond to the protective holes on the elastic support plate having the protective holes at the respective central positions of the regions surrounded by the lattice-shaped break lines, By pressing the expand bar along the line, the resin layer is broken.

In order to solve this problem, the breaking apparatus of the present invention is characterized in that a resin is coated on a brittle material substrate having a functional region on one side thereof, and a break line is formed on the brittle material substrate, A breakage apparatus for breaking a resin layer, comprising: a table and a flat plate made of an elastic member having an area in the plane direction equal to at least the composite substrate, and a protection hole provided at each center position of the area surrounded by the lattice- An elastic supporting plate disposed on the table and holding the composite substrate with the surface on which the break line is formed as an upper surface; an expander having an expand bar; a moving mechanism for moving the table along the surface; While maintaining the substrate and the expand bar in parallel, the composite substrate on the elastic support plate And an elevating mechanism for elevating and lowering the expander toward the surface.

According to the present invention having such features, the composite substrate is disposed on an elastic support plate having an opening that includes protruding portions of the respective functional regions, and the position of the composite substrate is adjusted so that the bottom line of the stripe- I am breaking it. Therefore, the effect that the resin layer can be broken along the break line without damaging the functional region can be obtained.

1 is a cross-sectional view showing a state of a conventional semiconductor wafer at the time of breaking.
Fig. 2 is a front view and a side view of a substrate to be divided according to the embodiment of the present invention. Fig.
3 is a perspective view showing an example of a resin layer breaking apparatus used at the time of breaking according to the present embodiment.
4 is a perspective view showing an example of an expander used at the time of breaking according to the present embodiment.
5 is a perspective view showing an elastic support plate according to an embodiment of the present invention.
Fig. 6 is a schematic view showing the process of dividing the composite substrate according to this embodiment.
7 is a schematic view showing a process of breaking the resin layer according to this embodiment.

Next, an embodiment of the present invention will be described. 2 shows a front view and a side view of a composite substrate 10 on which a rectangular semiconductor element is formed as an example of such a substrate. In this embodiment, the composite substrate 10 to be cut is a composite substrate 10 on which a resin layer, for example, a silicone resin 12 is coated, on the ceramic substrate 11. [ Here, the division of only the ceramic substrate 11 of the composite substrate 10 is referred to as " brake " because the scribe penetrates perpendicularly to the substrate and the division is progressed at once, and the division of the silicon resin layer 12 is performed by applying a force Since the cracks of the resin layer gradually expand and are torn, it is expressed as " fracture ". The division of the entire composite substrate 10 is expressed as " division ". In the manufacturing process of the composite substrate 10, a plurality of functional regions 13 are formed in a lattice shape in a longitudinal and a transverse direction along a line parallel to the x axis and the y axis. The function area 13 is, for example, an LED. Each functional region has a structure 14 protruding from the surface of the composite substrate 10 such as a lens. In order to divide each functional region into semiconductor chips, a line to be scribed (S _y1 to S _yn ) in the longitudinal direction and a line to be scribed in the horizontal direction (S _x1 To S _xm ), and a part of the functional area is located at the center of the square surrounded by the scribing line.

Next, the breaking apparatus 20 used for breaking the resin layer 12 of this embodiment will be described. The fracture device 20 has a table 21 capable of moving and rotating in the y direction as shown in Fig. The breaking apparatus 20 is provided with a moving mechanism for moving the table 21 along the surface in the y-axis direction below the table 21 and further rotating the table 21 along the surface. The composite substrate 10 to be divided is put on the table 21 through the elastic support plate 40 to be described later. A 'U' -shaped horizontal fixing member 22 is provided on the upper portion of the table 21, and a servomotor 23 is held on the upper portion thereof. A ball screw 24 is directly connected to the rotary shaft of the servo motor 23 and a lower end of the ball screw 24 is supported to be rotatable by a separate horizontal fixing member 25. The upper moving member 26 is provided with a female screw 27 which mates with the ball screw 24 at its center and has supporting shafts 28a and 28b downwardly from both ends thereof. The supporting shafts 28a and 28b are connected to the lower moving member 29 through a pair of through holes of the horizontal fixing member 25. [ On the lower surface of the lower moving member 29, an expander 30, which will be described later, is provided parallel to the surface of the table 21. Accordingly, when the ball screw 24 is rotated by the servomotor 23, the upper movable member 26 and the lower movable member 29 integrally move up and down, and the expander 30 simultaneously moves up and down do. The servomotor 23, the horizontal fixing members 22 and 25 and the upper and lower movable members 26 and 29 constitute an elevating mechanism for raising and lowering the expander 30.

Next, the expander 30 used for breaking the silicon resin layer will be described. As shown in a perspective view in FIG. 4, for example, the expander 30 has a plurality of stripe-shaped expand bars 32a to 32n parallel to the plane base 31, which are formed in parallel. All the ridges of each of these expanded bars constitute one plane. The spacing of the expand bars may be constant and may be an integer multiple of 2 or more of the intervals of the scribing lines, and is doubled in the present embodiment.

The cross section of each expand bar is not particularly limited as long as it has a protruding portion capable of being pressed along the brake line, but it is preferable to form a curved circular arc as described later. In Fig. 4, the upper bars are used to indicate the expand bars 32a to 32n. In use, however, the bars 32a to 32n are provided on the lower bar 29 so as to be downward.

In this embodiment, the elastic support plate 40 is used to break the resin layer of the composite substrate 10. As shown in a perspective view in Fig. 5, the elastic support plate 40 is a jig having elasticity such as a rubber plate of a rectangular plate, and is the same size as the composite substrate 10, and has a thickness of, for example, several millimeters. The elastic support plate 40 has a plurality of circular protective holes 41 arranged vertically and horizontally along the lines in the x and y directions at positions corresponding to the areas including the functional areas of the composite substrate 10 have. The pitch of these protection hole 41 is placed to exactly match the pitch of the planned scribing line (S _x1 ~ S _xm, S _y1 ~ S _yn) of the composite substrate 10 to be subjected to the fracture, the planned scribing line (S _x1 To S _xm , S _y1 to S _{y n} , respectively. The protective hole 41 is provided to prevent the structure 14 such as a lens of the composite substrate 10 from being subjected to a force when it is broken. In this case, the through hole 41 is larger than the structure 14.

Next, a method of dividing the composite substrate 10 will be described. FIG. 6 is a view showing a process of dividing, and FIG. 6 (a) shows a part of the composite substrate 10. First, as shown in Fig. 6 (b), the scribing wheel 50 is moved by a scribing device (not shown) with the surface of the ceramics substrate 11 as an upper surface, and scribed along the planned scribing line. Then, scribe lines (S _x1 to S _xm ) in the x direction and scribe lines (S _y1 to S _yn ) in the y direction are formed as shown in Fig. 2 (a).

Next, in the breaking process of the ceramics substrate 11, the composite substrate 10 is first inverted as shown in Fig. 6 (c). Then, by using a brake device (not shown), the brake bar 51 is positioned just above the scribe line already formed, and only the ceramic substrate 11 is broken by depressing the brake bar 51.

As a result, only the ceramic substrate 11 is in a state of being _broken along the scribe lines S _x1 to S _xm , S _y1 to S _yn . 6 (d) shows a part of the composite substrate 10 that has been broken along the scribe lines in the x direction and the y direction. Since the scribe lines (S _x1 to S _xm , S _y1 to S _{y n} ) are all _broken , the break lines (B _x1 to B _xm , B _y1 to B _yn ) are hereinafter referred to as break lines

Next, as shown in Fig. 7, a method of breaking the substrate 10 by infiltrating the break line formed on the ceramics substrate 11 into the silicon resin layer will be described. FIG. 7 is a view showing a process of breaking the resin layer, and FIG. 7 (a) shows a part of the composite substrate. First, the elastic support plate 40 is disposed on the table 21 of the above-described fracture apparatus 20, and the composite substrate 10 is further disposed on the upper surface thereof. At this time, as shown in Fig. 7 (a), the silicone resin layer 12 is disposed so as to be in contact with the elastic support plate 40. [ At this time, the composite substrate 10 is positioned by determining the position so that the structure 14 of the functional region 13 of the composite substrate 10 is completely contained in the protective hole 41 of the elastic support plate 40. 7 (a), all the structures 14 are located at positions corresponding to the protection holes 41, and are not in direct contact with the elastic support plate 40. [0051] Fig.

The break line of the ceramic substrate 11, for example S _x1, is taken as the upper surface. Then, the position is determined so that the ridge line of the expand bar of any one of the expanders 30, for example, 32a, is aligned with the break line.

Next, the servomotor 23 is driven to gradually lower the upper movable member 26 and the lower movable member 29 while simultaneously keeping the expand bar of the expander 30 parallel to the table 21 . Then, as shown in Fig. 7 (b), the expand bar 32a is pressed against the ceramic substrate 11 just above the break line B _x1 . 7 (c), the ceramic substrate 11 is pressed and deformed by the expand bar 32a, and the elastic support plate 40 similarly deforms into a V-shape. 7B, when the expand bar 32a is pushed in, the composite substrate 10 is slightly submerged. At portions corresponding to the left and right functional regions 13, the protective holes 41 The resin layer 12 of the composite substrate 10 can be broken without directly contacting the protruding structure 14 of the functional region 13 to the elastic support plate 40. [ At this time, the right and left sides of the ceramic substrate are uniformly deformed as the expand bar 32a is pushed in, so that the crack can penetrate downward along the break line. Here, the shape of the lower end surface of the expand bar is not particularly limited. For example, in the case of a triangular shape, the necessity of highly precisely positioning the vertex to the break line becomes relatively high. In order to deform the ceramic substrate 11 and the silicon resin 12 in such a well-balanced manner, the section of the lower side of each expand bar is formed in a circular arc. As a result, the allowable range of the accuracy of positioning for aligning the ridgeline of the expanded bar with the break line is relatively widened. By sufficiently raising the Expand bar, the crack in the resin is advanced, and the force of pushing to the left and right is applied, and the fracture is completed. When the break is completed, the servo motor 23 is reversed to raise the expander 30.

At this time, the expander 30 has a plurality of expand bars formed in parallel, and since the interval is twice the scribe line, the silicone resin 12 can be broken at the same time along the plurality of break lines at one interval have.

Then, the table 21 is moved in the y-axis direction by the pitch of the break line, and the expander 30 is similarly lowered to complete the fracture of the resin layer with respect to other adjacent brake lines. In this case, since the interval of the expand bars is twice as large as the pitch of the scribe lines, the table 21 can be shifted once and broken to complete the fracture of the composite substrate 10 in the x-axis direction. In addition, when the interval of the expand bars is three times the pitch of the scribe lines, the table 21 can be broken twice by moving the table 21 to complete the fracture in the x-axis direction.

Then, the table 21 is rotated by 90 degrees and the expander 30 is similarly lowered against the y-axis break line to break the resin layer. Then, the table 21 is moved in the y-axis direction by the pitch of the break line, and the expander 30 is lowered in the same manner. In this way, the breakage of the front surface is completed, and the resin is torn along the respective brake lines to divide the function area of the square shape, thereby forming a large number of LED chips.

In this embodiment, the plurality of protection holes 41 of the elastic support plate 40 are used as through holes to protect the functional area. However, when the structure 14 of the composite substrate 10 is in contact It is not a through hole but may be a hole having such a depth that the structure 14 does not contact.

In this embodiment, a ceramics substrate is described as a base substrate. However, the present invention can also be applied to various brittle material substrates such as a semiconductor substrate and a glass substrate.

In this embodiment, a silicone resin is described as a resin to be applied to a ceramics substrate. However, a layer of a polarizing plate or the like may be used as a layer of various other materials, for example, a glass substrate.

The present invention can be effectively applied to a fracture apparatus for a substrate on which a functional region is formed since a brittle material substrate having a region to be protected can be scribed and divided without damaging an area to be protected.

10 composite substrate
11 Ceramic substrate
12 silicone resin
13 Function area
14 Structure
20 break device
21 tables
22, 25 horizontal fixing member
23 Servo motor
24 Ball Screw
26, 29 movable member
30 expander
31 base
32a to 32n Expand Bar
40 elastic support plate
41 Protective hole

Claims (3)

A brittle material substrate having a plurality of functional areas formed on one side thereof aligned in the longitudinal direction and the transverse direction is coated with a resin and has a stripe-shaped break line formed in a lattice pattern An elastic supporting plate for supporting the composite substrate when the composite substrate is divided,
And a protection hole provided at each central position of a region enclosed by the lattice-like break line, which is a flat plate made of at least an elastic member having the same shape as the composite substrate. A method of dividing a composite substrate on which a brake line is formed such that a resin is coated on a brittle material substrate having a functional region on one side and the functional region is divided,
The composite substrate is placed on an elastic support plate having a protective hole at each center position of the region surrounded by the lattice-shaped break line so that the functional region of the composite substrate corresponds to the protection hole,
A method of breaking a resin layer by pressing an expand bar along a broken line. A breaking apparatus for breaking a resin layer of a composite substrate on which a resin is coated on a brittle material substrate having a functional region on one side and a break line is formed on the brittle material substrate as if dividing the functional region,
Table,
And a protective hole provided at each central position of an area enclosed by the lattice-like break line, wherein the break line is disposed on the table, An elastic support plate holding the composite substrate with the formed surface as an upper surface,
An expander having an expand bar,
A moving mechanism for moving the table along the surface,
And an elevating mechanism for elevating and lowering the expander toward the surface of the composite substrate on the elastic support plate while maintaining the composite substrate and the expand bar in parallel.

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