JP6115438B2 - Breaking device and cutting method - Google Patents

Description

  The present invention relates to a breaking device and a cutting method for a composite substrate in which a resin layer or the like is coated on a brittle material substrate such as a semiconductor substrate or a ceramic substrate.

  A semiconductor chip is manufactured by dividing an element region formed on a semiconductor wafer at a boundary position of the region. Conventionally, when a wafer is divided into chips, a dicing blade is rotated by a dicing apparatus, and the semiconductor wafer is cut into small pieces by cutting.

  However, when using a dicing machine, water is required to discharge the waste generated by cutting, and the semiconductor chip is protected so that the water or the discharged waste does not adversely affect the performance of the semiconductor chip. In addition, a pre- and post-process for cleaning the discharged waste is required. Therefore, the process is complicated, and there is a disadvantage that cost reduction and processing time cannot be shortened. In addition, there is a problem that the film is peeled off or chipped by cutting using a dicing blade. Further, in the MEMS substrate having a minute mechanical structure, the structure is broken by the surface tension of water, so that water cannot be used, and there is a problem that it cannot be divided by dicing.

  Patent Documents 1 and 2 propose a substrate breaker that breaks a semiconductor wafer on which a scribe line is formed by pressing it perpendicularly to the surface along the scribe line from the back surface of the surface on which the scribe line is formed. Has been. Hereinafter, an outline of the break by such a breaking device will be shown. It is assumed that a number of functional regions are formed in alignment on a semiconductor wafer to be broken. When dividing, first, scribe lines are formed in the vertical direction and the horizontal direction at equal intervals between the functional areas on the semiconductor wafer. And it cut | disconnects with a fracture | rupture apparatus along this scribe line. FIG. 1A shows a cross-sectional view of a semiconductor wafer placed on a breaking device before cutting. As shown in this figure, functional regions 101a, 101b and scribe lines S1, S2, S3,... In the case of dividing, an adhesive tape 102 is attached to the back surface of the composite substrate 101, and a protective film 103 is attached to the surface. In the case of a break, a scribe line to be broken, in this case a scribe line S2, is arranged in the middle of the receiving blades 105 and 106 as shown in FIG. The composite substrate 101 is pressed. In this way, a break by three-point bending between the pair of receiving blades 105 and 106 and the blade 104 has been performed.

JP 2004-39931 A JP 2010-149495 A

  In the breaking device having such a configuration, when the blade 104 is pushed down and pressed at the time of the break, the composite substrate 101 is slightly bent, so the composite substrate 101 and the front edges of the receiving blades 105 and 106 are in contact with each other. Stress is concentrated. For this reason, if the receiving blades 105 and 106 of the breaking device are in contact with the functional areas 101a and 101b as shown in FIG. 1A, a force is applied to the functional area during the break. Therefore, there is a problem that the functional area on the semiconductor wafer may be damaged.

  As a substrate to be cut using a breaking device, there is a composite substrate in which a silicon resin is coated on a ceramic substrate. In such a composite substrate, there is a problem that when the resin layer is directly pressed by a break bar after the ceramic substrate is broken, the resin layer is easily deformed and damaged. In order to solve this problem, there is a problem that if the laser beam is used to divide the laser beam, the laser beam may be damaged by the influence of heat or the scattered objects may adhere to the periphery after the laser irradiation. there were.

  The present invention has been made paying attention to such problems, and an object of the present invention is to be able to break a composite substrate on which a brittle material substrate has already been broken without damage.

  In order to solve this problem, the dividing method of the present invention is such that a resin is coated on a brittle material substrate having a functional region on one side, and a break line is formed on the brittle material substrate so as to divide the functional region. A dividing method for dividing a composite substrate, wherein the composite substrate is disposed on an elastic support plate so that a surface of the brittle material substrate is an upper surface, and an expand bar is pushed along a break line of the brittle material substrate. By doing so, the resin layer is broken.

In order to solve this problem, the dividing method of the present invention is a dividing method for dividing a composite substrate in which a resin is coated on a brittle material substrate having a functional region on one side, the functional region of the composite substrate And scribing the surface of the brittle material substrate that is not coated with resin to form a scribe line, breaking the brittle material substrate of the composite substrate along the scribe line, and the composite substrate arranged such that the surface of the brittle material substrate is the upper surface, it is to break the resin layer by pressing along the d Kisupandoba the break line of the brittle material substrate.

In order to solve this problem, in the breaking device of the present invention, a resin is coated on a brittle material substrate having a functional region on one side, and a break line is formed on the brittle material substrate so as to divide the functional region. a breaking device for breaking the resin layer of the composite substrate that is, a table, a flat plate made of an elastic member having a width of at least the composite substrate equivalent to the planar direction, are arranged on the front Symbol table, break An elastic support plate for holding the composite substrate with the surface on which the line is formed as an upper surface, an expander having an expand bar, a moving mechanism for moving the table along the surface, and the composite substrate and the expand bar. And an elevating mechanism that elevates and lowers the expander toward the surface of the composite substrate on the elastic support plate while maintaining parallelism.

  Here, the expander of the expander may have a lower end section formed in an arc shape.

  According to the present invention having such a feature, the composite substrate is disposed on the elastic support plate, and is aligned and broken so that the lowermost line of the streak-like expanded bar corresponds to the break line. Therefore, the effect that the resin layer can be broken along the break line without damaging the functional region is obtained.

FIG. 1 is a cross-sectional view showing a state of a conventional semiconductor wafer during break. FIG. 2 is a front view and a side view of a substrate to be divided according to the embodiment of the present invention. FIG. 3 is a perspective view showing an example of a resin layer breaking device used at the time of breaking according to the present embodiment. FIG. 4 is a perspective view showing an example of an expander according to the present embodiment. FIG. 5 is a perspective view showing an elastic support plate used at the time of breaking according to the embodiment of the present invention. FIG. 6 is a schematic view showing the process of dividing the composite substrate according to this embodiment. FIG. 7 is a schematic view showing a resin layer dividing process according to this embodiment.

Next, an embodiment of the present invention will be described. FIG. 2 shows a front view and a side view of a composite substrate 10 on which a rectangular semiconductor element is formed as an example of such a substrate. In this embodiment, the composite substrate 10 to be divided is a composite substrate 10 in which a ceramic layer 11 is coated with a resin layer, for example, a silicon resin 12. Here, the division of only the ceramic substrate 11 of the composite substrate 10 is expressed as “break” because the scribe penetrates perpendicularly to the substrate and the division proceeds at a stretch. The division of the silicon resin layer 12 is performed by applying force to the resin layer. Since the cracks of the are gradually spread and tear, it is expressed as “breaking”. Further, the entire division of the composite substrate 10 is expressed as “division”. In the manufacturing process of the composite substrate 10, a large number of functional regions 13 are formed in a lattice shape so as to be aligned vertically and horizontally along lines parallel to the x-axis and y-axis. This functional area 13 is a MEMS functional area in which, for example, LEDs, machine components, sensors, actuators, and the like are built. Then, in order to divide each functional area into semiconductor chips, as shown by alternate long and short dash lines, scribe lines S _{y1 to} S _yn are arranged at equal intervals in the vertical direction, and scribe lines are arranged at equal intervals in the horizontal direction. S _{x1 to} S _xm are set so that the functional area component is located at the center of the square surrounded by the scribe lines.

  Next, the breaking device 20 used for breaking the resin layer according to this embodiment will be described. As shown in FIG. 3, the breaking device 20 has a table 21 that can move and rotate in the y direction. The breaking device 20 is provided below the table 21 with a moving mechanism for moving the table 21 along the surface in the y-axis direction and rotating along the surface. Then, the composite substrate 10 to be divided is placed on the table 21 via an elastic support plate 40 described later. A U-shaped horizontal fixing member 22 is provided on the upper portion of the table 21, and a servo motor 23 is held on the upper portion. A ball screw 24 is directly connected to the rotation shaft of the servo motor 23, and the lower end of the ball screw 24 is supported so that it can be rotated by another horizontal fixing member 25. The upper moving member 26 is provided with a female screw 27 screwed into the ball screw 24 at the center, and support shafts 28a and 28b from both ends thereof downward. The support shafts 28 a and 28 b pass through a pair of through holes of the horizontal fixing member 25 and are connected to the lower moving member 29. An expander 30 which will be described later is attached to the lower surface of the lower moving member 29 in parallel to the surface of the table 21. As a result, when the ball screw 24 is rotated by the servo motor 23, the upper moving member 26 and the lower moving member 29 move up and down together, and the expander 30 moves up and down simultaneously. Here, the servo motor 23, the horizontal fixing members 22, 25, and the upper and lower moving members 26, 29 constitute an elevating mechanism for elevating the expander 30.

  Next, the expander 30 used when the silicon resin layer is broken will be described. For example, as shown in a perspective view in FIG. 4, the expander 30 includes a large number of streak-like expanded bars 32 a to 32 n that are parallel to the planar base 31. All the ridge lines of each expanding bar constitute one plane. The interval between the expanded bars is constant and may be an integer multiple of 2 or more than the interval between the scheduled scribe lines. In the present embodiment, the interval is twice. The section of each expanded bar is not particularly limited as long as it has a shape having a protrusion that can be pressed along the break line, but is preferably a curved arc as described later. In FIG. 4, the expanded bars 32 a to 32 n are shown to be on the upper surface in order to clearly show them. However, when used, the expanded bars 32 a to 32 n are attached to the lower moving member 29 so as to be downward.

  In the present embodiment, the elastic support plate 40 is used when the resin layer of the composite substrate 10 is broken. As shown in the perspective view of FIG. 5, the elastic support plate 40 is a rectangular flat rubber jig having the same size as the composite substrate 10 and has a thickness of, for example, about several mm.

Next, a method for dividing the composite substrate 10 will be described. FIG. 6 is a diagram showing a process of dividing, and FIG. 6A shows a part of the composite substrate 10. First, as shown in FIG. 6B, the scribing wheel 50 is moved by a scribing device (not shown) with the surface of the ceramic substrate 11 as the upper surface, and scribing is performed along the planned scribe line. Then, scribe lines S _{x1 to} S _{xm in} the x direction and scribe lines S _{y1 to} S _yn in the y direction are formed as shown in FIG.

  Next, in the breaking process, as shown in FIG. 6C, first, the composite substrate 10 is inverted. Then, the break bar 51 is positioned directly above the scribe line already formed using a break device (not shown), and only the ceramic substrate 11 is broken by pushing down the break bar 51.

This ceramic substrate 11 only scribe line S _x1 to S _xm, in a state of being break along the S _y1 to S _yn. FIG. 6D shows a part of the composite substrate 10 that is broken along the scribe lines in the x and y directions. Since the scribe lines S _{x1 to} S _xm and S _{y1 to} S _yn are all broken, they are hereinafter referred to as break lines B _{x1 to} B _xm and B _{y1 to} B _yn .

Next, a method for completing the division of the composite substrate 10 by allowing the break line formed on the ceramic substrate 11 to penetrate the silicon resin layer as shown in FIG. FIG. 7 is a diagram showing a process of breaking the resin layer, and FIG. 7A shows a part of the composite substrate. First, the elastic support plate 40 is disposed on the table 21 of the breaking device 20 described above, and the composite substrate 10 is disposed on the upper surface thereof. At this time, as shown in FIG. 7A, the silicon resin layer 12 is disposed so as to contact the elastic support plate 40, and the surface of the ceramic substrate 11 is the upper surface. Next, the expansion bar of any one of the expanders 30, for example, the lowermost ridge line of 32a is positioned so as to be aligned with the break line, for example, _Bx1 . This way, every other expanded bar will be directly above the break line.

Next, the servo motor 23 is driven, and the upper moving member 26 and the lower moving member 29 are lowered at the same time, and the expanding bar of the expander 30 is gradually lowered while being kept parallel to the table 21. Then, as shown in FIG. 7B, the expanded bar 32a is pressed against the ceramic substrate 11 from directly above the break line _Bx1 . If it carries out like this, as shown in FIG.7 (c), the ceramic substrate 11 will be pushed and deform | transformed by the expand bar 32a, will sink, and the elastic support plate 40 will similarly deform | transform into a V shape. At this time, the left and right sides of the ceramic substrate are uniformly deformed in response to the pushing of the expand bar 32a, so that the crack can penetrate downward along the break line. Here, the shape of the cross section below the expand bar is not particularly limited. However, for example, in the case of a triangular shape, the necessity of highly accurately positioning the apex to the break line becomes relatively high. Therefore, in order to deform the ceramic substrate 11 and the silicon resin 12 in a balanced manner as described above, the lower cross section of each expanding bar has an arc shape. Thereby, the tolerance | permissible_range of the positioning accuracy which aligns the ridgeline of an expanded bar with a break line is relatively wide. Then, by sufficiently lowering the expanding bar, a crack in the resin progresses and a force to push left and right is applied, and the fracture is completed. When the breakage is completed, the servo motor 23 is reversed to raise the expander 30.

  At this time, the expander 30 has a large number of expanded bars formed in parallel, and the distance between them is twice that of the scribe line. Therefore, the silicon resin 12 can be simultaneously broken along a plurality of break lines. it can.

  Then, by moving the table 21 in the y-axis direction by the break line pitch and lowering the expander 30 in the same manner, the breakage of the resin layer can be completed for the other adjacent break lines. Here, since the interval between the expanded bars is twice the pitch of the scribe lines, all the breaks in the x-axis direction of the composite substrate 10 can be completed by shifting the table 21 once and breaking. When the interval between the expanded bars is three times the pitch of the scribe lines, all the breaks in the x-axis direction can be completed by moving the table 21 twice and breaking.

  Then, the table 21 is rotated by 90 °, and the expander 30 is similarly lowered with respect to the break line of the y-axis to break the resin layer. Then, the table 21 is moved in the y-axis direction by the break line pitch, and the expander 30 is lowered similarly. By doing so, the entire surface is broken, and the resin is torn along each break line to divide the square-shaped functional region, so that a large number of MEMS chips can be formed.

  In this embodiment, the ceramic substrate is described as the base substrate. However, the present invention can also be applied to various brittle material substrates such as a semiconductor substrate and a glass substrate.

  In this embodiment, the silicon resin is described as the resin to be applied to the ceramic substrate. However, it may be a layer of various other materials, for example, a layer such as a polarizing plate to be laminated on the glass substrate. Good.

  In this embodiment, the expander is a flat plate member having a large number of expand bars on the lower surface. However, the expander is formed by only one expand bar, and the expander is pressed against the composite substrate to break. It may be.

  Since the present invention can be ruptured without damaging the area to be protected when scribing and dividing the brittle material substrate having the area to be protected, the invention is effectively applied to a substrate breaking apparatus in which the functional area is formed. can do.

DESCRIPTION OF SYMBOLS 10 Composite substrate 11 Ceramic substrate 12 Silicon resin 13 Functional area 20 Breaking device 21 Table 22, 25 Horizontal fixing member 23 Servo motor 24 Ball screw 26, 29 Moving member 30 Expander 31 Base 32a-32n Expand bar 40 Elastic support plate

Claims (5)

A cutting method for dividing a composite substrate in which a resin is coated on a brittle material substrate having a functional region on one side and a break line is formed on the brittle material substrate so as to divide the functional region,
The composite substrate is disposed on the elastic support plate so that the surface of the brittle material substrate is the upper surface,
A cutting method for breaking a resin layer by pressing an expand bar along a break line of the brittle material substrate. A cutting method for cutting a composite substrate in which a resin is coated on a brittle material substrate having a functional region on one side,
Scribing the surface of the brittle material substrate that is not coated with resin so as to divide the functional area of the composite substrate to form a scribe line,
Breaking the brittle material substrate of the composite substrate along the scribe line;
The composite substrate is disposed on the elastic support plate so that the surface of the brittle material substrate is the upper surface ,
Cutting method to break the resin layer by pressing along the d Kisupandoba the break line of the brittle material substrate. The dividing method according to claim 1 or 2, wherein the expanded bar has a lower end formed in an arc shape. A breaker that breaks a resin layer of a composite substrate in which a resin is coated on a brittle material substrate having a functional region on one side and a break line is formed on the brittle material substrate so as to divide the functional region. ,
Table,
A flat plate made of an elastic member having at least the width of the composite substrate equivalent planar direction, are arranged on the front Symbol table, and an elastic supporting plate that holds the composite substrate surfaces which break line is formed as the upper surface ,
An expander having an expanded bar;
A moving mechanism for moving the table along its surface;
A breaking device comprising: an elevating mechanism that elevates and lowers the expander toward the surface of the composite substrate on the elastic support plate while keeping the composite substrate and the expanding bar in parallel. The breaking device according to claim 4, wherein the expander of the expander has a lower end section formed in an arc shape.