CN104552630A - Spring support plate, fracture device and dividing method - Google Patents
Spring support plate, fracture device and dividing method Download PDFInfo
- Publication number
- CN104552630A CN104552630A CN201410310194.5A CN201410310194A CN104552630A CN 104552630 A CN104552630 A CN 104552630A CN 201410310194 A CN201410310194 A CN 201410310194A CN 104552630 A CN104552630 A CN 104552630A
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- Prior art keywords
- base plate
- composite base
- brisement
- line
- disjunction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Laminated Bodies (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a spring support plate, a fracture device and a dividing method. Resin layers of a composite substrate can be fractured along a fracture line. One face of the composite substrate is provided with substrate coating resin layers which are orderly arranged longitudinally and transversely so as to form multiple functional areas, and parts of the substrate are fractured at advance. Structural bodies (14) protruding from the functional areas are arranged on the upper surface of the composite substrate (10). Grid-shaped areas which are the same as the lines of the composite substrate (10) in separation distance are distributed on the spring support plate (40). Centers of the areas comprise protection holes (41) larger than the functional areas. When the resin layers of the composite substrate (10) are fractured, the structural bodies (14) of the functional areas are aligned to the protection holes (41) so as to dispose the composite substrate on the spring support plate (40). Then, extension bars are pressed from upper parts and the lower parts. In this way, the resin layers (12) can be fractured without damage to the functional areas (13).
Description
Technical field
The elastic supporting plate, disrumpent feelings device and the method for dividing that use when the present invention relates to a kind of disjunction in the composite base plate of coating resin layer on the brittle substrate such as semiconductor substrate, ceramic substrate.
Background technology
Semiconductor chip is by manufacturing forming element area on the semiconductor wafer in the boundary position disjunction of described element area.In the past, when wafer is divided be broken into chip, by cutter sweep, cutting blade is rotated, thus by cut semiconductor wafer is cut off less.
But; when using cutter sweep, whom must having to discharge because cutting the discharge chip produced, in order to not make this water or discharge chip, harmful effect being produced to the performance of semiconductor chip; front and back step must be had to implement protection to semiconductor chip, and wash water or discharge chip.Therefore, become complicated in steps, shortcoming cost cannot cut down or shorten process time.In addition, because using cutting blade to cut, so the problems such as film stripping or defect can be produced.In addition, in MEMS (Micro-Electro-Mechanical Systems, the MEMS) substrate with milli machine structure, structure destruction can be caused because of the surface tension of water, so water can not be used, thus produce the problem cannot being carried out disjunction by cutting.
In addition, in patent document 1,2, propose a kind of substrate brisement device, by the semiconductor wafer forming line, from the back side forming line one side, along ruling its brisement perpendicular to the pressing of this face.Below, the summary of the brisement utilizing this kind of brisement device is shown.The semiconductor wafer becoming brisement object is formed multiple functional area neatly arrangedly.When carrying out disjunction, first, on the semiconductor wafer, longitudinally and laterally line is formed at equal intervals the spaced apart of functional area.Then, brisement device is utilized to carry out disjunction along this line.Fig. 1 (a) is placed in the sectional view of the semiconductor wafer of brisement device before representing disjunction.As shown in this figure, composite base plate 101 forms functional area 101a, 101b, between functional area 101a, 101b, form line S1, S2, S3....When carrying out disjunction, attaching adhesive tape 102 at the back side of composite base plate 101, attaching diaphragm 103 in its front.Then, when brisement, as shown in Fig. 1 (b), configuring the line of answering brisement in the middle of supporting cutter 105,106, is line S2 in this case, makes blade 104 aim at line decline in portion from it, thus pressing composite base plate 101.In this way, the three-point bending of a pair supporting cutter 105,106 and blade 104 is utilized to carry out brisement.
[background technology document]
[patent document]
[patent document 1] Japanese Patent Laid-Open 2004-39931 publication
[patent document 2] Japanese Patent Laid-Open 2010-149495 publication
Summary of the invention
[inventing the problem that will solve]
In the brisement device with this kind of formation, when being pressed toward pressing down by blade 104 when in brisement, composite base plate 101 meeting warpage a little, therefore, stress can concentrate on the part of the edge contact of composite base plate 101 and supporting cutter 105,106.Therefore, if the part of the supporting cutter of brisement device 105,106 touches functional area 101a, 101b as shown in Fig. 1 (a), so power can be applied to functional area when brisement.Therefore, the problem of the functional area that may damage on semiconductor wafer is had.
In addition, as the substrate using brisement device to carry out disjunction, the composite base plate of silicone-coating on ceramic substrate is had.Composite base plate also has the situation at each functional area with functional areas such as the lens given prominence to from resin bed.In this kind of composite base plate, after by ceramic substrate brisement, directly utilize brisement rod pressing resin bed, in the case, there is resin bed distortion and be easy to the problem that sustains damage.In addition, if want to use laser to carry out disjunction to solve described problem, so existence can sustain damage because of the heat affecting of laser, or after irradiation laser, splash is attached to the problem of periphery.In addition, if the regions such as the lens outstanding from front are made composite base plate as below and support cutter and contact, the problem sustained damage when so there is resin bed disrumpent feelings.
The present invention is conceived to this kind of problem and completes, and its object is to can be disrumpent feelings with no damage by the composite base plate of brisement by brittle substrate.
[technological means of dealing with problems]
In order to solve this problem, elastic supporting plate of the present invention supports described composite base plate when disjunction composite base plate, described composite base plate is coating resin on the brittle substrate that a mask has the multiple functional areas formed in longitudinally and transversely proper alignment, and has at described brittle substrate and be formed as cancellate banded brisement line with breaking function region; Described elastic supporting plate is at least comprise the flat board with the elastic component of described composite base plate same shape, and comprises the protective hole of each center being arranged at the region surrounded by described cancellate brisement line.
In order to solve this problem, method for dividing of the present invention is by the method for dividing of composite base plate disjunction, described composite base plate is coating resin on the brittle substrate that a mask has functional area, and forms brisement line with functional area described in disjunction; And have on the elastic supporting plate of protective hole in each center in the region surrounded by described cancellate brisement line; correspond to the mode of protective hole with each functional area of composite base plate to carry out position alignment and described composite base plate is configured on this elastic supporting plate, by the down companding exhibition rod and resin bed is disrumpent feelings of the line along brisement.
In order to solve this problem, disrumpent feelings device of the present invention is by disrumpent feelings device disrumpent feelings for the resin bed of composite base plate, described composite base plate is coating resin on the brittle substrate that a mask has functional area, and forms brisement line with functional area described in disjunction at described brittle substrate; Described disrumpent feelings device comprises: workbench; Elastic supporting plate, it is at least comprising the flat board of the elastic component of the width with the in-plane equal with described composite base plate, and comprise the protective hole of each center being arranged at the region surrounded by described cancellate brisement line, be configured on described workbench, the face forming brisement line is kept described composite base plate as upper surface; Expander, comprises expansion rod; Travel mechanism, makes described workbench move along its face; And elevating mechanism, keep described composite base plate and expansion rod abreast, while make described expander be elevated towards the face of the composite base plate on described elastic supporting plate.
[effect of invention]
According to the present invention with this kind of feature, composite base plate is configured on the elastic supporting plate of the opening with the ledge comprising each functional area, the mode corresponding to brisement line with the line bottom of banded expansion rod carries out position alignment, thus carries out disrumpent feelings.Therefore, can obtain and can not damage functional area and along brisement line by effect disrumpent feelings for resin bed.
Accompanying drawing explanation
The sectional view of state when Fig. 1 (a), Fig. 1 (b) are the semiconductor wafer brisements represented in the past.
Fig. 2 (a), Fig. 2 (b) are the front view becoming the substrate of disjunction object and the side view of embodiments of the present invention.
Fig. 3 is the stereogram of an example of the disrumpent feelings device of the resin bed used when disrumpent feelings representing present embodiment.
Fig. 4 is the stereogram of an example of the expander used when disrumpent feelings representing present embodiment.
Fig. 5 is the stereogram of the elastic supporting plate representing embodiments of the present invention.
Fig. 6 (a) ~ Fig. 6 (d) is the skeleton diagram of the breaking course of the composite base plate representing this embodiment.
Fig. 7 (a) ~ Fig. 7 (d) is the skeleton diagram of the breaking course of the resin bed representing this embodiment.
Detailed description of the invention
Next, embodiments of the present invention are described.Fig. 2 (a), Fig. 2 (b) show front view and the side view of the composite base plate 10 of the OBL semiconductor element of installation of the example as this kind of substrate.In this embodiment, using the composite base plate 10 of coating resin layer on ceramic substrate 11, such as silicones 12 as disjunction object.Herein, the disjunction of the only ceramic substrate 11 of composite base plate 10 makes delineation vertically penetrate into substrate and carries out disjunction once, therefore this disjunction is expressed as " brisement ", and the disjunction of silicone layer 12 makes the be full of cracks of resin bed expand gradually by applying power and splits, therefore by this disjunction statement " disrumpent feelings ".In addition, the disjunction of composite base plate 10 entirety is expressed as " disjunction ".In the manufacturing step of composite base plate 10, along being parallel to x-axis, the line of y-axis forms multiple functional area 13 in length and breadth neatly arrangedly in lattice shape.This functional area 13 is such as set to LED (Light-Emitting Diode, light emitting diode).Each functional area comprises the structure 14 that lens etc. are given prominence to from the face of composite base plate 10.And, making semiconductor chip to carry out disjunction by each functional area, as shown in some chain lines, longitudinal equally spaced line being set to delineation preset lines S
y1~ S
yn, transversely equally spaced line is set to delineation preset lines S
x1~ S
xm, the part of functional area is positioned at the foursquare central authorities surrounded by these delineation preset lines.
Next, the disrumpent feelings device 20 for disrumpent feelings resin bed 12 of this embodiment is described.As shown in Figure 3, disrumpent feelings device 20 comprises the workbench 21 that can move towards y direction and rotate.In disrumpent feelings device 20, arrange travel mechanism in the below of workbench 21, described travel mechanism makes workbench 21 move in the y-axis direction along its face, and workbench 21 is rotated along its face.And, workbench 21 becomes across following elastic supporting plate 40 mounting the composite base plate 10 of disjunction object.On the top of workbench 21, the horizontal affixation member 22 of U-shaped is set, remains servomotor 23 on the top of horizontal affixation member 22.Directly be connected to ball screw 24 at the rotating shaft of servomotor 23, the lower end of ball screw 24 is supported by another horizontal affixation member 25, and makes ball screw 24 rotatable.Upper mobile member 26 possesses the box thread 27 screwed togather with ball screw 24 at central portion, possess back shaft 28a, 28b downward from the both ends of described upper mobile member 26.A pair through hole of the through horizontal affixation member 25 of back shaft 28a, 28b and be linked to lower mobile member 29.At the lower surface of lower mobile member 29, with the face of workbench 21, following expander 30 is installed abreast.Thus, when making ball screw 24 rotate by servomotor 23, upper mobile member 26 is integrated with lower mobile member 29 one-tenth and moves up and down, and expander 30 also moves up and down simultaneously.Herein, servomotor 23 forms with horizontal affixation member 22,25 and upper and lower mobile member 26,29 elevating mechanism that expander 30 is elevated.
Next, the expander 30 used when disrumpent feelings silicone layer is described.Such as, shown in the stereogram of Fig. 4, expander 30 forms multiple parallel excellent 32a ~ 32n of banded expansion side by side in plane substrate 31.These all crestal lines that respectively expansion is excellent form a plane.In addition, if the interval of expansion rod be fixing and for the interval of delineating preset lines more than 2 integral multiple, be set to 2 times in the present embodiment.And, as long as the cross section of each expansion rod along the shape of the protuberance of brisement line pressing, then can be not particularly limited for having, but be preferably set to as described below as bending arc-shaped.In addition, in the diagram, in order to clearly represent expansion excellent 32a ~ 32n, make expansion rod 32a ~ 32n become upper surface and represent, but be in use expand excellent 32a ~ 32n become below mode be installed on lower mobile member 29.
In the present embodiment, elastic supporting plate 40 is used when the resin bed to disrumpent feelings composite base plate 10.As shown in the perspective view of fig. 5, elastic supporting plate 40 is that the rubber etc. of rectangular flat board has flexible tool, and its size is identical with composite base plate 10, and such as thickness is set to a few millimeter.This elastic supporting plate 40 is corresponding to the position comprising the region of each functional area of composite base plate 10, has in the x-direction and the multiple circular protective hole 41 of line proper alignment in length and breadth in y direction.Make the spacing of these protective hole 41 and the delineation preset lines S of composite base plate 10 becoming disrumpent feelings object
x1~ S
xm, S
y1~ S
ynspacing consistent exactly, described each protective hole 41 is to be positioned at by delineation preset lines S
x1~ S
xm, S
y1~ S
ynthe mode at the center in each region surrounded is formed.This protective hole 41 for not applying power to structures 14 such as the lens of composite base plate 10 when disrumpent feelings, and through hole is larger than structure 14 herein.
Next, the method for disjunction composite base plate 10 is described.Fig. 6 (a), Fig. 6 (b) are the parts that the figure representing breaking course, Fig. 6 (a) represent composite base plate 10.First, as shown in Fig. 6 (b), using the face of ceramic substrate 11 as upper surface, by not shown chalker, stitch marker 50 is moved, rule along delineation preset lines.Thus as shown in Fig. 2 (a), form the line S in x direction
x1~ S
xm, y direction line S
y1~ S
yn.
Next, in the brisement step of ceramic substrate 11, as shown in Fig. 6 (c), first make composite base plate 10 overturn.Then, not shown brisement device is used, directly over the line making brisement rod 51 be positioned to have been formed, by brisement rod 51 is only made ceramic substrate 11 brisement toward pressing down.
Thus, become only ceramic substrate 11 along line S
x1~ S
xm, S
y1~ S
ynthe state of brisement.Fig. 6 (d) represents the part along the composite base plate 10 after each line brisement in x direction and y direction.In addition, rule S
x1~ S
xm, S
y1~ S
ynall by brisement, therefore hereinafter referred to brisement line B
x1~ B
xm, B
y1~ B
yn.
Next, as shown in Fig. 7 (a), Fig. 7 (b), the method terminating the disjunction of composite base plate 10 to making the brisement line being formed at ceramic substrate 11 also extend to silicone layer is described.Fig. 7 is the part that the figure of the fracture representing resin bed, Fig. 7 (a) represent composite base plate.First, the workbench 21 of described disrumpent feelings device 20 configures elastic supporting plate 40, and then configure composite base plate 10 at the upper surface of elastic supporting plate 40.Now, as shown in Fig. 7 (a), configure silicone layer 12 in the mode being connected to elastic supporting plate 40.Now, the mode being contained in the protective hole 41 of elastic supporting plate 40 with the structure 14 of the functional area 13 of composite base plate 10 is completely located and configures composite base plate 10.Sectional view is now the figure shown in Fig. 7 (a), and all structures 14 become the position corresponding to protective hole 41, directly do not contact with elastic supporting plate 40.
Make the brisement line such as S of ceramic substrate 11
x1become upper surface.Then, position in the mode of the crestal line aligning brisement line making the foot of any one expansion rod such as 32a of this expander 30.
Next, drive servomotor 23, mobile member 26 and lower mobile member 29 are declined simultaneously, and the expansion of expander 30 rod is declined on one side gradually relative to workbench 21 keeping parallelism.Then, as shown in Fig. 7 (b), excellent 32a will be expanded from brisement line B
x1directly over press ceramic substrate 11.So, as shown in Fig. 7 (c), ceramic substrate 11 is expanded excellent 32a and presses and be out of shape, and sinks and make elastic supporting plate 40 similarly be deformed into V shape.Now as shown in Fig. 7 (b); when being pressed into expansion excellent 32a, composite base plate 10 can sink a little; but because the part corresponding to functional area 13 about it arranges protective hole 41; so the outstanding structure 14 of functional area 13 can be avoided directly to be contacted with elastic supporting plate 40, and by disrumpent feelings for the resin bed 12 of composite base plate 10.Now, the left and right of ceramic substrate is out of shape, therefore, it is possible to make be full of cracks extend to below along brisement line equably along with the press-in of the excellent 32a of expansion.Herein, the cross sectional shape of the below of expansion rod is not particularly limited, but when such as triangle, carries out accurately the necessity of the location of summit alignment brisement line is uprised relatively.Therefore, in order to make ceramic substrate 11, silicones 12 is out of shape in this way evenly, and the cross section of the below of each expansion rod is set to arc-shaped.Thus, the permissible range of the precision of the location of the crestal line of expansion rod alignment brisement line is made relatively to broaden.And, by making expansion rod sufficient decent, the be full of cracks progress in resin and left and right is applied to the power pushed open, thus terminate disrumpent feelings.If disrumpent feelings end, servomotor 23 is so made to reverse and make expander 30 increase.
Now, form multiple expansion rod side by side at expander 30, and it is spaced apart the twice of line, therefore can makes expansion rod every one along multiple brisement line disrumpent feelings silicones 12 simultaneously.
Then, make workbench 21 in the y-axis direction movement be equivalent to the amount of the spacing of brisement line, similarly make expander 30 decline, thus also can disrumpent feelings for other adjacent brisement toe-in bundle resin beds.Herein, owing to expanding the twice being spaced apart the spacing of line of rod, therefore undertaken by making workbench 21 offset once disrumpent feelingsly just can terminating the disrumpent feelings of all x-axis directions of composite base plate 10.In addition, when expand rod be spaced apart three times of the spacing of line, undertaken by making workbench 21 move twice disrumpent feelingsly just can terminating the disrumpent feelings of all x-axis directions.
Then, make workbench 21 half-twist, the brisement line for y-axis makes expander 30 decline similarly, thus resin bed is disrumpent feelings.Then, make workbench 21 in the y-axis direction movement be equivalent to the amount of the spacing of brisement line, similarly make expander 30 decline.So, terminate whole disrumpent feelings, tear the functional area of resin and disjunction square shape along each brisement line, thus multiple LED chip can be formed.
In addition; in this embodiment; in order to can defencive function region and multiple protective hole 41 of elastic supporting plate 40 are set to through hole; as long as but the structure 14 of composite base plate 10 can not touch elastic supporting plate 40 when disrumpent feelings; also through hole can not be set to, and to be set to the degree of depth be the hole that structure 14 can not touch the degree of elastic supporting plate 40.
In addition, in this embodiment, as the substrate becoming substrate, ceramic substrate is illustrated, but the present invention also goes for the various brittle substrate such as semiconductor substrate or glass substrate.
In addition, in this embodiment, as the resin coating ceramic substrate, silicones is illustrated, but also can be other various materials layer, such as to layers such as the Polarizers of glass substrate lamination.
[industrial utilizability]
The present invention delineating the brittle substrate with the region that should protect during disjunction, can not damage the region that should protect and carrying out disrumpent feelings, therefore, effectively can be applicable to the disrumpent feelings device of the substrate forming functional area.
[explanation of symbol]
10 composite base plates
11 ceramic substrates
12 silicones
13 functional areas
14 structures
20 disrumpent feelings devices
21 workbench
22,25 horizontal affixation member
23 servomotors
24 ball screws
26,29 mobile members
30 expanders
31 substrates
32a ~ 32n expands rod
40 elastic supporting plates
41 protective hole
Claims (3)
1. an elastic supporting plate, it supports described composite base plate when disjunction composite base plate, described composite base plate is coating resin on the brittle substrate that a mask has the multiple functional areas formed in longitudinally and transversely proper alignment, and comprises the banded brisement line that formed in clathrate with breaking function region at described brittle substrate; And
Described elastic supporting plate is at least comprise the flat board with the elastic component of described composite base plate same shape, and comprises the protective hole of each center being arranged at the region surrounded by described cancellate brisement line.
2. a method for dividing, its disjunction composite base plate, described composite base plate is coating resin on the brittle substrate that a mask has functional area, and forms brisement line with functional area described in disjunction; And
Comprise on the elastic supporting plate of protective hole in each center in the region surrounded by described cancellate brisement line, the mode corresponding respectively to protective hole with the functional area of composite base plate is carried out position alignment and configures described composite base plate,
By the line along brisement down companding exhibition rod and resin bed is disrumpent feelings.
3. a disrumpent feelings device, the resin bed of it is disrumpent feelings composite base plate, described composite base plate is coating resin on the brittle substrate that a mask has functional area, and on described brittle substrate, forms brisement line with functional area described in disjunction; Described disrumpent feelings device comprises:
Workbench;
Elastic supporting plate, it is at least comprising the flat board of the elastic component of the area with the in-plane equal with described composite base plate, comprise the protective hole of each center being arranged at the region surrounded by described cancellate brisement line, be configured on described workbench, the face forming brisement line is kept described composite base plate as upper surface;
Expander, comprises expansion rod;
Travel mechanism, makes described workbench along its planar movement; And
Elevating mechanism, keeps described composite base plate and expansion rod abreast, while make described expander towards the composite base plate face lifting on described elastic supporting plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013215393A JP6213134B2 (en) | 2013-10-16 | 2013-10-16 | Elastic support plate, breaking device and dividing method |
| JP2013-215393 | 2013-10-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104552630A true CN104552630A (en) | 2015-04-29 |
| CN104552630B CN104552630B (en) | 2017-11-03 |
Family
ID=53009606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410310194.5A Expired - Fee Related CN104552630B (en) | 2013-10-16 | 2014-07-01 | Elastic supporting plate, disrumpent feelings device and method for dividing |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6213134B2 (en) |
| KR (1) | KR20150044374A (en) |
| CN (1) | CN104552630B (en) |
| TW (1) | TWI607975B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104552614A (en) * | 2013-10-25 | 2015-04-29 | 三星钻石工业股份有限公司 | Cutting method and device of substrate made of fragile material |
| CN106298587A (en) * | 2015-06-29 | 2017-01-04 | 三星钻石工业株式会社 | The substrate-placing portion component of shearing device, the cutting-off method of substrate and shearing device |
| CN111263974A (en) * | 2017-10-27 | 2020-06-09 | 三星钻石工业股份有限公司 | Breaking method of substrate with metal film |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017001180A (en) * | 2016-09-29 | 2017-01-05 | 三星ダイヤモンド工業株式会社 | Surface layer fracturing apparatus of brittle material substrate |
| JP7206829B2 (en) | 2018-11-15 | 2023-01-18 | 日本電気硝子株式会社 | METHOD FOR MANUFACTURING PLATE MEMBER AND LAMINATE |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4133150A1 (en) * | 1991-09-30 | 1993-04-01 | Siemens Ag | Cross cutting semiconductor optical waveguide strip - using linear bottom support and upper pressure plate with spring loaded cutting wedge fitting into etched separating groove |
| JP2001250798A (en) * | 2000-03-06 | 2001-09-14 | Sony Corp | Method and apparatus for dividing material along scribing line |
| CN1348850A (en) * | 2000-10-02 | 2002-05-15 | 三星钻石工业株式会社 | Method and device for mfg. brittle substrates |
| CN1678439A (en) * | 2002-07-02 | 2005-10-05 | 三星钻石工业股份有限公司 | Pasted base board cutting system and base board cutting method |
| CN102329075A (en) * | 2010-07-05 | 2012-01-25 | 三星钻石工业股份有限公司 | Breaking device |
| CN103203806A (en) * | 2012-01-16 | 2013-07-17 | 三星钻石工业股份有限公司 | Method for breaking brittle material substrate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0784006B2 (en) * | 1986-07-29 | 1995-09-13 | 松下電器産業株式会社 | Substrate dividing device |
| WO2003082542A1 (en) * | 2002-04-01 | 2003-10-09 | Mitsuboshi Diamond Industrial Co., Ltd. | Parting method for fragile material substrate and parting device using the method |
-
2013
- 2013-10-16 JP JP2013215393A patent/JP6213134B2/en not_active Expired - Fee Related
-
2014
- 2014-06-23 TW TW103121613A patent/TWI607975B/en not_active IP Right Cessation
- 2014-07-01 CN CN201410310194.5A patent/CN104552630B/en not_active Expired - Fee Related
- 2014-07-29 KR KR20140096313A patent/KR20150044374A/en not_active Application Discontinuation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4133150A1 (en) * | 1991-09-30 | 1993-04-01 | Siemens Ag | Cross cutting semiconductor optical waveguide strip - using linear bottom support and upper pressure plate with spring loaded cutting wedge fitting into etched separating groove |
| JP2001250798A (en) * | 2000-03-06 | 2001-09-14 | Sony Corp | Method and apparatus for dividing material along scribing line |
| CN1348850A (en) * | 2000-10-02 | 2002-05-15 | 三星钻石工业株式会社 | Method and device for mfg. brittle substrates |
| CN1678439A (en) * | 2002-07-02 | 2005-10-05 | 三星钻石工业股份有限公司 | Pasted base board cutting system and base board cutting method |
| CN102329075A (en) * | 2010-07-05 | 2012-01-25 | 三星钻石工业股份有限公司 | Breaking device |
| CN103203806A (en) * | 2012-01-16 | 2013-07-17 | 三星钻石工业股份有限公司 | Method for breaking brittle material substrate |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104552614A (en) * | 2013-10-25 | 2015-04-29 | 三星钻石工业股份有限公司 | Cutting method and device of substrate made of fragile material |
| CN104552614B (en) * | 2013-10-25 | 2018-02-02 | 三星钻石工业股份有限公司 | The cutting-off method and shearing device of brittle substrate |
| CN106298587A (en) * | 2015-06-29 | 2017-01-04 | 三星钻石工业株式会社 | The substrate-placing portion component of shearing device, the cutting-off method of substrate and shearing device |
| CN106298587B (en) * | 2015-06-29 | 2022-01-11 | 三星钻石工业株式会社 | Cutting device, method for cutting substrate, and member for substrate mounting section of cutting device |
| CN111263974A (en) * | 2017-10-27 | 2020-06-09 | 三星钻石工业股份有限公司 | Breaking method of substrate with metal film |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI607975B (en) | 2017-12-11 |
| JP6213134B2 (en) | 2017-10-18 |
| TW201516010A (en) | 2015-05-01 |
| JP2015077711A (en) | 2015-04-23 |
| CN104552630B (en) | 2017-11-03 |
| KR20150044374A (en) | 2015-04-24 |
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