JP4025664B2 - Mounting structure of reinforcing plate on flexible circuit board - Google Patents
Mounting structure of reinforcing plate on flexible circuit board Download PDFInfo
- Publication number
- JP4025664B2 JP4025664B2 JP2003059559A JP2003059559A JP4025664B2 JP 4025664 B2 JP4025664 B2 JP 4025664B2 JP 2003059559 A JP2003059559 A JP 2003059559A JP 2003059559 A JP2003059559 A JP 2003059559A JP 4025664 B2 JP4025664 B2 JP 4025664B2
- Authority
- JP
- Japan
- Prior art keywords
- reinforcing plate
- circuit board
- flexible circuit
- connecting portion
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、金属補強板材料を有する可撓性回路基板の実装用捨て基板と共に出荷する形態であって、金属補強板材料から金属補強板領域を簡便に分離できるようにした可撓性回路基板に於ける補強板の取り付け構造に関する。
【0002】
【従来の技術とその問題点】
この種の可撓性回路基板に於ける補強板の取り付け構造としては、特開2002−16325公報のように、金属補強板材料に離脱しないように連結部を介して区画形成した金属補強板の領域に可撓性回路基板の所定箇所を貼付け、その金属補強板と連結部との境界部の両面部位には形成位置が相互に僅かに異なる溝状の分離用スリットを設けたものがある。
【0003】
しかしこのような構造では、製品側のみに分離部分を設けているので、その連結部位が必ず捨て基板部分に残り、製品のすぐ近傍に破断面が残ることになる。また、この連結部は捨て基板部分と共に実装用ラインに乗せる為、製品とあわせて実装工程を流れることになる。
【0004】
従って、回路基板の形成後、クリーム半田印刷、部品搭載、リフロ−及び洗浄などの回路基板を実際に使用する為に必要な多くの工程を通過する。このため、工程中で連結部が破断して製品に亀裂、打痕や傷を与える場合があり、また、製品搬出時に連結部が引っかかって工程の一時停止を起こす場合や、連結部の切り離し作業中に金属の鋭利な破断面に触れて負傷する危険性もある。
【0005】
そこで、本発明は上記不都合を解消できる可撓性回路基板に於ける補強板の取り付け構造を提供するものである。
【0006】
【課題を解決するための手段】
その為に本発明に係る可撓性回路基板に於ける補強板の取り付け構造では、金属補強板材料に離脱しないように連結部を介して区画形成した金属補強板の領域に可撓性回路基板の所定箇所を貼付け、前記金属補強板と前記連結部との境界部及び前記連結部と捨て基板部との境界部のそれぞれの両面部位には形成位置が相互に僅かに異なる溝状の分離用スリットを設けるように構成したものである。
【0007】
さらに、前記連結部の中央部には、前記連結部を押圧する治具が篏合する形状の切り欠き部を設けるように構成したものである。また、前記溝状の分離用スリットはエッチング手段で同時に形成することができる。
【0008】
【発明の実施の形態】
以下、図示の実施例を参照しながら本発明を更に説明する。図1は本発明による可撓性回路基板に於ける補強板の取り付け構造の要部平面構成図であって、1は可撓性回路基板を含む製品部を示し、2はこの製品部1を連結部3を介して一体に支持する為の捨て基板部である。
【0009】
可撓性回路基板はその所定箇所が、金属補強板材料に離脱しないように連結部3を介して区画形成した金属補強板の領域に貼付けられており、連結部3も金属補強板材料により一体に形成されている。
【0010】
そして、製品部1に於ける金属補強板と連結部3との境界部及び連結部3と捨て基板部2との境界部のそれぞれの両面部位には形成位置が相互に僅かに異なる溝状の分離用スリット4を両面同時のエッチング手段で設けるように構成してある。
【0011】
このように連結部3の両端に溝状の分離用スリット4を設けることによって、連結部3の分離は容易となり、また、他の部分に可撓性回路基板のみで接続部分を設けることにより実装工程前に破断部分を取り除くことができるので、既述した従来の不具合を好適に防止できる。
【0012】
しかし、上記のように分離用スリット4を連結部3の両端に設けただけでは、この連結部3の特性上、一方の分離用スリット4の部分で破断すると他方の分離用スリット4の部分が容易に変形して連結部3が離脱しない場合がある。
【0013】
そこで、連結部3の中央部などに穴状の切り欠き部5を形成し、この切り欠き部5に篏合する先端形状の治具を押し当てると、上記のような不具合を生ずることなく確実に連結部3の分離を行なえる。
【0014】
このような切り欠き部は、図2に示すように連結部3の中央部両側に矩形状の切り欠き部6に形成してもよく、また、図3のようにV字状の切り欠き部7に形成してもよく、いずれにしても連結部3を押す治具の先端形状がその切り欠き部に篏合して分離用スリット4に均等に押圧力がかかる形状であればその他の任意の形状を採用できる。
【0015】
【発明の効果】
本発明に係る可撓性回路基板に於ける補強板の取り付け構造によれば、補強板として金属補強板材料を使用しても製品部と捨て基板部との連結部を容易確実に分離できる。
【0016】
従って、製品の傷、亀裂、打痕の防止など品質の向上を図れるほか、プレス工程やバリ取り作業の削除など工程の省略ができ、また、金属板打ち抜きの為の型も不要であるなどの工具の簡易化も図れる。
【図面の簡単な説明】
【図1】本発明の一実施例による可撓性回路基板に於ける補強板の取り付け構造の要部平面構成図。
【図2】本発明の他の実施例による同様な要部平面構成図。
【図3】本発明の更に他の実施例による同様な要部平面構成図。
【符号の説明】
1 製品部
2 捨て基板部
3 連結部
4 分離用スリット
5 切り欠き部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a flexible circuit board that is shipped together with a discarding board for mounting a flexible circuit board having a metal reinforcing plate material, and in which the metal reinforcing plate region can be easily separated from the metal reinforcing plate material. The present invention relates to a mounting structure of a reinforcing plate.
[0002]
[Prior art and its problems]
As a mounting structure of the reinforcing plate in this type of flexible circuit board, as disclosed in JP-A-2002-16325, a metal reinforcing plate that is partitioned through a connecting portion so as not to be separated from the metal reinforcing plate material. In some cases, a predetermined portion of the flexible circuit board is attached to the region, and groove-shaped separation slits having slightly different formation positions are provided on both surface portions of the boundary portion between the metal reinforcing plate and the connecting portion.
[0003]
However, in such a structure, since the separation portion is provided only on the product side, the connecting portion is always discarded and remains on the substrate portion, and a fracture surface remains in the immediate vicinity of the product. In addition, since this connecting portion is placed on the mounting line together with the discarded substrate portion, it flows through the mounting process together with the product.
[0004]
Therefore, after forming the circuit board, it passes through many processes necessary for actually using the circuit board such as cream solder printing, component mounting, reflow, and washing. For this reason, the connecting part may break during the process, resulting in cracks, dents and scratches on the product, and when the product is unloaded, the connecting part may be caught and the process may be temporarily stopped. There is also a risk of injury by touching the sharp fracture surface of the metal inside.
[0005]
In view of the above, the present invention provides a mounting structure for a reinforcing plate in a flexible circuit board that can eliminate the above disadvantages.
[0006]
[Means for Solving the Problems]
For this purpose, in the mounting structure of the reinforcing plate in the flexible circuit board according to the present invention, the flexible circuit board is formed in the region of the metal reinforcing plate that is partitioned through the connecting portion so as not to be separated from the metal reinforcing plate material. For the separation of the groove shape, the formation positions are slightly different from each other on the both sides of the boundary portion between the metal reinforcing plate and the connecting portion and the boundary portion between the connecting portion and the discarding substrate portion. A slit is provided.
[0007]
Furthermore, the center part of the said connection part is comprised so that the notch part of the shape which the jig | tool which presses the said connection part may engage | combine is provided. The groove-shaped separation slits can be simultaneously formed by etching means.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be further described below with reference to the illustrated embodiments. FIG. 1 is a plan view of a principal part of a mounting structure of a reinforcing plate in a flexible circuit board according to the present invention. 1 is a product part including the flexible circuit board, and 2 is a
[0009]
A predetermined portion of the flexible circuit board is affixed to the region of the metal reinforcing plate formed through the connecting
[0010]
Further, in the
[0011]
Thus, by providing the groove-shaped separation slits 4 at both ends of the connecting
[0012]
However, if the separation slits 4 are only provided at both ends of the connecting
[0013]
Therefore, if a hole-
[0014]
Such a notch may be formed in a rectangular notch 6 on both sides of the central part of the connecting
[0015]
【The invention's effect】
According to the mounting structure of the reinforcing plate in the flexible circuit board according to the present invention, the connecting portion between the product portion and the discarded substrate portion can be easily and reliably separated even if a metal reinforcing plate material is used as the reinforcing plate.
[0016]
Therefore, it is possible to improve the quality by preventing scratches, cracks, and dents on the product, omitting the pressing process and removing the deburring operation, and eliminating the need for a mold for punching the metal plate. Tools can be simplified.
[Brief description of the drawings]
FIG. 1 is a plan view of a principal part of a reinforcing plate mounting structure in a flexible circuit board according to an embodiment of the present invention.
FIG. 2 is a plan view of a similar main part according to another embodiment of the present invention.
FIG. 3 is a plan view of a similar main part according to still another embodiment of the present invention.
[Explanation of symbols]
1
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003059559A JP4025664B2 (en) | 2003-03-06 | 2003-03-06 | Mounting structure of reinforcing plate on flexible circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003059559A JP4025664B2 (en) | 2003-03-06 | 2003-03-06 | Mounting structure of reinforcing plate on flexible circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004273599A JP2004273599A (en) | 2004-09-30 |
JP4025664B2 true JP4025664B2 (en) | 2007-12-26 |
Family
ID=33122340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003059559A Expired - Fee Related JP4025664B2 (en) | 2003-03-06 | 2003-03-06 | Mounting structure of reinforcing plate on flexible circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4025664B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106132079A (en) * | 2016-08-29 | 2016-11-16 | 广东永创鑫电子有限公司 | Flexible circuit board of collapsible moulding a kind of of heat dissipation metal and preparation method thereof |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4549939B2 (en) * | 2005-06-28 | 2010-09-22 | 日東電工株式会社 | Wiring circuit board holding sheet |
-
2003
- 2003-03-06 JP JP2003059559A patent/JP4025664B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106132079A (en) * | 2016-08-29 | 2016-11-16 | 广东永创鑫电子有限公司 | Flexible circuit board of collapsible moulding a kind of of heat dissipation metal and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
JP2004273599A (en) | 2004-09-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4025664B2 (en) | Mounting structure of reinforcing plate on flexible circuit board | |
JPH0855948A (en) | Lead frame and manufacture thereof | |
JPH08125097A (en) | Lead frame | |
JP2526846B2 (en) | Lead cutting method for resin-sealed semiconductor device | |
JPH0722555A (en) | Lead frame structure for semiconductor device and method of cutting | |
JP3008470B2 (en) | Lead frame | |
JPH05326788A (en) | Lead frame material and semiconductor device provided therewith | |
JP2007281133A (en) | Original board, electronic component mounting board, and electronic equipment | |
JP3009175U (en) | Printed wiring board | |
JP5195713B2 (en) | Manufacturing method of electronic parts | |
JP3315155B2 (en) | Printed circuit board manufacturing method | |
JP2538718B2 (en) | Method for manufacturing semiconductor device | |
JP2938038B1 (en) | Tie bar cutting mold | |
JPH03296253A (en) | Lead frame | |
JP6711207B2 (en) | Printed wiring board | |
JP2991174B2 (en) | Lead frame for semiconductor device and method of manufacturing the semiconductor device | |
JPH03169059A (en) | Semiconductor element package | |
JPH0575001A (en) | Lead frame | |
JPS61241957A (en) | Manufacture of leadframe and manufacture of semiconductor device using said leadframe | |
JP2002353681A (en) | Shield plate | |
JPH11179535A (en) | Soldering iron | |
JPH05291456A (en) | Lead frame and processing method therefor | |
JP2593365Y2 (en) | Structure of lead frame for electronic parts | |
KR200160429Y1 (en) | Metal mold for chamfering leadframe pad | |
JP3233159B2 (en) | Terminal connection structure and liquid crystal display |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041126 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070605 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070711 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20070911 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20071005 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101012 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111012 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121012 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121012 Year of fee payment: 5 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131012 Year of fee payment: 6 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |