CN106132079A - Flexible circuit board of collapsible moulding a kind of of heat dissipation metal and preparation method thereof - Google Patents
Flexible circuit board of collapsible moulding a kind of of heat dissipation metal and preparation method thereof Download PDFInfo
- Publication number
- CN106132079A CN106132079A CN201610753940.7A CN201610753940A CN106132079A CN 106132079 A CN106132079 A CN 106132079A CN 201610753940 A CN201610753940 A CN 201610753940A CN 106132079 A CN106132079 A CN 106132079A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- metal
- heat dissipation
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses the flexible circuit board of the collapsible moulding of a kind of heat dissipation metal, including flexible circuit board, polylith metal fin is close to be provided with in the described flexible circuit board back side, is connected by flexible circuit board between described metal fin, and the limit of adjacent metal fin is relative.The invention also discloses the preparation method preparing above-mentioned flexible circuit board.The present invention arranges the metal fin that polylith separates at the flexible circuit board back side, is connected by flexible circuit board, both can realize quick heat radiating, it is possible to carry out fold configuration between metal fin, applied widely.
Description
Technical field
The present invention relates to flexible circuit board, be specifically related to flexible circuit board and the system thereof of the collapsible moulding of a kind of heat dissipation metal
Preparation Method.
Background technology
Existing heat dissipation for circuit board technology major part be heat radiating metal is bonded in circuit board after, but needs folding is made
For the circuit board of type, use heat radiating metal directly to bond, owing to metal is the most pliable, it can be caused to cannot be carried out folding and make
Type.The circuit board of band heat radiating metal as disclosed in the Chinese utility model of Publication No. CN202026521U, discloses and will dispel the heat
Metal invests the technical scheme of circuit board bottom, can well realize the heat radiation of circuit board, but the program is only applicable to hard electricity
Road plate, if circuit board needs to fold, then can rupture and scrap.
Summary of the invention
In order to solve above-mentioned technical problem, it is an object of the invention to provide the collapsible moulding of a kind of heat dissipation metal
Flexible circuit board and preparation method thereof.
The technical solution adopted in the present invention is:
The flexible circuit board of the collapsible moulding of a kind of heat dissipation metal, including flexible circuit board, the described flexible circuit board back side is close to arrange
Having polylith metal fin, connected by flexible circuit board between described metal fin, the limit of adjacent metal fin is relative.
As the further improvement of technique scheme, described metal fin includes one piece of polygonal centre slice, with
And the polylith pleated sheet around centre slice setting.
A kind of preparation method preparing above-mentioned flexible circuit board, comprises the following steps:
S1, the sheet metal of the flexible circuit board of full wafer with full wafer is bonded together；
S2, sticking protecting film on sheet metal, protecting film covers position to be retained；
S3, the sheet metal covered unprotected film by chemical attack mode are dissolved, and make sheet metal be separated into multinugget
Belong to fin.
The invention has the beneficial effects as follows:
The present invention arranges the metal fin that polylith separates at the flexible circuit board back side, between metal fin by flexible circuit board even
Connect, both can realize quick heat radiating, it is possible to carry out fold configuration, applied widely.
Accompanying drawing explanation
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, in embodiment being described below required for make
Accompanying drawing be briefly described.Obviously, described accompanying drawing is a part of embodiment of the present invention rather than all implements
Example, those skilled in the art is not on the premise of paying creative work, it is also possible to other obtained according to these accompanying drawings set
Meter scheme and accompanying drawing.
Fig. 1 is the structural representation of the one of which embodiment of the present invention.
Fig. 2 is the structural representation of the another kind of embodiment of the present invention.
Detailed description of the invention
Below with reference to embodiment and accompanying drawing, the technique effect of design, concrete structure and the generation of the present invention is carried out clearly
Chu, it is fully described by, to be completely understood by the purpose of the present invention, feature and effect.Obviously, described embodiment is this
Bright a part of embodiment rather than all embodiment, based on embodiments of the invention, those skilled in the art is not paying
Other embodiments obtained on the premise of creative work, belong to the scope of protection of the invention.
Providing the first embodiment of the present invention with reference to Fig. 1, Fig. 1, including flexible circuit board 1, described flexible circuit board 1 back side is tight
Being sticked and be equipped with two pieces of metal fins 2, the limit of two pieces of metal fins 2 is relative, and is linked together by flexible circuit board 1.
Providing the second embodiment of the present invention with reference to Fig. 2, Fig. 2, including flexible circuit board 1, described flexible circuit board 1 back side is tight
Being sticked and be equipped with polylith metal fin, described metal fin includes one piece of polygonal centre slice 3, and around centre slice 3
The polylith pleated sheet 4 arranged, a limit of every piece of corresponding centre slice 3 of pleated sheet 4, described centre slice 3 and pleated sheet 4 are by soft electricity
Road plate 1 links together.
The present invention arranges the metal fin that polylith separates at the flexible circuit board back side, passes through flexible circuit between metal fin
Plate connects, and both can realize quick heat radiating, it is possible to carry out fold configuration easily, applied widely.
Present invention also offers the preparation method preparing above-mentioned flexible circuit board, comprise the following steps: S1, soft by full wafer
Circuit board is bonded together with the sheet metal of full wafer；S2, sticking protecting film on sheet metal, protecting film covers position to be retained
Put；S3, the sheet metal covered unprotected film by chemical attack mode are dissolved, and make sheet metal be separated into polylith metal
Fin.
Above concrete structure and sized data are to be illustrated presently preferred embodiments of the present invention, but present invention wound
Making and be not limited to described embodiment, those of ordinary skill in the art it may also be made that kind on the premise of spirit of the present invention
The equivalent variations planted or replacement, deformation or the replacement of these equivalents are all contained in the application claim limited range.
Claims (3)
1. the flexible circuit board of the collapsible moulding of a heat dissipation metal, it is characterised in that: include flexible circuit board, described flexible circuit board
Polylith metal fin is close to be provided with in the back side, is connected by flexible circuit board between described metal fin, and adjacent metal is dispelled the heat
The limit of sheet is relative.
The flexible circuit board of the collapsible moulding of a kind of heat dissipation metal the most according to claim 1, it is characterised in that: described
Metal fin includes one piece of polygonal centre slice, and the polylith pleated sheet arranged around centre slice.
3. the preparation method of the flexible circuit board prepared described in claim 1 or 2, it is characterised in that comprise the following steps:
S1, the sheet metal of the flexible circuit board of full wafer with full wafer is bonded together；
S2, sticking protecting film on sheet metal, protecting film covers position to be retained；
S3, the sheet metal covered unprotected film by chemical attack mode are dissolved, and make sheet metal be separated into multinugget
Belong to fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610753940.7A CN106132079A (en) | 2016-08-29 | 2016-08-29 | Flexible circuit board of collapsible moulding a kind of of heat dissipation metal and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610753940.7A CN106132079A (en) | 2016-08-29 | 2016-08-29 | Flexible circuit board of collapsible moulding a kind of of heat dissipation metal and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106132079A true CN106132079A (en) | 2016-11-16 |
Family
ID=57272074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610753940.7A Pending CN106132079A (en) | 2016-08-29 | 2016-08-29 | Flexible circuit board of collapsible moulding a kind of of heat dissipation metal and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106132079A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4025664B2 (en) * | 2003-03-06 | 2007-12-26 | 日本メクトロン株式会社 | Mounting structure of reinforcing plate on flexible circuit board |
| CN202514167U (en) * | 2012-04-27 | 2012-10-31 | 深圳市盛创新精密电子有限公司 | Connecting structure for hard circuit boards and flexible circuit boards of LED (Light Emitting Diode) strip |
| CN204887674U (en) * | 2015-07-16 | 2015-12-16 | 广东欧珀移动通信有限公司 | Circuit plate structure and terminal |
| CN105263257A (en) * | 2015-10-31 | 2016-01-20 | 张南国 | Foldable circuit board for luminescent lamp |
| CN105674132A (en) * | 2014-11-20 | 2016-06-15 | 深圳市裕富照明有限公司 | LED flexible strip light |
| CN206077824U (en) * | 2016-08-29 | 2017-04-05 | 广东永创鑫电子有限公司 | A kind of flexible circuit board of the foldable moulding of use heat dissipation metal |
-
2016
- 2016-08-29 CN CN201610753940.7A patent/CN106132079A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4025664B2 (en) * | 2003-03-06 | 2007-12-26 | 日本メクトロン株式会社 | Mounting structure of reinforcing plate on flexible circuit board |
| CN202514167U (en) * | 2012-04-27 | 2012-10-31 | 深圳市盛创新精密电子有限公司 | Connecting structure for hard circuit boards and flexible circuit boards of LED (Light Emitting Diode) strip |
| CN105674132A (en) * | 2014-11-20 | 2016-06-15 | 深圳市裕富照明有限公司 | LED flexible strip light |
| CN204887674U (en) * | 2015-07-16 | 2015-12-16 | 广东欧珀移动通信有限公司 | Circuit plate structure and terminal |
| CN105263257A (en) * | 2015-10-31 | 2016-01-20 | 张南国 | Foldable circuit board for luminescent lamp |
| CN206077824U (en) * | 2016-08-29 | 2017-04-05 | 广东永创鑫电子有限公司 | A kind of flexible circuit board of the foldable moulding of use heat dissipation metal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161116 |
|
| RJ01 | Rejection of invention patent application after publication |