CN210489604U - Temperature equalizing plate - Google Patents
Temperature equalizing plate Download PDFInfo
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- CN210489604U CN210489604U CN201921731878.7U CN201921731878U CN210489604U CN 210489604 U CN210489604 U CN 210489604U CN 201921731878 U CN201921731878 U CN 201921731878U CN 210489604 U CN210489604 U CN 210489604U
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- upper plate
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Abstract
The utility model provides a temperature-uniforming plate. This temperature-uniforming plate includes: the device comprises a lower plate, an upper plate, a circle of bulges, a groove, a capillary structure and a brazing filler metal layer, wherein the lower plate and the upper plate are arranged oppositely, the circle of bulges is arranged on one side, facing the upper plate, of the lower plate, the groove is arranged in the upper plate and faces the lower plate, the capillary structure is arranged in the groove, and the brazing filler metal layer is arranged between the lower plate and the upper plate and surrounds the bulges; the groove and the inner part of the bulge jointly form an accommodating cavity; the brazing filler metal layer seals the containing cavity, and the protruding portion can block the brazing filler metal layer from flowing into the containing cavity, so that the brazing filler metal layer is prevented from polluting the capillary structure, the capillary structure is prevented from losing capillary force, and the product yield is improved.
Description
Technical Field
The utility model relates to a heat abstractor field especially relates to a temperature-uniforming plate.
Background
Along with the demand of the current electronic devices for being light and thin as a target board, the size of each component should be reduced accordingly, but the heat generated by the size reduction of the electronic devices becomes a major obstacle for improving the performance of the electronic devices and systems. At present, the Heat dissipation mode of the mobile phone mainly comprises a graphite sheet, a Heat pipe (Heat pipe) and a Vapor chamber (Vapor chamber).
The working principle of the heat pipe is that the inner wall of the heat pipe is provided with a capillary structure, and then the heat pipe is vacuumized and filled with working liquid or filled with the working liquid first and then vacuumized, and finally sealed to form the heat pipe structure. When the working liquid is heated and evaporated by the evaporation part and then is diffused to the condensation end, the working liquid is in a vapor state in the evaporation part, is gradually cooled and condensed to be converted into a liquid state after leaving from the evaporation part and then is diffused to the condensation end, and then flows back to the evaporation part through the capillary structure.
The working principle of the temperature equalizing plate is similar to that of a heat pipe, and the difference is that the heat conduction of the heat pipe is linear transmission in a one-dimensional direction, and the heat conduction of the temperature equalizing plate is linear transmission in a two-dimensional direction. The temperature-uniforming plate mainly comprises an upper plate body, a lower plate body and a cavity arranged between the upper plate body and the lower plate body, wherein working liquid is filled in the cavity, a capillary structure is arranged on the inner wall of the cavity, after the lower plate body is contacted with a heating element (such as a central processing unit, a north-south bridge crystal, a transistor and the like), the working liquid in the cavity is converted into a gaseous state from a liquid state and is transmitted towards the upper plate body, and finally, heat energy is transmitted out by a heat dissipation device (such as a fin) on the temperature-uniforming plate except the region contacted with the heating element or on the outer side of the temperature-uniforming plate, at the moment, the working liquid can be converted back into the liquid state to return to the lower plate body.
The existing manufacturing process of the temperature-equalizing plate comprises the steps of brazing, diffusion welding, laser welding and the like, mainly takes brazing as a main step, specifically comprises the steps of firstly placing brazing filler metal between an upper plate body and a lower plate body of the temperature-equalizing plate, then melting the brazing filler metal to weld the upper plate body and the lower plate body, and the existing brazing process is easy to produce glue overflow (namely the brazing filler metal flows into the inside of the temperature-equalizing plate or flows to the outside of the temperature-equalizing plate) and air leakage (namely the tightness of the upper plate body and the lower plate body is poor), so that the production yield of the temperature-equalizing plate is low, and the industrial.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a temperature-uniforming plate can block the brazing filler metal layer and flow into and hold the chamber, improves the product yield.
In order to achieve the above object, the utility model provides a vapor chamber, include: the device comprises a lower plate, an upper plate, a circle of bulges, a groove, a capillary structure and a brazing filler metal layer, wherein the lower plate and the upper plate are arranged oppositely, the circle of bulges is arranged on one side, facing the upper plate, of the lower plate, the groove is arranged in the upper plate and faces the lower plate, the capillary structure is arranged in the groove, and the brazing filler metal layer is arranged between the lower plate and the upper plate and surrounds the bulges;
the groove and the inner part of the bulge jointly form an accommodating cavity; the solder layer seals the accommodating cavity.
A dispensing space is formed between the lower plate and the upper plate corresponding to the outer part of the boss, and the brazing filler metal layer is positioned in the dispensing space; the volume of the dispensing space is larger than that of the brazing filler metal layer.
The capillary structure is a copper net, a steel net or a titanium alloy net.
And working liquid for heat dissipation is filled in the capillary structure.
The temperature equalizing plate also comprises a plurality of supporting structures which are arranged on the upper side of the lower plate element and face the upper plate element; the support structure is located in the receiving cavity.
The support structure is cylindrical, truncated cone-shaped, ellipsoid-shaped or cuboid-shaped.
The thickness of the support structure is equal to the thickness of the boss.
The utility model has the advantages that: the utility model discloses a temperature-uniforming plate includes: the device comprises a lower plate, an upper plate, a circle of bulges, a groove, a capillary structure and a brazing filler metal layer, wherein the lower plate and the upper plate are arranged oppositely, the circle of bulges is arranged on one side, facing the upper plate, of the lower plate, the groove is arranged in the upper plate and faces the lower plate, the capillary structure is arranged in the groove, and the brazing filler metal layer is arranged between the lower plate and the upper plate and surrounds the bulges; the groove and the inner part of the bulge jointly form an accommodating cavity; the brazing filler metal layer seals the containing cavity, and the protruding portion can block the brazing filler metal layer from flowing into the containing cavity, so that the brazing filler metal layer is prevented from polluting the capillary structure, the capillary structure is prevented from losing capillary force, and the product yield is improved.
Drawings
For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the present invention and accompanying drawings, which are provided for the purpose of illustration and description and are not intended to limit the present invention.
In the drawings, there is shown in the drawings,
FIG. 1 is a cross-sectional view of a vapor chamber of the present invention;
fig. 2 is an exploded view of the vapor chamber of the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Referring to fig. 1 and 2, the present invention provides a vapor chamber, including: a lower plate 10 and an upper plate 20 which are oppositely arranged, a circle of bulges 11 which are arranged on the upper side of the lower plate 10 facing the upper plate 20, grooves 21 which are arranged in the upper plate 20 and face the lower plate 10, capillary structures 22 which are arranged in the grooves 21, and a solder layer 30 which is arranged between the lower plate 10 and the upper plate 20 and surrounds the bulges 11;
the groove 21 and the inner part of the boss 11 jointly form an accommodating cavity 50; the solder layer 30 seals the receiving space 50.
It should be noted that, the utility model discloses lower plate 10 has set up round bellying 11 towards plate 20 one side, has set up recess 21 at upper plate 20 towards lower plate 10 one side, and recess 21 constitutes one jointly with the inside of bellying 11 and holds chamber 50 so, brazing filler metal layer 30 locates down between plate 10 and the upper plate 20 and surrounds bellying 11, when melting brazing filler metal layer 30 through brazing makes lower plate 10 and upper plate 20 butt fusion, this brazing filler metal layer 30 can seal the clearance between lower plate 10 and the upper plate 20 to sealed chamber 50 that holds, and bellying 11 can block during molten brazing filler metal layer 30 flows into and holds chamber 50, prevent that brazing filler metal layer 30 from polluting capillary structure 22, and then avoid capillary structure 22 to lose the capillary force, improve the product yield.
Specifically, a dispensing space 40 is formed between the lower plate 10 and the upper plate 20 corresponding to the outside of the protruding portion 11 (the dispensing space 40 is a semi-closed space), and the solder layer 30 is located in the dispensing space 40; the volume of the dispensing space 40 is larger than that of the solder layer 30, so that the melted solder layer 30 can be prevented from flowing to the outside of the temperature equalization plate.
Further, the capillary structure 22 is a copper mesh, a steel mesh or a titanium alloy mesh, but may be other materials having a capillary action.
Specifically, the capillary structure 22 is filled with a working fluid for heat dissipation, that is, the working fluid is filled in the mesh gaps, after the lower plate 10 contacts a heating element (such as a central processing unit, a north-south bridge crystal, a transistor, etc.), the working fluid is converted from a liquid state to a gas state and is transmitted toward the upper plate 20, and finally, heat energy is transmitted by a heat dissipation device (such as a fin) on the temperature equalization plate or outside the temperature equalization plate except for the region contacting the heating element, at this time, the working fluid is converted back to the liquid state and returns to the lower plate 10, and the next heat dissipation cycle is performed again.
Specifically, the temperature equalization plate further comprises a plurality of support structures 12 arranged on one side of the lower plate member 10 facing the upper plate member 20; the support structure 12 is located in the receiving cavity 50 and is used for supporting the capillary structure 22 and preventing the capillary structure 22 from deforming.
Further, the shape of the supporting structure 12 is cylindrical, truncated cone, ellipsoid or cuboid, but may also be other shapes with supporting function.
In particular, the thickness of the support structure 12 is equal to the thickness of the projections 11, in order to better support the capillary structure 22.
To sum up, the utility model discloses a temperature-uniforming plate includes: the device comprises a lower plate, an upper plate, a circle of bulges, a groove, a capillary structure and a brazing filler metal layer, wherein the lower plate and the upper plate are arranged oppositely, the circle of bulges is arranged on one side, facing the upper plate, of the lower plate, the groove is arranged in the upper plate and faces the lower plate, the capillary structure is arranged in the groove, and the brazing filler metal layer is arranged between the lower plate and the upper plate and surrounds the bulges; the groove and the inner part of the bulge jointly form an accommodating cavity; the brazing filler metal layer seals the containing cavity, and the protruding portion can block the brazing filler metal layer from flowing into the containing cavity, so that the brazing filler metal layer is prevented from polluting the capillary structure, the capillary structure is prevented from losing capillary force, and the product yield is improved.
From the above, it is obvious to those skilled in the art that various other changes and modifications can be made according to the technical solution and the technical idea of the present invention, and all such changes and modifications should fall within the protection scope of the claims of the present invention.
Claims (7)
1. A vapor chamber, comprising: the device comprises a lower plate (10) and an upper plate (20) which are oppositely arranged, a circle of bulges (11) which are arranged on one side of the lower plate (10) facing the upper plate (20), a groove (21) which is arranged in the upper plate (20) and faces the lower plate (10), a capillary structure (22) which is arranged in the groove (21), and a brazing filler metal layer (30) which is arranged between the lower plate (10) and the upper plate (20) and surrounds the bulges (11);
the groove (21) and the inner part of the bulge (11) jointly form an accommodating cavity (50); the solder layer (30) seals the receiving space (50).
2. The temperature equalization plate according to claim 1, wherein a dispensing space (40) is formed between the lower plate member (10) and the upper plate member (20) corresponding to the outside of the protrusion (11), and the solder layer (30) is located in the dispensing space (40); the volume of the dispensing space (40) is larger than that of the solder layer (30).
3. The vapor plate of claim 1, wherein the capillary structure (22) is a copper mesh, a steel mesh, or a titanium alloy mesh.
4. The vapor-deposition plate according to claim 1, wherein the capillary structure (22) is filled with a working liquid for heat dissipation.
5. A temperature-uniforming plate according to claim 1, further comprising a plurality of support structures (12) provided on the lower plate member (10) on a side thereof facing the upper plate member (20); the support structure (12) is located in the receiving cavity (50).
6. A vapor-distribution plate according to claim 5, characterized in that said supporting structure (12) has the shape of a cylinder, a truncated cone, an ellipsoid or a cuboid.
7. A temperature-uniforming plate according to claim 5, wherein the thickness of the support structure (12) is equal to the thickness of the boss (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921731878.7U CN210489604U (en) | 2019-10-15 | 2019-10-15 | Temperature equalizing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921731878.7U CN210489604U (en) | 2019-10-15 | 2019-10-15 | Temperature equalizing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210489604U true CN210489604U (en) | 2020-05-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921731878.7U Active CN210489604U (en) | 2019-10-15 | 2019-10-15 | Temperature equalizing plate |
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| CN (1) | CN210489604U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112461025A (en) * | 2020-12-15 | 2021-03-09 | 爱美达（深圳）热能系统有限公司 | Temperature equalizing plate |
| WO2021238662A1 (en) * | 2020-05-26 | 2021-12-02 | 广州力及热管理科技有限公司 | Thin vapor chamber element structure and manufacturing method therefor |
| WO2022025251A1 (en) * | 2020-07-31 | 2022-02-03 | 日本電産株式会社 | Heat conduction member |
-
2019
- 2019-10-15 CN CN201921731878.7U patent/CN210489604U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021238662A1 (en) * | 2020-05-26 | 2021-12-02 | 广州力及热管理科技有限公司 | Thin vapor chamber element structure and manufacturing method therefor |
| WO2022025251A1 (en) * | 2020-07-31 | 2022-02-03 | 日本電産株式会社 | Heat conduction member |
| CN112461025A (en) * | 2020-12-15 | 2021-03-09 | 爱美达（深圳）热能系统有限公司 | Temperature equalizing plate |
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Address after: 518000 room 1204, C12 / F, building 2, software industry base, No. 87, 89 and 91, Gaoxin South 10th Road, Binhai community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Leishi Thermal Management Technology Co.,Ltd. Address before: 518000 room 1204, C12 / F, building 2, software industry base, No. 87, 89 and 91, Gaoxin South 10th Road, Binhai community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: STONEPLUS THERMAL MANAGEMENT TECHNOLOGIES Ltd. |
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| CP01 | Change in the name or title of a patent holder |