CN221829315U - Vapor chamber and electronic equipment - Google Patents
Vapor chamber and electronic equipment Download PDFInfo
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- CN221829315U CN221829315U CN202323288636.4U CN202323288636U CN221829315U CN 221829315 U CN221829315 U CN 221829315U CN 202323288636 U CN202323288636 U CN 202323288636U CN 221829315 U CN221829315 U CN 221829315U
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- 238000002791 soaking Methods 0.000 claims abstract description 125
- 238000007789 sealing Methods 0.000 claims abstract description 107
- 238000005219 brazing Methods 0.000 claims abstract description 45
- 238000001816 cooling Methods 0.000 claims abstract description 23
- 230000003014 reinforcing effect Effects 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 27
- 239000002131 composite material Substances 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 12
- 230000002787 reinforcement Effects 0.000 claims description 10
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- 239000003351 stiffener Substances 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 abstract description 10
- 238000003825 pressing Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 58
- 230000008569 process Effects 0.000 description 40
- 239000007788 liquid Substances 0.000 description 33
- 238000004519 manufacturing process Methods 0.000 description 26
- 239000002826 coolant Substances 0.000 description 19
- 238000002347 injection Methods 0.000 description 15
- 239000007924 injection Substances 0.000 description 15
- 238000009434 installation Methods 0.000 description 14
- 238000012545 processing Methods 0.000 description 13
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 12
- 238000010586 diagram Methods 0.000 description 10
- 238000001704 evaporation Methods 0.000 description 10
- 230000008020 evaporation Effects 0.000 description 10
- 239000012071 phase Substances 0.000 description 10
- 238000005530 etching Methods 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000009833 condensation Methods 0.000 description 5
- 230000005494 condensation Effects 0.000 description 5
- 239000007791 liquid phase Substances 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 239000012808 vapor phase Substances 0.000 description 5
- 238000003475 lamination Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 2
- 230000003190 augmentative effect Effects 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application relates to a vapor chamber and an electronic device, the soaking plate comprises a first cover plate, a second cover plate, a connecting piece, a first brazing layer, a second brazing layer and a capillary structure. The connector includes a sealing portion and a supporting portion. The sealing part is positioned between the periphery of the first cover plate and the periphery of the second cover plate. The supporting part is connected to the periphery of the sealing part and protrudes relative to the periphery of the first cover plate and the periphery of the second cover plate. The first brazing layer is sealingly connected between the sealing portion and the peripheral edge of the first cover plate. The second brazing layer is sealingly connected between the sealing portion and the periphery of the second cover plate. The second brazing layer, the first cover plate, the sealing part and the second cover plate jointly form a sealing cavity. A cooling working medium is arranged in the sealing cavity. The capillary structure is located within the sealed cavity. According to the technical scheme, the structure of the vapor chamber can be adjusted, so that the connection of the pressing position of the vapor chamber with other structures of electronic equipment is avoided, and the sealing performance of the vapor chamber is not affected after the vapor chamber is subjected to external force.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a vapor chamber and electronic equipment.
Background
With the gradual improvement of the performance of electronic devices such as mobile phones and notebook computers, components with stronger operation and processing capabilities are easy to generate a large amount of heat instantaneously, so that the temperature of a local area of the electronic device is rapidly increased, and the normal operation of the components is affected. In order to solve the problem of local high temperature of electronic equipment, a vapor chamber with high heat dissipation capacity is applied to the electronic equipment.
The vapor chamber generally comprises two cover plates which are pressed up and down. The edges of the two cover plates are pressed together to form a sealed cavity. The sealing cavity is internally provided with a liquid cooling working medium. The lamination area of the vapor chamber can be directly assembled and connected with other structures of the electronic equipment. When the soaking plate receives external force, interaction force is easy to generate between the lamination area of the soaking plate and other structures of the electronic equipment, the external force can lead to deformation of the lamination area of the soaking plate, the tightness of the lamination area is affected, and finally liquid cooling working medium in the soaking plate is easy to leak.
Disclosure of utility model
The embodiment of the application provides a vapor chamber and electronic equipment, wherein the structure of the vapor chamber can be adjusted, and the connection of the pressing position of the vapor chamber with other structures of the electronic equipment is avoided, so that the sealing performance of the vapor chamber is not affected after the vapor chamber is subjected to external force.
In a first aspect, the present application provides a vapor chamber including a first cover plate, a second cover plate, a connector, a first braze layer, a second braze layer, and a capillary structure. The second cover plate is arranged opposite to the first cover plate. The connector includes a sealing portion and a supporting portion. The sealing part is positioned between the periphery of the first cover plate and the periphery of the second cover plate. The supporting part is connected to the periphery of the sealing part and protrudes relative to the periphery of the first cover plate and the periphery of the second cover plate. The first brazing layer is sealingly connected between the sealing portion and the peripheral edge of the first cover plate. The second brazing layer is sealingly connected between the sealing portion and the periphery of the second cover plate. The second brazing layer, the first cover plate, the sealing part and the second cover plate jointly form a sealing cavity. A cooling working medium is arranged in the sealing cavity. The capillary structure is located within the sealed cavity.
Wherein, the thickness range of the plate body of the first cover plate is between 0.01mm and 0.05 mm.
Wherein, the thickness range of the plate body of the second cover plate is between 0.01mm and 0.05 mm.
According to the application, the first cover plate, the second cover plate and the connecting piece are respectively molded, so that the processing of the connecting piece on the first cover plate and/or the second cover plate can be avoided, the processing process of the first cover plate and the second cover plate is reduced, the yield of the first cover plate and the second cover plate is improved, the stable volume production is facilitated, and the production cost of the vapor chamber is reduced.
Furthermore, when the supporting part protrudes relative to the first cover plate and the second cover plate, the supporting part can be directly overlapped with other structures of the electronic equipment. When the electronic device is impacted by an external force, the impact force can be transmitted from the mounting structure of the electronic device to the support portion of the vapor chamber. Because the supporting part is not directly connected with the first cover plate and the second cover plate, external force can be transmitted to the sealing part after being buffered and attenuated by the supporting part, and the external force acting on the supporting part can not directly influence the sealing stability among the first cover plate, the second cover plate and the sealing part. The sealing area of the vapor chamber is prevented from being directly impacted. Therefore, the leakage position of the sealing area among the first cover plate, the second cover plate and the connecting piece is avoided, and the leakage of the cooling working medium in the soaking plate is prevented. According to the application, the supporting part is protruded relative to the first cover plate and the second cover plate, so that the soaking plate can be connected with the mounting piece through the supporting part, the stress mode of the soaking plate when the soaking plate is impacted is changed, and the sealing performance of the soaking plate when the soaking plate is subjected to external force is not easily affected.
In this embodiment, the first cover plate, the second cover plate and the connecting member are three separate structures. Therefore, the first cover plate and the connecting piece and the second cover plate and the connecting piece are all required to be connected through brazing.
In one possible embodiment, the thickness of the support portion is greater than the sum of the thickness of the sheet material of the first cover plate and the thickness of the sheet material of the second cover plate.
In this embodiment, the first cover plate, the second cover plate and the connecting member are manufactured separately by adopting a disassembly scheme. Rather than forming the edges of the first cover plate and/or the edges of the second cover plate into a connection. Therefore, under the condition that the thicknesses of the plate body of the first cover plate and the plate body of the second cover plate of the vapor chamber are reduced as much as possible, the thickness of the connecting piece is not influenced by the thickness of the plate body of the first cover plate and the thickness of the plate body of the second cover plate. The thickness of the connecting piece can be larger than the sum of the thickness of the plate body of the first cover plate and the thickness of the plate body of the second cover plate, the structural strength of the connecting piece can meet the installation requirement of the vapor chamber, and the connection stability of the vapor chamber and the installation piece is improved.
In one possible embodiment, the thickness of the support is greater than or equal to 0.05mm.
In this embodiment, when the thickness of the supporting portion is too small, the structural strength of the supporting portion is low, and the supporting portion is easily deformed or broken under the impact of external force, so that the vapor chamber cannot be connected with the mounting structure of the electronic device. When the thickness of the supporting part is greater than or equal to 0.05mm, the supporting part can bear most of external force in the use process of a user to ensure that the structure is not deformed, so that the stability of connection of the vapor chamber and the mounting structure of the electronic equipment is ensured.
In a possible embodiment, the tensile strength of the support is greater than or equal to 150MPa, and/or the elastic modulus of the support is greater than or equal to 100GPa, and/or the micro vickers hardness of the support is greater than or equal to 50HV.
In this embodiment, the yield strength of the support portion is 300Mpa or more. It is known that the yield strength is the yield limit at which the metallic material yields, i.e. the stress that resists minor plastic deformation. External forces greater than the yield strength will permanently fail the part and fail to recover. According to the embodiment of the application, the yield strength of the supporting part is improved, so that the supporting part is not easy to deform in a shaping way under the condition of impact, and the vapor chamber is prevented from falling off from the mounting structure of the electronic equipment. The elastic modulus of the support part is greater than or equal to 100Gpa. It is known that the greater the modulus of elasticity, the less likely the material will deform, and the greater the stiffness and hardness. According to the embodiment of the application, the elastic modulus of the supporting part is improved, so that the hardness of the supporting part is improved, the supporting part is prevented from being scratched and rubbed in the processes of processing, assembling and the like, and the situation that the surface of the supporting part is uneven and cannot be stably connected with the mounting structure of the electronic equipment is avoided. The mounting structure of the vapor chamber and the electronic equipment is ensured to have higher connection strength.
In a possible implementation manner, the material of the first cover plate and the material of the second cover plate comprise copper, copper alloy plates, copper steel composite or copper-titanium composite plates, and the material of the connecting piece comprises copper or copper alloy plates.
The first cover plate and the second cover plate are made of non-copper-aluminum composite plates.
In this embodiment, the first cover plate and the second cover plate of the present application are made of a non-copper-aluminum composite plate material. The soaking plate of the application adopts a brazing process with the temperature of more than 600 ℃ to weld the first cover plate, the connecting piece and the second cover plate. The melting point of the aluminum alloy in the copper-aluminum composite board is about 660 ℃. The brazing process temperature employed in the embodiments of the present application is generally near or above the melting point of aluminum in the copper aluminum composite sheet. In the brazing process, the copper-aluminum composite plate can be subjected to material soft change, even melting and the like. In order to avoid the structural strength of the vapor chamber from being influenced in the processing process, the first cover plate and the second cover plate adopt non-copper-aluminum composite plates.
In one possible embodiment, the sealing portion includes a first face and a second face opposite to each other in the thickness direction, the supporting portion includes a third face and a fourth face opposite to each other in the thickness direction, the first face faces the first cover plate with the third face flush, the second face faces the second cover plate with the fourth face flush, and the second face faces the fourth face flush.
In this embodiment, when the sealing portion is flush with the supporting portion, the shape of the connecting member is relatively simple, and the forming process of the connecting member is relatively easy.
In a possible embodiment, the first cover plate comprises a fifth face facing away from the second cover plate, and the support part comprises a third face facing away from the second cover plate, the fifth face being flush with the third face.
In this embodiment, in some possible usage scenarios, the third surface and the fifth surface are flush, so that other components of the electronic device can be more conveniently installed close to the soaking plate, and the uneven appearance surface of the soaking plate is prevented from occupying the installation space of other components.
In one possible embodiment, the support is provided with a relief notch extending through the support in the thickness direction of the support.
In this embodiment, dodging the breach can provide dodging the space for other devices of electronic equipment to avoid other devices of electronic equipment to overlap at electronic equipment's thickness direction with vapor chamber, thereby be that electronic equipment can be lighter and thinner.
In one possible embodiment, the first cover plate includes a plate body including a sixth surface facing the second cover plate, and a plurality of supporting bodies disposed by the sixth surface protruding, the plurality of supporting bodies being disposed at intervals.
Wherein the height of the support body ranges from 0.05mm to 0.25mm (including the end points of 0.05mm and 0.25 mm). The distance between two adjacent supporting bodies is larger than or equal to 0.3mm. The diameter of the support body is greater than or equal to 0.3mm.
In this embodiment, the support is located in the sealed cavity of the soaking plate. The inside of the vapor chamber is generally subjected to a vacuum treatment. The air pressure in the sealed cavity is thus negative. The plate body of the first cover plate and the second cover plate have a trend of approaching each other. The support body can support between the first plate body and the second cover plate of the first cover plate, and the situation that the plate body and the second cover plate of the first cover plate are close to each other, so that the space of a steam channel inside the vapor chamber is insufficient, and heat of heating components cannot be taken away is avoided.
In addition, the space between the supporting bodies is the steam channel of the soaking plate. The height of the support body is the height of the steam channel. When the height range of the support body is between 0.05mm and 0.25mm, the height of the steam channel can meet the requirement that the cooling working medium in the soaking plate can finish the processes of evaporation, diffusion and condensation in a short time, so that heat on components is taken away in the phase change process of the cooling working medium.
Furthermore, when the density of the support bodies of the array is too high, the space of the vapor channel becomes small, so that the space where the cooling medium can evaporate, diffuse and condense is small, and finally the heat dissipation performance of the vapor chamber is affected. When the density of the supporting bodies of the array is too small, the pressure intensity generated by the single supporting body on the plate body of the first cover plate and the second cover plate is too large, so that the plate body of the first cover plate and the second cover plate are easy to deform and approach each other, the space of the whole channel is finally influenced, and the soaking heat dissipation performance of the soaking plate is influenced. In the embodiment of the application, the diameters of the supporting bodies are larger than or equal to 0.3mm, and when the distance between two adjacent supporting bodies is larger than or equal to 0.3mm, the pressure generated by the plurality of supporting bodies on the second cover plate cannot exceed the bearing range of the second cover plate. The support body can not destroy the structures of the plate body of the first cover plate and the second cover plate, and a gap is reserved between the plate body of the first cover plate and the second cover plate, so that a sufficient space is ensured for the steam channel.
In one possible embodiment, the capillary structure is connected to a surface of the second cover plate facing the first cover plate, and the plurality of supporting bodies and the capillary structure are stacked and abutted against the capillary structure.
The capillary structure is a structure capable of generating capillary phenomenon. Capillary phenomenon is a process in which liquid flows in a narrow space, and the flowing process can be carried out without any help of external force, even in the opposite direction to the external force such as gravity.
In the present embodiment, when the vapor channel and the capillary channel are laminated in the thickness direction of the vapor chamber. The vapor passage has larger space and the vapor chamber has larger vapor flow. When the gas-phase liquid cooling working medium in the steam channel is condensed, the gas-phase liquid cooling working medium can directly fall back to the capillary channel, so that the cooling working medium can be rapidly circulated between the evaporation area and the colder area, and the rapid and uniform transfer of heat on the whole vapor chamber is ensured. When the capillary structure is an integral net, the soaking plate has larger capillary force, and can guide liquid more quickly.
In one possible implementation manner, the plurality of supporting bodies support the second cover plate, the plurality of supporting bodies are arranged in a plurality of rows, a first gap is formed between every two adjacent rows of supporting bodies, the capillary structure comprises a plurality of sub-portions, and every other or more first gaps are provided with one sub-portion.
In the present embodiment, the capillary structure is provided between the plurality of supports, and the vapor channel and the capillary channel may be provided in parallel. That is, the vapor channel and the capillary channel are not overlapped in the thickness direction of the vapor chamber. The vapor channel and the capillary channel are equivalent to compression parts, and the thickness of the vapor chamber can be further thinned under the condition of keeping certain heat equalizing capacity of the vapor chamber. The vapor channel and capillary channel parallel vapor chamber is suitable for use in a use scene with a small installation space.
In one possible embodiment, the soaking plate further comprises a reinforcing plate, and the reinforcing plate is connected to a side of the first cover plate facing away from the second cover plate.
In the present embodiment, the reinforcing plate may further increase the structural strength of the soaking plate. The vapor chamber with the stiffener plate can also be applied to electronic equipment which is more susceptible to impact in the working environment. The soaking plate with the reinforcing plate is not easy to deform and fail after being impacted by external force.
In one possible embodiment, the reinforcing plate is connected to the first cover plate by means of bonding or soldering.
In one possible embodiment, the soaking plate further includes a reinforcing plate, the reinforcing plate is connected to a side of the second cover plate facing away from the first cover plate, and the orthographic projection of the reinforcing plate to the soaking plate covers part of the second cover plate.
In a possible embodiment, the material of the reinforcement plate has a micro-vickers hardness that is greater than the micro-vickers hardness of the material of the first cover plate.
Wherein the material of the reinforcing plate has a micro-Vickers hardness that is also greater than the micro-Vickers hardness of the material of the second cover plate and the material of the connector.
In a second aspect, the application also provides another vapor chamber. The soaking plate comprises a first cover plate, a second cover plate, a connecting piece, a first brazing layer, a second brazing layer, a reinforcing plate and a capillary structure, wherein the first cover plate and the first cover plate are oppositely arranged. The connecting piece is positioned between the periphery of the first cover plate and the periphery of the second cover plate, and the first brazing layer is connected between the connecting piece and the periphery of the first cover plate in a sealing mode. The second brazing layer is sealingly connected between the connecting member and the periphery of the second cover plate. The second brazing layer, the first cover plate, the connecting piece and the second cover plate jointly form a sealing cavity. A cooling working medium is arranged in the sealing cavity. The reinforcing plate is connected to one side of the first cover plate, which is away from the second cover plate, and the reinforcing plate protrudes relative to the periphery of the first cover plate and the periphery of the second cover plate. The capillary structure is located within the sealed cavity.
In this embodiment, when the reinforcing plate protrudes relative to the first cover plate and the second cover plate, the reinforcing plate can directly overlap with other structures of the electronic device. When the electronic device is impacted by external force, the impact force can be transmitted from the mounting structure of the electronic device to the reinforcing plate of the soaking plate. Because the reinforcing plate is not directly connected with the first cover plate and the second cover plate, external force can be transmitted to the sealing part after being buffered and attenuated by the reinforcing plate, and the external force acting on the reinforcing plate can not directly influence the sealing stability among the first cover plate, the second cover plate and the sealing part. The sealing area of the vapor chamber is prevented from being directly impacted. Therefore, the leakage position of the sealing area among the first cover plate, the second cover plate and the connecting piece is avoided, and the leakage of the cooling working medium in the soaking plate is prevented. According to the application, the reinforcing plate is protruded relative to the first cover plate and the second cover plate, so that the soaking plate can be connected with the mounting piece through the reinforcing plate, the stress mode of the soaking plate when the soaking plate is impacted is changed, and the sealing performance of the soaking plate when the soaking plate is subjected to external force is not easily affected.
In a third aspect, the application provides an electronic device, which comprises a mounting piece, a heating element and the vapor chamber as described above, wherein the heating element is connected to the mounting piece, the supporting part is connected to the mounting piece, and the surface of the second cover plate, which is away from the first cover plate, is contacted with the heating element.
In this embodiment, the space between the plurality of supports is a steam channel. The position on the vapor chamber, which is contacted with the heating element, is an evaporation area of the vapor chamber, and when the heat of the heating element is transferred to the evaporation area of the vapor chamber, the cooling working medium in the sealed cavity is gasified after being heated in the environment with low vacuum degree, absorbs heat energy and rapidly expands in volume, and the gas-phase cooling working medium rapidly fills the whole steam channel. Condensation occurs when the gaseous cooling medium contacts a relatively cool region of the soaking plate, releasing heat accumulated during vaporization. The condensed cooling liquid returns to the evaporation area through the capillary channel in the capillary structure, and the operation is repeatedly performed in the cavity, so that the heat of the heating element is uniformly dispersed.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained by those skilled in the art without the inventive effort.
Fig. 1 is a schematic view of a part of an electronic device according to an embodiment of the present application;
FIG. 2 is a schematic view of the mounting member shown in FIG. 1;
FIG. 3 is a schematic view of the vapor chamber shown in FIG. 1;
FIG. 4 is an exploded view of the vapor chamber shown in FIG. 1;
FIG. 5 is a schematic view of the first cover plate shown in FIG. 4;
FIG. 6 is a schematic view of the structure of the connector shown in FIG. 4;
FIG. 7 is a schematic cross-sectional view of the vapor chamber shown in FIG. 3 at A-A;
FIG. 8 is a schematic view of a portion of the electronic device shown in FIG. 1 at another angle;
FIG. 9 is a schematic view of the first embodiment of the connector shown in FIG. 4;
FIG. 10 is a schematic view of a second embodiment of the connector shown in FIG. 4;
FIG. 11 is a schematic view of a portion of the third embodiment of the attachment member shown in FIG. 4 attached to a mounting member;
FIG. 12 is another exploded view of the vapor chamber shown in FIG. 1;
Fig. 13 is a schematic structural view of an electronic device including the vapor chamber shown in fig. 12;
FIG. 14 is a schematic view of still another construction of the electronic device shown in FIG. 1;
FIG. 15 is a schematic partial cross-sectional view of the electronic device shown in FIG. 14;
FIG. 16 is a schematic view of still another configuration of the electronic device shown in FIG. 1;
FIG. 17 is a schematic view, partially in cross-section, of the electronic device shown in FIG. 16;
FIG. 18 is a schematic cross-sectional view of one embodiment of the capillary structure shown in FIG. 4;
FIG. 19 is a schematic partial cross-sectional view of the vapor chamber of FIG. 4 provided with a capillary structure of another embodiment;
fig. 20 is a schematic view of the structure of the first cover plate and the second cover plate provided with the capillary structure shown in fig. 19;
FIG. 21 is a flow chart of a method for manufacturing a vapor chamber according to an embodiment of the present application;
Fig. 22 is a schematic structural view of the first plate after S100 is completed in the method for manufacturing a vapor chamber shown in fig. 21;
fig. 23 is a schematic structural view of a second plate member after S200 is completed in the method for manufacturing a vapor chamber shown in fig. 21;
Fig. 24 is a schematic structural view of the connection member after S300 is completed in the method for manufacturing a vapor chamber shown in fig. 21;
fig. 25 is a schematic structural view of a first assembly after S400 is completed in the method for manufacturing a vapor chamber shown in fig. 21;
Fig. 26 is a schematic structural view of a second assembly after S500 is completed in the method for manufacturing a vapor chamber shown in fig. 21;
Fig. 27 is a schematic structural view of an initial soaking plate after S600 is completed in the preparation method of the soaking plate shown in fig. 21;
FIG. 28 is a flow chart of a method for manufacturing a vapor chamber according to an embodiment of the present application;
fig. 29 is a schematic structural view of the vapor chamber after S800 is completed in the method for manufacturing a vapor chamber shown in fig. 28.
Detailed Description
Specific embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While the exemplary embodiments of the application are shown in the drawings, it should be understood that the application may be practiced otherwise than as described herein and is therefore not limited to the embodiments described below.
For convenience of understanding, terms involved in the embodiments of the present application will be explained first.
And/or: merely one association relationship describing the associated object, the representation may have three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone.
A plurality of: refers to two or more.
And (3) connection: it is to be understood in a broad sense that, for example, a is linked to B either directly or indirectly via an intermediary.
The following description of the embodiments of the present application will be made with reference to the accompanying drawings.
Referring to fig. 1, fig. 1 is a schematic view of a part of an angle of an electronic device 1000 according to an embodiment of the application. The X-direction shown in fig. 1 is a width direction of the electronic device 1000. The Y-direction is the longitudinal direction of the electronic device 1000. The Z-direction is the thickness direction of the electronic device 1000. The present application provides an electronic device 1000. The electronic apparatus 1000 includes a mount 100, a heat generating component 200, and a Vapor chamber 300 (VC). The mount 100 provides mounting locations for the heat generating components 200 and the vapor chamber 300. The vapor chamber 300 is in contact with the heat generating component 200. The soaking plate 300 can absorb heat generated by the heat generating component 200 and transfer the heat to other positions with lower temperature, so that the heat of the heat generating component 200 is uniformly dispersed.
Illustratively, the electronic device 1000 may be an intelligent consumer electronic device such as a cell phone, tablet computer, notebook computer, or the like. Or the electronic device 1000 may also be a wearable device such as augmented Reality (Augmented Reality, AR), virtual Reality (VR), smart glasses, smart goggles, smart watches, smart bracelets, wireless headsets, wireless bone conduction headsets, wireless neck band headsets, wireless real (True Wireless Stereo, TWS) headsets, etc.
For convenience of understanding, the electronic device 1000 with a wide population of users and rich application scenarios, such as a mobile phone, will be described below as an example, but not limited thereto.
Referring to fig. 1 and 2 in combination, fig. 2 is a schematic structural view of the mounting member 100 shown in fig. 1. When the electronic device 1000 is a cellular phone, the mount 100 may be a center in the cellular phone.
In some embodiments, the mount 100 may include a base plate 10, a rim 20, and a stop frame 30. Wherein the bottom plate 10 may have a rectangular shape, and the bottom plate 10 includes a first surface 11 and a second surface 12 disposed opposite to each other in a thickness direction of the bottom plate 10. That is, the first surface 11 and the second surface 12 are disposed opposite to each other in the Z direction. The first surface 11 is a surface of the base plate 10 facing the opposite direction of the Z direction, and the second surface 12 is a surface of the base plate 10 facing the Z direction.
Illustratively, the base plate 10 is provided with a first opening 101, a second opening 102 and a connecting slot 103. The first opening 101 and the second opening 102 each extend through the first surface 11 and the second surface 12 of the base plate 10. The first opening 101 and the second opening 102 are spaced apart. The first opening 101 is used for accommodating the heat generating component 200. The second opening 102 is used to receive other components of the electronic device 1000. The connecting groove 103 is recessed from the first surface 11 toward the second surface 12. The connecting groove 103 is arranged around the opening of the first opening 101 at the first surface 11. The connection groove 103 communicates with the first opening 101.
Wherein the rim 20 may surround the outer circumference of the base plate 10. One side of the frame 20 facing the Z direction protrudes relative to the second surface 12 of the base plate 10, so that the frame 20 and the second surface 12 can jointly enclose a first accommodating space 1001, and the first accommodating space 1001 can be used for mounting components such as a battery (not shown). The side of the frame 20 facing the opposite direction of the Z direction protrudes relative to the first surface 11 of the base plate 10, so that the frame 20 and the first surface 11 can jointly enclose a second accommodating space 1002. The second receiving space 1002 can be used to receive at least part of the soaking plate 300 and a screen (not shown) and the like.
The limit frame 30 is a rectangular frame. The limiting frame 30 includes a first side 31 and a second side 32 disposed opposite to each other, and a third side 33 and a fourth side 34 disposed opposite to each other. The third side 33 and the fourth side 34 are each connected between the first side 31 and the second side 32. The first edge 31, the third edge 33, the second edge 32 and the fourth edge 34 are connected end to end in sequence to define a mounting position. The first side 31 is provided with a relief groove 301. The escape groove 301 is recessed from one side edge of the first side 31 toward the other side edge in the width direction. The escape groove 301 penetrates the first side 31 in the thickness direction of the first side 31.
The limiting frame 30 is connected to the second surface 12 of the base plate 10. The first edge 31 and the second edge 32 are oppositely disposed along the Y direction. The third side 33 and the fourth side 34 are disposed opposite to each other in the X direction. The mounting position surrounded by the limit frame 30 is used for mounting the battery.
In this embodiment, the first edge 31, the second edge 32, the third edge 33 and the fourth edge 34 can abut against the periphery of the battery, and the second surface 12 of the bottom plate 10 can provide a supporting force for the battery, so that the battery can be stably mounted on the mounting member 100, and the battery is prevented from shaking relative to the mounting member 100.
In some embodiments, the first edge 31 may be located on a side of the first opening 101 facing the Z-direction. The relief groove 301 may be recessed in the Z-direction from the side of the first edge 31 toward the second surface 12. The escape groove 301 penetrates the first side 31 in the Y direction. The bottom wall of the relief groove 301 has a clearance from the plane of the second surface 12. The two groove side walls of the avoiding groove 301 which are oppositely arranged along the X direction are flush with the hole wall of the first hole 101.
Wherein the heat generating component 200 may be located at a side of the first side 31 facing away from the second side 32. In actual use, the heat generating component 200 may be soldered to a motherboard (not shown) of the electronic device 1000. The heat generating component 200 may be a chip, a central processing unit (Central Processing Unit, CPU), a graphics processor (Graphics Processing Unit, GPU), a wireless module, a battery, a high-power inductor, a capacitor, or the like.
In this embodiment, after the soaking plate 300 is mounted on the mounting member 100, a gap may be formed between the first edge 31 of the limiting frame 30 and one side of the soaking plate 300 facing the Z direction, so as to avoid the limiting frame 30 from pressing the soaking plate 300 to damage the structure of the soaking plate 300. The gap between the bottom wall of the relief groove 301 and the plane of the second surface 12 is used to provide an installation space for the soaking plate 300.
In other embodiments, the first edge 31 may not be provided with the relief groove 301.
Referring to fig. 3 and 4 in combination, fig. 3 is a schematic structural diagram of the vapor chamber 300 shown in fig. 1, and fig. 4 is an exploded schematic diagram of the vapor chamber 300 shown in fig. 1. The soaking plate 300 may also be called a soaking plate, or a superconducting heat plate, or a heat conduction plate. The vapor chamber 300 is similar to the Heat pipe (Heat pipe) principle. The vapor chamber 300 utilizes the liquid phase boiling phase transition of a cooling working medium (cooling medium) in a sealed cavity to vapor phase heat absorption and vapor phase condensation to liquid phase heat release, and utilizes capillary force, gravity and the like as liquid phase cooling working medium transportation power to complete the phase transition circulation of the vapor phase and the liquid phase in a cold and hot area thereof, thereby realizing efficient heat exchange by utilizing the modes of phase transition latent heat, heat conduction, convection and the like. Compared with a heat pipe, the soaking plate 300 has a larger contact area with a heat source and a heat dissipation medium, and can make the surface temperature more uniform. And the vapor chamber 300 is lighter and thinner, and can be more suitable for the trend of integrating and lightening the electronic equipment 1000.
Currently, a soaking plate generally includes two cover plates pressed up and down. The edges of the two cover plates are welded to form a sealed cavity. The sealing cavity is internally provided with a liquid cooling working medium. The edge area of the vapor chamber can be directly assembled and connected with other structures of the electronic equipment. When the soaking plate receives external force, interaction force is easy to generate between the edge area of the soaking plate and other structures of the electronic equipment, the external force can possibly cause the deformation of the edge area of the soaking plate, the tightness of the soaking plate is affected, and finally liquid cooling working medium in the soaking plate is easy to leak.
Based on this, the structure of the vapor chamber 300 can be adjusted, so that the sealing connection position of the vapor chamber 300 is prevented from being connected with other structures of the electronic device 1000, and the sealing performance of the vapor chamber 300 is not affected after the vapor chamber is subjected to external force.
The vapor chamber 300 may include a first cover plate 310, a second cover plate 320, a connector 330, a capillary structure 340, a first brazing layer 400, a second brazing layer 500, and a cooling medium (not shown). The first cap plate 310, the first brazing layer 400, the connection member 330, the second brazing layer 500, and the second cap plate 320 are sequentially stacked and connected to form a sealed cavity. The capillary structure 340 and the cooling medium are located in the sealed cavity of the vapor chamber 300, and the capillary structure 340 is connected to the side of the second cover plate 320 facing the first cover plate 310. Wherein the material of the first braze layer 400 and the material of the second braze layer 500 may comprise braze paste.
The vapor chamber 300 may have a first region 3001 and a second region 3002. The second area 3002 surrounds the first area 3001. The middle portion of the first cover plate 310, the middle portion of the second cover plate 320, the sealed cavity of the soaking plate 300, the capillary structure 340, and the cooling medium are located in the first area 3001. The peripheral portion of the first cover plate 310, the connection member 330, and the peripheral portion of the second cover plate 320 are located in the second area 3002. The capillary structure 340 is a structure capable of generating a capillary phenomenon. Capillary phenomenon is a process in which liquid flows in a narrow space, and the flowing process can be carried out without any help of external force, even in the opposite direction to the external force such as gravity.
The specific structure of the soaking plate 300 will be described below.
Referring to fig. 5, fig. 5 is a schematic structural diagram of the first cover plate 310 shown in fig. 4. The first cover plate 310 includes a first plate body 315, a support body 313, and a first extension body 314. The first plate 315 includes a fifth face 312 and a sixth face 311 that are disposed opposite to each other in the thickness direction. The support 313 protrudes from the sixth surface 311. The number of the supporting bodies 313 is plural. The plurality of supporters 313 are arranged in an array at a middle position of the sixth surface 311. Specifically, the height of the support 313 ranges between 0.05mm and 0.25mm (inclusive of the end points 0.05mm and 0.25 mm). The distance between two adjacent support bodies 313 is greater than or equal to 0.3mm. The diameter of the support 313 is greater than or equal to 0.3mm. The first extension 314 extends along an edge of the first plate 315 in a direction away from the first plate 315.
Illustratively, the support 313 is a protrusion formed on the first plate 315 by a stamping process. The support 313 may be a groove at a corresponding position of the fifth surface 312. The first cover plate 310 may be stamped and formed from a plate having a thickness in the range of 0.01mm to 0.05mm (inclusive of 0.01mm and 0.05 mm). The embodiment of the application ensures the dimensional accuracy of the first plate 315 through a precision rolling process. The material of the first plate body 315 of the first cover plate 310 includes copper, copper alloy plate, copper steel composite, copper titanium composite plate, etc.
It should be noted that, the material of the first cover plate 310 of the present application is a non-copper-aluminum composite board. Since the soaking plate 300 of the present application adopts a brazing process of 600 c or more to weld the first cover plate 310, the connecting member 330 and the second cover plate 320. The melting point of the aluminum alloy in the copper-aluminum composite board is about 660 ℃. The brazing process temperature employed in the embodiments of the present application is generally near or above the melting point of aluminum in the copper aluminum composite sheet. The copper-aluminum composite board can be softened or even melted in the brazing process. In order to avoid the structural strength of the soaking plate 300 from being affected during the processing, the first cover plate 310 of the present application adopts a non-copper aluminum composite plate.
In this embodiment, an etching process is commonly used to process the first cover plate, and the structure of a part of the first cover plate is removed by etching, so that the rest forms a supporting body of the first cover plate. However, the use of the etching process is required to ensure that the first cover plate is not penetrated during the etching process, and thus, the first cover plate has a certain residual thickness after the etching process. The common etching process leaves a residual thickness of greater than 0.05mm to ensure the structural integrity of the first cover plate. Therefore, the first cover plate processed through the etching process cannot be further thinned.
The present application uses a stamping process to manufacture the support 313 of the first cover plate 310, thereby solving the problem that the thickness of the first plate 315 cannot be further thinned due to an etching process. The embodiment of the application prepares the first plate body 315 with the thickness smaller than 0.05mm by using a conventional structural member forming process, thereby thinning the whole of the vapor chamber 300. The light and thin soaking plate 300 occupies a smaller installation space, and thus can be applied to more use scenes.
Referring to fig. 4, the second cover 320 may have a flat plate shape. The second cover plate 320 may include a second extension body 321 and a second plate body 322. The second extension body 321 extends from the edge of the second plate body 322 in a direction away from the second plate body 322. The thickness of the second cover plate 320 ranges between 0.01mm and 0.05mm (inclusive of the end points 0.01mm and 0.05 mm), for example. The thickness of the second cap plate 320 is sized by a precision rolling process. The material of the second cover plate 320 includes copper, copper alloy plate, copper steel composite, copper titanium composite plate, etc. The same material as the first cover plate 310 is also a non-copper-aluminum composite material for the second cover plate 320, and for specific reasons, see the description of the first cover plate 310 above, the material of the second cover plate 320 will not be described herein.
Referring to fig. 6, fig. 6 is a schematic structural diagram of the connector 330 shown in fig. 4. The connector 330 includes a sealing portion 331 and a supporting portion 332. The sealing portion 331 may have a frame shape. The sealing portion 331 includes a first surface 333 and a second surface 334 that are disposed opposite to each other in the thickness direction of the sealing portion 331. The sealing portion 331 is provided with a first notch 3311. The first notch 3311 extends through the first face 333 and the second face 334. The first notch 3311 communicates between the space inside and the space outside the sealing portion 331.
The support portion 332 is disposed around the sealing portion 331. The support portion 332 is connected to the outer periphery of the sealing portion 331. The supporting portion 332 may also have a frame shape. The support portion 332 is provided with a second notch 3321. The second notch 3321 communicates between the space inside the supporting portion 332 and the space outside. The second notch 3321 is positioned corresponding to the first notch 3311. The second notch 3321 communicates with the first notch 3311. The support portion 332 is integrally formed with the sealing portion 331. The material of the supporting portion 332 and the sealing portion 331 may include copper, a copper alloy plate material, and the like. The material of the surface of the sealing part 331 facing the first and second cover plates 310 and 320 may be copper.
Referring to fig. 3 and 7 in combination, fig. 7 is a schematic cross-sectional view of the vapor chamber 300 shown in fig. 3 at A-A. In the soaking plate 300, the sealing portion 331 of the connector 330 is connected between the first cover plate 310 and the second cover plate 320 to form a sealed cavity 3003. The support 332 protrudes with respect to the peripheral edges of the first and second cover plates 310 and 320. The cooling medium is located in the sealed cavity 3003 of the soaking plate 300. It should be understood that the cooling medium may be any cooling medium having thermal expansion and contraction properties, and the embodiment of the present application is not particularly limited thereto. By way of example, the cooling medium may be, but is not limited to, ethylene Glycol (EG), fluorinated fluid FC-3283, PFPE, deionized water, liquid metal, and the like.
Wherein, the first surface 333 of the sealing portion 331 is connected to the sixth surface 311 of the first cover plate 310. Wherein the first face 333 is connected to the sixth face 311 of the first cover plate 310 by the first brazing layer 400 using a brazing method of 600 c or more. The thickness of the first braze layer 400 between the first face 333 and the sixth face 311 is 0.01mm-0.05mm (inclusive of the end points 0.01mm and 0.05 mm). The second surface 334 of the sealing portion 331 is connected to a surface of the second cover plate 320. Wherein the second face 334 is joined to the second cap plate 320 by the second brazing layer 500 using a brazing method of 600 c or more. The thickness of the second braze layer 500 between the second face 334 and the surface of the second cover 320 is 0.01mm-0.05mm (inclusive of the end points 0.01mm and 0.05 mm). The sealing part 331 may be simultaneously welded with the first cover plate 310 and the second cover plate 320, respectively. Or the sealing part 331 may be welded with one of the first and second cover plates 310 and 320 first, and then the sealing part 331 is welded with the other of the first and second cover plates 310 and 320. The sealing portion 331 is located in the second area 3002 of the soaking plate 300 with both the peripheral edge of the first cover plate 310 and the peripheral edge of the second cover plate 320.
In this embodiment, the welding is easier when the sheets are made of the same material or similar materials. The material of the supporting portion 332 and the sealing portion 331 of the connector 330 is the same as that of the first cover plate 310 and the second cover plate 320, so that after the sealing portion 331 of the connector 330 is welded to the first cover plate 310 and the second cover plate 320, the connection between the sealing portion 331 and the first cover plate 310 and the second cover plate 320 is firm.
Illustratively, in the composite board of the first cover plate 310, the side facing the seal cavity 3003 is a copper layer. In the composite board of the second cover plate 320, a copper layer is disposed on a side facing the sealed cavity 3003. The plate material of the sealing portion 331 may be a copper plate. So that the material of the surface where the sealing part 331 and the first cover plate 310 are connected is the same, both are copper layers. The sealing portion 331 and the second cover plate 320 are both copper layers, and are made of the same material. Thereby improving the welding strength of the sealing portion 331 and the first and second cover plates 310 and 320, and further improving the sealing performance of the soaking plate 300.
Wherein, the sealing portion 331 is provided with a first notch 3311, and the edge of the first cover plate 310 and the edge of the second cover plate 320 may be directly connected. Illustratively, the first cover plate 310 and the second cover plate 320 are connected by brazing, and the brazing paste is located in the first notch 3311. The thickness of the solder paste 600 located in the first notch 3311 is the same as the thickness of the sealing portion 331.
In this embodiment, the first cover plate 310 and the second cover plate 320 at the first notch 3311 may be welded by solder paste. The solder paste seals the first notch 3311. So that a sealed cavity 3003 is formed between the first cover plate 310, the sealing portion 331 and the second cover plate 320. And the thickness of the solder paste is the same as that of the sealing portion 331, the first cover plate 310 and the second cover plate 320 can be kept relatively parallel. The first cover plate 310 and the second cover plate 320 are prevented from being deformed at the first notch 3311, thereby preventing the sealability of the soaking plate 300 from being affected.
In some embodiments, the first cover plate 310 and the second cover plate 320 are disposed opposite to each other in the thickness direction of the soaking plate 300. The sixth surface 311 of the first plate 315 faces the second cover 320. Referring to fig. 4 again, the supporting portion 332 of the connecting member 330 protrudes with respect to the periphery of the first cover plate 310 and the periphery of the second cover plate 320. The first extension 314 is opposite to the second extension 321 in the thickness direction of the soaking plate 300. The first extension 314 and the second extension 321 are located in the second notch 3321 of the supporting portion 332. The first extension 314, the second extension 321, and the outer circumferential surface of the support 332 are flush. The first extension 314 and the second extension 321 are connected by welding. The first extension 314, the second extension 321, and the support 332 are all located in the second region 3002 of the soaking plate 300.
In some embodiments, please refer to fig. 1, fig. 2, and fig. 8 in combination, fig. 8 is a schematic view of a portion of the electronic device 1000 shown in fig. 1 at another angle. The soaking plate 300 may cover the opening of the first opening 101 of the mounting member 100 at the first surface 11. The first cover plate 310 of the soaking plate 300 faces the first surface 11 of the mount 100. The second cover plate 320 of the soaking plate 300 faces the second surface 12 of the mount 100. The support 332 of the connector 330 is positioned in the connection slot 103 of the mounting member 100. The support portion 332 is connected to the groove wall of the connection groove 103. The second cover plate 320 is in contact with the heat generating component 200. For example, a heat-conducting medium may be filled between the second cover 320 and the heat-generating component 200, so as to increase the contact area between the second cover 320 and the heat-generating component 200, and reduce the thermal resistance between the second cover 320 and the heat-generating component 200, so that the heat of the heat-generating component 200 can be transferred to the soaking plate 300 more quickly. Wherein the heat conducting medium may be a heat conducting gel.
In the present embodiment, when the supporting portion 332 protrudes with respect to the first and second cover plates 310 and 320, the supporting portion 332 can directly overlap with the mounting member 100. When the electronic device 1000 is impacted by an external force, the impact force may be transmitted from the mount 100 to the support 332 of the soaking plate 300. Since the supporting portion 332 is not directly connected to the first cover plate 310 and the second cover plate 320, the external force is damped by the supporting portion 332 and then transferred to the sealing portion 331, and the external force acting on the supporting portion 332 does not directly affect the sealing stability between the first cover plate 310, the second cover plate 320 and the sealing portion 331. The first region 3001 of the soaking plate 300 is prevented from being directly impacted. Thereby avoiding leakage positions in the sealing areas among the first cover plate 310, the second cover plate 320 and the connecting piece 330, and preventing leakage of cooling medium inside the soaking plate 300. According to the application, the support part 332 is protruded relative to the first cover plate 310 and the second cover plate 320, so that the vapor chamber 300 can be connected with the mounting piece 100 through the support part 332, and the stress mode of the vapor chamber 300 when being impacted is changed, so that the sealing performance of the vapor chamber 300 is not easily affected when being impacted by external force.
Moreover, by forming the first cover plate 310, the second cover plate 320 and the connecting piece 330 respectively, the processing of the connecting piece 330 on the first cover plate 310 and/or the second cover plate 320 can be avoided, and the processing process of the first cover plate 310 and the second cover plate 320 is reduced, so that the yield of the first cover plate 310 and the second cover plate 320 is improved, the stable volume production is facilitated, and the production cost of the vapor chamber 300 is reduced.
Illustratively, the thickness of the support 332 is greater than the sum of the thicknesses of the first and second cover plates 310, 320. The thickness of the support 332 may be 0.05mm or more. The yield strength of the support 332 may be greater than or equal to 300Mpa. Or the elastic modulus of the support 332 may be greater than or equal to 100Gpa. Or the micro vickers hardness of the support portion 332 may be greater than or equal to 50HV.
In this embodiment, the first cover plate 310, the second cover plate 320 and the connecting member 330 are separately manufactured in a split type scheme. Rather than forming the edge of the first cover plate 310 and/or the edge of the second cover plate 320 into the connector 330. Therefore, in the case that the thicknesses of the first plate 315 and the second cover 320 of the soaking plate 300 are reduced as much as possible, the thickness of the connecting piece 330 is not affected by the thickness of the first plate 315 and the thickness of the second cover 320, so that the structural strength of the connecting piece 330 can meet the installation requirement of the soaking plate 300, and the connection stability of the soaking plate 300 and the installation piece 100 is improved.
In addition, the yield strength of the support portion 332 is 300Mpa or more. It is known that the yield strength is the yield limit at which the metallic material yields, i.e. the stress that resists minor plastic deformation. External forces greater than the yield strength will permanently fail the part and fail to recover. The embodiment of the application improves the yield strength of the supporting part 332, so that the supporting part 332 is not easy to deform in a shaping way under the condition of impact, and the vapor chamber 300 is prevented from falling off from the mounting piece 100.
The elastic modulus of the support portion 332 is 100Gpa or more. It is known that the greater the modulus of elasticity, the less likely the material will deform. The embodiment of the application improves the elastic modulus of the supporting part 332, so that the supporting part 332 can bear larger stress without damage.
The micro vickers hardness of the support portion 332 is 50HV or more. It can be appreciated that the surface of the supporting portion 332 may be scratched and rubbed during the processing and assembling processes, so that the hardness of the supporting portion 332 is improved, and the roughness and unevenness of the surface of the supporting portion 332 caused by friction during the processing process can be avoided, so that the supporting portion 332 cannot be stably connected with the mounting member 100. Ensuring a high connection strength between the soaking plate 300 and the mounting member 100.
In the present embodiment, the support 313 is located in the sealed chamber 3003 of the soaking plate 300. The inside of the soaking plate 300 is generally subjected to a vacuum-pumping process. The air pressure in the seal chamber 3003 is thus negative. The first plate body 315 and the second plate body 320 of the first plate 310 have a tendency to approach each other. The supporting body 313 can be supported between the first plate 315 and the second plate 320 of the first cover 310, so as to avoid that the first plate 315 and the second plate 320 of the first cover 310 are close to each other, resulting in insufficient space of the vapor channel inside the vapor chamber 300, and heat of the heat generating component 200 cannot be taken away.
In addition, the space between the plurality of supporters 313 is the vapor passage of the soaking plate 300. The height of the support 313 is the height of the steam channel. When the height of the supporting body 313 is in the range of 0.05mm-0.25mm, the height of the steam channel can meet the requirement that the cooling medium in the vapor chamber 300 can complete the processes of evaporation, diffusion and condensation in a short time, so that the heat on the components is taken away in the phase change process of the cooling medium.
In the present embodiment, when the density of the support 313 of the array is excessively large, the space of the vapor channel becomes small, thereby resulting in a small space where the cooling medium can evaporate, diffuse, and condense, and eventually, the heat dissipation performance of the vapor chamber 300 is affected. When the density of the supporting bodies 313 of the array is too small, the pressure generated by the single supporting body 313 on the first plate 315 and the second cover 320 is too large, so that the first plate 315 and the second cover 320 are easy to deform and approach each other, and finally the space of the whole channel is affected, and the soaking heat dissipation performance of the soaking plate 300 is affected. In the embodiment of the present application, the diameter of the supporting body 313 is greater than or equal to 0.3mm, and when the distance between two adjacent supporting bodies 313 is greater than or equal to 0.3mm, the pressure generated by the plurality of supporting bodies 313 on the second cover plate 320 does not exceed the bearing range of the second cover plate 320. The supporting body 313 does not damage the structures of the first plate 315 and the second cover 320 and has a gap between the first plate 315 and the second cover 320, thereby ensuring a sufficient space for the steam passage.
When the heat generating component 200 generates heat, the second cover plate 320 can transfer the heat to the inside of the soaking plate 300. The cooling medium in the vapor chamber 300 absorbs heat and then changes from a liquid phase to a gas phase. The gas may diffuse from the second cover 320 toward the first cover 310 and at the same time, away from the heat source (heat generating component 200). When the gas reaches the colder position of the first cover plate 310, the heat is released and condensed into liquid, so as to achieve the purpose of uniformly distributing the heat to the soaking plate 300. The liquid flows to the capillary structure 340 on the surface of the second cover plate 320, and the capillary structure 340 may redirect the liquid back to the heat source. So as to carry out the next gas-liquid circulation.
The shape of the support portion 332 may be adaptively adjusted in accordance with the installation position of the installation member 100, so that the soaking plate 300 can be suitable for more usage scenarios. Hereinafter, the present application provides three embodiments of the connector 330 to adapt to different usage scenarios.
In a first possible embodiment, referring to fig. 5 and 9, fig. 9 is a schematic structural view of the first embodiment of the connecting member 330 shown in fig. 4. In this embodiment, the supporting portion 332 and the sealing portion 331 of the connecting member 330 are disposed in a stepped manner.
The support portion 332 includes a third surface 336 and a fourth surface 335 that are disposed opposite to each other in the thickness direction of the support portion 332. The third face 336 may be disposed in a convex manner with respect to the first face 333. The fourth face 335 may be recessed with respect to the second face 334. The plane in which the fourth surface 335 of the support portion 332 is located may be located between the plane in which the first surface 333 of the sealing portion 331 is located and the plane in which the second surface 334 is located.
After the first surface 333 of the sealing portion 331 is connected to the sixth surface 311 of the first plate 315, the third surface 336 may be flush with the fifth surface 312 of the first plate 315. Or the third face 336 may protrude with respect to the fifth face 312 of the first plate 315.
The fourth surface 335 of the support 332 is glued or otherwise connected to the groove wall of the connecting groove 103 of the mounting member 100. The third surface 336 of the supporting portion 332 and the fifth surface 312 of the first cover plate 310 are both surfaces of the soaking plate 300 facing away from the heat generating component 200.
In some possible usage scenarios, making the third face 336 flush with the fifth face 312 may facilitate the installation of other components of the electronic device 1000 proximate to the vapor chamber 300, so as to avoid the uneven surface of the vapor chamber 300 from occupying the installation space of the other components.
In other possible use scenarios, the thickness of the support 332 may be greater by having the third face 336 protrude relative to the fifth face 312 of the first cover plate 310. Increasing the thickness of the support 332 can increase the structural rigidity of the support 332, thereby improving the stability of the assembly of the soaking plate 300 with the mount 100.
In a second possible embodiment, please refer to fig. 10, fig. 10 is a schematic structural diagram of a second embodiment of the connecting member 330 shown in fig. 4. Unlike the first embodiment, the sealing portion 331 is the same thickness as the supporting portion 332. The third face 336 of the support portion 332 is flush with the first face 333 of the seal portion 331. The fourth face 335 of the support portion 332 is flush with the second face 334 of the seal portion 331.
In the present embodiment, when the sealing portion 331 is flush with the supporting portion 332, the shape of the connecting member 330 is relatively simple, and the forming process of the connecting member 330 is relatively easy.
In a third possible embodiment, please refer to fig. 11, fig. 11 is a schematic view showing a portion of the structure of the third embodiment of the connecting member 330 shown in fig. 4 connected to the mounting member 100. Unlike the first possible embodiment, the support 332 is also provided with at least one relief notch 3322. The escape notch 3322 is recessed from the outer peripheral side of the support portion 332 (the side of the support portion away from the seal portion) toward the inner peripheral side of the support portion 332 (the side of the support portion connected to the seal portion). The escape notch 3322 penetrates the support portion 332 in the thickness direction of the support portion 332.
The mounting member 100 may be provided with at least one mounting through hole 40. The mounting through-hole 40 extends through at least part of the bottom wall of the relief groove 301. The support 332 is connected to the mounting member 100. The position of the mounting through hole 40 may be set corresponding to the position of the avoidance notch 3322. The walls of a portion of the mounting holes 40 may be flush with the walls of the relief notches 3322.
The dodging notch 3322 of the vapor chamber 300 and the mounting through hole 40 together form a mounting space, and the mounting space can be communicated with the first receiving space 1001 and the second receiving space 1002 of the mounting member 100. The mounting space may be used to accommodate components that need to extend from the first housing space 1001 to the second housing space 1002. For example, the mounting through hole 40 of the mounting member 100 may be penetrated by an electrical connector of the electronic device 1000, one end of the electrical connector may be connected to the battery of the first receiving space 1001, and the other end of the electrical connector may be connected to the screen located in the second receiving space 1002.
In the present embodiment, since the thickness of the support portion 332 is large, even if the support portion 332 having the escape notch 3322 is provided, a firm overlap with the mount 100 can be ensured. Since the area of the soaking plate 300 is generally large, the flexible configuration of the support 332 may be suitable for more installation scenarios of the electronic device 1000. The support portion 332 is provided with some avoiding notches 3322, which can save the space required for installing the soaking plate 300, and is beneficial for the miniaturization and light-weight development of the electronic device 1000.
In some possible embodiments, please refer to fig. 12 and 13 in combination, fig. 12 is another exploded schematic view of the vapor chamber 300 shown in fig. 1, and fig. 13 is a schematic view of the structure of an electronic device including the vapor chamber 300 shown in fig. 12. Unlike the first embodiment, the soaking plate 300 further includes a reinforcing plate 350. Illustratively, the material of the reinforcing plate 350 may include a single metal material such as titanium-based, iron-based, copper-based, aluminum-based, or a non-metal material such as a carbon fiber composite board, a plastic board, or a layered composite material. The reinforcing plate 350 may also be surface treated, such as sprayed or electroplated, for more reliable connection and protection with the cover plate (the first cover plate 310 or the second cover plate 320).
In some possible implementations of the present embodiment, the reinforcement plate 350 is coupled to the fifth surface 312 of the first cover plate 310 and the third surface 336 of the support 332. Illustratively, the reinforcement plate 350 and the first cover plate 310 and/or the support 332 may be each attached by adhesive-backed bonding, dispensing, brazing, or the like. The micro-vickers hardness of the material of the reinforcement plate 350 is greater than the micro-vickers hardness of the material of the first cover plate 310, the second cover plate 320, and the connection member 330. Wherein the reinforcing plate may be in the shape of a regular flat plate. Or the stiffener 350 may be shaped with notches or relief holes to provide additional mounting locations for other components of the electronic device 1000.
In other possible implementations of the present embodiment, please refer to fig. 14 and 15 in combination, fig. 14 is a schematic structural diagram of the electronic device 1000 shown in fig. 1, and fig. 15 is a schematic sectional view of a portion of the electronic device 1000 shown in fig. 14. Unlike the previous possible embodiment, the reinforcing plate 350 is attached to the surface of the second cover plate 320 facing away from the first cover plate 310. The reinforcing plate 350 orthographically projects toward the second cover plate 320 to cover a portion of the second cover plate 320. The surface of the second cover 320, which leaks out with respect to the reinforcing plate 350, may be bonded to the heat generating component 200.
In the present embodiment, the reinforcing plate 350 may further increase the structural strength of the soaking plate 300. The vapor chamber 300 with the stiffener 350 may also be suitable for use in an electronic device 1000 that is more susceptible to impact in the operating environment. The vapor chamber 300 having the reinforcing plate 350 is not easily deformed and failed even when being impacted by external force.
In some other embodiments, referring to fig. 16 and 17, fig. 16 is a schematic view of still another structure of the electronic device 1000 shown in fig. 1, and fig. 17 is a schematic view of a part of the electronic device shown in fig. 16 in cross section. Unlike the above-described embodiment, the connector 330 in the present embodiment may not include the supporting portion 332 described above. The connector 330 includes only a part of the structure of the sealing portion 331 described above. The outer circumference of the connection member 330 may be flush with the outer circumference of the first cover plate 310 and the outer circumference of the second cover plate 320. The reinforcing plate 350 is connected to a side of the first cover plate 310 facing away from the second cover plate 320, and a periphery of the reinforcing plate 350 may be protruded with respect to a periphery of the first cover plate 310 and a periphery of the second cover plate 320.
In the present embodiment, the shape of the reinforcement plate 350 can be adaptively adjusted in accordance with the mounting position of the mounting member 100, so that the soaking plate 300 can be applied to more usage scenarios.
When the reinforcing plate 350 protrudes with respect to the first and second cover plates 310 and 320, the reinforcing plate 350 can directly overlap the mounting member 100. When the electronic device 1000 is impacted by an external force, the impact force may be transmitted from the mount 100 to the reinforcement plate 350 of the soaking plate 300. Since the reinforcing plate 350 is not directly connected to the first cover plate 310 and the second cover plate 320, the external force is damped by the reinforcing plate 350 and then transferred to the sealing portion 331, and the external force acting on the reinforcing plate 350 does not directly affect the sealing stability between the first cover plate 310, the second cover plate 320 and the sealing portion 331. The first region 3001 of the soaking plate 300 is prevented from being directly impacted. Thereby avoiding leakage positions in the sealing areas among the first cover plate 310, the second cover plate 320 and the connecting piece 330, and preventing leakage of cooling medium inside the soaking plate 300. According to the application, the reinforcing plate 350 is protruded relative to the first cover plate 310 and the second cover plate 320, so that the vapor chamber 300 can be connected with the mounting piece 100 through the reinforcing plate 350, and the stress mode of the vapor chamber 300 when being impacted is changed, so that the sealing performance of the vapor chamber 300 is not easily affected when being impacted by external force.
The application also provides two embodiments of the vapor chamber 300 with different capillary structures 340, and the thicknesses of the vapor chamber 300 of the two embodiments are different, so that the vapor chamber is suitable for different use scenes.
In one possible embodiment, referring to FIG. 18, FIG. 18 is a schematic cross-sectional view of one embodiment of a capillary structure 340 shown in FIG. 4. The capillary structure is a complete copper net, and one end of the support 313, which is away from the first cover plate 310, is abutted against the capillary structure 340. Illustratively, the capillary structure 340 may be a copper mesh or copper powder structure bonded to the surface of the second cover plate 320. The thickness of the capillary structure 340 may be less than or equal to 0.05mm.
The capillary structure 340 has a gap with the solder paste connected to the periphery of the second cover plate 320. The solder paste is prevented from being spread inside the capillary 340 by being guided by the capillary 340 before being soldered after being applied to the second cover 320, and eventually causes the capillary 340 to fail.
In the present embodiment, the space between the plurality of supporters 313 is a steam channel. The position on the vapor chamber 300, which is in contact with the heating element 200, is the evaporation area of the vapor chamber 300, and when the heat of the heating element 200 is transferred to the evaporation area of the vapor chamber 300, the cooling medium in the sealed cavity 3003 is gasified after being heated in the environment with low vacuum degree, absorbs heat energy and rapidly expands in volume, and the gas-phase cooling medium rapidly fills the whole steam channel. Condensation occurs when the gaseous cooling medium contacts a relatively cool region of the vapor chamber 300, releasing heat that builds up during vaporization. The condensed cooling liquid returns to the evaporation area through the capillary channel in the capillary structure 340, and this operation is repeated in the cavity, so as to uniformly disperse the heat of the heat generating component 200.
When the vapor channel and the capillary channel are laminated in the thickness direction of the vapor chamber 300. The vapor passage space is large, and the vapor chamber 300 has a large vapor flow rate. When the vapor phase liquid cooling working medium in the vapor channel is condensed, the vapor phase liquid cooling working medium directly falls back onto the capillary channel, so that the cooling working medium can rapidly circulate between the evaporation area and the colder area, and the rapid and uniform transfer of heat on the whole vapor chamber 300 is ensured. When the capillary structure 340 is an integral net, the soaking plate 300 has a larger capillary force, so that the liquid can be guided more quickly.
In another possible embodiment, please refer to fig. 19 and 20 in combination, fig. 19 is a schematic partial cross-sectional view of a vapor chamber 300 with a capillary structure according to another embodiment shown in fig. 4. Fig. 20 is a schematic structural view of the first cover plate 310 and the second cover plate 320 provided with the capillary structure 340 shown in fig. 19. Unlike the fifth embodiment, an end of the support body 313 facing away from the first plate 315 abuts against the second cover plate 320. The capillary structure 340 is located between the second cover 320 and the first cover 310.
Specifically, the supporting bodies 313 of the first cover plate 310 may be arranged in a rectangular array. The plurality of supporters 313 are arranged in a plurality of rows. The gap between two adjacent rows of support bodies 313 is a first gap 3130. The first gap 3130 extends in the width direction of the soaking plate 300. Or the first gap 3130 extends in the length direction of the soaking plate 300.
The capillary structure 340 has a plurality of sub-portions 341. The plurality of sub-portions 341 are located in the plurality of first gaps 3130, respectively. As illustrated in fig. 12, the extending direction of the sub-portion 341 is the same as that of the first gap 3130, and the sub-portion 341 is disposed in part of the first gap 3130, and the sub-portion 341 is not disposed in part of the first gap 3130. Every other one or more first gaps 3130 are provided with a sub-portion 341. The first gap 3130 where the sub-portion 341 is located is a space where the capillary passage is located. The first gap 3130 where the sub-portion 341 is not provided is a space of the steam passage. For example, when the capillary structure 340 is disposed between the plurality of supporters 313, the thickness of the capillary structure 340 may be less than or equal to the height of the supporters 313.
In the present embodiment, the capillary structure 340 is disposed between the plurality of supporters 313, and the vapor channel and the capillary channel may be disposed in parallel. That is, the vapor channel and the capillary channel are not overlapped in the thickness direction of the vapor chamber 300. The thickness of the soaking plate 300 can be further reduced while maintaining a certain soaking capacity of the soaking plate 300, which corresponds to the compression part of the vapor channel and the capillary channel. The vapor channel and capillary channel parallel vapor chamber 300 provided by the application is suitable for use in a use scene with a small installation space.
The application also provides a preparation method of the soaking plate 300. Referring to fig. 21, fig. 21 is a schematic flow chart of a method for manufacturing a soaking plate 300 according to an embodiment of the present application. The specific structure of the vapor chamber 300 may refer to fig. 1-20 and the description above, and regarding the improvement of the vapor chamber 300, without conflict, the method may be applied to the description of the upper Wen Junre plate 300, and the method includes:
Step S100 will be described below with reference to fig. 22, and fig. 22 is a schematic structural view of the first plate 3103 after S100 is completed in the method of manufacturing the soaking plate 300 shown in fig. 21.
S100: the first plate 3103 is prepared. The support 313 and the first injection structure 3102 are formed on the initial plate body 3101 of the first cover plate 310 using a stamping process, forming a first plate 3103.
Specifically, a 0.02mm copper plate band is used as the initial plate body 3101 of the first cover plate 310, and a support body 313 is formed at the intermediate position of the initial plate body 3101, the support body 313 protruding from one surface in the thickness direction of the initial plate body 3101. The first liquid injection structure 3102 is formed at an edge position of the initial plate body 3101. The first liquid injection structure 3102 is recessed from one surface of the initial plate body 3101 in the thickness direction, and is protruded from one surface of the initial plate body 3101 in the thickness direction. The first liquid injection structure 3102 and the support 313 protrude from opposite surfaces of the initial plate 3101 in the thickness direction.
Step S200 will be described below with reference to fig. 23, and fig. 23 is a schematic structural view of a second plate 3203 after S200 is completed in the manufacturing method of the vapor chamber 300 shown in fig. 21.
S200: a second plate 3203 is prepared. A second injection structure 3202 is formed on the initial plate body 3201 of the second cover plate 320 by using a stamping process, so as to form a second plate 3203.
Specifically, a 0.02mm copper strap is used as the initial plate 3201 of the second cover plate 320, and the second liquid-injection structure 3202 is formed at the edge position of the initial plate 3201 of the second cover plate 320. The second liquid injection structure 3202 is recessed from one surface in the thickness direction of the initial plate body 3201 of the second cover plate 320, and protrudes with respect to the other surface in the thickness direction of the initial plate body 3201 of the second cover plate 320.
Step S300 will be described below in conjunction with fig. 24, and fig. 24 is a schematic structural diagram of the connector 330 after S300 is completed in the method for manufacturing the soaking plate 300 shown in fig. 21.
S300: the connection member 330 is prepared, and the connection member 330 includes a sealing portion 331 and a supporting portion 332.
Specifically, a copper strap with a target gauge of 0.17mm is used as the initial plate 3301 of the connector 330, and the connector 330 is formed by stamping, forging, and/or computer numerical control machining.
It should be noted that the order of S100, S200, and S300 is merely to illustrate that the first plate 3103, the second plate 3203, and the connector 330 may be separately prepared. In an actual manufacturing process, the present application does not limit the manufacturing sequence of the first plate 3103, the second plate 3203 and the connecting member 330. The first plate 3103, the second plate 3203, and the connector 330 may be manufactured in any order, including, for example, sequentially, or simultaneously.
Step S400 will be described below in conjunction with fig. 25, and fig. 25 is a schematic structural diagram of the first assembly 700 after S400 is completed in the method for manufacturing the soaking plate 300 shown in fig. 21.
S400: the first plate 3103 and the sealing portion 331 are joined by brazing to form the first assembly 700.
Specifically, the first brazing layer 400 is coated on the connection member 330 and/or the periphery of the surface of the first plate member 3103 on which the support body 313 is provided, and the connection member 330 is connected to the first plate member 3103 by a brazing process. The region where the connector 330 is connected to the first plate 3103 is a sealing portion 331 of the connector 330. The first notch 3311 of the seal portion 331 communicates with the first liquid injection structure 3102. The protruding area of the connection member 330 with respect to the first plate member 3103 is a supporting portion 332 of the connection member 330. The second notch 3321 of the support 332 communicates with the first liquid injection structure 3102.
Step S500 will be described below with reference to fig. 26, and fig. 26 is a schematic structural diagram of the second assembly 800 after S500 is completed in the method for manufacturing the soaking plate 300 shown in fig. 21.
S500: the capillary structure 340 is formed on the second plate 3203, forming the second assembly 800.
Specifically, a copper mesh is combined at a middle position of the surface of the second plate 3203, and the copper mesh is located on the surface of the second plate 3203, on which the second liquid injection structure is concavely arranged, so as to form the capillary structure 340.
Step S600 will be described below in conjunction with fig. 27, and fig. 27 is a schematic structural view of an initial soaking plate 3000 after S600 is completed in the manufacturing method of the soaking plate 300 shown in fig. 21.
It should be noted that the order of S400 and S500 is merely to illustrate that the first assembly 700 and the second assembly 800 may be separately prepared. In an actual manufacturing process, the present application does not limit the manufacturing sequence of the first and second assemblies 700 and 800. The first assembly 700 and the second assembly 800 may be prepared in any order.
S600: the first assembly 700 and the second assembly 800 are connected to form an initial soaking plate 3000.
Specifically, the surface of the sealing portion 331 of the first component 700 facing away from the first plate 3103 is coated with the second brazing layer 500, and/or the periphery of the surface of the second plate 3203 of the second component 800 provided with the copper mesh is coated with a brazing paste, which is disposed at a distance from the copper mesh. The first assembly 700 is connected with the second assembly 800 by a brazing process. The first liquid injection structure 3102 and the second liquid injection structure are connected in the thickness direction of the initial soaking plate 3000, and form a liquid injection tube 3004.
It should be noted that the above includes two brazing processes. The brazing step described above is only one example. The welding of the sealing portion 331 and the first plate 3103 and the welding of the sealing portion and the second plate 3203 may be performed separately or simultaneously.
S700: the initial vapor chamber 3000 is evacuated and filled with liquid, and the liquid filling tube 3004 is sealed, thereby forming the vapor chamber 300.
Specifically, the inside of the initial vapor chamber 3000 is evacuated and filled with liquid, then the liquid filling tube 3004 is flattened, and then the vapor chamber 300 is formed by welding and sealing by means of welding or the like. The flattened pour tube 3004 may be machined flush with the outer peripheral surface of the support 332. After the step S700 is completed, the first plate 3103 forms the first cover 310 described above. The second plate 3203 forms the second cover plate 320 described above. The flattened first liquid injection structure is the first extension 314 described above. The flattened second injection structure 3202 is the second extension 321 described above.
After the above steps are completed, the vapor chamber may be combined with a mount to form the electronic device 1000 through S800 and S900 described below.
S800: the soaking plate 300 is subjected to vacuum condition and soaking test.
Specifically, helium is used to test the vacuum condition of the vacuum chamber of the soaking plate 300, and a heat source is used to test the soaking capability of the soaking plate 300.
S900: the vapor chamber 300, which has passed the test in step S800, is assembled with the mount 100 to form a vapor chamber of the electronic device 1000.
The application also provides a preparation method of the soaking plate 300. Referring to fig. 28, fig. 28 is a schematic flow chart of another method for manufacturing a soaking plate 300 according to an embodiment of the present application. The preparation method shown in fig. 28 may be the same as S100-S600 of the preparation method shown in fig. 21, and details are not described here, and the preparation method shown in fig. 28 further includes:
S700: the initial soaking plate 3000 is vacuumized and filled with liquid, and the liquid filling pipe 3004 is sealed to form a soaking plate body 3005.
Step S800 will be described below with reference to fig. 29, and fig. 29 is a schematic structural diagram of the vapor chamber 300 after S800 is completed in the method for manufacturing the vapor chamber 300 shown in fig. 28.
S800: the reinforcement plate 350 is provided, and the reinforcement plate 350 is connected to the soaking plate body 3005 to form the soaking plate 300.
The foregoing is illustrative of the embodiments of the application, and it will be appreciated by those skilled in the art that changes and modifications may be made without departing from the principles of the application, such changes and modifications are to be considered as within the scope of the application.
Claims (17)
1. A soaking plate, comprising:
a first cover plate;
The second cover plate is arranged opposite to the first cover plate;
The connecting piece comprises a sealing part and a supporting part, the sealing part is positioned between the periphery of the first cover plate and the periphery of the second cover plate, the supporting part is connected to the periphery of the sealing part, and the supporting part protrudes relative to the periphery of the first cover plate and the periphery of the second cover plate;
A first brazing layer sealingly connected between the sealing portion and a periphery of the first cover plate;
The second brazing layer is connected between the sealing part and the periphery of the second cover plate in a sealing way, the second brazing layer, the first cover plate, the sealing part and the second cover plate form a sealing cavity together, and a cooling working medium is arranged in the sealing cavity; and
And the capillary structure is positioned in the sealing cavity.
2. The vapor chamber of claim 1, wherein the thickness of the support is greater than the sum of the sheet thickness of the first cover plate and the sheet thickness of the second cover plate.
3. The vapor chamber of claim 2, wherein the thickness of the support is greater than or equal to 0.05mm.
4. The vapor chamber according to claim 1, wherein the tensile strength of the support portion is greater than or equal to 150MPa, and/or the elastic modulus of the support portion is greater than or equal to 100GPa, and/or the micro vickers hardness of the support portion is greater than or equal to 50HV.
5. The vapor chamber of claim 1, wherein the material of the first cover plate and the material of the second cover plate each comprise copper, copper alloy sheet, copper steel composite or copper titanium composite sheet, and the material of the connector comprises copper or copper alloy sheet.
6. The vapor chamber according to any one of claims 1 to 5, wherein the sealing portion includes a first face and a second face disposed opposite to each other in a thickness direction, the support portion includes a third face and a fourth face disposed opposite to each other in the thickness direction, the first face and the third face are oriented toward the first cover plate, the first face and the third face are flush, the second face and the fourth face are oriented toward the second cover plate, and the second face and the fourth face are flush.
7. The vapor chamber of any one of claims 1-5, wherein the first cover plate comprises a fifth face facing away from the second cover plate, and the support comprises a third face facing away from the second cover plate, the fifth face being flush with the third face.
8. The vapor chamber according to any one of claims 1 to 5, wherein the support portion is provided with a relief notch penetrating through the support portion in a thickness direction of the support portion.
9. The vapor chamber of any one of claims 1-5, wherein the first cover plate comprises a first plate body and a plurality of support bodies, the first plate body comprising a sixth face facing the second cover plate, the plurality of support bodies being disposed in a convex shape from the sixth face, the plurality of support bodies being disposed at intervals.
10. The vapor chamber of claim 9, wherein the capillary structure is connected to a surface of the second cover plate facing the first cover plate, and a plurality of the supporting bodies are stacked with the capillary structure and abut against the capillary structure.
11. The vapor chamber of claim 9, wherein a plurality of said support bodies abut against said second cover plate, a plurality of said support bodies are arranged in a plurality of rows, a first gap is formed between two adjacent rows of said support bodies, said capillary structure comprises a plurality of sub-portions, and every other or more of said first gaps is provided with one of said sub-portions.
12. The vapor chamber of any one of claims 1-5, further comprising a stiffener plate attached to a side of the first cover plate facing away from the second cover plate.
13. The vapor chamber of claim 12, wherein the reinforcement plate is bonded or brazed to the first cover plate.
14. The soaking plate of any of claims 1-5, further comprising a stiffener plate attached to a side of the second cover plate facing away from the first cover plate, wherein an orthographic projection of the stiffener plate onto the soaking plate covers a portion of the second cover plate.
15. The vapor chamber of claim 14, wherein the material of the reinforcement plate has a micro-vickers hardness greater than the micro-vickers hardness of the material of the first cover plate.
16. A soaking plate, comprising:
a first cover plate;
The second cover plate is arranged opposite to the first cover plate;
The connecting piece is positioned between the periphery of the first cover plate and the periphery of the second cover plate;
A first brazing layer sealingly connected between the connecting piece and the periphery of the first cover plate;
The second brazing layer is connected between the connecting piece and the periphery of the second cover plate in a sealing way, the second brazing layer, the first cover plate, the connecting piece and the second cover plate form a sealing cavity together, and a cooling working medium is arranged in the sealing cavity;
The reinforcing plate is connected to one side of the first cover plate, which is away from the second cover plate, and protrudes relative to the periphery of the first cover plate and the periphery of the second cover plate; and
And the capillary structure is positioned in the sealing cavity.
17. An electronic device, comprising a mounting member, a heating element and a vapor chamber according to any one of claims 1 to 15, wherein the heating element is connected to the mounting member, the support portion is connected to the mounting member, and a surface of the second cover plate facing away from the first cover plate contacts the heating element.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323288636.4U CN221829315U (en) | 2023-12-01 | 2023-12-01 | Vapor chamber and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323288636.4U CN221829315U (en) | 2023-12-01 | 2023-12-01 | Vapor chamber and electronic equipment |
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| CN221829315U true CN221829315U (en) | 2024-10-11 |
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| CN202323288636.4U Active CN221829315U (en) | 2023-12-01 | 2023-12-01 | Vapor chamber and electronic equipment |
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| CN (1) | CN221829315U (en) |
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