CN111174617A - High-efficiency uniform temperature plate and manufacturing process thereof - Google Patents
High-efficiency uniform temperature plate and manufacturing process thereof Download PDFInfo
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- CN111174617A CN111174617A CN202010172825.7A CN202010172825A CN111174617A CN 111174617 A CN111174617 A CN 111174617A CN 202010172825 A CN202010172825 A CN 202010172825A CN 111174617 A CN111174617 A CN 111174617A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000007788 liquid Substances 0.000 claims abstract description 35
- 238000003466 welding Methods 0.000 claims description 32
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 26
- 238000002347 injection Methods 0.000 claims description 25
- 239000007924 injection Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000012530 fluid Substances 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 239000002861 polymer material Substances 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 14
- 229910000975 Carbon steel Inorganic materials 0.000 claims description 13
- 229910045601 alloy Inorganic materials 0.000 claims description 13
- 239000000956 alloy Substances 0.000 claims description 13
- 239000010962 carbon steel Substances 0.000 claims description 13
- 229910052742 iron Inorganic materials 0.000 claims description 13
- 238000005245 sintering Methods 0.000 claims description 13
- 239000012209 synthetic fiber Substances 0.000 claims description 10
- 229920002994 synthetic fiber Polymers 0.000 claims description 10
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- 238000005219 brazing Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 239000010935 stainless steel Substances 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000011230 binding agent Substances 0.000 claims description 5
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- 239000011812 mixed powder Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000003507 refrigerant Substances 0.000 claims description 3
- 238000010992 reflux Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000005530 etching Methods 0.000 description 13
- 239000002253 acid Substances 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000003912 environmental pollution Methods 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000009617 vacuum fusion Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a high-efficiency temperature-uniforming plate and a manufacturing process thereof, wherein the temperature-uniforming plate comprises a cover plate and a bottom plate, wherein the cover plate is provided with a pit, a porous capillary structure is arranged between the cover plate and the bottom plate, one end of the inner wall of the cover plate is provided with a first groove, one end of the inner wall of the bottom plate is provided with a second groove, vacuumizing/liquid injecting pipes are fixedly arranged in the first groove and the second groove, and the cover plate and the bottom plate are manufactured in a stamping mode; a plurality of support columns are fixedly arranged in the concave pits of the cover plate, and the support columns are made by stamping and are in an integrated structure with the cover plate; one surface of the porous capillary structure is combined with the inner wall of the bottom plate, and the other surface of the porous capillary structure is contacted with the supporting column; the support columns are cylinders, polygonal columns or strip-shaped columns; the shape of the porous capillary structure is the same as that of the cover plate and the bottom plate. The high-efficiency temperature equalizing plate has a simple structure, the processing technology is energy-saving and environment-friendly, the cost is saved, the production efficiency is improved, the product cost is finally reduced, and the environment is protected.
Description
Technical Field
The invention relates to the field of temperature-uniforming plates, in particular to a high-efficiency temperature-uniforming plate and a manufacturing process thereof.
Background
The current electronic products require light weight and high performance, so the electronic components need to generate high power operation in a very small volume range and a short time, therefore, the high temperature of the current electronic products is usually concentrated in a specific area during the operation process to generate a heat accumulation (heat accumulation) phenomenon, and the uniform temperature plate is filled with a fluid capable of evaporating and condensing to have good heat conduction efficiency, and has the characteristics of light weight and light weight, so the uniform temperature plate is widely applied to the field of electronic products to replace a heat dissipation plate.
In the small power device heat dissipation of narrow space, the ultra-thin temperature-equalizing plate or ultra-thin heat pipe is used as the main heat transfer or radiating element, and the periphery of the upper cover plate and the lower cover plate with pits and salient points is welded, sealed, injected with liquid, vacuumized and sealed in the existing ultra-thin temperature-equalizing plate. In the traditional scheme, the upper cover plate and the lower cover plate are both made of thick plates by etching, in order to etch the supporting pillars, the etched plates are usually thick, such as 0.25mm or 0.3mm, because the demand is huge, the loss material of each product is 45%, and the waste of the materials is serious due to the thick plate etching; meanwhile, since the unprotected material is removed by chemical etching, a strong acid solution is inevitably adopted, which causes environmental pollution and damage; and the etching process consumes a lot of manpower and financial resources. Due to the limitation of the processing technology, the traditional uniform temperature plate has lower processing production efficiency.
Therefore, a new temperature equalization plate needs to be developed.
Disclosure of Invention
In order to solve the above conventional problems, the present invention provides a high performance vapor chamber and a manufacturing process thereof. The invention is realized by the following technical scheme.
A high-efficiency temperature-uniforming plate comprises a cover plate and a bottom plate, wherein the cover plate is provided with a pit, a porous capillary structure is arranged between the cover plate and the bottom plate, a first groove is formed in one end of the inner wall of the cover plate, a second groove is formed in one end of the inner wall of the bottom plate, vacuumizing/liquid injecting pipes are fixedly arranged in the first groove and the second groove, and the cover plate and the bottom plate are both manufactured in a stamping mode; a plurality of support columns are fixedly arranged in the concave pits of the cover plate, and the support columns are made by stamping and are in an integrated structure with the cover plate; one side of the porous capillary structure is fixedly connected with the inner wall of the bottom plate, and the other side of the porous capillary structure is contacted with the supporting column.
Preferably, the supporting column is a cylinder, a polygonal column or a strip column.
Preferably, the supporting column is made of metal or high polymer material, wherein the metal comprises copper and alloy thereof, iron and carbon steel thereof, and the like.
Preferably, the shape of the porous capillary structure is the same as the shape of the cover plate and the bottom plate.
A manufacturing process of the high-efficiency temperature-uniforming plate comprises the following steps:
s1, processing a cover plate, a bottom plate, a porous capillary structure and a support column;
the cover plate is manufactured in a stamping mode, multiple times of stamping forming is adopted to form a complete surface with pits, the pits are stamped firstly, the convex hulls with a certain rule are stamped on the surfaces of the pits in a reverse direction to serve as supporting columns, the strength is guaranteed, the path of liquid cooling backflow is also guaranteed, the cover plate is obtained by adopting a coil stock with the thickness of 0.03-0.35 mm for continuous stamping, and the material properties comprise copper and copper alloy thereof, iron, carbon steel, aluminum and alloy thereof, and high polymer materials such as steel;
the bottom plate is obtained by adopting a stamping mode, and is obtained by continuously stamping a coil stock with the thickness of 0.03-0.35 mm, and the material properties comprise copper and copper alloy thereof, iron, carbon steel, aluminum and alloy thereof and high polymer materials such as stainless steel;
the porous capillary structure is woven by metal wires or synthetic fibers, and can also be obtained by sintering metal powder particles;
s2, combining the porous capillary structure with the bottom plate: if the porous capillary structure adopts a woven wire mesh or synthetic fibers, the porous capillary structure is in contact with the bottom plate in a resistance welding or sintering mode; if the porous capillary structure adopts metal powder within 40 μm, mixing the metal powder with alcohol or water and a certain binder, and coating the mixed powder on a specified area of one surface of the bottom plate for furnace high-temperature sintering;
s3, combining the cover plate with the bottom plate:
the peripheries of the cover plate and the bottom plate are mutually attached and welded by adopting welding methods such as brazing, laser welding, resistance welding or argon arc welding;
s4, welding a vacuum/liquid injection pipe:
placing the vacuum/liquid injection pipe into the slot holes at one ends of the cover plate and the bottom plate, and then welding the cover plate and the bottom plate together by adopting a brazing or resistance welding method;
s5, injecting working fluid:
injecting a certain amount of working fluid into the sealed cavity through the vacuum/liquid injection pipe, wherein the injection amount is different according to different product sizes;
s6, vacuumizing:
the vacuum pump is connected with the vacuum injection pipe, and the non-condensable gas in the product is removed as much as possible through the vacuum pump;
s7, product sealing:
when the product is pumped out to reach a certain value, the vacuum/liquid injection pipe is completely cut off and sealed.
Preferably, the support columns punched on the first thin plate are arranged according to different processes and products, and are in the shapes of cylinders, polygonal columns, strip-shaped columns and the like, and the shapes of the support columns are mainly used for enhancing the structural strength and the liquid backflow path;
preferably, the working fluid may be water, methanol, acetone or a refrigerant such as R1233ZD or 7100.
The invention has the beneficial effects that:
the supporting columns on the top plate of the high-efficiency uniform-temperature plate are processed into an integral structure with the top plate in a stamping mode, the structure is firm, and the production efficiency is high; the supporting column in the traditional production mode is processed by etching, so that the thickness of an etched plate is thicker, such as 0.25mm or 0.3mm, due to the huge demand, the material waste is serious due to the thick plate etching, and the loss material of each product is 45%; meanwhile, since the unprotected material is removed by chemical etching, a strong acid solution is inevitably adopted, which causes environmental pollution and damage; the labor and financial resources are consumed for etching such products; finally, the etching efficiency is low, the time required for complete etching of a single plate is close to 12 hours, and by the stamping method, stamping of a single product is completed within 10 seconds.
The high-efficiency temperature equalizing plate has a simple structure, the processing technology is energy-saving and environment-friendly, the capacity is correspondingly improved by at least 60 percent, the related material cost and labor cost are saved, the production efficiency is improved, and the product cost is finally reduced and the environment is protected.
Drawings
Fig. 1 is a schematic diagram of a split structure of a high performance vapor chamber according to the present invention.
Wherein: 1. a cover plate; 101. a first groove; 102. a support pillar; 2. a porous capillary structure; 3. a base plate; 301. a second groove; 4. vacuum tube/vacuum/infusion tube.
Detailed Description
The technical scheme of the invention is more fully explained in detail by combining the attached drawings.
A high-efficiency temperature-uniforming plate comprises a cover plate 1 and a bottom plate 3, wherein the cover plate 1 is provided with a pit, a porous capillary structure 2 is arranged between the cover plate 1 and the bottom plate 3, one end of the inner wall of the cover plate 1 is provided with a first groove 101, one end of the inner wall of the bottom plate 3 is provided with a second groove 301, a vacuumizing/liquid injecting pipe 4 is fixedly arranged in the first groove 101 and the second groove 301, and the cover plate 1 and the bottom plate 3 are both manufactured in a stamping mode; a plurality of support columns 102 are fixedly arranged in the pits of the cover plate 1, and the support columns 102 are made by stamping and are in an integral structure with the cover plate 1; one side of the porous capillary structure 2 is fixedly connected with the inner wall of the bottom plate 3, and the other side is contacted with the supporting column 102.
Preferably, the supporting column 2 is a cylinder, a polygonal column or a strip-shaped column, and the supporting column 2 is made of metal or polymer material such as copper and its alloy, iron and its carbon steel.
A manufacturing process of the high-efficiency temperature-uniforming plate comprises the following steps:
s1, processing a cover plate, a bottom plate, a porous capillary structure and a support column;
the cover plate is manufactured in a stamping mode, multiple times of stamping forming is adopted to form a complete surface with pits, the pits are stamped firstly, the convex hulls with a certain rule are stamped on the surfaces of the pits in a reverse direction to serve as supporting columns, the strength is guaranteed, the path of liquid cooling backflow is also guaranteed, the cover plate is obtained by adopting a coil stock with the thickness of 0.03-0.35 mm for continuous stamping, and the material properties comprise copper and copper alloy thereof, iron, carbon steel, aluminum and alloy thereof, and high polymer materials such as steel;
the bottom plate is obtained by adopting a stamping mode, and is obtained by continuously stamping a coil stock with the thickness of 0.03-0.35 mm, and the material properties comprise copper and copper alloy thereof, iron, carbon steel, aluminum and alloy thereof and high polymer materials such as stainless steel;
the porous capillary structure is woven by metal wires or synthetic fibers, and can also be obtained by sintering metal powder particles;
s2, combining the porous capillary structure with the bottom plate: if the porous capillary structure adopts a woven wire mesh or synthetic fibers, the porous capillary structure is in contact with the bottom plate in a resistance welding or sintering mode; if the porous capillary structure adopts metal powder within 40 μm, mixing the metal powder with alcohol or water and a certain binder, and coating the mixed powder on a specified area of one surface of the bottom plate for furnace high-temperature sintering;
s3, combining the cover plate with the bottom plate:
the peripheries of the cover plate and the bottom plate are mutually attached and welded by adopting welding methods such as brazing, laser welding, resistance welding or argon arc welding;
s4, welding a vacuum/liquid injection pipe:
placing the vacuum/liquid injection pipe into the slot holes at one ends of the cover plate and the bottom plate, and then welding the cover plate and the bottom plate together by adopting a brazing or resistance welding method;
s5, injecting working fluid:
injecting a certain amount of working fluid into the sealed cavity through the vacuum/liquid injection pipe, wherein the injection amount is different according to different product sizes;
s6, vacuumizing:
the vacuum pump is connected with the vacuum injection pipe, and the non-condensable gas in the product is removed as much as possible through the vacuum pump;
s7, product sealing:
when the product is pumped out to reach a certain value, the vacuum/liquid injection pipe is completely cut off and sealed.
Detailed description of the preferred embodiment 1
A high-effect temperature-uniforming plate comprises a cover plate 1 with a pit and a base plate 3, wherein one end of the inner wall of the cover plate 1 is provided with a first groove 101, one end of the inner wall of the base plate 3 is provided with a second groove 301, and a vacuumizing/liquid injection pipe 4 is fixedly arranged in the first groove 101 and the second groove 301. The cover plate 1 and the bottom plate 3 are both manufactured by stamping, wherein a plurality of regularly arranged support columns 102 are fixedly arranged in the pits of the cover plate 1 by stamping for a plurality of times, the support columns 2 are cylinders, polygonal columns or strip-shaped columns, and the support columns 2 are made of metals such as copper and alloys thereof, iron and carbon steel thereof or high polymer materials.
A porous capillary structure 2 is arranged between the cover plate 1 and the bottom plate 3, the porous capillary structure can be obtained by weaving copper wires or sintering copper powder and serves as a liquid absorbing working medium, so that liquid can be quickly evaporated or boiled after absorbing heat in a certain vacuum cavity, and a large amount of heat can be taken away. If the woven wire mesh is adopted as the porous capillary structure, the cutting can be carried out in a stamping or die cutting mode; if the metal powder is sintered, the metal powder within 40 mu m is mixed with a certain binder by alcohol or water and is placed into a pit on the bottom plate to be sintered at high temperature in a furnace; for the synthetic fiber, it can be obtained by using synthetic fiber and cutting. One side of the porous capillary structure 2 is fixedly connected with the inner wall of the bottom plate 3, and the other side is contacted with the supporting column 102.
The thickness of the cover plate 1 is 0.03-0.35 mm, the thickness of the bottom plate 2 is 0.03-0.35 mm, and the cover plate and the bottom plate are both made of copper and copper alloy thereof, iron, carbon steel, aluminum and alloy thereof and high polymer material such as stainless steel.
As a further optimized scheme, the shape of the porous capillary structure 2 is the same as that of the cover plate 1 and the bottom plate 2, and the size of the porous capillary structure 2 is the same as that of the pits on the bottom plate 2.
The vacuumizing/liquid injecting pipe 4 is a tubular structure with the outer diameter D1.5mm-3 mm and made of metal or high polymer materials.
A manufacturing process of the high-efficiency temperature-uniforming plate comprises the following steps:
s1, processing a cover plate, a bottom plate, a porous capillary structure and a support column;
the cover plate is manufactured in a stamping mode, multiple times of stamping forming is adopted to form a complete surface with pits, the convex hulls with certain rules are stamped on the inner concave surface to serve as support columns, the strength is guaranteed, the path of liquid cooling backflow is also guaranteed, the cover plate is obtained by adopting a coil stock of 0.03-0.35 mm for continuous stamping, and the material properties comprise copper and copper alloy thereof, iron, carbon steel, aluminum and alloy thereof and high polymer materials; the support columns punched on the first thin plate are arranged according to different processes and products, and are in the shapes of cylinders, polygonal columns, strip-shaped columns and the like, and the main functions of the support columns are to strengthen the structural strength and the liquid backflow path
The bottom plate is obtained by stamping in a continuous stamping mode by using a coil stock with the thickness of 0.03-0.35 mm, and the material properties comprise copper and copper alloy thereof, iron, carbon steel, aluminum and alloy thereof and high polymer materials such as stainless steel.
The porous capillary structure is woven by metal wires or synthetic fibers, and can also be obtained by sintering metal powder particles;
s2, combining the porous capillary structure with the bottom plate: if the porous capillary structure adopts a woven wire mesh or synthetic fibers, the porous capillary structure is in contact with the bottom plate in a resistance welding or sintering mode; if the porous capillary structure adopts metal powder with the diameter less than or equal to 40 mu m, the metal powder is mixed with certain binding agent by adopting alcohol or water, and then the mixed powder is coated on a set area of one surface of the bottom plate to carry out furnace high-temperature sintering.
S3, combining the cover plate with the bottom plate:
the porous capillary structure is fixed at the concave part of the bottom plate, one side of the cover plate with the supporting columns is combined with one side of the bottom plate with the porous capillaries, the peripheries of the cover plate and the bottom plate are mutually attached and welded, and welding methods such as brazing, laser welding, resistance welding or argon arc welding are adopted.
S4, welding a vacuum/liquid injection pipe:
and placing the vacuum/liquid injection pipe into the slotted holes at one ends of the cover plate and the bottom plate, and then welding the cover plate and the bottom plate together by adopting a brazing or resistance welding method.
S5, injecting working fluid:
injecting a certain amount of working fluid into the sealed cavity through the vacuum/liquid injection pipe, wherein the injection amount is different according to different product sizes; the working fluid may be water, methanol, acetone, or a refrigerant such as R1233ZD or 7100.
S6, vacuumizing:
the vacuum pump is connected with the vacuum injection pipe, and the non-condensable gas in the product is removed as much as possible through the vacuum pump;
s7, product sealing:
when the product is pumped out to reach a certain value, the vacuum/liquid injection pipe is completely cut off and sealed.
The working principle is as follows:
according to the ultrathin uniform temperature plate, when a heating device is attached to the outer surface of the bottom plate, a certain amount of liquid working fluid can be stored in the porous capillary structure inside, the liquid working fluid absorbs heat and changes phase into saturated steam under a certain vacuum degree, the saturated steam can flow to the whole cavity under a certain pressure difference, because the phase change temperature of the gaseous working fluid under the certain vacuum degree is constant, the saturated steam can be condensed into a liquid state when the wall surface of the cavity is cooled, and relevant latent heat is released, so that waste heat of the device can be released to a larger external environment.
According to the invention, the supporting columns on the top plate are processed into an integral structure with the top plate in a stamping manner, the structure is firm, and the production efficiency is high; the supporting column in the traditional production mode is processed by etching, so that the thickness of an etched plate is thicker, such as 0.25mm or 0.3mm, due to the huge demand, the material waste is serious due to the thick plate etching, and the loss material of each product is 45%; meanwhile, since the unprotected material is removed by chemical etching, a strong acid solution is inevitably adopted, which causes environmental pollution and damage; the labor and financial resources are consumed for etching such products; finally, the etching efficiency is low, the time required for complete etching of a single plate is close to 12 hours, and by the stamping method, stamping of a single product is completed within 10 seconds.
The high-efficiency temperature equalizing plate has a simple structure, the processing technology is energy-saving and environment-friendly, the capacity is correspondingly improved by at least 60 percent, the related material cost and labor cost are saved, the production efficiency is improved, and the product cost is finally reduced and the environment is protected.
It is to be understood that the described embodiments are merely individual embodiments of the invention, rather than all embodiments. All other implementations made by those skilled in the art without any inventive step based on the embodiments of the present invention belong to the protection scope of the present invention.
Claims (7)
1. The utility model provides a high-effect temperature-uniforming plate, is including apron (1) and bottom plate (3) that have the pit, be equipped with porous capillary structure (2) between apron (1) and bottom plate (3), first recess (101) are seted up to the inner wall one end of apron (1), second recess (301) are seted up to the inner wall one end of bottom plate (3), first recess (101) and second recess (301) internal stability are taken out the vacuum/are annotated liquid pipe (4), its characterized in that:
the cover plate (1) and the bottom plate (3) are both manufactured in a stamping mode;
a plurality of supporting columns (102) are fixedly arranged in the pits of the cover plate (1), and the supporting columns (102) are made by stamping and are of an integrally formed structure with the cover plate (1);
one side of the porous capillary structure (2) is fixedly connected with the inner wall of the bottom plate (3), and the other side of the porous capillary structure is contacted with the supporting column (102).
2. The high performance vapor chamber as recited in claim 1, wherein: the supporting column (2) is a cylinder, a polygonal column or a strip-shaped column, and provides a path for the reflux of condensed steam.
3. The high performance vapor chamber as recited in claim 2, wherein: the supporting column (2) is made of metal or high polymer material such as copper and alloy thereof, iron and carbon steel thereof and the like, such as stainless steel.
4. The high performance vapor chamber as recited in claim 1, wherein: the shape of the porous capillary structure (2) is the same as that of the cover plate (1) and the bottom plate (2).
5. A process for manufacturing the high performance thermal uniforming plate as claimed in claim 1, wherein: the method comprises the following steps:
s1, processing a cover plate, a bottom plate, a porous capillary structure and a support column;
the cover plate is manufactured by adopting a stamping mode, a pit is stamped out firstly, a convex hull with a certain rule is stamped on the surface of the pit in a reverse direction to serve as a supporting column, the strength is ensured, the path of liquid cooling backflow is also ensured, the cover plate is obtained by adopting a coil stock with the thickness of 0.03-0.35 mm for continuous stamping, and the material properties comprise copper and copper alloy thereof, iron, carbon steel, aluminum and alloy thereof, and high polymer materials such as stainless steel and the like;
the bottom plate is obtained by adopting a stamping mode, and is obtained by continuously stamping a coil stock with the thickness of 0.03-0.35 mm, and the material properties comprise copper and copper alloy thereof, iron, carbon steel, aluminum and alloy thereof and high polymer materials such as stainless steel and the like;
the porous capillary structure is woven by metal wires or synthetic fibers, and can also be obtained by sintering metal powder particles;
s2, combining the porous capillary structure with the bottom plate: if the porous capillary structure adopts a woven wire mesh or synthetic fibers, the porous capillary structure is in contact with the bottom plate in a resistance welding or sintering mode; if the porous capillary structure adopts metal powder within 40 μm, mixing the metal powder with alcohol or water and a certain binder, and coating the mixed powder on a specified area of one surface of the bottom plate for furnace high-temperature sintering;
s3, combining the cover plate with the bottom plate:
the peripheries of the cover plate and the bottom plate are mutually attached and welded by adopting welding methods such as brazing, laser welding, resistance welding or argon arc welding;
s4, welding a vacuum/liquid injection pipe:
placing the vacuum/liquid injection pipe into the slot holes at one ends of the cover plate and the bottom plate, and then welding the cover plate and the bottom plate together by adopting a brazing or resistance welding method;
s5, injecting working fluid:
injecting a certain amount of working fluid into the sealed cavity through the vacuum/liquid injection pipe, wherein the injection amount is different according to different product sizes;
s6, vacuumizing:
the vacuum pump is connected with the vacuum injection pipe, and the non-condensable gas in the product is removed as much as possible through the vacuum pump;
s7, product sealing:
when the product is pumped out to reach a certain value, the vacuum/liquid injection pipe is completely cut off and sealed.
6. The manufacturing process of a high performance vapor chamber as claimed in claim 5, wherein: the support columns punched on the first thin plate are arranged according to different processes and products, and are in the shapes of cylinders, polygonal columns, strip-shaped columns and the like, and the structural strength and the liquid backflow path are mainly enhanced.
7. The manufacturing process of a high performance vapor chamber as claimed in claim 5, wherein: the working fluid may be water, methanol, acetone, or a refrigerant such as R1233ZD or 7100.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010172825.7A CN111174617A (en) | 2020-03-13 | 2020-03-13 | High-efficiency uniform temperature plate and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010172825.7A CN111174617A (en) | 2020-03-13 | 2020-03-13 | High-efficiency uniform temperature plate and manufacturing process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111174617A true CN111174617A (en) | 2020-05-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010172825.7A Pending CN111174617A (en) | 2020-03-13 | 2020-03-13 | High-efficiency uniform temperature plate and manufacturing process thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112091551A (en) * | 2020-08-03 | 2020-12-18 | 东莞领杰金属精密制造科技有限公司 | Manufacturing method and structure of inflation plate |
| CN113811139A (en) * | 2020-06-15 | 2021-12-17 | 昆山巨仲电子有限公司 | Capillary structure of temperature equalizing plate |
| CN114061346A (en) * | 2020-08-04 | 2022-02-18 | 北京小米移动软件有限公司 | Soaking plate |
| TWI772822B (en) * | 2020-06-18 | 2022-08-01 | 大陸商尼得科巨仲電子（昆山）有限公司 | Vapor chamber having capillary structure |
| CN115870707A (en) * | 2023-02-01 | 2023-03-31 | 深圳威铂驰热技术有限公司 | Vapor chamber module for 5G mobile terminal, processing method of vapor chamber module and 5G mobile terminal |
| CN116487768A (en) * | 2023-03-30 | 2023-07-25 | 昆山捷桥电子科技有限公司 | Multi-effect temperature-equalizing plate and manufacturing process thereof |
| WO2024016408A1 (en) * | 2022-07-21 | 2024-01-25 | 瑞泰精密科技(沭阳)有限公司 | Vapor chamber cavity sealing process and vapor chamber |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113811139A (en) * | 2020-06-15 | 2021-12-17 | 昆山巨仲电子有限公司 | Capillary structure of temperature equalizing plate |
| TWI772822B (en) * | 2020-06-18 | 2022-08-01 | 大陸商尼得科巨仲電子（昆山）有限公司 | Vapor chamber having capillary structure |
| CN112091551A (en) * | 2020-08-03 | 2020-12-18 | 东莞领杰金属精密制造科技有限公司 | Manufacturing method and structure of inflation plate |
| CN114061346A (en) * | 2020-08-04 | 2022-02-18 | 北京小米移动软件有限公司 | Soaking plate |
| WO2024016408A1 (en) * | 2022-07-21 | 2024-01-25 | 瑞泰精密科技(沭阳)有限公司 | Vapor chamber cavity sealing process and vapor chamber |
| CN115870707A (en) * | 2023-02-01 | 2023-03-31 | 深圳威铂驰热技术有限公司 | Vapor chamber module for 5G mobile terminal, processing method of vapor chamber module and 5G mobile terminal |
| CN116487768A (en) * | 2023-03-30 | 2023-07-25 | 昆山捷桥电子科技有限公司 | Multi-effect temperature-equalizing plate and manufacturing process thereof |
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