CN112461025A - Temperature equalizing plate - Google Patents
Temperature equalizing plate Download PDFInfo
- Publication number
- CN112461025A CN112461025A CN202011479620.XA CN202011479620A CN112461025A CN 112461025 A CN112461025 A CN 112461025A CN 202011479620 A CN202011479620 A CN 202011479620A CN 112461025 A CN112461025 A CN 112461025A
- Authority
- CN
- China
- Prior art keywords
- heat
- plate
- bosses
- temperature
- boss
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002347 injection Methods 0.000 claims description 14
- 239000007924 injection Substances 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000009792 diffusion process Methods 0.000 abstract description 9
- 238000012546 transfer Methods 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 17
- 238000003466 welding Methods 0.000 description 6
- 239000000110 cooling liquid Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009841 combustion method Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to the technical field of heat transfer and discloses a temperature-equalizing plate. The temperature equalizing plate comprises a heat conducting bottom plate, an accommodating cavity is concavely arranged on the heat conducting bottom plate, the size of the bottom surface of the accommodating cavity is limited to be at least one dimension larger than any other dimension, the depth of the accommodating cavity is 0.02mm-0.1mm, a plurality of groups of parallel bosses arranged at intervals are arranged on the bottom surface of the accommodating cavity, each group of bosses comprise a plurality of bosses extending in the same direction and arranged at intervals, the height of each boss is 0.02mm-0.1mm, the width of each boss is 0.05mm-0.2mm, the length-width ratio of each boss is larger than 3:1, and a medium flow channel is formed between every two adjacent groups of bosses. By controlling the length-width ratio of the lug boss and optimizing the size and the shape of the formed medium flow channel, the capillary backwater quantity along the length direction of the lug boss can be slightly controlled, so that the diffusion of the capillary backwater quantity in the temperature-uniforming plate along the length direction of the lug boss is larger than that along the width direction of the lug boss, and the problem of large temperature difference at different positions on the temperature-uniforming plate is solved.
Description
Technical Field
The invention relates to the technical field of heat transfer, in particular to a temperature-equalizing plate.
Background
The rapid development of electronic technology requires higher performance, higher density and higher intelligence for chips, and as the integration level, packaging density and operating frequency of chips are continuously improved, the power consumption required by chips is also increased, and in order to maintain efficient heat dissipation of chips, temperature-uniforming plates have been widely used in the field of heat dissipation of electronic devices.
The vapor chamber utilizes the phase change process of the working medium to achieve the purpose of effective heat transfer by absorbing and releasing latent heat, and can effectively dissipate heat with high heat flux density 'hot spots' and flatten the heat into a relatively uniform temperature field. With the rapid development of notebook computers, tablet computer chips and the like, notebook computers and tablet computers are increasingly light and thin, and the heat dissipation space is very limited, so that higher requirements are provided for heat dissipation of the notebook computers and the tablet computers. And the temperature-uniforming plate need dispel the heat through capillary backward flow water, and for guaranteeing that each position temperature is comparatively unanimous on the temperature-uniforming plate, the temperature-uniforming plate of the longer one side of length requires more to capillary backward flow, but current temperature-uniforming plate is 360 diffusion backward flow, lead to its capillary backward flow speed or the backward flow volume in longer one side not enough, return water and steam circulation can not keep up in the temperature-uniforming plate easily appearing, the temperature-uniforming plate is kept away from the great problem of the one end temperature difference of heating source and the one end that is close to the heating source, lead to the condition that the dry combustion method appears in the temperature-uniforming plate.
Therefore, the diffusion of the capillary backwater inside the temperature equalization plate in the length direction of the boss inside the temperature equalization plate is larger than that in the width direction of the boss inside the temperature equalization plate, so that the problem of large temperature difference at different positions on the temperature equalization plate is solved, and the condition of dry burning of the temperature equalization plate is avoided.
Disclosure of Invention
The invention aims to provide a temperature-uniforming plate, which aims to realize that the diffusion of the capillary backwater in the temperature-uniforming plate in the length direction of a boss in the temperature-uniforming plate is larger than the diffusion of the capillary backwater in the width direction of the boss, so that the problem of larger temperature difference at different positions on the temperature-uniforming plate is solved, and the condition that the temperature-uniforming plate is dried is avoided.
As the conception, the technical scheme adopted by the invention is as follows:
a temperature equalization plate comprises a heat conduction bottom plate, wherein an accommodating cavity is concavely arranged on the heat conduction bottom plate, the size of the bottom surface of the accommodating cavity is limited to be at least one dimension larger than any other dimension, the depth of the accommodating cavity is 0.02mm-0.1mm, a plurality of groups of parallel bosses arranged at intervals are arranged on the bottom surface of the accommodating cavity, each group of bosses comprises a plurality of bosses extending in the same direction and arranged at intervals, the height of each boss is 0.02mm-0.1mm, the width of each boss is 0.05mm-0.2mm, the length-width ratio of each boss is larger than 3:1, and a medium flow channel is formed between every two adjacent groups of bosses.
Further, the bosses of two adjacent groups of bosses are arranged in one-to-one alignment or staggered mode.
Further, the heat conducting bottom plate is long, and the length-width ratio of the long strip is greater than 1.5: 1; every the boss all follows rectangular form length direction extends, and adjacent two sets of bosses follow rectangular form width direction interval sets up.
Furthermore, the heat conduction cover plate is covered with the heat conduction bottom plate, and a plurality of bulges are convexly arranged on the heat conduction cover plate towards the direction of the heat conduction bottom plate and are distributed at intervals.
Furthermore, the heat dissipation plate also comprises a heat dissipation net, the heat dissipation net is diffusion-welded on the heat conduction bottom plate, and the lug boss and the bulge respectively abut against two sides of the heat dissipation net.
Furthermore, the heat dissipation net is a woven body made of copper wires, the side length of a square hole in the woven body is 0.03mm-0.12mm, and the diameter of each copper wire is 0.02mm-0.08 mm.
The heat conduction bottom plate is provided with a liquid injection port, and the liquid injection port is formed in the heat conduction bottom plate; or
The liquid injection port is formed in the heat conduction cover plate; or
The liquid injection port is formed by splicing two half holes respectively arranged on the heat conduction bottom plate and the heat conduction cover plate.
Further, the heat conduction bottom plate and the heat conduction cover plate are connected in a welding mode.
Further, the protrusion is formed by etching or punching.
Further, the boss is formed by etching.
The invention has the beneficial effects that:
the temperature-uniforming plate comprises a heat-conducting bottom plate, wherein an accommodating cavity is concavely arranged on the heat-conducting bottom plate, the size of the bottom surface of the accommodating cavity is limited to be at least one dimension which is larger than any other dimension, the depth of the accommodating cavity is 0.02mm-0.1mm, a plurality of groups of parallel bosses which are arranged at intervals are arranged on the bottom surface of the accommodating cavity, each group of bosses comprise a plurality of bosses which extend along the same direction and are arranged at intervals, the height of each boss is 0.02mm-0.1mm, the width of each boss is 0.05mm-0.2mm, the length-width ratio of each boss is larger than 3:1, and a medium flow channel is formed between every two adjacent groups of. By controlling the length-width ratio of the lug boss, the size and the shape of the formed medium flow channel are optimized, and the capillary backwater quantity in the length direction of the lug boss can be slightly controlled, so that the diffusion of the capillary backwater quantity in the temperature-uniforming plate in the length direction of the lug boss is larger than that in the width direction of the lug boss, the problem that the temperature difference of different positions on the temperature-uniforming plate is large is solved, and the dry burning condition of the temperature-uniforming plate is effectively avoided.
Drawings
FIG. 1 is a schematic structural diagram of a vapor chamber provided in an embodiment of the present invention;
fig. 2 is a partial schematic view of a heat conducting base plate according to an embodiment of the invention.
In the figure:
1. a heat conducting cover plate; 11. a protrusion;
2. a heat-dissipating web;
3. a thermally conductive base plate; 31. a boss; 32. a media flow path.
Detailed Description
In order to make the technical problems solved, the technical solutions adopted and the technical effects achieved by the present invention clearer, the technical solutions of the present invention are further described below by way of specific embodiments with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the elements associated with the present invention are shown in the drawings.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used based on the orientations and positional relationships shown in the drawings only for convenience of description and simplification of operation, and do not indicate or imply that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
As shown in fig. 1 and fig. 2, the present embodiment provides a temperature equalization plate, which includes a heat conduction bottom plate 3, a receiving cavity is concavely disposed on the heat conduction bottom plate, the bottom surface of the receiving cavity is limited to have at least one dimension larger than any other dimension, the depth of the receiving cavity is 0.02mm to 0.1mm, the bottom surface of the receiving cavity is provided with a plurality of sets of parallel and spaced bosses, each set of bosses includes a plurality of bosses 31 extending in the same direction and spaced apart from each other, the height of each boss 31 is 0.02mm to 0.1mm, the width of each boss 31 is 0.05mm to 0.2mm, the aspect ratio of each boss 31 is greater than 3:1, and a medium flow channel 32 is formed between two adjacent sets of bosses.
The uniform temperature plate has the function of uniformly distributing a plurality of heat sources in a short distance on a larger heat dissipation area, specifically, when heat is conducted from the heat sources to an evaporation area, the cooling liquid in the cavity starts to generate a gasification phenomenon of the cooling liquid after being heated in a low-vacuum environment, at the moment, heat energy is absorbed, the volume rapidly expands, a gas-phase cooling medium quickly fills the whole cavity, when a gas-phase working medium contacts a relatively cold area, a condensation phenomenon is generated, heat accumulated during evaporation is released by the condensation phenomenon, the condensed cooling liquid returns to the evaporation heat source again by a capillary tube of a microstructure, and the operation is repeated in the cavity. Therefore, by controlling the length-width ratio of the boss 31 and changing the size and shape of the medium flow channel 32 formed on the heat conducting bottom plate 3, the capillary backwater amount in the length direction of the boss can be slightly controlled, so that the diffusion of the capillary backwater amount in the temperature equalizing plate in the length direction of the boss is larger than that in the width direction of the boss, the condition of dry burning of the temperature equalizing plate can be effectively avoided, and the problem of large temperature difference at different positions on the temperature equalizing plate is solved.
Specifically, in the present embodiment, the bosses 31 of two adjacent sets of bosses are aligned one by one or are disposed in a staggered manner. As shown in fig. 2, the bosses 31 of two adjacent sets of bosses are arranged in a staggered manner, a medium flow passage 32 is formed between two adjacent sets of bosses, and a gap between two adjacent bosses 31 communicates two adjacent medium flow passages 32. Similarly, when the bosses 31 of two adjacent sets of bosses are aligned one by one (not shown in the figure), the media flow channels 32 are formed between the two adjacent sets of bosses, and the gap between the two adjacent bosses 31 communicates with the two adjacent media flow channels 32, which may together form a checkerboard-like media flow channel.
Further, the heat conducting bottom plate 3 is long, and the length-width ratio of the long strip is larger than 1.5: 1. It can be understood that the temperature equalizing plate used for heat dissipation in the notebook or tablet computer chips commonly seen in the market is basically in a long strip shape, and the processing is convenient. Therefore, in the present embodiment, each of the bosses 31 extends in the length direction of the elongated shape, and two adjacent sets of the bosses are spaced apart in the width direction of the elongated shape.
In addition, in practical application, a proper shape of the medium flow channel 32 can be selected according to the specific size of the temperature equalization plate and the distribution position of the heat source, so as to ensure good heat dissipation performance of each position of the temperature equalization plate. Alternatively, a series of bosses 31 may be provided only at desired positions to form the medium flow paths 32, depending on the actual heat source distribution. In addition, in order to promote the uniformity of the distribution of the capillary backwater in the medium channel 32, the boss 31 is preferably a strip-shaped boss, so that the influence of the corner of the boss 31 on the flow field of the capillary backwater can be effectively avoided.
As shown in fig. 1, the temperature equalizing plate provided in this embodiment further includes a heat conducting cover plate 1 covering the heat conducting bottom plate 3, the heat conducting cover plate 1 is provided with a plurality of protrusions 11 protruding toward the heat conducting bottom plate 3, and the plurality of protrusions 11 are distributed at intervals. In particular, the protrusions 11 mainly serve as a support to avoid the problem of deformation of the vapor chamber that may occur when a vacuum is subsequently applied to the interior of the vapor chamber. Therefore, the shape of the protrusion 11 does not need to be excessive, and in the present embodiment, the protrusion 11 is preferably a hemisphere. Of course, in another embodiment, the protrusion 11 may be configured as a cylinder. Specifically, the protrusion 11 is formed by etching or stamping, the protrusion 11 and the heat conducting cover plate 1 are integrally formed, the processing technology is less, the production cost can be reduced, and the heat dissipation efficiency can be improved.
Further, the temperature-uniforming plate provided by the embodiment further includes a heat-dissipating net 2, the heat-dissipating net 2 is diffusion-welded on the heat-conducting bottom plate 3, and the bosses 31 and the protrusions 11 respectively abut against two sides of the heat-dissipating net 2. Specifically, the heat dissipating mesh 2 is welded to the boss 31 inside the heat conductive base plate 3 by diffusion welding. The heat dissipation net 2 is a woven body made of copper wires, the side length of square holes in the woven body is 0.03mm-0.12mm, the diameter of the copper wires is 0.02mm-0.08mm, hot air can circulate more rapidly in a copper net micro-environment under the vacuum design, the aperture of the woven body has higher consistency, and fluid can flow more smoothly. Of course, in another embodiment, the heat dissipation mesh 2 may be formed by sintering metal powder.
In addition, the boss 31 is formed by etching, so the shape or size of the boss is inevitably subject to etching processing errors, in this embodiment, the theoretical width of the design of the boss 31 part is 0.05mm-0.2mm, and etching errors are allowed in the processing process, but it is still required to ensure that the width of the top of the etching platform is at least 0.02mm, that is, in the direction perpendicular to the heat conducting bottom plate 3, the cross section of the boss 31 is allowed to be approximately trapezoidal, and the length of the shorter side of the trapezoid is more than or equal to 0.02mm, so as to ensure that the heat dissipation net 2 can be welded on the boss 31. Preferably, in order to ensure the welding effect, the top of the boss 31 should be flat to ensure that the heat dissipation net 2 can be tightly pressed on the upper surface of the boss 31.
Furthermore, the temperature equalization plate provided by the embodiment further comprises a liquid injection port, wherein the liquid injection port is mainly used for injecting cooling liquid into the temperature equalization plate after vacuumizing, and after liquid injection is completed, the liquid injection port is closed, so that a closed cavity is formed in the temperature equalization plate. It can be understood that the liquid injection port can be opened on the heat conduction bottom plate 3 or the heat conduction cover plate 1, or the liquid injection port is formed by splicing two half holes respectively arranged on the heat conduction bottom plate 3 and the heat conduction cover plate 1.
In addition, in the present embodiment, the heat conductive base plate 3 and the heat conductive cover plate 1 are welded, wherein the welding method includes, but is not limited to, diffusion welding, soldering, and laser welding.
In addition, in order to ensure good heat conduction effect and ensure light and thin structure of the temperature equalization plate, in this embodiment, the heat conduction base plate 3 is made of copper alloy material, or after the boss 31 is etched on the heat conduction base plate 3, the heat conduction base plate 3 is plated with copper. Similarly, the heat-conducting cover plate 1 may be made of copper alloy, or the heat-conducting cover plate 1 may be plated with copper after the protrusions 11 are punched or etched on the heat-conducting cover plate 1.
Finally, it should be noted that, in order to ensure the above practical application effect in the temperature-uniforming plate, in this embodiment, the total thickness of the temperature-uniforming plate after the heat-conducting bottom plate 3 and the heat-conducting cover plate 1 are welded together is preferably less than or equal to 1.2 mm.
The foregoing embodiments are merely illustrative of the principles and features of this invention, which is not limited to the above-described embodiments, but rather is susceptible to various changes and modifications without departing from the spirit and scope of the invention, which changes and modifications are within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. The temperature-uniforming plate is characterized by comprising a heat-conducting base plate (3), wherein an accommodating cavity is concavely arranged on the heat-conducting base plate (3), the depth of the accommodating cavity is 0.02-0.1 mm, a plurality of groups of parallel bosses arranged at intervals are arranged on the bottom surface of the accommodating cavity, each group of bosses comprises a plurality of bosses (31) extending in the same direction and arranged at intervals, the height of each boss (31) is 0.02-0.1 mm, the width of each boss (31) is 0.05-0.2 mm, the length-width ratio of each boss (31) is greater than 3:1, and a medium flow channel (32) is formed between every two adjacent groups of bosses.
2. The vapor-insulating plate according to claim 1, characterized in that the bosses (31) of two adjacent sets of bosses are arranged in alignment or offset.
3. A temperature-uniforming plate according to claim 1, wherein the heat-conducting base plate (3) is elongate, the elongate length having an aspect ratio of greater than 1.5: 1; each boss (31) extends along the length direction of the long strip, and two adjacent groups of bosses are arranged at intervals along the width direction of the long strip.
4. The temperature equalizing plate according to claim 1, further comprising a heat conducting cover plate (1) covering the heat conducting bottom plate (3), wherein the heat conducting cover plate (1) is provided with a plurality of protrusions (11) protruding towards the heat conducting bottom plate (3), and the plurality of protrusions (11) are distributed at intervals.
5. The temperature-uniforming plate according to claim 4, further comprising a heat-dissipating net (2), wherein the heat-dissipating net (2) is diffusion-welded on the heat-conducting bottom plate (3), and the bosses (31) and the protrusions (11) respectively abut against two sides of the heat-dissipating net (2).
6. The temperature-equalizing plate as claimed in claim 5, wherein the heat-dissipating mesh (2) is a woven body made of copper wires, the sides of square holes in the woven body are 0.03mm-0.12mm long, and the diameter of the copper wires is 0.02mm-0.08 mm.
7. The vapor chamber according to claim 4, further comprising a liquid injection port, wherein the liquid injection port is opened on the heat conducting bottom plate (3); or
The liquid injection port is formed in the heat conduction cover plate (1); or
The liquid injection port is formed by splicing two half holes respectively formed in the heat conduction bottom plate (3) and the heat conduction cover plate (1).
8. Temperature-uniforming plate according to claim 4, characterized in that the heat-conducting base plate (3) and the heat-conducting cover plate (1) are welded.
9. Temperature-uniforming plate according to claim 1, wherein the protrusions (11) are formed by etching or stamping.
10. A temperature-uniforming plate according to claim 1, wherein the bosses (31) are formed by etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011479620.XA CN112461025A (en) | 2020-12-15 | 2020-12-15 | Temperature equalizing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011479620.XA CN112461025A (en) | 2020-12-15 | 2020-12-15 | Temperature equalizing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112461025A true CN112461025A (en) | 2021-03-09 |
Family
ID=74804402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011479620.XA Pending CN112461025A (en) | 2020-12-15 | 2020-12-15 | Temperature equalizing plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112461025A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113518539A (en) * | 2021-04-19 | 2021-10-19 | Oppo广东移动通信有限公司 | Heat dissipation device and electronic equipment |
| CN113970090A (en) * | 2021-11-16 | 2022-01-25 | 成都东骏激光股份有限公司 | Static ceramic lighting assembly, preparation method thereof and lighting device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105280583A (en) * | 2015-09-15 | 2016-01-27 | 东南大学 | Anti-deformation pressure resistant temperature-uniforming plate |
| CN106376214A (en) * | 2015-07-20 | 2017-02-01 | 台达电子工业股份有限公司 | Slim vapor chamber |
| CN109348682A (en) * | 2018-10-22 | 2019-02-15 | 深圳市晟达真空钎焊技术有限公司 | A kind of compound temperature-uniforming plate of the hot copper aluminium microflute group of new superconductive and its manufacturing method |
| CN110285699A (en) * | 2019-07-26 | 2019-09-27 | 联德精密材料（中国）股份有限公司 | A kind of compound temperature-uniforming plate and its manufacturing method |
| CN110567304A (en) * | 2019-10-15 | 2019-12-13 | 联德精密材料（中国）股份有限公司 | Thin capillary structure supporting temperature equalizing plate |
| CN110779369A (en) * | 2019-12-04 | 2020-02-11 | 东莞市万维热传导技术有限公司 | Take capillary structure inflation formula aluminium temperature-uniforming plate |
| CN210489604U (en) * | 2019-10-15 | 2020-05-08 | 深圳垒石热管理技术有限公司 | Temperature equalizing plate |
| CN211607177U (en) * | 2020-01-13 | 2020-09-29 | 东莞泰硕电子有限公司 | Antigravity composite energy channel forced flow guiding uniform temperature plate, radiator and electronic product |
| CN111765788A (en) * | 2020-07-16 | 2020-10-13 | 深圳市飞荣达科技股份有限公司 | Novel phase change temperature-uniforming plate |
| CN214065819U (en) * | 2020-12-15 | 2021-08-27 | 爱美达（深圳）热能系统有限公司 | Temperature equalizing plate |
-
2020
- 2020-12-15 CN CN202011479620.XA patent/CN112461025A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106376214A (en) * | 2015-07-20 | 2017-02-01 | 台达电子工业股份有限公司 | Slim vapor chamber |
| CN105280583A (en) * | 2015-09-15 | 2016-01-27 | 东南大学 | Anti-deformation pressure resistant temperature-uniforming plate |
| CN109348682A (en) * | 2018-10-22 | 2019-02-15 | 深圳市晟达真空钎焊技术有限公司 | A kind of compound temperature-uniforming plate of the hot copper aluminium microflute group of new superconductive and its manufacturing method |
| CN110285699A (en) * | 2019-07-26 | 2019-09-27 | 联德精密材料（中国）股份有限公司 | A kind of compound temperature-uniforming plate and its manufacturing method |
| CN110567304A (en) * | 2019-10-15 | 2019-12-13 | 联德精密材料（中国）股份有限公司 | Thin capillary structure supporting temperature equalizing plate |
| CN210489604U (en) * | 2019-10-15 | 2020-05-08 | 深圳垒石热管理技术有限公司 | Temperature equalizing plate |
| CN110779369A (en) * | 2019-12-04 | 2020-02-11 | 东莞市万维热传导技术有限公司 | Take capillary structure inflation formula aluminium temperature-uniforming plate |
| CN211607177U (en) * | 2020-01-13 | 2020-09-29 | 东莞泰硕电子有限公司 | Antigravity composite energy channel forced flow guiding uniform temperature plate, radiator and electronic product |
| CN111765788A (en) * | 2020-07-16 | 2020-10-13 | 深圳市飞荣达科技股份有限公司 | Novel phase change temperature-uniforming plate |
| CN214065819U (en) * | 2020-12-15 | 2021-08-27 | 爱美达（深圳）热能系统有限公司 | Temperature equalizing plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113518539A (en) * | 2021-04-19 | 2021-10-19 | Oppo广东移动通信有限公司 | Heat dissipation device and electronic equipment |
| CN113970090A (en) * | 2021-11-16 | 2022-01-25 | 成都东骏激光股份有限公司 | Static ceramic lighting assembly, preparation method thereof and lighting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106376214B (en) | Slim temperature-uniforming plate | |
| TW201240587A (en) | Vapor chamber | |
| US9074823B2 (en) | Thermal siphon structure | |
| WO2022057938A1 (en) | Temperature equalization chamber, electronic device, and temperature equalization chamber production method | |
| CN109152294A (en) | The hot superconducting radiator of liquid-cooled | |
| CN112461025A (en) | Temperature equalizing plate | |
| CN111246706B (en) | Double-sided heat dissipation device | |
| CN1849049A (en) | Flat column shape thermal tube | |
| CN209930821U (en) | Liquid-cooled heat conduction block and water-cooled radiator | |
| WO2023010836A1 (en) | Heat dissipation module and electronic device | |
| EP3907457B1 (en) | Boiling enhancement apparatus | |
| CN109287095A (en) | Air-cooled hot superconduction panel radiator | |
| CN109192711A (en) | The air-cooled hot superconduction panel radiator of liquid-cooling combined type | |
| CN100557367C (en) | A kind of large power plate integral type phase change heat-radiation method and radiator | |
| CN214065819U (en) | Temperature equalizing plate | |
| CN110828404A (en) | Micro-channel vapor chamber with recess structure | |
| CN211782950U (en) | VC soaking plate capillary is applicable to heat dissipation module structure | |
| CN112188792A (en) | Heat radiator | |
| CN215261346U (en) | Temperature equalizing plate | |
| CN210805756U (en) | Micro-channel vapor chamber with recess structure | |
| CN110740612A (en) | Vapor chamber | |
| WO2007124652A1 (en) | Micro-slot group integrated heat-pipe radiator | |
| CN109526183B (en) | Self-cooling heat superconducting plate fin radiator | |
| CN215984138U (en) | Heat radiating member and cooling device having the same | |
| CN209594123U (en) | The hot superconducting radiator of liquid-cooled |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 510623 floors 1-4 of building a and 1-4 of building B in aimeda hi tech Industrial Park, Xinshi community, Dalang street, Longhua District, Shenzhen City, Guangdong Province Applicant after: Baode South China (Shenzhen) thermal energy system Co.,Ltd. Address before: 510623 floors 1-4 of building a and 1-4 of building B in aimeda hi tech Industrial Park, Xinshi community, Dalang street, Longhua District, Shenzhen City, Guangdong Province Applicant before: Aavid Shenzen Thermal Energy System Co.,Ltd. |