CN210959288U - Temperature equalizing mother board - Google Patents
Temperature equalizing mother board Download PDFInfo
- Publication number
- CN210959288U CN210959288U CN201922183146.5U CN201922183146U CN210959288U CN 210959288 U CN210959288 U CN 210959288U CN 201922183146 U CN201922183146 U CN 201922183146U CN 210959288 U CN210959288 U CN 210959288U
- Authority
- CN
- China
- Prior art keywords
- plate
- grooves
- temperature
- whole plate
- capillary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Micromachines (AREA)
Abstract
The utility model provides a samming mother board. The temperature-equalizing mother board comprises a lower whole board and an upper whole board which are oppositely arranged and a plurality of capillary cores which are arranged between the lower whole board and the upper whole board; a plurality of first grooves arranged at intervals are formed in the lower whole plate, a plurality of second grooves respectively corresponding to the first grooves are formed in the upper whole plate, and each first groove and the corresponding second groove form an accommodating cavity; the plurality of capillary cores are respectively positioned in the plurality of accommodating cavities; the multiple first grooves of the lower whole plate, the multiple second grooves of the upper whole plate and the multiple capillary cores respectively form multiple temperature-equalizing plates, and the temperature-equalizing mother plate can be subsequently cut into the multiple temperature-equalizing plates through a cutting process, so that the manufacturing efficiency is high, and the manufacturing yield of the temperature-equalizing plates is high.
Description
Technical Field
The utility model relates to a heat abstractor field especially relates to a samming mother board.
Background
Along with the demand of the current electronic devices for being light and thin as a target board, the size of each component should be reduced accordingly, but the heat generated by the size reduction of the electronic devices becomes a major obstacle for improving the performance of the electronic devices and systems. At present, the Heat dissipation mode of the mobile phone mainly comprises a graphite sheet, a Heat pipe (Heat pipe) and a Vapor chamber (Vapor chamber).
The working principle of the heat pipe is that the inner wall of the heat pipe is provided with a capillary structure, and then the heat pipe is vacuumized and filled with working liquid or filled with the working liquid first and then vacuumized, and finally sealed to form the heat pipe structure. When the working liquid is heated and evaporated by the evaporation part and then is diffused to the condensation end, the working liquid is in a vapor state in the evaporation part, is gradually cooled and condensed to be converted into a liquid state after leaving from the evaporation part and then is diffused to the condensation end, and then flows back to the evaporation part through the capillary structure.
The working principle of the temperature equalizing plate is similar to that of a heat pipe, and the difference is that the heat conduction of the heat pipe is linear transmission in a one-dimensional direction, and the heat conduction of the temperature equalizing plate is linear transmission in a two-dimensional direction. The temperature-uniforming plate mainly comprises an upper plate body, a lower plate body and a cavity arranged between the upper plate body and the lower plate body, wherein working liquid is filled in the cavity, a capillary structure is arranged on the inner wall of the cavity, after the lower plate body is contacted with a heating element (such as a central processing unit, a north-south bridge crystal, a transistor and the like), the working liquid in the cavity is converted into a gaseous state from a liquid state and is transmitted towards the upper plate body, and finally, heat energy is transmitted out by a heat dissipation device (such as a fin) on the temperature-uniforming plate except the region contacted with the heating element or on the outer side of the temperature-uniforming plate, at the moment, the working liquid can be converted back into the liquid state to return to the lower plate body.
The existing manufacturing process of the uniform temperature plate mainly comprises the steps of etching or punching a metal plate into a single upper cover and a single lower cover, then sintering the upper cover and the lower cover with a metal mesh or metal powder, assembling the upper cover and the lower cover together through processes of brazing, diffusion welding or laser welding and the like, injecting a working medium into a cavity, vacuumizing or injecting the working medium after vacuumizing, and then performing heating degassing and detection processes. The existing whole process flow adopts single-piece operation, so that the efficiency is low and the reject ratio is high.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a samming mother board, the preparation yield of the efficient and samming board of preparation is high.
In order to achieve the above object, the utility model provides a temperature equalization mother board, include: the capillary core comprises a lower whole plate, an upper whole plate and a plurality of capillary cores, wherein the lower whole plate and the upper whole plate are arranged oppositely, and the plurality of capillary cores are arranged between the lower whole plate and the upper whole plate;
a plurality of first grooves arranged at intervals are formed in the lower whole plate, a plurality of second grooves respectively corresponding to the first grooves are formed in the upper whole plate, and each first groove and the corresponding second groove form an accommodating cavity; the plurality of capillary cores are respectively positioned in the plurality of accommodating cavities;
and the plurality of first grooves of the lower whole plate, the plurality of second grooves of the upper whole plate and the plurality of capillary cores respectively form a plurality of temperature equalizing plates.
And a plurality of lower plate positioning holes are formed in the lower whole plate and are arranged at intervals with the first grooves.
And the upper whole plate is provided with a plurality of upper plate positioning holes respectively corresponding to the lower plate positioning holes.
The capillary core is a metal mesh.
And working liquid for heat dissipation is filled in the capillary core.
The temperature equalizing mother board also comprises a plurality of support columns which are arranged on one side of the lower whole board facing the upper whole board; the plurality of support columns are respectively positioned in the plurality of first grooves.
The support column is cylindrical, truncated cone-shaped, ellipsoidal or cuboid.
The height of the supporting column is equal to the depth of the first groove.
The utility model has the advantages that: the utility model discloses a samming mother board, include: the capillary core comprises a lower whole plate, an upper whole plate and a plurality of capillary cores, wherein the lower whole plate and the upper whole plate are arranged oppositely, and the capillary cores are arranged between the lower whole plate and the upper whole plate; a plurality of first grooves arranged at intervals are formed in the lower whole plate, a plurality of second grooves respectively corresponding to the first grooves are formed in the upper whole plate, and each first groove and the corresponding second groove form an accommodating cavity; the plurality of capillary cores are respectively positioned in the plurality of accommodating cavities; the multiple first grooves of the lower whole plate, the multiple second grooves of the upper whole plate and the multiple capillary cores respectively form multiple temperature-equalizing plates, and the temperature-equalizing mother plate can be subsequently cut into the multiple temperature-equalizing plates through a cutting process, so that the manufacturing efficiency is high, and the manufacturing yield of the temperature-equalizing plates is high.
Drawings
For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the present invention and accompanying drawings, which are provided for the purpose of illustration and description and are not intended to limit the present invention.
In the drawings, there is shown in the drawings,
FIG. 1 is an exploded view of a temperature equalization mother plate according to the present invention;
FIG. 2 is a schematic view of the lower whole plate of the temperature-equalizing mother plate of the present invention;
FIG. 3 is a schematic view of the upper whole plate of the temperature-equalizing mother plate of the present invention;
fig. 4 is a schematic diagram of the capillary core of the temperature equalization mother plate of the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Referring to fig. 1 to 4, the present invention provides a temperature equalization mother board, including: the capillary core comprises a lower whole plate 10, an upper whole plate 20 and a plurality of capillary cores 31, wherein the lower whole plate 10 and the upper whole plate 20 are arranged oppositely;
a plurality of first grooves 11 arranged at intervals are arranged in the lower whole plate 10, a plurality of second grooves 21 respectively corresponding to the plurality of first grooves 11 are arranged in the upper whole plate 20, and each first groove 11 and the corresponding second groove 21 form an accommodating cavity 30; the plurality of capillary cores 31 are respectively positioned in the plurality of accommodating cavities 30;
the plurality of first grooves 11 of the lower whole plate 10, the plurality of second grooves 21 of the upper whole plate 20 and the plurality of capillary cores 31 respectively form a plurality of temperature equalizing plates.
It should be noted that, the utility model discloses make the first recess 11 that a plurality of intervals set up in whole board 10 down, be equivalent to the lower plate of making a plurality of temperature-uniforming plates in whole board 10 down, make a plurality of second recess 21 that correspond with a plurality of first recess 11 respectively in last whole board 20, be equivalent to the last plate of making a plurality of temperature-uniforming plates in last whole board 20, every first recess 11 and the second recess 21 who corresponds rather than constitute one and hold chamber 30, be equivalent to the chamber that holds that is equipped with a plurality of temperature-uniforming plates between whole board 10 and the last whole board 20 down, follow-up all sets up capillary core 31 in a plurality of chambers 30 that hold, can form the temperature-uniforming mother board including a plurality of temperature-uniforming plates, follow-up accessible cutting process cuts into a plurality of temperature-uniforming plates with the temperature-uniforming mother board, not only can improve the preparation efficiency, can also improve the preparation yield of temperature-uniforming plates.
Specifically, referring to fig. 1 to 3, a plurality of lower plate positioning holes 12 are formed in the lower plate 10 and spaced apart from the first groove 11, a plurality of upper plate positioning holes 22 corresponding to the lower plate positioning holes 12 are formed in the upper plate 20, and the lower plate 10 and the upper plate 20 may be welded (specifically, soldered, diffusion welded, or laser welded) by aligning the lower plate positioning holes 12 and the upper plate positioning holes 22 during the manufacturing process.
Specifically, the lower plate positioning holes 12 are distributed on both sides of the lower plate 10, and the upper plate positioning holes 22 are distributed on both sides of the upper plate 20.
Specifically, the capillary core 31 may be a metal mesh or metal powder, or the capillary core 31 may be directly formed on the lower whole plate 10 or the upper whole plate 20 by etching or laser engraving.
Further, referring to fig. 4, when the capillary cores 31 are made of metal mesh, the temperature equalization motherboard further includes a substrate 40 disposed between the lower whole plate 10 and the upper whole plate 20, the plurality of capillary cores 31 are distributed on the substrate 40 at intervals, the substrate 40 is provided with a plurality of substrate positioning holes 41 respectively corresponding to the plurality of lower plate positioning holes 12, and the lower whole plate 10, the upper whole plate 20, and the substrate 40 can be welded (specifically, brazed, diffusion welded, or laser welded) by aligning the substrate positioning holes 41 with the lower plate positioning holes 12 and the upper plate positioning holes 22 during the manufacturing process to fix the capillary cores 31. In addition, the capillary wick 31 can be removed after being fixed between the lower whole plate 10 and the upper whole plate 20.
Specifically, the capillary core 31 is filled with a working liquid for heat dissipation, that is, the working liquid is filled in the pore gap, when the lower plate of the temperature equalization plate contacts a heating element (such as a central processing unit, a north-south bridge crystal, a transistor, etc.), the working liquid is converted from a liquid state to a gas state and is transmitted toward the upper plate of the temperature equalization plate, and finally, heat energy is transmitted by a region of the temperature equalization plate except the region contacting the heating element or a heat dissipation device (such as a fin) outside the temperature equalization plate, at this time, the working liquid is converted back to the liquid state and returns to the lower plate of the temperature equalization plate, and the next heat dissipation cycle is repeated.
Specifically, the temperature equalization motherboard further comprises a plurality of support columns 13 arranged on one side of the lower whole plate 10 facing the upper whole plate 20; the plurality of supporting columns 13 are respectively located in the plurality of first grooves 11, and are used for supporting the capillary wick 31 and preventing the capillary wick 31 from deforming.
Specifically, the height of the supporting column 13 is equal to the depth of the first groove 11.
Further, the shape of the supporting column 13 is cylindrical, truncated cone, ellipsoid or cuboid, but may also be other shapes with supporting function.
Specifically, the capillary core 31 is used as a metal mesh to illustrate the manufacturing process of the uniform temperature mother board of the present invention:
1. manufacturing a plurality of first grooves 11 arranged at intervals in a lower whole plate 10, and manufacturing a plurality of lower plate positioning holes 12 arranged at intervals with the first grooves 11 on the lower whole plate 10;
2. manufacturing a plurality of second grooves 21 corresponding to the plurality of first grooves 11 respectively in the upper whole plate 20, and manufacturing a plurality of upper plate positioning holes 22 corresponding to the plurality of lower plate positioning holes 12 in the upper whole plate 20;
3. arranging a plurality of capillary cores 31 on a substrate 40, and manufacturing a plurality of substrate positioning holes 41 corresponding to a plurality of lower plate positioning holes 12 on the substrate 40;
4. aligning through a substrate positioning hole 41 and a lower plate positioning hole 12, fixing the substrate 40 and the lower whole plate 10 through resistance welding or other modes, removing the substrate 40 after fixing, reserving the capillary core 31, placing the capillary core 31 and the lower whole plate 10 into a graphite jig for sintering, aligning through an upper plate positioning hole 22 and the lower plate positioning hole 12 after sintering, and welding the upper whole plate 20 and the lower whole plate 10 together through brazing, diffusion welding, laser welding or other welding modes; at this time, each first groove 11 and the corresponding second groove 21 form an accommodating cavity 30; the plurality of capillary cores 31 are respectively positioned in the plurality of accommodating cavities 30;
5. injecting working liquid into the accommodating cavities 30 one by one or together through the liquid injection machine, vacuumizing the accommodating cavities 30 one by one or together through the vacuumizing machine, or vacuumizing the accommodating cavities 30 one by one or together through the vacuumizing machine, and injecting the working liquid into the accommodating cavities 30 one by one or together through the liquid injection machine; at this time, the plurality of first grooves 11 of the lower whole plate 10, the plurality of second grooves 21 of the upper whole plate 20 and the plurality of capillary cores 31 respectively form a plurality of uniform temperature plates;
6. heating and degassing the welded upper whole plate 20 and the lower whole plate 10 by a heating degassing machine;
7. detecting the welded upper whole plate 20 and the welded lower whole plate 10 by a detector to complete the operation procedure of the temperature-equalizing mother plate;
8. and cutting the detected temperature-equalizing mother board into a plurality of temperature-equalizing boards by laser cutting or other cutting modes.
To sum up, the utility model discloses a samming mother board, include: the capillary core comprises a lower whole plate, an upper whole plate and a plurality of capillary cores, wherein the lower whole plate and the upper whole plate are arranged oppositely, and the capillary cores are arranged between the lower whole plate and the upper whole plate; a plurality of first grooves arranged at intervals are formed in the lower whole plate, a plurality of second grooves respectively corresponding to the first grooves are formed in the upper whole plate, and each first groove and the corresponding second groove form an accommodating cavity; the plurality of capillary cores are respectively positioned in the plurality of accommodating cavities; the multiple first grooves of the lower whole plate, the multiple second grooves of the upper whole plate and the multiple capillary cores respectively form multiple temperature-equalizing plates, and the temperature-equalizing mother plate can be subsequently cut into the multiple temperature-equalizing plates through a cutting process, so that the manufacturing efficiency is high, and the manufacturing yield of the temperature-equalizing plates is high.
From the above, it is obvious to those skilled in the art that various other changes and modifications can be made according to the technical solution and the technical idea of the present invention, and all such changes and modifications should fall within the protection scope of the claims of the present invention.
Claims (8)
1. A temperature equalization motherboard, comprising: the capillary core comprises a lower whole plate (10) and an upper whole plate (20) which are oppositely arranged, and a plurality of capillary cores (31) arranged between the lower whole plate (10) and the upper whole plate (20);
a plurality of first grooves (11) arranged at intervals are formed in the lower whole plate (10), a plurality of second grooves (21) respectively corresponding to the plurality of first grooves (11) are formed in the upper whole plate (20), and each first groove (11) and the corresponding second groove (21) form an accommodating cavity (30); the plurality of capillary cores (31) are respectively positioned in the plurality of accommodating cavities (30);
the plurality of first grooves (11) of the lower whole plate (10), the plurality of second grooves (21) of the upper whole plate (20) and the plurality of capillary cores (31) respectively form a plurality of temperature equalizing plates.
2. A temperature-uniforming mother plate according to claim 1, wherein the lower plate (10) is provided with a plurality of lower plate positioning holes (12) spaced apart from the first grooves (11).
3. A temperature-equalizing motherboard according to claim 2, characterized in that the upper plate (20) is provided with a plurality of upper plate positioning holes (22) corresponding to the plurality of lower plate positioning holes (12), respectively.
4. A temperature equalization master plate according to claim 1, characterized in that the capillary wick (31) is a metal mesh.
5. A temperature equalization master plate according to claim 1, characterized in that the capillary core (31) is filled with a working liquid for heat dissipation.
6. A temperature-uniforming mother plate according to claim 1, further comprising a plurality of support columns (13) provided on a side of the lower entire plate (10) facing the upper entire plate (20); the plurality of support columns (13) are respectively positioned in the plurality of first grooves (11).
7. A temperature equalization motherboard according to claim 6, characterised in that the shape of the supporting columns (13) is cylindrical, truncated circular, ellipsoid or cuboid.
8. A temperature equalization motherboard according to claim 6, characterised in that the height of the supporting columns (13) is equal to the depth of the first grooves (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922183146.5U CN210959288U (en) | 2019-12-06 | 2019-12-06 | Temperature equalizing mother board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922183146.5U CN210959288U (en) | 2019-12-06 | 2019-12-06 | Temperature equalizing mother board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210959288U true CN210959288U (en) | 2020-07-07 |
Family
ID=71382420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922183146.5U Active CN210959288U (en) | 2019-12-06 | 2019-12-06 | Temperature equalizing mother board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210959288U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566466A (en) * | 2020-12-11 | 2021-03-26 | 佛山市飞成金属制品有限公司 | Machining method of heat dissipation structure |
| CN115870707A (en) * | 2023-02-01 | 2023-03-31 | 深圳威铂驰热技术有限公司 | Vapor chamber module for 5G mobile terminal, processing method of vapor chamber module and 5G mobile terminal |
-
2019
- 2019-12-06 CN CN201922183146.5U patent/CN210959288U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566466A (en) * | 2020-12-11 | 2021-03-26 | 佛山市飞成金属制品有限公司 | Machining method of heat dissipation structure |
| CN112566466B (en) * | 2020-12-11 | 2021-07-09 | 佛山市飞成金属制品有限公司 | Heat dissipation structure and processing method thereof |
| CN115870707A (en) * | 2023-02-01 | 2023-03-31 | 深圳威铂驰热技术有限公司 | Vapor chamber module for 5G mobile terminal, processing method of vapor chamber module and 5G mobile terminal |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20100326630A1 (en) | Heat spreader with vapor chamber and method for manufacturing the same | |
| CN112747619B (en) | Temperature equalizing plate | |
| CN107421364B (en) | Temperature equalizing plate structure and manufacturing method thereof | |
| US11131506B2 (en) | Burst resistant thin wall heat sink | |
| CN210959288U (en) | Temperature equalizing mother board | |
| US20020135979A1 (en) | Two-phase cooling module and method of making the same | |
| KR102047933B1 (en) | Thin Plate Type Heat Pipe and Manufacturing Method | |
| CN111447792B (en) | Heat dissipation device, preparation method of heat dissipation device and electronic equipment | |
| CN210489604U (en) | Temperature equalizing plate | |
| KR20180021145A (en) | Plate type temperature equalizing device | |
| CN215832540U (en) | Ultra-light high-performance copper-aluminum composite soaking plate | |
| CN111912276A (en) | Temperature equalizing plate | |
| CN110785054B (en) | Punch forming method for vapor chamber | |
| CN212344311U (en) | Temperature equalizing plate structure and temperature equalizing plate material plate | |
| CN211120791U (en) | Thin type temperature equalizing plate | |
| CN106403674B (en) | Plate temperature equalization system | |
| CN218155682U (en) | Temperature-uniforming plate with composite 3D capillary structure | |
| TWI801739B (en) | Temperature-uniformizing board and method for making the same | |
| CN212006864U (en) | High-efficiency temperature equalizing plate | |
| CN214322184U (en) | Heat radiator with easy welding structure | |
| CN214537539U (en) | Temperature equalization plate and electronic product | |
| CN109891178A (en) | The slim soaking plate formed by Sheet Metal Forming Technology | |
| CN210952459U (en) | Temperature equalizing plate | |
| CN221147297U (en) | Etching capillary temperature equalizing plate | |
| TWI550249B (en) | Method of manufacturing vapor chamber |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 room 1204, C12 / F, building 2, software industry base, No. 87, 89 and 91, Gaoxin South 10th Road, Binhai community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Leishi Thermal Management Technology Co.,Ltd. Address before: 518000 room 1204, C12 / F, building 2, software industry base, No. 87, 89 and 91, Gaoxin South 10th Road, Binhai community, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: STONEPLUS THERMAL MANAGEMENT TECHNOLOGIES Ltd. |
|
| CP01 | Change in the name or title of a patent holder |