CN102143647B - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN102143647B CN102143647B CN201010564278.3A CN201010564278A CN102143647B CN 102143647 B CN102143647 B CN 102143647B CN 201010564278 A CN201010564278 A CN 201010564278A CN 102143647 B CN102143647 B CN 102143647B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- adhesive linkage
- dielectric layer
- transmission line
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 13
- 230000005540 biological transmission Effects 0.000 claims abstract description 54
- 230000001070 adhesive effect Effects 0.000 claims description 63
- 239000000853 adhesive Substances 0.000 claims description 62
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 230000008054 signal transmission Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Credit Cards Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The embodiment of the invention provides a circuit board, comprising at least one bonding layer and at least one transmission line, wherein an air cavity is formed in the bonding layer; and the orthographic projection of the transmission line falls on the area in which the air cavity of the bonding layer is located. In the circuit board provided by the embodiment of the invention, the air cavity is arranged in the bonding layer of the circuit board, so that the characteristic that the air has low Df value and low Dk value is utilized for reducing the Dk and Df characteristics of the whole circuit board, and further the signal transmission quality of the circuit board is improved; and in addition, the step of arranging the air cavity on the bonding layer is simple, and is easy to realize, so that the manufacturing cost of the circuit board can be reduced.
Description
Technical field
The present invention relates to a kind of circuit board, particularly a kind of manufacture method with circuit board and this circuit board of higher signal transmission quality.
Background technology
Along with the high speed development of large scale integrated circuit, more and more higher to the requirement of message transmission rate, message transmission rate can reach 100Gbps at present, will realize the message transmission rate that 200Gbps, 400Gbps are even higher in the near future.In order to arrive high transfer rate, very high to the requirement of printed circuit board (PCB) (PCB) material, conventionally require PCB to there is low-k Df and low dielectric loss Dk characteristic.At present, reduce the Df of pcb board and the means of Dk, mainly from glass and resin system, carry out modification, as: pottery filling, flat glass adopted, non-epoxy systems resin (PTFE) etc.Yet, for the sheet material major part of Df < 0.003, be PTFE material, be unfavorable for the processing of PCB multi-layer sheet; In addition, the price of the material of low Dk, Df costliness very, causes the cost of product very high.
Summary of the invention
In view of this, the embodiment of the present invention provides a kind of circuit board cheaply, and a kind of manufacture method of circuit board is also provided.
A kind of circuit board, it comprises at least one adhesive linkage and at least one transmission line, in described adhesive linkage, be formed with air chamber, the orthographic projection of described transmission line drops on the region at the air chamber place of described adhesive linkage, described circuit board also comprises a reference layer and a dielectric layer, on described adhesive linkage, be provided with the fluting corresponding with transmission line, described reference layer and dielectric layer are laminated and form described air chamber with fluting adhesive linkage around respectively.
A manufacture method for circuit board, it comprises the following steps:
A central layer is provided, and this central layer comprises dielectric layer, and the conducting medium that at least covers described dielectric layer one side;
On the conducting medium of described central layer one side, form transmission line;
Another central layer is provided, and this central layer comprises dielectric layer, and the conducting medium that at least covers described dielectric layer one side;
On the conducting medium of this central layer one side, an adhesive linkage is set;
On described adhesive linkage, offer to form the fluting of air chamber;
Described central layer and the adhesive linkage pressing around of described fluting that is formed with transmission line formed to described air chamber, and the orthographic projection of described transmission line and described air chamber are aligned.
In the circuit board that the embodiment of the present invention provides and electroplax manufacture method, by air chamber being set in the adhesive linkage of circuit board, thereby the characteristic of utilizing air to have low Df and low Dk value reduces Dk and the Df characteristic of whole circuit board, thus the signal transmission quality of raising circuit board; In addition, the step that air chamber is set on described adhesive linkage is simple, easily realizes, thereby can reduce the manufacturing cost of circuit board.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of a kind of circuit board of providing of first embodiment of the invention;
Fig. 2 is the schematic diagram of another structure of a kind of circuit board of providing of first embodiment of the invention;
Fig. 3 is the schematic diagram of a kind of circuit board of providing of second embodiment of the invention;
Fig. 4 is the schematic diagram of a kind of circuit board of providing of third embodiment of the invention;
Fig. 5 is the schematic diagram of a kind of circuit board of providing of fourth embodiment of the invention;
Fig. 6 is the schematic diagram of a kind of circuit board of providing of fourth embodiment of the invention.
Embodiment
Below in conjunction with drawings and the specific embodiments, the embodiment of the present invention is elaborated.
The circuit board 100 that the embodiment of the present invention provides comprises the circuit board unit that at least one consists of adhesive linkage 120 and transmission line 140.Described in each, on the adhesive linkage 120 of circuit board unit, be formed with air chamber 124, the orthographic projection of described transmission line 140 drops on the region at air chamber 124 places of described adhesive linkage 120.
Refer to Fig. 1, a kind of circuit board 100 that the embodiment of the present invention provides, this circuit board 100 consists of a circuit board unit, and this circuit board unit comprises a reference layer 110, described adhesive linkage 120, at least one dielectric layer 130 and described transmission line 140.On described adhesive linkage 120, be provided with the fluting 122 of corresponding described transmission line 140, described reference layer 110 and dielectric layer 130 are laminated and form described air chamber 124 with described fluting 122 adhesive linkage 120 around respectively.Described transmission line 140 is arranged on described dielectric layer 130, and its orthographic projection drops on the region at described air chamber 124 places.
Described reference layer 110 is made by electric conducting material, and reference layer described in the present embodiment 110 adopts Copper Foil.Described reference layer 110 comprises first surface 112 and the second surface 114 corresponding with described first surface 112.In order to improve the mechanical strength of described reference layer 110, on the second surface 114 of described reference layer 110, be also provided with an enhancement layer 150, this enhancement layer 150 can be made by insulating material.
The one side of described adhesive linkage 120 is bonded on the first surface of described reference layer 110 on 112.Adhesive linkage described in the present embodiment 120 adopts the material colloid that adhesive properties are strong, gummosis amount is low, for example, and with the polyimides of glue-line or photoresist etc.In the present embodiment, the width that is formed on the fluting 122 on described adhesive linkage 120 is wider than the width of described transmission line 140, the projection that is described transmission line 140 can fall in described fluting 122, and in the present embodiment, the width of described fluting 122 is than the wide 0.2mm～0.3mm of the width of described transmission line 140.
Described dielectric layer 130 is made by insulating material.Described dielectric layer 130 comprises upper surface 132 and the lower surface 134 corresponding with described upper surface 132.Described dielectric layer 130 pass through the another side that its lower surface 134 is bonded in described adhesive linkage 120.
In the present embodiment, described transmission line 140 is arranged on the lower surface 134 of described dielectric layer 130, and be contained in described air chamber 124, in the circuit board unit of this structure, also a ground plane 160 can be set on the upper surface of described dielectric layer 130, described ground plane 160 adopts electric conducting material to make, and in the present embodiment, described ground plane 160 adopts Copper Foil.
Be appreciated that as shown in Figure 2, described transmission line 140 also can be formed on the upper surface 132 of described dielectric layer 130.
The circuit board 100 providing in the embodiment of the present invention by forming the air chamber 124 over against described transmission line 140 on adhesive linkage 120, utilize the low Df of air and the characteristic of Dk, thereby reduce dielectric constant and the dielectric loss of circuit board 100, improve the transmission quality of signal; In addition, on described adhesive linkage 120, form fluting 122, and by described reference layer 110 and dielectric layer 130, be pressed together on that thereby on described fluting 122 adhesive linkage 120 around, to form the manufacture craft of air chamber 124 simple, easily realize, thereby can reduce manufacturing cost.
Refer to Fig. 3, a kind of circuit board 200 that second embodiment of the invention provides, this circuit board 200 comprises a plurality of superimposed circuit board units successively, particularly, this circuit board 200 comprise with the first embodiment in the roughly the same first circuit board of structure unit 200a, second circuit board unit 200b and the tertiary circuit plate unit 200c of circuit board 100.The reference layer 210b of described second circuit board unit 200b is arranged on the dielectric layer 240a of described first circuit board unit 200a; The reference layer 210c of tertiary circuit plate unit 200c is arranged on the dielectric layer 240b of described second circuit board unit 200b.Be appreciated that, circuit board unit 200a, the 200b that the three groups of structures of only take in the present embodiment are roughly the same and 200c mutually constitute multilayer circuit board and the structure that how builds the multilayer circuit board that contains a plurality of air chambers by a plurality of circuit board units are described as example, but the stack number that the number of plies of circuit board 200 is not limited to show in the present embodiment.In addition, in the present embodiment, the dielectric layer 240c of described tertiary circuit plate unit 200c is upper, namely in outermost circuit board unit, is exposed on outside dielectric layer, and a ground plane 260 can be set equally.
Refer to Fig. 4, a kind of circuit board 300 that third embodiment of the invention provides, this circuit board 300 comprises a circuit board unit, this circuit board unit comprises a sub-circuit board 310,320, one reference layers 330 of one adhesive linkage, and one dielectric layer 340.
Described sub-circuit board 310 is identical with the structure of circuit board 100 in the first embodiment, comprises 312, one dielectric layers 313 of 311, one adhesive linkages of a reference layer and a transmission lines 314.Its difference is, described dielectric layer 313 adopts thin type structures, i.e. the thickness of described dielectric layer 313 time dielectric layer 340, and the thickness that is originally dielectric layer described in embodiment is 2 mils (mil).
Described adhesive linkage 320 is arranged on the outside of the dielectric layer 313 of described circuit board 310, is provided with another fluting 322 relative with the transmission line 314 of described sub-circuit board 310 on described adhesive linkage 320.
Described in described reference layer 330, dielectric layer 313 is pressed together on respectively on described another fluting 322 inferior adhesive linkage 320 around and forms another air chamber 324.The orthographic projection of described transmission line 314 drops in described another air chamber 324.
Described time dielectric layer 340 is arranged on described reference layer 330.
The circuit board 300 providing in the present embodiment, by the both sides at described transmission line 314, air chamber is set, thereby thereby the reduction that the characteristic that can further utilize the low Dk of air and Df reduces dielectric constant and the dielectric loss of circuit board 300, thereby improve the transmission quality of signal.
Refer to Fig. 5, a kind of circuit board 400 that fourth embodiment of the invention provides, this circuit board 400 comprises a plurality of superimposed circuit board units successively, described circuit board unit is identical with circuit board 300 structures in the 3rd embodiment, it comprises first circuit board unit 400a, and second circuit board unit 400b.Thereby the reference layer 411b of wherein said second circuit board unit 400b is arranged on the upper formation of the inferior dielectric layer 440b Multi-layer circuit board structure of described first circuit board unit 400a.
Refer to Fig. 6 a kind of circuit board manufacturing method provided by the invention,
It comprises the following steps:
Step 1 a: central layer 500 is provided, and this central layer 500 comprises dielectric layer 510, and the conducting medium 512 that at least covers described dielectric layer 510 1 sides;
In this step, described central layer 500 can adopt
or pottery is filled or
the core material of type, wherein conducting medium 512 can be Copper Foil.
On the conducting medium 512 of described central layer 500 1 sides, form transmission line 540;
In this step, the formation of described transmission line 540 can adopt the mode of chemical etching or physical etch to realize.
Step 2: another central layer 500 is provided, and this central layer 500 comprises dielectric layer 510, and the conducting medium 512 that at least covers described dielectric layer 510 1 sides; One adhesive linkage 520 is set on the conducting medium 512 of these central layer 500 1 sides;
Step 3: the fluting 522 of offering to form air chamber 524 on described adhesive linkage 520;
In this step, can adopt the methods such as laser formation, development moulding or mould be pre-formed to form described fluting 522; When forming described fluting 522, require: on the conducting medium 512 of the described fluting 522 of correspondence, namely the glue-free stain in the bottom of described air chamber 524 is residual.
Step 4: the described central layer 500 that is formed with transmission line 540 is superimposed on described fluting 522 adhesive linkage 520 around and forms described air chamber 514, and the orthographic projection of described transmission line 510 and described air chamber 524 are aligned.
Be appreciated that this circuit board manufacturing method, thereby also comprise that repeating above-mentioned making step forms as the step of the various multilayer circuit boards that provided in the embodiment of the present invention.
In the circuit board manufacturing method that the embodiment of the present invention provides, by the air chamber 524 corresponding with described transmission line 540 is set on the adhesive linkage 520 at described circuit board, utilize the characteristic of low Dk that air is lower and Df to reduce Dk and the Df characteristic of whole circuit board, thereby improve the signal transmission quality of circuit board; In addition, the step that air chamber 524 is set on described adhesive linkage 520 is simple, easily realizes, thereby can reduce the manufacturing cost of circuit board.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (14)
1. a circuit board, it is characterized in that, described circuit board comprises at least one adhesive linkage and at least one transmission line, in described adhesive linkage, be formed with air chamber, the orthographic projection of described transmission line drops on the region at the air chamber place of described adhesive linkage, described circuit board also comprises a reference layer and a dielectric layer, is provided with the fluting corresponding with transmission line on described adhesive linkage, and described reference layer and dielectric layer are laminated and form described air chamber with fluting adhesive linkage around respectively.
2. circuit board as claimed in claim 1, is characterized in that, the width of described fluting is greater than the width of described transmission line.
3. circuit board as claimed in claim 1, is characterized in that, the width of described fluting is than the wide 0.2mm～0.3mm of the width of described transmission line.
4. circuit board as claimed in claim 1, it is characterized in that, described reference layer comprises first surface and the second surface corresponding with described first surface, described adhesive linkage is bonded on the first surface of described reference layer, described circuit board also comprises that an enhancement layer is in order to improve the mechanical strength of described reference layer, and described enhancement layer is arranged on the second surface of described reference layer.
5. circuit board as claimed in claim 1, is characterized in that, described dielectric layer comprise a lower surface and by described lower surface bonds on described adhesive linkage, described transmission line is arranged on the lower surface of described dielectric layer.
6. circuit board as claimed in claim 1, it is characterized in that, described dielectric layer comprises upper surface and the lower surface corresponding with described upper surface, described dielectric layer pass through its lower surface bonds on described adhesive linkage, described transmission line is arranged on the upper surface of described dielectric layer.
7. circuit board as claimed in claim 1, it is characterized in that, described circuit board also comprises to inferior adhesive linkage, inferior reference layer, and inferior dielectric layer, described adhesive linkage is arranged on the outside of the dielectric layer of described circuit board, on described adhesive linkage, be provided with the orthographic projection of the transmission line of described sub-circuit board over against another fluting, described reference layer and described dielectric layer are pressed together on respectively on the inferior adhesive linkage of surrounding of described another fluting and form another air chamber, the orthographic projection of described transmission line drops on the region at described another air chamber place, described time dielectric layer is arranged on described reference layer.
8. circuit board as claimed in claim 7, it is characterized in that, described reference layer comprises first surface and the second surface corresponding with described first surface, the one side of described adhesive linkage is bonded on the first surface of described reference layer, described circuit board also comprises that an enhancement layer is in order to improve the mechanical strength of described reference layer, and described enhancement layer is arranged on the second surface of described reference layer.
9. circuit board as claimed in claim 7, is characterized in that, described dielectric layer comprise a lower surface and by described lower surface bonds on described adhesive linkage, described transmission line is arranged on the lower surface of described dielectric layer.
10. the circuit board as described in claim 5 or 9, is characterized in that, described transmission line is contained in described air chamber.
11. circuit boards as claimed in claim 8, is characterized in that, described dielectric layer is thinner than inferior dielectric layer.
12. 1 kinds of circuit boards, it is characterized in that, described circuit board comprises at least one adhesive linkage and at least one transmission line, in described adhesive linkage, be formed with air chamber, the orthographic projection of described transmission line drops on the region at the air chamber place of described adhesive linkage, described circuit board comprises that at least two by described at least one adhesive linkage, and the circuit board unit of at least one transmission line formation, described circuit board unit is superimposed with each other successively, wherein described in each, in the adhesive linkage of circuit board unit, be formed with air chamber, described in each, the orthographic projection of the transmission line of circuit board unit drops in described air chamber.
13. circuit boards as claimed in claim 12, it is characterized in that, each described circuit board unit also comprises a reference layer and a dielectric layer, described dielectric layer is overlapped into one by described adhesive linkage and described reference layer, on described adhesive linkage, be provided with the fluting corresponding with described transmission line, described reference layer and dielectric layer are laminated and form described air chamber with described fluting adhesive linkage around respectively, described transmission line is arranged on described dielectric layer, and wherein the reference layer of a circuit board unit is arranged on the dielectric layer of another circuit board unit.
14. circuit boards as claimed in claim 12, is characterized in that, described in each, circuit board unit also comprises and also comprises a reference layer, a dielectric layer, one adhesive linkage, one reference layer, and one dielectric layer; Described dielectric layer is overlapped into one by described adhesive linkage and described reference layer; On described adhesive linkage, be provided with the fluting corresponding with described transmission line, described reference layer and dielectric layer are laminated and form described air chamber with described fluting adhesive linkage around respectively; Described transmission line is arranged on described dielectric layer; Described adhesive linkage is arranged on the outside of the dielectric layer of described circuit board; On described adhesive linkage, be provided with another the corresponding fluting with described transmission line; Thereby described reference layer and described dielectric layer are pressed together on described another fluting inferior adhesive linkage around and form inferior air chamber; The orthographic projection of described transmission line drops in described air chamber; Described time dielectric layer is arranged on described reference layer; Wherein the reference layer of a circuit board unit is arranged on the inferior dielectric layer of another circuit board unit.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010564278.3A CN102143647B (en) | 2010-11-25 | 2010-11-25 | Circuit board and manufacturing method thereof |
| MX2011013097A MX2011013097A (en) | 2010-11-25 | 2011-05-16 | Circuit board and manufacturing method thereof. |
| PCT/CN2011/074076 WO2011150738A1 (en) | 2010-11-25 | 2011-05-16 | Circuit board and manufacturing method thereof |
| HU1200255A HU230941B1 (en) | 2010-11-25 | 2011-05-16 | Printed circuit board and manufacturing method thereof |
| BRPI1105246A BRPI1105246B1 (en) | 2010-11-25 | 2011-05-16 | circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010564278.3A CN102143647B (en) | 2010-11-25 | 2010-11-25 | Circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102143647A CN102143647A (en) | 2011-08-03 |
| CN102143647B true CN102143647B (en) | 2014-08-20 |
Family
ID=44410785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010564278.3A Active CN102143647B (en) | 2010-11-25 | 2010-11-25 | Circuit board and manufacturing method thereof |
Country Status (5)
| Country | Link |
|---|---|
| CN (1) | CN102143647B (en) |
| BR (1) | BRPI1105246B1 (en) |
| HU (1) | HU230941B1 (en) |
| MX (1) | MX2011013097A (en) |
| WO (1) | WO2011150738A1 (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106470523B (en) * | 2015-08-19 | 2019-04-26 | 鹏鼎控股(深圳)股份有限公司 | Flexible circuit board and preparation method thereof |
| CN106488642A (en) * | 2015-08-27 | 2017-03-08 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and preparation method thereof |
| CN105636341A (en) * | 2016-01-01 | 2016-06-01 | 广州兴森快捷电路科技有限公司 | PCB with hollow cavity structure and manufacturing method therefor |
| CN107666764B (en) * | 2016-07-27 | 2021-02-09 | 庆鼎精密电子（淮安）有限公司 | Flexible circuit board and manufacturing method thereof |
| CN106231801A (en) * | 2016-08-19 | 2016-12-14 | 深圳崇达多层线路板有限公司 | For the technique making pottery plate HDI plate |
| CN108633167A (en) * | 2018-05-28 | 2018-10-09 | 维沃移动通信有限公司 | A kind of circuit board, signal transmssion line and preparation method thereof |
| CN109195311B (en) * | 2018-09-11 | 2021-07-20 | 番禺得意精密电子工业有限公司 | Circuit board |
| CN109788648A (en) * | 2018-12-31 | 2019-05-21 | 广州添利电子科技有限公司 | Radar circuit plate air chamber manufacturing process |
| CN110139490A (en) * | 2019-05-31 | 2019-08-16 | 上海安费诺永亿通讯电子有限公司 | A kind of production method and transmission line plate of transmission line plate |
| CN110636718B (en) * | 2019-10-30 | 2021-01-05 | 生益电子股份有限公司 | Manufacturing method of PCB |
| EP3820258A1 (en) | 2019-11-08 | 2021-05-12 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with exposed layer |
| CN112261802B (en) * | 2020-11-04 | 2021-08-13 | 生益电子股份有限公司 | Manufacturing method of embedded cavity and PCB |
| CN112105150B (en) * | 2020-11-04 | 2021-08-13 | 生益电子股份有限公司 | Manufacturing method of embedded cavity and PCB |
| CN116033651A (en) | 2021-10-25 | 2023-04-28 | 鹏鼎控股(深圳)股份有限公司 | Circuit substrate and manufacturing method thereof |
| CN114364168A (en) * | 2022-01-07 | 2022-04-15 | 安捷利（番禺）电子实业有限公司 | Preparation method of circuit board with built-in cavity, circuit board and electronic equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1543298A (en) * | 2000-06-27 | 2004-11-03 | ���µ�����ҵ��ʽ���� | Multilayer ceramic device |
| CN101841079A (en) * | 2010-04-21 | 2010-09-22 | 惠州Tcl移动通信有限公司 | Printed circuit board (PCB) for bearing feed pad in mobile phone antenna and antenna |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6653572B2 (en) * | 2001-02-07 | 2003-11-25 | The Furukawa Electric Co., Ltd. | Multilayer circuit board |
| CN2479712Y (en) * | 2001-03-27 | 2002-02-27 | 安捷利（番禺）电子实业有限公司 | Sectional glued flexible printed circuit board |
| JP4540493B2 (en) * | 2005-02-02 | 2010-09-08 | 東北リコー株式会社 | Printed wiring board |
| JP4817771B2 (en) * | 2005-09-09 | 2011-11-16 | 株式会社フジクラ | Manufacturing method of multilayer printed wiring board |
-
2010
- 2010-11-25 CN CN201010564278.3A patent/CN102143647B/en active Active
-
2011
- 2011-05-16 HU HU1200255A patent/HU230941B1/en unknown
- 2011-05-16 MX MX2011013097A patent/MX2011013097A/en active IP Right Grant
- 2011-05-16 BR BRPI1105246A patent/BRPI1105246B1/en active IP Right Grant
- 2011-05-16 WO PCT/CN2011/074076 patent/WO2011150738A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1543298A (en) * | 2000-06-27 | 2004-11-03 | ���µ�����ҵ��ʽ���� | Multilayer ceramic device |
| CN101841079A (en) * | 2010-04-21 | 2010-09-22 | 惠州Tcl移动通信有限公司 | Printed circuit board (PCB) for bearing feed pad in mobile phone antenna and antenna |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102143647A (en) | 2011-08-03 |
| WO2011150738A1 (en) | 2011-12-08 |
| MX2011013097A (en) | 2012-02-08 |
| BRPI1105246A2 (en) | 2016-05-03 |
| HU230941B1 (en) | 2019-05-28 |
| BRPI1105246B1 (en) | 2020-04-22 |
| HUP1200255A2 (en) | 2013-01-28 |
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