CN109195311B

CN109195311B - Circuit board

Info

Publication number: CN109195311B
Application number: CN201811055954.7A
Authority: CN
Inventors: 林庆其
Original assignee: Lotes Guangzhou Co Ltd
Current assignee: Lotes Guangzhou Co Ltd
Priority date: 2018-09-11
Filing date: 2018-09-11
Publication date: 2021-07-20
Anticipated expiration: 2038-09-11
Also published as: CN109195311A

Abstract

The invention discloses a circuit board, which is characterized by comprising: an insulator; the insulator comprises at least one through groove; at least one conductor part is fixedly held in the groove wall of the through groove, and at least one end of the conductor is exposed out of the through groove and is not contacted with the rest groove walls of the through groove. The signal transmission of the conductor can transmit signals through air, and compared with the traditional circuit board which transmits signals through a dielectric layer, the signal transmission effect with ultralow signal attenuation can be achieved.

Description

Circuit board

Technical Field

The present invention relates to a circuit board, and more particularly, to a circuit board using air as a medium for transmitting signals.

Background

With the development of electronic technology, transmission attenuation of high-frequency signals is mainly influenced by a medium during transmission of electronic signals. The fundamental reason for this is that the high frequency signal is related to the dielectric constant of the medium, and the lower the dielectric constant of the medium, the better the high frequency signal transmission. In a conventional medium, a Liquid Crystal Polymer (LCP), a Teflon (Teflon), a pure glue with a low relative dielectric constant, or the like is generally used as a substrate layer for covering a signal line.

However, the dielectric loss of the above materials is still relatively large, resulting in a relatively large signal attenuation of the transmission line of the circuit board made of the above materials. In addition, teflon and liquid crystal high molecular polymer all belong to special material, have higher material cost, and so, traditional signal layer all sets up in the top or the below of dielectric layer, so set up then thickened the circuit board for the pliability of circuit board descends.

Therefore, there is a need for an improved circuit board to overcome the above problems.

Disclosure of Invention

The invention aims to provide a circuit board with better high-frequency signal transmission.

In order to achieve the purpose, the invention adopts the following technical means:

a circuit board, comprising:

an insulator; the insulator comprises at least one through groove;

at least one conductor part is fixedly held in the groove wall of the through groove, and at least one end of the conductor is exposed out of the through groove and is not contacted with the rest groove walls of the through groove.

Further, the insulator extends in a substantially flat plate shape along the longitudinal direction, and the through groove is opened along the longitudinal direction and penetrates through the insulator.

Furthermore, the insulator comprises at least two through grooves which are horizontally arranged side by side, the conductor part is fixedly held in the groove wall between two adjacent through grooves, and two ends of the conductor are exposed out of the through grooves and are not in contact with the other groove walls of the through grooves.

Further, the circuit board is a flexible circuit board.

Furthermore, a shielding layer is arranged on the upper surface and the lower surface of the insulator, an insulating layer is arranged on the upper surface and the lower surface of the shielding layer, and the plane of the upper surface and the plane of the lower surface of the insulator are parallel to the plane defined by the extending direction of the through grooves and the arrangement direction of the through grooves.

Further, the conductor comprises a signal layer and a ground layer, an accommodating space is arranged between the shielding layer and the insulator, and the shielding layer is sunken into the accommodating space and is electrically connected with the ground layer.

Furthermore, a solder is arranged in the accommodating space, the shielding layer and the grounding layer are electrically connected in a conductive manner after the solder is welded, and a space is still reserved between the solder and the accommodating space after the solder is welded.

Furthermore, the signal layer also comprises a high-speed signal pair, a shielding cover is arranged on the outer side of the high-speed signal pair, and the upper side and the lower side of the shielding cover are both in contact with the shielding layer.

Further, the ground layer is cylindrical, and the signal layer is flat and planar.

Further, the ground layer is flat and flat, and the signal layer is cylindrical.

Furthermore, the conductors are flat and planar, and the volume of the ground layer is larger than that of the signal layer.

Further, the conductors are cylindrical.

Compared with the prior art, the invention has the following beneficial effects:

the insulator of the circuit board is provided with a plurality of through grooves side by side, the conductor part is fixedly arranged in the groove wall between two adjacent through grooves, and the rest part is exposed in the through grooves and is not contacted with the through grooves, so that the signal transmission of the conductor can transmit signals through air, and compared with the traditional circuit board which transmits signals through a dielectric layer, the signal transmission effect with ultralow signal attenuation can be achieved.

[ description of the drawings ]

FIG. 1 is an exploded perspective view of a first embodiment of a circuit board of the present invention;

FIG. 2 is an enlarged partial schematic view of FIG. 1;

FIG. 3 is an exploded perspective view of FIG. 2;

FIG. 4 is a plan exploded view of FIG. 3;

FIG. 5 is an assembled view of FIG. 4;

FIG. 6 is a front cross-sectional view of a second embodiment of the circuit board of the present invention;

FIG. 7A is a front cross-sectional view of a third embodiment of the circuit board of the present invention with solder placed therein;

FIG. 7B is a front cross-sectional view of the solder joint of FIG. 7A;

FIG. 8 is a front cross-sectional view of a fourth embodiment of the circuit board of the present invention;

FIG. 9 is a front cross-sectional view of a fifth embodiment of the circuit board of the present invention;

FIG. 10 is a front cross-sectional view of a sixth embodiment of the circuit board of the present invention;

fig. 11 is a front sectional view of a seventh embodiment of the circuit board of the present invention.

Detailed description of the embodiments reference is made to the accompanying drawings in which:

circuit board 100	Electrical connector 200	Insulator 1
			Through groove 11	First tank wall 111	Second grooveWall 112
Shielding layer 2	Insulating layer 3	Electric conductor 4
			Signal layer 41	Ground layer 42	Accommodating space 5
Abutment 21	Solder 6	Shielding cover 7
			High speed signal pair 411

[ detailed description ] embodiments

For a better understanding of the objects, structure, features, and functions of the invention, reference should be made to the drawings and detailed description that follow.

As shown in fig. 1 to 11, a circuit board 100 according to the present invention is a flexible circuit board 100, and the circuit board 100 can be used for electrically connecting an electrical connector 200 or other electronic components.

As shown in fig. 1 to 5, a first embodiment of the circuit board 100 of the present invention is a circuit board 100, which first defines an X axis as a left-right direction, a Y axis as a longitudinal direction, and a Z axis as a vertical direction, and the circuit board 100 is a five-layer board structure circuit board, and includes an insulator 1, the insulator 1 extends along the longitudinal direction and is substantially flat, the insulator 1 is horizontally provided with a plurality of through slots 11 side by side, the through slots 11 are opened along the longitudinal direction and penetrate through the insulator 1, openings of the through slots 11 are substantially rectangular, the through slots 11 are provided with a first slot wall 111 disposed opposite to each other in the horizontal direction and a second slot wall 112 disposed opposite to each other in the vertical direction, the upper and lower surfaces of the insulator 1 are respectively covered with a shielding layer 2, the upper and lower surfaces of the shielding layer 2 are respectively covered with an insulating layer 3, and a plane of the upper and lower surfaces of the insulator 1 is parallel to a plane surrounded by the extending direction of the through slots 11 and the arrangement direction of the through slots 11.

A plurality of conductors 4 are accommodated in the insulator 1, the conductors 4 include a signal layer 41 and a ground layer 42, and are substantially flat, the volume of the ground layer 42 is larger than the volume of the signal layer 41, the conductors 4 are held in the first groove wall 111 between two adjacent through grooves 11, the left and right sides of the conductors 4 are exposed to the through grooves 11, and the left and right sides of the conductors 4 are not in contact with the other first groove wall 111 and the second groove wall 112 of the through grooves 11, so that the conductors 4 are only partially held in contact with the insulator 1, and the rest of the conductors are in contact with the air.

In the flexible circuit board 100 of the present invention, the conductive body 4 except the holding portion is exposed in the through groove 11 to contact with air, and the dielectric constant of the air in the through groove 11 is lower than that of the conventional teflon, liquid crystal high molecular polymer, pure glue or other insulating materials, so that the air is used as a dielectric layer to cover the periphery of the signal line instead of the conventional teflon, liquid crystal high molecular polymer, pure glue or other insulating materials, so that the signals of the flexible circuit board 100 are almost lossless as transmitted in the air, thereby achieving signal transmission with ultra-low signal attenuation, and the through grooves 11 are provided on the insulator 1, so that the structural strength of the insulator 1 can be further reduced, thereby the flexibility is better than that of the insulator 1 without the through groove 11, and when the insulator 1 adopts the conventional teflon or liquid crystal high molecular polymer, the manufacturing cost is high, and when a plurality of through grooves 11 are formed, the material consumption of the insulator 1 can be reduced, so that the production cost is reduced.

As shown in fig. 6, a second embodiment of the circuit board 100 of the present invention is different from the first embodiment in that an accommodating space 5 is formed between the position of the insulator 1 accommodating the ground layer 42 and the shielding layer 2, the shielding layer 2 is bent or recessed into the accommodating space 5 to form a contact portion 21 for electrically contacting the ground layer 42, so as to achieve a better shielding effect, and after the shielding layer 2 is bent or recessed to contact the ground layer 42, the accommodating space 5 still has a space for allowing air to exist, which is similar to the first embodiment in structure.

As shown in fig. 7, a third embodiment of the circuit board 100 of the present invention is different from the first embodiment in that an accommodating space 5 is formed between the position of the insulator 1 for accommodating the ground layer 42 and the shielding layer 2, a solder 6 can be placed in the accommodating space 5, the solder 6 is placed in the accommodating space 5 in a spherical shape, at this time, since the diameter of the solder 6 is larger than the vertical distance from the shielding layer 2 to the ground layer 42, the shielding layer 2 receives the support of the solder 6 and is slightly raised (see fig. 7A), when the solder 6 completely welds the shielding layer 2 and the ground layer 42, at this time, the solder 6 does not have the support to the shielding layer 2 and is restored to the original state, and the electrical connection between the shielding layer 2 and the ground layer 42 can be realized to achieve a better shielding effect, when the solder 6 completely welds the shielding layer 2 and the ground layer 42, the weld and the accommodation space 5 still leave a space for allowing air to exist (see fig. 7B).

As shown in fig. 8, a fourth embodiment of the circuit board 100 of the present invention is different from the first embodiment in that the ground layer 42 is formed in a cylindrical shape, the signal layer 41 is still in a flat plate shape, the cylindrical ground layer 42 is held at upper and lower ends in the through groove 11, and left and right ends are exposed in the through groove 11, and since the ground layer 42 is formed in a cylindrical shape, a diameter of the cylindrical shape is smaller than a length of the flat plate shape in a horizontal direction, a distance between the cylindrical shape and the flat plate shape is larger than a distance between the flat plate shape and the flat plate shape, and thus, the distance between the adjacent cylindrical conductive bodies 4 and the flat plate-shaped conductive bodies 4 is further, and mutual interference is smaller.

As shown in fig. 9, a fifth embodiment of the circuit board 100 of the present invention is different from the first embodiment in that the signal layer 41 is formed in a cylindrical shape, and the ground layer 42 is still formed in a flat plate shape, so that the distance between the adjacent cylindrical conductor 4 and the flat plate-shaped conductor 4 is further increased, and the mutual interference is smaller.

As shown in fig. 10, a sixth embodiment of the circuit board 100 of the present invention is different from the first embodiment in that the conductors 4 are made in a cylindrical shape, and the distance between two adjacent conductors 4 is further reduced, thereby reducing the mutual interference between two adjacent conductors 4.

As shown in fig. 11, a seventh embodiment of the circuit board 100 of the present invention is different from the first embodiment in that the signal layer 41 further includes a high-speed signal pair 411, a shielding cover 7 is further covered outside the high-speed signal pair 411, the shielding cover 7 can be used to isolate the interference of other signal layers 41 or ground layers 42 beside the high-speed signal pair 411, if the ground layer 42 is beside the high-speed signal pair 411, the ground layer 42 can be in contact with or not in contact with the shielding cover 7, the upper and lower ends of the shielding cover 7 are both covered on the upper and lower ends of the insulator 1, the left and right ends of the shielding cover 7 penetrate through the insulator 1 in the upper and lower directions and enter the through slot 11, due to the existence of the shielding cover 7, the shielding layers 2 originally covered on the upper and lower sides of the insulator 1 are located at the upper and lower positions of the shielding cover 7, each of the insulating layers 3 is slightly protruded upward and downward, and the insulating layers 3 covering the upper and lower sides of the shielding layer 2 are provided with a concave area at the position of the protrusion to accommodate the protrusion, so that the flatness of the upper and lower surfaces of the circuit board 100 is maintained.

In summary, the circuit board 100 of the present invention has the following beneficial effects:

(1) the conductive layer of the traditional circuit board 100 structure is generally arranged above the dielectric layer, and a dielectric layer is arranged above the conductive layer, so the signal transmission of the conductive layer is mainly influenced by the dielectric layer, when the dielectric constant of the dielectric layer is lower, the signal transmission effect is better, and the dielectric constants of the dielectric layers of the traditional materials are all larger than the dielectric constant of air, therefore, the insulator 1 of the circuit board 100 of the invention is provided with a plurality of through grooves 11 side by side, the conductor 4 is only contacted with one groove wall of the through groove 11, most of the structure of the conductor is contacted with the air in the through groove 11, and therefore the conductor 4 can transmit signals by air, and the signal transmission effect with ultralow signal attenuation is achieved.

(2) The insulator 1 of the circuit board 100 of the present invention is provided with the plurality of through grooves 11 side by side, so that the material consumption of the insulator 1 can be reduced, and in order to make signal transmission more excellent, the conventional circuit board also uses teflon and liquid crystal high molecular polymer as a dielectric layer, so that the production cost can be reduced due to the existence of the through grooves 11, and the circuit board 100 of the present invention is a flexible circuit board 100, and due to the existence of the through grooves 11, the structural strength of the insulator 1 is also reduced, so that the flexibility of the circuit board 100 is improved.

(3) The conductive layer of the conventional circuit board structure is generally disposed above the dielectric layer, and the conductive body 4 of the circuit board 100 of the present invention is disposed between the insulators 1, so that the thickness of the circuit board 100 is reduced, the space is saved, the circuit board 100 has the possibility of disposing more other structures, and the flexibility of the circuit board 100 is improved.

The above detailed description is only for the purpose of illustrating the preferred embodiments of the present invention, and not for the purpose of limiting the scope of the present invention, therefore, all technical changes that can be made by applying the present specification and drawings are included in the scope of the present invention.

Claims

1. A circuit board, comprising:

an insulator; the insulator comprises at least one through groove, and the through groove is formed along the longitudinal direction;

the conductive bodies extend along the longitudinal direction, one part of the conductive bodies is continuously fixed in the groove walls of the through grooves in the longitudinal direction, and at least one end of each conductive body in the left-right direction is exposed in the through grooves and is not in contact with the rest of the groove walls of the through grooves.

2. The circuit board of claim 1, wherein: the insulator extends along the longitudinal direction and is approximately in a flat plate shape, and the through groove penetrates through the insulator along the longitudinal direction.

3. The circuit board of claim 1, wherein: the insulator comprises at least two through grooves which are horizontally arranged side by side, the conductor part is fixedly arranged in a groove wall between two adjacent through grooves, and two ends of the conductor are exposed out of the through grooves and are not in contact with the other groove walls of the through grooves.

4. The circuit board of claim 1, wherein: the circuit board is a flexible circuit board.

5. The circuit board of claim 3, wherein: and the upper surface and the lower surface of the insulator are provided with a shielding layer, the upper surface and the lower surface of the shielding layer are provided with an insulating layer, and the plane of the upper surface and the lower surface of the insulator is parallel to the plane defined by the extending direction of the through grooves and the arrangement direction of the through grooves.

6. The circuit board of claim 5, wherein: the conductor comprises a signal layer and a grounding layer, an accommodating space is arranged between the shielding layer and the insulator, and the shielding layer is sunken towards the accommodating space and is electrically connected with the grounding layer.

7. The circuit board of claim 6, wherein: and a solder is arranged in the accommodating space, the shielding layer and the grounding layer are electrically connected in a conductive manner after the solder is welded, and a space is still reserved between the solder and the accommodating space after the solder is welded.

8. The circuit board of claim 6, wherein: the signal layer further comprises a high-speed signal pair, a shielding cover is arranged on the outer side of the high-speed signal pair, and the upper side and the lower side of the shielding cover are in contact with the shielding layer.

9. The circuit board of claim 6, wherein: the ground layer is cylindrical, and the signal layer is flat and planar.

10. The circuit board of claim 6, wherein: the ground layer is flat and flat, and the signal layer is cylindrical.

11. The circuit board of claim 6, wherein: the conductors are flat and planar, and the volume of the ground layer is greater than that of the signal layer.

12. The circuit board of claim 1, wherein: the conductors are all cylindrical.