CN110139490A - A kind of production method and transmission line plate of transmission line plate - Google Patents
A kind of production method and transmission line plate of transmission line plate Download PDFInfo
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- CN110139490A CN110139490A CN201910469834.XA CN201910469834A CN110139490A CN 110139490 A CN110139490 A CN 110139490A CN 201910469834 A CN201910469834 A CN 201910469834A CN 110139490 A CN110139490 A CN 110139490A
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- coated copper
- copper plate
- side coated
- adhesive layer
- plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of production methods of double-deck transmission line plate, it is pressed to obtain double-layer overlapped structure structure using two panels single-side coated copper plate and a piece of adhesive layer with region of removing photoresist, then it is etched the copper foil layer in an outside of double-layer overlapped structure structure to obtain surface line again, the signal transmssion line of surface line is corresponding with the regional location that removes photoresist.In the present invention, adhesive layer thickness signal transmssion line blank medium region is thinning or completely removes, so that the dielectric layer of signal transmssion line reference is the air of the single-side coated copper plate of signal wire two sides and the regional location that removes photoresist, and, the thickness of single-side coated copper plate and adhesive layer ratio is 1:3, to make the corresponding air section position of signal transmssion line become larger, the dielectric constant of air is 1, fissipation factor is 0, far below the dielectric constant and fissipation factor of single-side coated copper plate, the signal transmssion line of the double-deck transmission line plate of method production provided by the invention has lower loss.
Description
Technical field
The invention belongs to flexible circuit board field more particularly to a kind of production methods and transmission line of transmission line plate
Plate.
Background technique
With the development of electronic communication, the requirement of transmission performance is gradually increased in all kinds of high-frequency communications.People are led at present
It is often the high performance requirements by meeting antenna to the selection of baseplate material, such as by adding Gao Jie in macromolecule matrix
Electroceramics phase or conductive phase obtain high-dielectric composite material, increase the chemical research to the various types of materials of transmission line.However,
How to reduce the loss of signal transmssion line is still a urgent problem to be solved.
Summary of the invention
The object of the present invention is to provide a kind of production method of transmission line plate and transmission line plates, and signal can be effectively reduced
The loss of transmission line.
To solve the above problems, the technical solution of the present invention is as follows:
A kind of production method of bilayer transmission line plate, includes the following steps:
Two panels is obtained to prepare the single-side coated copper plate of the double-deck transmission line plate and a piece of prepare the bilayer transmission line
The adhesive layer of road plate, the adhesive layer have region of removing photoresist, and the thickness of the binder in the region of removing photoresist is less than the area of removing photoresist
The thickness of the binder of domain side；
The adhesive layer is sandwiched between single-side coated copper plate described in two panels and carries out folded structure, and the copper foil of the single-side coated copper plate
It places outwardly layer side；
By after folded structure the single-side coated copper plate and the adhesive layer press, obtain double-layer overlapped structure structure；
The copper foil layer in one outside of the double-layer overlapped structure structure is etched to obtain the first surface line, described first
First signal transmssion line of surface line is corresponding with the regional location that removes photoresist, and obtains the double-deck transmission line plate.
Preferably, it obtains and prepare the adhesive layer of the bilayer transmission line plate and further comprise:
The a piece of and consistent initial adhesion layer of the single-side coated copper plate area is provided；
The initial adhesion layer is subjected to local processing of removing photoresist and obtains the adhesive layer.
Preferably, the thickness ratio of the single-side coated copper plate and the adhesive layer is 1~1:5.
Preferably, the thickness ratio of the single-side coated copper plate and the adhesive layer is 1:3.
Based on identical inventive concept, invention also improves a kind of double-deck transmission line plates, comprising:
The copper foil layer of first single-side coated copper plate, first single-side coated copper plate is etched with the first surface line；
Second single-side coated copper plate；
Adhesive layer, the adhesive layer have region of removing photoresist, and the thickness of the binder in the region of removing photoresist is less than described remove photoresist
The thickness of the binder of region side；
First single-side coated copper plate is opposite with the flexible parent metal side of second single-side coated copper plate to be laid, the bonding
Layer is sandwiched between first single-side coated copper plate and second single-side coated copper plate, and the first signal of first surface line passes
Defeated line is corresponding with the regional location that removes photoresist.
Preferably, first single-side coated copper plate is identical as the thickness of second single-side coated copper plate, first single side
The thickness ratio of copper-clad plate and the adhesive layer is 1~1:5.
Preferably, the thickness ratio of first single-side coated copper plate and the adhesive layer is 1:3.
Based on identical inventive concept, the present invention also provides a kind of production methods of three-layer transmission wiring board, including such as
Lower step:
The third single-side coated copper plate, the 4th single-side coated copper plate, the 5th single side that acquisition prepares the three-layer transmission wiring board cover
Copper sheet, the first adhesive layer and the second adhesive layer, first adhesive layer have first to remove photoresist region, and described first removes photoresist region
Binder thickness be less than described first remove photoresist region side binder thickness, second adhesive layer, which has, second to be gone
Glue region, described second remove photoresist region binder thickness be less than described second remove photoresist region side binder thickness；
First adhesive layer is sandwiched between the third single-side coated copper plate and the 4th single-side coated copper plate and is folded
Structure, and the copper foil layer side of the third single-side coated copper plate and the 4th single-side coated copper plate is placed outwardly；
The third single-side coated copper plate, first adhesive layer and the 4th single-side coated copper plate after folded structure is pressed
It closes, obtains double-layer overlapped structure structure；
It is etched the copper foil layer in one outside of double-layer overlapped structure structure to obtain the second surface line；
Successively fold the second adhesive layer and the 5th single-side coated copper plate described in structure again in second surface line, and
The copper foil layer side of 5th single-side coated copper plate is placed outwardly, the second signal transmission line of second surface line with
Described first remove photoresist region and second remove photoresist region position it is corresponding, obtain three stacking structure structures；
It is pressed the three stackings structure structure to obtain the three-layer transmission wiring board.
Preferably, the third single-side coated copper plate, the 4th single-side coated copper plate and the 5th single-side coated copper plate are thick
Spend identical, the thickness of first adhesive layer and second adhesive layer is identical, the third single-side coated copper plate and described the
The thickness ratio of one adhesive layer is 1~1:5.
Preferably, the thickness ratio of the third single-side coated copper plate and first adhesive layer is 1:3.
Based on identical inventive concept, the present invention also provides a kind of three-layer transmission wiring boards, comprising:
Third single-side coated copper plate；
The copper foil layer of 4th single-side coated copper plate, the 4th single-side coated copper plate is etched with the second surface line；
5th single-side coated copper plate；
First adhesive layer, first adhesive layer have first to remove photoresist region, the described first binder for removing photoresist region
Thickness be less than described first remove photoresist region side binder thickness；
Second adhesive layer, second adhesive layer have second to remove photoresist region, the described second binder for removing photoresist region
Thickness be less than described second remove photoresist region side binder thickness；
Wherein, the third single-side coated copper plate, the 4th single-side coated copper plate and the 5th single-side coated copper plate successively fold structure,
The third single-side coated copper plate is opposite with the flexible parent metal side of the 4th single-side coated copper plate to be laid, and the 5th single side covers copper
Plate folds structure on the upside of second surface line, and the super outside of copper foil layer of the 5th single-side coated copper plate is placed, and described first
Adhesive layer is sandwiched between the third single-side coated copper plate and the 4th single-side coated copper plate, and second adhesive layer is sandwiched in described
Between four single-side coated copper plates and the 5th single-side coated copper plate, the second signal transmission line of second surface line and described the
One remove photoresist region and second remove photoresist region position it is corresponding.
Preferably, the third single-side coated copper plate, the 4th single-side coated copper plate and the 5th single-side coated copper plate are thick
Spend identical, the thickness of first adhesive layer and second adhesive layer is identical, the third single-side coated copper plate and described the
The thickness ratio of one adhesive layer is 1~1:5.
Preferably, the thickness ratio of the third single-side coated copper plate and first adhesive layer is 1:3.
Based on identical inventive concept, the present invention also provides a kind of production methods of multilayer transmission wiring board, including such as
Lower step:
If obtain dry plate prepare the intermediate single-side coated copper plate of the multilayer transmission wiring board, a piece of transmission single-side coated copper plate,
If single-side coated copper plate and dry plate prepare the adhesive layer of the multilayer transmission wiring board on the outside of two panels, the adhesive layer has area of removing photoresist
Domain, the thickness of the binder in the region of removing photoresist are less than the thickness of the binder of the region side of removing photoresist；
By a piece of adhesive layer be sandwiched between a piece of intermediate single-side coated copper plate and the transmission single-side coated copper plate into
The folded structure of row, and the copper foil layer side of the intermediate single-side coated copper plate and the transmission single-side coated copper plate is placed outwardly；
The adhesive layer, the intermediate single-side coated copper plate and the transmission single-side coated copper plate after folded structure is pressed,
Obtain double-layer overlapped structure structure；
It is etched the copper foil layer of the transmission single-side coated copper plate to obtain intermediate surface route；
The copper foil layer of the intermediate single-side coated copper plate is etched to obtain copper region, the copper for going to copper region
Foil thickness is less than the copper thickness for going to copper region side；
If remaining dry plate is had the intermediate single-side coated copper plate for going to copper region successively fold structure in the double-layer overlapped structure
The one or both sides of structure, the adhesive layer are sandwiched between the intermediate single-side coated copper plate, the signal of the intermediate surface route
Transmission line with it is described remove photoresist region and the position for going to copper region it is corresponding, obtain intermediate multi-laminate structure structure；
Successively adhesive layer described in structure is folded again in two outsides of the intermediate multi-laminate structure structure and the outside single side covers copper
Plate, and the copper foil layer of the outside single-side coated copper plate is placed towards outside, obtains multi-laminate structure structure；
The multi-laminate structure structure is pressed to obtain the multilayer transmission wiring board.
Preferably, the thickness ratio of the intermediate single-side coated copper plate and the adhesive layer is 1~1:5.
Preferably, the thickness ratio of the intermediate single-side coated copper plate and the adhesive layer is 1:3.
Based on identical inventive concept, the present invention also provides a kind of multilayer transmission wiring boards, comprising:
If single-side coated copper plate among dry plate, the intermediate single-side coated copper plate, which has, removes copper region, the copper for going to copper region
Foil thickness is less than the copper thickness for going to copper region side；
The copper foil layer of a piece of transmission single-side coated copper plate, the transmission single-side coated copper plate has intermediate surface route；
Single-side coated copper plate on the outside of two panels；
Adhesive layer, the adhesive layer have region of removing photoresist, and the thickness of the binder in the region of removing photoresist is less than described remove photoresist
The thickness of the binder of region side；
If by outside single side described in intermediate single-side coated copper plate, a piece of transmission single-side coated copper plate and two panels described in dry plate
Structure is successively folded in copper-clad plate, and the outside single side covers two outsides that copper is located at the multilayer transmission wiring board, and the outside is single
The copper foil layer of face copper-clad plate is placed towards outside, between the intermediate single-side coated copper plate, the intermediate single-side coated copper plate and institute
It states between transmission single-side coated copper plate and the intermediate single-side coated copper plate or the transmission single-side coated copper plate and the outside single side
It covers and accompanies one layer of adhesive layer between copper, the signal transmssion line of the intermediate surface route and described remove photoresist and described remove copper at region
The position in region is corresponding.
Preferably, the consistency of thickness of the intermediate single-side coated copper plate and the transmission single-side coated copper plate, the intermediate single side
The thickness ratio of copper-clad plate and the adhesive layer is 1~1:5.
Preferably, the thickness ratio of the intermediate single-side coated copper plate and the adhesive layer is 1:3.
Based on identical inventive concept, the present invention also provides a kind of flexible circuit boards, including the above-mentioned double-deck transmission line
Road plate or above-mentioned three-layer transmission wiring board or above-mentioned multilayer transmission wiring board.
The present invention due to using the technology described above, makes it have the following advantages that and actively imitate compared with prior art
Fruit:
1) the present invention provides a kind of production method of double-deck transmission line plate, two panels single-side coated copper plate and a piece of is used
Adhesive layer with region of removing photoresist is pressed to obtain double-layer overlapped structure structure, then again by the copper in an outside of double-layer overlapped structure structure
Layers of foil is etched to obtain surface line, and the signal transmssion line of surface line is corresponding with the regional location that removes photoresist, and obtains the double-deck transmission
Wiring board.In the present invention, the adhesive layer thickness signal transmssion line blank medium region is thinning or completely removes, so that letter
The dielectric layer of number transmission line reference is the air of the single-side coated copper plate of signal wire two sides and the regional location that removes photoresist, due to air
Dielectric constant is 1, fissipation factor 0, far below the dielectric constant and fissipation factor of single-side coated copper plate, so mentioning through the invention
The signal transmssion line of the double-deck transmission line plate of the production method production of the double-deck transmission line plate supplied has lower loss.
2) thickness of single-side coated copper plate and adhesive layer ratio is 1~1:5 in the present invention, and in traditional flexible circuit board
The thickness of single-side coated copper plate and adhesive layer ratio is 3, by adjusting the ratio of single-side coated copper plate substrate and adhesive layer, reduces single side and covers
The thickness of copper sheet, increases the thickness of adhesive layer, to make the corresponding air section position of signal transmssion line become larger, due to air
Dielectric constant is 1, fissipation factor 0, far below the dielectric constant and fissipation factor of single-side coated copper plate, so mentioning through the invention
The signal transmssion line of the double-deck transmission line plate of the production method production of the double-deck transmission line plate supplied has lower loss, makes
With the loss of the signal transmssion line of the double-deck transmission line plate of the production method production of the double-deck transmission line plate provided by the invention
The loss low 30%~50% of the signal transmssion line of more traditional double-deck transmission line plate.
3) the present invention provides a kind of double-deck transmission line plate, including the first single-side coated copper plate, the second single-side coated copper plate with
And adhesive layer, and adhesive layer has region of removing photoresist；The flexible parent metal side of first single-side coated copper plate and the second single-side coated copper plate
Opposite to lay, adhesive layer is sandwiched between the first single-side coated copper plate and the second single-side coated copper plate, the first single-side coated copper plate and the second list
The thickness of face copper-clad plate is identical, and the thickness ratio of the first single-side coated copper plate and adhesive layer is 1~1:5, and the signal of surface line transmits
Line is corresponding with the regional location that removes photoresist.In the present invention, the adhesive layer thickness signal transmssion line blank medium region it is thinning or
It completely removes, so that the dielectric layer of signal transmssion line reference is the single-side coated copper plate of signal wire two sides and the regional location that removes photoresist
Air, also, the thickness of single-side coated copper plate and adhesive layer ratio is 1~1:5 in the present invention, and in traditional flexible circuit board
The thickness of single-side coated copper plate and adhesive layer ratio is 3, by adjusting the ratio of single-side coated copper plate substrate and adhesive layer, reduces single side and covers
The thickness of copper sheet, increases the thickness of adhesive layer, to make the corresponding air section position of signal transmssion line become larger, due to air
Dielectric constant is 1, fissipation factor 0, far below the dielectric constant and fissipation factor of single-side coated copper plate, so provided by the invention
The signal transmssion line of the double-deck transmission line plate has lower loss, the signal transmission of bilayer transmission line plate provided by the invention
The loss low 30%~50% of the signal transmssion line of the more traditional double-deck transmission line plate of the loss of line.
Detailed description of the invention
Fig. 1 is a kind of flow chart of the production method of double-deck transmission line plate；
Fig. 2 a to Fig. 2 d is the schematic diagram of the production method of the double-deck transmission line plate；
Fig. 3 is the schematic diagram of the production method of adhesive layer；
Fig. 4 is the schematic diagram of the production method of traditional double-deck transmission line plate；
Fig. 5 is the schematic diagram of the double-deck transmission line plate；
Fig. 6 is a kind of flow chart of the production method of three-layer transmission wiring board；
Fig. 7 a to Fig. 7 g is a kind of schematic diagram of the production method of three-layer transmission wiring board；
Fig. 8 is the schematic diagram of the production method of traditional three-layer transmission wiring board；
Fig. 9 is the schematic diagram of three-layer transmission wiring board；
Figure 10 is a kind of flow chart of the production method of multilayer transmission wiring board；
Figure 11 a to Figure 11 g is a kind of schematic diagram of the production method of four layers of transmission line plate；
Figure 12 a to Figure 12 g is a kind of schematic diagram of the production method of five layers of transmission line plate；
Figure 13 is the schematic diagram of four layers of transmission line plate；
Figure 14 is the schematic diagram of five layers of transmission line plate.
Description of symbols:
1: the double-deck transmission line plate；11: single-side coated copper plate；111: the first single-side coated copper plates；The transmission of 1111: the first signals
Line；112: the second single-side coated copper plates；12: adhesive layer；121: region of removing photoresist；2: three-layer transmission wiring board；21: third single side covers copper
Plate；211: second signal transmission line；22: the four single-side coated copper plates；23: the five single-side coated copper plates；24: the first adhesive layers；241:
First removes photoresist region；25: the second adhesive layers；Remove photoresist region at 251: the second；3: four layers of transmission line plate；31: transmission single side covers copper
Plate；311: intermediate surface route；3111: signal transmssion line；32: intermediate single-side coated copper plate；321: going to copper region；33: outside is single
Face copper-clad plate；4: five layers of transmission line plate.
Specific embodiment
Below in conjunction with the drawings and specific embodiments to a kind of production method and transmission of transmission line plate proposed by the present invention
Wiring board is described in further detail.According to following explanation and claims, advantages and features of the invention will be become apparent from.
Embodiment one
Referring to shown in Fig. 1, Fig. 2 a to Fig. 2 d, Fig. 1 is a kind of flow chart of the production method of double-deck transmission line plate, Fig. 2 a
To the schematic diagram for the production method that Fig. 2 d is the double-deck transmission line plate.The invention proposes a kind of production of double-deck transmission line plate
Method includes the following steps to obtain single-side coated copper plate 11 and the double-deck biography of a piece of preparation that two panels prepares the double-deck transmission line plate 1
The adhesive layer 12 of defeated wiring board 1, adhesive layer 12 have region 121 of removing photoresist, and the thickness of the binder in region 121 of removing photoresist, which is less than, to remove photoresist
The thickness ratio of the thickness of the binder of 121 side of region, single-side coated copper plate 11 and adhesive layer 12 is 1~1:5；Adhesive layer 12 is pressed from both sides
Folded structure is carried out between two panels single-side coated copper plate 11, and the copper foil layer side of single-side coated copper plate 11 is placed outwardly；After folded structure
Single-side coated copper plate 11 and adhesive layer 12 are pressed, and double-layer overlapped structure structure is obtained；By the copper foil layer in one outside of double-layer overlapped structure structure
It is etched to obtain the first surface line, the first signal transmssion line of the first surface line is corresponding with 121 position of region of removing photoresist, and obtains
To the double-deck transmission line plate 1.
As shown in Figure 2 a, single-side coated copper plate 11 and a piece of preparation for first obtaining the double-deck transmission line plate 1 of two panels preparation are double
The adhesive layer 12 of layer transmission line plate 1, adhesive layer 12 have region 121 of removing photoresist, as shown in figure 3, Fig. 3 is the production side of adhesive layer
The schematic diagram of method, in the present embodiment, the preparation step of adhesive layer 12 further comprises: first providing a piece of and single-side coated copper plate face
Then the consistent initial adhesion layer of product is become the adhesive layer in certain region on initial adhesion layer using the processing mode locally removed photoresist
It is thin or completely through removal, obtain adhesive layer 12.The thickness ratio of single-side coated copper plate 11 and adhesive layer 12 is 1~1:5, in this reality
It applies in example, the thickness ratio of single-side coated copper plate 11 and adhesive layer 12 is 1:3.
As shown in Figure 2 b, adhesive layer 12 is sandwiched between two panels single-side coated copper plate 11 and carries out folded structure, and single-side coated copper plate 11
Copper foil layer side place outwardly.
As shown in Figure 2 c, by after folded structure single-side coated copper plate 11 and adhesive layer 12 be laminated or be put into roll squeezer and carried out
Pressing, obtains double-layer overlapped structure structure.
As shown in Figure 2 d, the copper foil layer in the outside of double-layer overlapped structure structure one is etched to obtain the first surface line, first
Surface line has the first signal transmssion line and ground wire, the first signal transmssion line of the first surface line and 121, region of removing photoresist
Correspondence is set, the double-deck transmission line plate 1 is obtained.
Referring to shown in Fig. 4, Fig. 4 is the schematic diagram of the production method of traditional double-deck transmission line plate, and conventional at present is double
The folded structure method of laminate flat transmission line laminated construction, signal transmssion line are walked on surface layer, directly use single-side coated copper plate and copper first
It does roll-in and obtains double face copper, then the side copper foil of double face copper is etched, loses surface line out, the surface layer line
The dielectric layer of road reference is the copper-clad plate substrate medium floor of signal wire bottom side, and the dielectric constant and fissipation factor of reference are exactly single
Substrate medium material in the copper-clad plate of face.
The present invention provides a kind of production methods of double-deck transmission line plate, use two panels single-side coated copper plate and a piece of tool
There is the adhesive layer in region of removing photoresist to be pressed to obtain double-layer overlapped structure structure, then again by the copper foil in an outside of double-layer overlapped structure structure
Layer is etched to obtain surface line, and the signal transmssion line of surface line is corresponding with the regional location that removes photoresist, and obtains the double-deck transmission line
Road plate.In the present invention, the adhesive layer thickness signal transmssion line blank medium region is thinning or completely removes, so that signal
The dielectric layer of transmission line reference is the air of the single-side coated copper plate of signal wire two sides and the regional location that removes photoresist, also, in this hair
The thickness ratio of bright middle single-side coated copper plate and adhesive layer is 1~1:5, and single-side coated copper plate and bonding in traditional flexible circuit board
The thickness ratio of layer is 3, by adjusting the ratio of single-side coated copper plate substrate and adhesive layer, reduces the thickness of single-side coated copper plate, is increased
The thickness of adhesive layer, so that the corresponding air section position of signal transmssion line is made to become larger, since the dielectric constant of air is 1, damage
Consuming the factor is 0, far below the dielectric constant and fissipation factor of single-side coated copper plate, so the double-deck transmission line provided through the invention
The signal transmssion line of the double-deck transmission line plate of the production method production of road plate has lower loss, and use is provided by the invention
The more traditional double-deck biography of the loss of the signal transmssion line of the double-deck transmission line plate of the production method production of the double-deck transmission line plate
The loss of the signal transmssion line of defeated wiring board low 30%~50%.
Embodiment two
Referring to shown in Fig. 5, Fig. 5 is the schematic diagram of the double-deck transmission line plate, and the present invention provides a kind of double-deck transmission lines
Plate, including the first single-side coated copper plate 111, the copper foil layer of the first single-side coated copper plate 111 are etched with the first surface line；Second single side
Copper-clad plate 112；Adhesive layer 12, adhesive layer 12 have region 121 of removing photoresist, and the thickness of the binder in region 121 of removing photoresist, which is less than, to remove photoresist
The thickness of the binder of 121 side of region；The flexible parent metal side of first single-side coated copper plate 111 and the second single-side coated copper plate 112
Opposite to lay, adhesive layer 12 is sandwiched between the first single-side coated copper plate 111 and the second single-side coated copper plate 112, the first single-side coated copper plate
111 is identical as the thickness of the second single-side coated copper plate 112, and the thickness ratio of the first single-side coated copper plate 111 and adhesive layer 12 is 1~1:5,
First signal transmssion line 1111 of the first surface line is corresponding with 121 position of region of removing photoresist.Preferably, the first single-side coated copper plate
111 with the thickness ratio of adhesive layer 12 be 1:3.
The present invention provides a kind of double-deck transmission line plate, including the first single-side coated copper plate, the second single-side coated copper plate and
Adhesive layer, and adhesive layer has region of removing photoresist；The flexible parent metal side phase of first single-side coated copper plate and the second single-side coated copper plate
To laying, adhesive layer is sandwiched between the first single-side coated copper plate and the second single-side coated copper plate, the first single-side coated copper plate and the second single side
The thickness of copper-clad plate is identical, and the thickness ratio of the first single-side coated copper plate and adhesive layer is 1~1:5, the signal transmssion line of surface line
It is corresponding with the regional location that removes photoresist.In the present invention, the adhesive layer thickness in signal transmssion line blank medium region is thinning or complete
Full removal, so that the dielectric layer of signal transmssion line reference is the sky of the single-side coated copper plate of signal wire two sides and the regional location that removes photoresist
Gas, also, the thickness of single-side coated copper plate and adhesive layer ratio is 1~1:5 in the present invention, and the list in traditional flexible circuit board
The thickness of face copper-clad plate and adhesive layer ratio is 3, by adjusting the ratio of single-side coated copper plate substrate and adhesive layer, reduces single side and covers copper
The thickness of plate, increases the thickness of adhesive layer, to make the corresponding air section position of signal transmssion line become larger, due to Jie of air
Electric constant is 1, fissipation factor 0, far below the dielectric constant and fissipation factor of single-side coated copper plate, so provided by the invention double
The signal transmssion line of layer transmission line plate has lower loss, the signal transmssion line of bilayer transmission line plate provided by the invention
The more traditional double-deck transmission line plate of loss signal transmssion line loss low 30%~50%.
Embodiment three
Referring to shown in Fig. 6, Fig. 7 a to Fig. 7 g, Fig. 6 is a kind of flow chart of the production method of three-layer transmission wiring board, Fig. 7 a
To a kind of schematic diagram for the production method that Fig. 7 g is three-layer transmission wiring board.The present invention provides a kind of three-layer transmission wiring boards
Production method includes the following steps: that the third single-side coated copper plate 21, the 4th single side that obtain preparation three-layer transmission wiring board 2 cover copper
Plate 22, the 5th single-side coated copper plate 23, the first adhesive layer 24 and the second adhesive layer 25, the first adhesive layer 24 have first to remove photoresist area
Domain 241, first remove photoresist region 241 binder thickness remove photoresist less than first 241 side of region binder thickness, second
Adhesive layer 25 has second to remove photoresist region 251, and the second thickness of binder for removing photoresist region 251 removes photoresist region 251 less than second
The thickness of the binder of side, third single-side coated copper plate 21, the 4th single-side coated copper plate 22 and 23 thickness of the 5th single-side coated copper plate
Identical, the thickness of the first adhesive layer 24 and the second adhesive layer 25 is identical, third single-side coated copper plate 21 and the first adhesive layer 25
Thickness ratio is 1~1:5, and in the present embodiment, the thickness of third single-side coated copper plate 21 and the first adhesive layer 25 is than being preferably 1:3；
First adhesive layer 24 is sandwiched between third single-side coated copper plate 21 and the 4th single-side coated copper plate 22 and carries out folded structure, and third single side covers
The copper foil layer side of copper sheet 21 and the 4th single-side coated copper plate 22 is placed outwardly；By after folded structure third single-side coated copper plate 21,
One adhesive layer 24 and the 4th single-side coated copper plate 22 are pressed, and double-layer overlapped structure structure is obtained；By one outside of double-layer overlapped structure structure
Copper foil layer is etched to obtain the second surface line；Successively fold the second adhesive layer of structure 25 and the 5th again in the second surface line
Single-side coated copper plate 23, and the copper foil layer side of the 5th single-side coated copper plate 23 is placed outwardly, the second signal of the second surface line passes
Defeated line 211 with first remove photoresist region 241 and second remove photoresist region 251 position it is corresponding, obtain three stacking structure structures；By three
Stacking structure structure is pressed to obtain three-layer transmission wiring board 2.
Referring to shown in Fig. 8, Fig. 8 is the schematic diagram of the production method of traditional three-layer transmission wiring board, traditional three ply board
Flat transmission line laminated construction, signal transmssion line can walk surface layer, can also walk middle layer, walk the flat transmission of three ply board on surface layer
The production method that the production method of line laminated construction is similar to traditional double-deck transmission line plate that Fig. 4 is introduced；Fig. 8 is illustrated
The production method that signal transmssion line walks the three ply board flat transmission line laminated construction of middle layer, first by the side copper of double face copper
Foil is etched to obtain surface line, then successively folds one layer of adhesive layer of structure and one layer of single-side coated copper plate again in surface line,
Finally three stacking structure structures are pressed to obtain three ply board flat transmission line laminated construction, the dielectric layer of surface line reference
The as copper-clad plate substrate medium layer of signal wire two sides, the dielectric constant and fissipation factor of reference are single-side coated copper plate or two-sided cover
Substrate medium material on copper sheet.
The production method of a kind of three-layer transmission wiring board provided by the invention, by signal transmssion line blank medium region
Adhesive layer thickness it is thinning or completely remove so that the single side that the dielectric layer of signal transmssion line reference is signal wire two sides covers
The air of copper sheet and the regional location that removes photoresist, also, the thickness of single-side coated copper plate and adhesive layer ratio is 1:3 in the present invention, and pass
The thickness ratio of single-side coated copper plate and adhesive layer in the flexible circuit board of system is 3, by adjusting single-side coated copper plate substrate and bonding
The ratio of layer, reduces the thickness of single-side coated copper plate, increases the thickness of adhesive layer, to make the corresponding air section of signal transmssion line
Position becomes larger, due to air dielectric constant be 1, fissipation factor 0, far below single-side coated copper plate dielectric constant and loss because
Son, so the signal for the three-layer transmission wiring board that the production method of the three-layer transmission wiring board provided through the invention makes transmits
Line has lower loss, the three-layer transmission wiring board made using the production method of three-layer transmission wiring board provided by the invention
Signal transmssion line the more traditional three-layer transmission wiring board of loss signal transmssion line loss low 30%~50%.
Example IV
Based on identical inventive concept, the present invention also provides a kind of three-layer transmission wiring board, referring to shown in Fig. 9, Fig. 9 is
The schematic diagram of three-layer transmission wiring board, the present invention provides a kind of three-layer transmission wiring boards 2, including third single-side coated copper plate 21；
The copper foil layer of 4th single-side coated copper plate 22, the 4th single-side coated copper plate 22 is etched with the second surface line；5th single-side coated copper plate 23；
First adhesive layer 24, the first adhesive layer 24 have first to remove photoresist region 241, first remove photoresist region 241 binder thickness it is small
In first remove photoresist 241 side of region binder thickness；Second adhesive layer 25, the second adhesive layer 25 have second to remove photoresist region
251, second remove photoresist region 251 binder thickness remove photoresist less than second 251 side of region binder thickness；Wherein,
Third single-side coated copper plate 21, the 4th single-side coated copper plate 22 and the 5th single-side coated copper plate 23 successively fold structure, third single-side coated copper plate
21 layings opposite with the flexible parent metal side of the 4th single-side coated copper plate 24, the 5th single-side coated copper plate 23 fold structure in the second surface line
Upside, and the super outside of copper foil layer of the 5th single-side coated copper plate 23 is placed, the first adhesive layer 24 be sandwiched in third single-side coated copper plate 21 with
Between 4th single-side coated copper plate 22, the second adhesive layer 25 is sandwiched between the 4th single-side coated copper plate 22 and the 5th single-side coated copper plate 23,
The second signal transmission line 211 of second surface line with first remove photoresist region 241 and second remove photoresist region 251 position it is right
It answers；
Third single-side coated copper plate 21, the 4th single-side coated copper plate 22 and 23 thickness of the 5th single-side coated copper plate are identical, and first is viscous
The thickness for tying layer 24 and the second adhesive layer 25 is identical, the thickness ratio of third single-side coated copper plate 21 and the first adhesive layer 24 for 1~
1:5, in the present embodiment, the thickness of third single-side coated copper plate 21 and the first adhesive layer 24 is than being preferably 1:3.
Embodiment five
Based on identical inventive concept, the present invention also provides a kind of production method of multilayer transmission wiring board, such as Figure 10
Shown, Figure 10 is a kind of flow chart of the production method of multilayer transmission wiring board, if including the following steps:, acquisition dry plate preparation is more
If on the outside of the layer intermediate single-side coated copper plate 32 of transmission line plate, a piece of transmission single-side coated copper plate 31, two panels single-side coated copper plate 33 and
Dry plate prepares the adhesive layer 12 of multilayer transmission wiring board, and adhesive layer 12 has region 121 of removing photoresist, the binder in region 121 of removing photoresist
Thickness be less than remove photoresist 121 side of region binder thickness；A piece of adhesive layer 12 is sandwiched in a piece of intermediate single-side coated copper plate
Folded structure, and intermediate single-side coated copper plate 32 and the copper foil layer for transmitting single-side coated copper plate 31 are carried out between 32 and transmission single-side coated copper plate 31
It places outwardly side；Adhesive layer 12, intermediate single-side coated copper plate 32 and transmission single-side coated copper plate 31 after folded structure is pressed,
Obtain double-layer overlapped structure structure；It is etched the copper foil layer for transmitting single-side coated copper plate 31 to obtain intermediate surface route 311；It will be intermediate
The copper foil layer of single-side coated copper plate 32 is etched to obtain copper region 321, goes the copper thickness in copper region 321 to be less than and goes to copper region
The copper thickness of 321 sides；If remaining dry plate is had the intermediate single-side coated copper plate 32 for going to copper region 321 successively fold structure in double
The one or both sides of structure structure are laminated, adhesive layer 12 is sandwiched between intermediate single-side coated copper plate 32, the signal of intermediate surface route 311
Transmission line 3111 region 121 and goes to the position in copper region 321 corresponding with removing photoresist, and obtains intermediate multi-laminate structure structure；In centre
Structure adhesive layer 12 and outside single-side coated copper plate 33 are successively folded in two outsides of multi-laminate structure structure again, and outside single-side coated copper plate 33
Copper foil layer is placed towards outside, obtains multi-laminate structure structure；It is pressed multi-laminate structure structure to obtain multilayer transmission wiring board.It is excellent
The thickness ratio of selection of land, intermediate single-side coated copper plate 32 and adhesive layer 12 is 1~1:5；Preferably, intermediate single-side coated copper plate 32 and bonding
The thickness ratio of layer 12 is 1:3.
Referring to shown in 11a to Figure 11 g and Figure 12 a to Figure 12 g, in the present embodiment, provides two kinds of specific multilayers and pass
The folded structure method of defeated wiring board, Figure 11 a to Figure 11 g are a kind of schematic diagram of the production method of four layers of transmission line plate, and Figure 12 a is extremely
Figure 12 g is a kind of schematic diagram of the production method of five layers of transmission line plate.
Embodiment six
Based on identical inventive concept, if including: list among dry plate the present invention also provides a kind of multilayer transmission wiring board
Face copper-clad plate 32, intermediate single-side coated copper plate 32, which has, goes to copper region 321, goes the copper thickness in copper region 321 to be less than and goes to copper region
The copper thickness of 321 sides；The copper foil layer of a piece of transmission single-side coated copper plate 31, transmission single-side coated copper plate 31 has middle table layer line
Road 311；Single-side coated copper plate 33 on the outside of two panels；Adhesive layer 12, adhesive layer 12 have region 121 of removing photoresist, the bonding in region 121 of removing photoresist
The thickness of agent is less than the thickness of the binder for 121 side of region of removing photoresist；If single-side coated copper plate 32, a piece of transmission among dry plate is single
Single side covers 33 plate of copper successively folded structure on the outside of face copper-clad plate 31 and two panels, and outside single side covers copper 33 and is located at multilayer transmission wiring board
Two outsides, and the copper foil layer of outside single-side coated copper plate 33 is placed towards outside, and between intermediate single-side coated copper plate 32, intermediate single side covers
Between copper sheet 32 and transmission single-side coated copper plate 31 and intermediate single-side coated copper plate 32 or transmission single-side coated copper plate 31 and outside single side
It covers and accompanies one layer of adhesive layer 12 between copper 33, the signal transmssion line 3111 of intermediate surface route 311 region 121 and is gone with removing photoresist
The position in copper region 321 is corresponding.Preferably, the consistency of thickness of intermediate single-side coated copper plate 32 and transmission single-side coated copper plate 31, in
Between the thickness ratio of single-side coated copper plate 32 and adhesive layer 12 be 1~1:5, it is preferable that intermediate single-side coated copper plate 32 and adhesive layer 12
Thickness ratio is 1:3.
In the present embodiment, two kinds of specific multilayer transmission wiring boards are provided, referring to shown in Figure 13 and Figure 14, Tu13Wei
The schematic diagram of four layers of transmission line plate, Figure 14 are the schematic diagram of five layers of transmission line plate.
Embodiment seven
Based on identical inventive concept, the present invention also provides a kind of flexible circuit boards, including double described in embodiment two
Multilayer transmission wiring board described in three-layer transmission wiring board described in layer transmission line plate or example IV or embodiment six.
Embodiments of the present invention are explained in detail above in conjunction with attached drawing, but the present invention is not limited to above-mentioned implementations
Mode.Even if to the present invention, various changes can be made, if these variations belong to the model of the claims in the present invention and its equivalent technologies
Within enclosing, then still fall within the protection scope of the present invention.
Claims (20)
1. a kind of production method of bilayer transmission line plate, which comprises the steps of:
Two panels is obtained to prepare the single-side coated copper plate of the double-deck transmission line plate and a piece of prepare the bilayer transmission line plate
Adhesive layer, the adhesive layer, which has, to remove photoresist region, and the thickness of the binder in the region of removing photoresist is less than described remove photoresist region week
The thickness of the binder of side；
The adhesive layer is sandwiched between single-side coated copper plate described in two panels and carries out folded structure, and the copper foil layer one of the single-side coated copper plate
It places outwardly side；
By after folded structure the single-side coated copper plate and the adhesive layer press, obtain double-layer overlapped structure structure；
It is etched the copper foil layer in one outside of double-layer overlapped structure structure to obtain the first surface line, first surface layer
First signal transmssion line of route is corresponding with the regional location that removes photoresist, and obtains the double-deck transmission line plate.
2. the production method of bilayer transmission line plate according to claim 1, which is characterized in that acquisition prepares the bilayer
The adhesive layer of transmission line plate further comprises:
The a piece of and consistent initial adhesion layer of the single-side coated copper plate area is provided；
The initial adhesion layer is subjected to local processing of removing photoresist and obtains the adhesive layer.
3. the production method of bilayer transmission line plate according to claim 1, which is characterized in that the single-side coated copper plate with
The thickness ratio of the adhesive layer is 1~1:5.
4. the production method of bilayer transmission line plate according to claim 3, which is characterized in that the single-side coated copper plate with
The thickness ratio of the adhesive layer is 1:3.
5. a kind of bilayer transmission line plate characterized by comprising
The copper foil layer of first single-side coated copper plate, first single-side coated copper plate is etched with the first surface line；
Second single-side coated copper plate；
Adhesive layer, the adhesive layer have region of removing photoresist, and the thickness of the binder in the region of removing photoresist is less than the region of removing photoresist
The thickness of the binder of side；
First single-side coated copper plate is opposite with the flexible parent metal side of second single-side coated copper plate to be laid, the adhesive layer folder
Between first single-side coated copper plate and second single-side coated copper plate, the first signal transmssion line of first surface line
It is corresponding with the regional location that removes photoresist.
6. bilayer transmission line plate according to claim 5, which is characterized in that first single-side coated copper plate and described the
The thickness of two single-side coated copper plates is identical, and the thickness ratio of first single-side coated copper plate and the adhesive layer is 1~1:5.
7. bilayer transmission line plate according to claim 6, which is characterized in that first single-side coated copper plate is glued with described
The thickness ratio for tying layer is 1:3.
8. a kind of production method of three-layer transmission wiring board, which comprises the steps of:
Obtain prepare the third single-side coated copper plate of the three-layer transmission wiring board, the 4th single-side coated copper plate, the 5th single-side coated copper plate,
First adhesive layer and the second adhesive layer, first adhesive layer have first to remove photoresist region, and described first removes photoresist the viscous of region
The thickness of knot agent be less than described first remove photoresist region side binder thickness, second adhesive layer has second to remove photoresist area
Domain, described second remove photoresist region binder thickness be less than described second remove photoresist region side binder thickness；
First adhesive layer is sandwiched between the third single-side coated copper plate and the 4th single-side coated copper plate and carries out folded structure, and
The copper foil layer side of the third single-side coated copper plate and the 4th single-side coated copper plate is placed outwardly；
The third single-side coated copper plate, first adhesive layer and the 4th single-side coated copper plate after folded structure is pressed,
Obtain double-layer overlapped structure structure；
It is etched the copper foil layer in one outside of double-layer overlapped structure structure to obtain the second surface line；
Successively fold the second adhesive layer and the 5th single-side coated copper plate described in structure again in second surface line, and described
The copper foil layer side of 5th single-side coated copper plate is placed outwardly, the second signal transmission line of second surface line with it is described
First remove photoresist region and second remove photoresist region position it is corresponding, obtain three stacking structure structures；
It is pressed the three stackings structure structure to obtain the three-layer transmission wiring board.
9. the production method of bilayer transmission line plate according to claim 8, which is characterized in that the third single side covers copper
Plate, the 4th single-side coated copper plate and the 5th single-side coated copper plate thickness are identical, first adhesive layer and described
The thickness of two adhesive layers is identical, and the thickness ratio of the third single-side coated copper plate and first adhesive layer is 1~1:5.
10. the production method of bilayer transmission line plate according to claim 9, which is characterized in that the third single side covers
The thickness ratio of copper sheet and first adhesive layer is 1:3.
11. a kind of three-layer transmission wiring board characterized by comprising
Third single-side coated copper plate；
The copper foil layer of 4th single-side coated copper plate, the 4th single-side coated copper plate is etched with the second surface line；
5th single-side coated copper plate；
First adhesive layer, first adhesive layer have first to remove photoresist region, described first remove photoresist region binder thickness
Remove photoresist less than described first region side binder thickness；
Second adhesive layer, second adhesive layer have second to remove photoresist region, described second remove photoresist region binder thickness
Remove photoresist less than described second region side binder thickness；
Wherein, the third single-side coated copper plate, the 4th single-side coated copper plate and the 5th single-side coated copper plate successively fold structure, described
Third single-side coated copper plate is opposite with the flexible parent metal side of the 4th single-side coated copper plate to be laid, and the 5th single-side coated copper plate is folded
Structure is on the upside of second surface line, and the super outside of copper foil layer of the 5th single-side coated copper plate is placed, first bonding
Layer is sandwiched between the third single-side coated copper plate and the 4th single-side coated copper plate, and it is single that second adhesive layer is sandwiched in the described 4th
Between face copper-clad plate and the 5th single-side coated copper plate, the second signal transmission line of second surface line is gone with described first
Glue region and second remove photoresist region position it is corresponding.
12. the production method of three-layer transmission wiring board according to claim 11, which is characterized in that the third single side covers
Copper sheet, the 4th single-side coated copper plate and the 5th single-side coated copper plate thickness are identical, first adhesive layer and described
The thickness of second adhesive layer is identical, and the thickness ratio of the third single-side coated copper plate and first adhesive layer is 1~1:5.
13. the production method of three-layer transmission wiring board according to claim 12, which is characterized in that the third single side covers
The thickness ratio of copper sheet and first adhesive layer is 1:3.
14. a kind of production method of multilayer transmission wiring board, which comprises the steps of:
If obtaining dry plate prepares the intermediate single-side coated copper plate of the multilayer transmission wiring board, a piece of transmission single-side coated copper plate, two panels
If outside single-side coated copper plate and dry plate prepare the adhesive layer of the multilayer transmission wiring board, the adhesive layer has region of removing photoresist,
The thickness of the binder in the region of removing photoresist is less than the thickness of the binder of the region side of removing photoresist；
The a piece of adhesive layer is sandwiched between a piece of intermediate single-side coated copper plate and the transmission single-side coated copper plate and is folded
Structure, and the copper foil layer side of the intermediate single-side coated copper plate and the transmission single-side coated copper plate is placed outwardly；
The adhesive layer, the intermediate single-side coated copper plate and the transmission single-side coated copper plate after folded structure is pressed, is obtained
Double-layer overlapped structure structure；
It is etched the copper foil layer of the transmission single-side coated copper plate to obtain intermediate surface route；
The copper foil layer of the intermediate single-side coated copper plate is etched to obtain copper region, the copper foil for going to copper region is thick
Degree is less than the copper thickness for going to copper region side；
If remaining dry plate is had the intermediate single-side coated copper plate for going to copper region successively fold structure in the double-layer overlapped structure structure
One or both sides, the adhesive layer is sandwiched between the intermediate single-side coated copper plate, the signal transmission of the intermediate surface route
Line with it is described remove photoresist region and the position for going to copper region it is corresponding, obtain intermediate multi-laminate structure structure；
Adhesive layer described in structure and the outside single-side coated copper plate are successively folded again in two outsides of the intermediate multi-laminate structure structure, and
The copper foil layer of the outside single-side coated copper plate is placed towards outside, obtains multi-laminate structure structure；
The multi-laminate structure structure is pressed to obtain the multilayer transmission wiring board.
15. the production method of multilayer transmission wiring board according to claim 14, which is characterized in that the intermediate single side covers
The thickness ratio of copper sheet and the adhesive layer is 1~1:5.
16. the production method of multilayer transmission wiring board according to claim 15, which is characterized in that the intermediate single side covers
The thickness ratio of copper sheet and the adhesive layer is 1:3.
17. a kind of multilayer transmission wiring board characterized by comprising
If single-side coated copper plate among dry plate, the intermediate single-side coated copper plate, which has, goes to copper region, and the copper foil for going to copper region is thick
Degree is less than the copper thickness for going to copper region side；
The copper foil layer of a piece of transmission single-side coated copper plate, the transmission single-side coated copper plate has intermediate surface route；
Single-side coated copper plate on the outside of two panels；
Adhesive layer, the adhesive layer have region of removing photoresist, and the thickness of the binder in the region of removing photoresist is less than the region of removing photoresist
The thickness of the binder of side；
If outside single side described in intermediate single-side coated copper plate, a piece of transmission single-side coated copper plate and two panels described in dry plate is covered copper
Plate successively folds structure, and the outside single side covers two outsides that copper is located at the multilayer transmission wiring board, and the outside single side covers
The copper foil layer of copper sheet is placed towards outside, between the intermediate single-side coated copper plate, the intermediate single-side coated copper plate and the biography
Between defeated single-side coated copper plate and the intermediate single-side coated copper plate or the transmission single-side coated copper plate and the outside single side cover copper
Between accompany one layer of adhesive layer, the signal transmssion line of the intermediate surface route and described remove photoresist and described go to copper region at region
Position it is corresponding.
18. multilayer transmission wiring board according to claim 17, which is characterized in that the intermediate single-side coated copper plate with it is described
The thickness ratio of the consistency of thickness of transmission single-side coated copper plate, the intermediate single-side coated copper plate and the adhesive layer is 1~1:5.
19. multilayer transmission wiring board according to claim 18, which is characterized in that the intermediate single-side coated copper plate with it is described
The thickness ratio of adhesive layer is 1:3.
20. a kind of flexible circuit board, which is characterized in that including the described in any item double-deck transmission line plates of claim 5 to 7 or
The described in any item three-layer transmission wiring boards of person's claim 11 to 13 or the described in any item multilayers of claim 17 to 19
Transmission line plate.
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| CN201910469834.XA CN110139490A (en) | 2019-05-31 | 2019-05-31 | A kind of production method and transmission line plate of transmission line plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113825296A (en) * | 2020-06-19 | 2021-12-21 | 庆鼎精密电子（淮安）有限公司 | High-frequency signal transmission structure and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0758429A (en) * | 1993-08-20 | 1995-03-03 | Matsushita Electric Works Ltd | Method of manufacturing printed wiring board |
| CN102143647A (en) * | 2010-11-25 | 2011-08-03 | 聚信科技有限公司 | Circuit board and manufacturing method thereof |
| CN107666764A (en) * | 2016-07-27 | 2018-02-06 | 鹏鼎控股(深圳)股份有限公司 | Flexible PCB and preparation method thereof |
-
2019
- 2019-05-31 CN CN201910469834.XA patent/CN110139490A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0758429A (en) * | 1993-08-20 | 1995-03-03 | Matsushita Electric Works Ltd | Method of manufacturing printed wiring board |
| CN102143647A (en) * | 2010-11-25 | 2011-08-03 | 聚信科技有限公司 | Circuit board and manufacturing method thereof |
| CN107666764A (en) * | 2016-07-27 | 2018-02-06 | 鹏鼎控股(深圳)股份有限公司 | Flexible PCB and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113825296A (en) * | 2020-06-19 | 2021-12-21 | 庆鼎精密电子（淮安）有限公司 | High-frequency signal transmission structure and manufacturing method thereof |
| CN113825296B (en) * | 2020-06-19 | 2023-07-21 | 庆鼎精密电子（淮安）有限公司 | High-frequency signal transmission structure and manufacturing method thereof |
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