CN104244570A - Rigid and flexible circuit board and manufacturing method thereof - Google Patents
Rigid and flexible circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN104244570A CN104244570A CN201410003683.6A CN201410003683A CN104244570A CN 104244570 A CN104244570 A CN 104244570A CN 201410003683 A CN201410003683 A CN 201410003683A CN 104244570 A CN104244570 A CN 104244570A
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- China
- Prior art keywords
- cover layer
- rigid
- bottom substrate
- circuit board
- layer
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a rigid and flexible circuit board and a manufacturing method thereof. The circuit board is formed through lamination of at least two or more bottom substrates with circuit layers on two surfaces. The rigid and flexible circuit board comprises a rigid region where rigid insulation layers are laminated on two surfaces of the bottom substrate respectively and a flexible region where coating layers are laminated on the sections where insulation layers are not laminated on two surfaces of the bottom substrate respectively. Surface roughness is formed on one surface of the coating layers laminated to contact each other in the coating layers.
Description
The cross reference of related application
To be advocated by the mode quoted as proof and in conjunction with following domestic priority application and foreign priority application:
" the cross reference of related application
This application claims the rights and interests of the korean patent application No.10-2013-0071604 in name submission on June 21st, 2013, by the mode quoted as proof, its full content is attached in the application at this.”
Technical field
The present invention relates to a kind of rigid flexible printed circuit board (rigid flexible printed circuit board) and manufacture method thereof, and more particularly, relate to rigid flexible printed circuit board and the manufacture method thereof that a kind of wherein bottom substrate is laminated to multilayer.
Background technology
Usually, printed circuit board (PCB) (PCB) plays to be electrically connected predetermined electronic component or insulating barrier that the circuit board and comprising of mechanical fixation is made up of the insulating material of such as phenolic resins or epoxy resin and be bonded to insulating barrier to form the copper foil layer of prescribed route pattern thereon.
Here, PCB can be divided into three types: one-sided PCB, and wherein wiring pattern is only formed on a surface of insulating barrier; Bilateral PCB, wherein wiring pattern is formed on two surfaces of insulating barrier; And multi-layer PCB, multiple insulating barriers wherein it with wiring pattern are pressed layer to form wiring pattern in multiple layer.
Recently, due to the microminiaturization of electronic product, reduced thickness and high density, as multilayer board, particularly there is the focus that flexible rigid flexible printed circuit board (RFPCB) has become PCB market, to the interest in this market also in increase.
This RFPCB is a kind of by the technology of existing multi-layer PCB technology and flexible PCB combine with technique, and be widely used in the device (such as notebook, digital camera, video camera and mobile communication terminal) requiring high-density circuit to design, this is because it realizes three dimensional wiring and can easily assemble.The problem that multi-layer PCB or flexible PCB have space due to the use of independent connector, connection reliability and element are installed, and RFPCB can overcome these problems and the function of execution unit mounting panel and the function of interface (interface) simultaneously.
Here, RFPCB comprises flexible region (wherein circuit pattern is formed in and has on flexible polyester or polyimide flex film) and rigid region (wherein insulating barrier is pressed layer on the flexible film to increase physical hardness).
This RFPCB is that double side flexible copper clad layers casting die (having the Copper Foil be positioned on two surfaces) is upper to be manufactured by being optionally laminated to by rigid insulation layers, there are the rigid substrate portions of rigid insulation layers and non-lamination to have the substrate portion of rigid insulation layers to form lamination, and form circuit pattern on flexible membrane and rigid insulation layers.
But, conventional RFPCB is by repeating to apply cover layer after form circuit pattern on two surfaces of flexible copper-clad laminate and the process of lamination insulating barrier and lamination one surface having the one-sided flexible copper-clad laminate of Copper Foil and the process forming circuit pattern manufactures, but owing to repeating lamination process and circuit pattern forming process, thus there is excessive lamination load and added go into operation time (lead time) and manufacturing cost.
[prior art document]
[patent documentation]
Patent documentation 1: the open No.2010-0079336 of Korean Patent Laid
Patent documentation 2: the open No.2011-0045991 of Korean Patent Laid
Summary of the invention
Design the present invention to overcome the problems referred to above, and therefore the object of this invention is to provide and a kind ofly reduce lamination load, simplify manufacture process and reduce the rigid flexible printed circuit board of manufacturing cost.
In addition, another object of the present invention prevents from being laminated to the adhesion between the tectal surface that contacts with each other.
At least two or more bottom substrates that two has circuit layer on the surface by lamination of rigid flexible printed circuit board according to first embodiment of the invention in order to realize described object manufacture, and comprise wherein respectively on two surfaces of bottom substrate lamination have the rigid region of rigid insulation layers and wherein to have in the part of rigid insulation layers lamination respectively have tectal flexible region at two of bottom substrate surperficial non-laminations, the tectal surface that being laminated to wherein in cover layer contacts with each other forms surface roughness.
Here, the cover layer that being laminated in cover layer contacts with each other can comprise inorganic filler.
Rigid flexible printed circuit board second embodiment of the invention also can comprise the matte layer be arranged between cover layer that being laminated in cover layer contact with each other.
Here, matte layer can be formed as the shape of film.
At this moment, matte layer can comprise inorganic filler.
Method in order to the manufacture according to first embodiment of the invention rigid flexible printed circuit board realizing described object comprises the following steps: prepare at least two or more bottom substrates that two has circuit layer on the surface; Cover cap rock on the flexible region upper strata of bottom substrate and on rigid region lamination insulating barrier; Lamination bottom substrate; And the bottom substrate after compacting lamination.
Here, manufacture the method for rigid flexible printed circuit board can be included in compacting lamination after bottom substrate step after bottom substrate after laminating outermost rigid insulation layers on form the step of external circuit layer.
At this moment, the tectal surface that contacts with each other of being laminated in cover layer can form surface roughness.
In addition, this cover layer that being laminated in cover layer contacts with each other can comprise inorganic filler.
The method manufacturing rigid flexible printed circuit board second embodiment of the invention inserts the step of matte layer between the cover layer that contacts with each other of being laminated in cover layer after also can being included in the step preparing bottom substrate.
Here, matte layer can comprise inorganic filler.
Accompanying drawing explanation
By the description carried out execution mode below in conjunction with accompanying drawing, these and/or other aspect of present general inventive concept of the present invention and advantage will become apparent and be easier to understanding, in accompanying drawing:
Fig. 1 and Fig. 2 shows the sectional view of rigid flexible printed circuit board according to first embodiment of the invention;
Fig. 3 A and Fig. 3 B shows the picture on tectal surface according to first embodiment of the invention;
Fig. 4 shows the sectional view of rigid flexible printed circuit board second embodiment of the invention; And
Fig. 5 A to Fig. 5 E shows the sectional view of the method for manufacture rigid flexible printed circuit board according to first embodiment of the invention.
embodiment
Hereinafter, the specific embodiment of the present invention will be described with reference to the drawings.Following execution mode only illustrates the present invention, and the invention is not restricted to following execution mode.
When describing of the present invention, omit the specific descriptions of well-known technology, embodiments of the present invention can be made necessarily to become hard to understand.Term is hereafter considered function of the present invention to limit, and can change according to the intention of user or operator or custom.Therefore, these terms should limit based on the content running through the description of this specification.
Technical spirit of the present invention should be defined by the following claims, and following execution mode provides effectively pass on technical spirit of the present invention to those skilled in the art by way of example.
Fig. 1 and Fig. 2 shows the sectional view of rigid flexible printed circuit board according to first embodiment of the invention.
As shown in fig. 1, according to first embodiment of the invention rigid flexible printed circuit board is made up of rigid region R and flexible region F, and the external circuit layer 140 on the outside of the bottom substrate 110,120 and 130 comprising two or more laminations and the bottom substrate 110,120 and 130 being formed at lamination, described bottom substrate has circuit layer 112,122 and 132 on the surface respectively at two.
At this moment, can be made up of eight layers according to rigid flexible printed circuit board of the present invention, these layers, by lamination, it have the first circuit layer 112, second circuit layer 122 and tertiary circuit layer 132 respectively, the first bottom substrate 110, second bottom substrate 120 and the 3rd bottom substrate 130 and two external circuit layers 140 formed.
Here, rigid region R and flexible region F is not distinguished from each other significantly, but the region of design arbitrarily in the mill.
At this moment, as for the difference between rigid region R and flexible region F, rigid region R can be the region that the first rigid insulation layers 113, second rigid insulation layers 123 and the 3rd rigid insulation layers 133 are laminated, and flexible region F can be the region that the first cover layer 114, second cover layer 124 and the 3rd cover layer 134 are laminated.
First bottom substrate 110, second bottom substrate 120 and the 3rd bottom substrate 130 can be by forming copper foil layer and the flexible copper-clad laminate formed respectively on two surfaces of the first flexible membrane 111, second flexible membrane 121 and the 3rd flexible membrane 131.
Here, the first flexible membrane 111, second flexible membrane 121 and the 3rd flexible membrane 131 can be made by having flexible resin material.Such as, polyimide resin material (such as polyimide resin, polyetherimide resin and polyamideimide resin), polyamide resin material or alkyd resin can be used.Especially, preferably polyimide resin material is used.In addition, the copper foil layer be formed on two surfaces of flexible membrane carrys out patterning, to form the first circuit layer 112, second circuit layer 122 and tertiary circuit layer 132 by exposure, development and etching process.
Lamination first cover layer 114, second cover layer 124 and the 3rd cover layer 134 form the first bottom substrate 110, second bottom substrate 120 and the 3rd bottom substrate 130, to protect the first circuit layer 112, second circuit layer 122 and the tertiary circuit layer 132 on two surfaces laying respectively at the first flexible membrane 111, second flexible membrane 121 and the 3rd flexible membrane 131 by lamination first rigid insulation layers 113, second rigid insulation layers 123 in rigid region R and the 3rd rigid insulation layers 133 and in flexible region F.Here, the first cover layer 114, second cover layer 124 and the 3rd cover layer 134 can be made up of polyimides.
Meanwhile, because the first bottom substrate 110, second bottom substrate 120 and the 3rd bottom substrate 130 are laminated, thus there is contact portion between the first cover layer 114, second cover layer 124 and the 3rd cover layer 134.
Here, the contact surface between the first cover layer 114, second cover layer 124 and the 3rd cover layer 134 can form surface roughness, to prevent the adhesion between the first cover layer 114, second cover layer 124 and the 3rd cover layer 134.At this moment, the first cover layer 114, second cover layer 124 and the 3rd cover layer 134 with surface roughness can comprise inorganic filler.Because inorganic filler is gathered on the surface, thus the contact surface between the first cover layer 114, second cover layer 124 and the 3rd cover layer 134 can form surface roughness.
At this moment, inorganic filler can be carbon, and the amount comprised is 9.87% to form suitable surface roughness.
Especially, inorganic filler is preferably incorporated in the only layer in the first cover layer 114, second cover layer 124 and the 3rd cover layer 134 contacted with each other, to reduce go into operation time and manufacturing cost.Here, only to be included in the second cover layer 124 of the second bottom substrate 120 due to inorganic filler and then on the top surface contacted with the 3rd cover layer 134 with the first cover layer 114 and basal surface of the second cover layer 124, to form surface roughness, thus can prevent the adhesion between the first cover layer 114, second cover layer 124 and the 3rd cover layer 134.
In addition, as shown in Figure 2, inorganic filler only can comprise the first cover layer 114 on the basal surface of the first flexible membrane 111 being formed in the first bottom substrate 110 and be formed in the 3rd bottom substrate 130 the 3rd flexible membrane 131 top surface the 3rd cover layer 134 in.Also be, because inorganic filler only to comprise in the first cover layer 114 be formed on the basal surface contacted with the second cover layer 124 of the second bottom substrate 120 of the first flexible membrane 111 and the 3rd cover layer 134 be formed on the top surface of the 3rd flexible membranes 131 to form surface roughness, the adhesion between the first cover layer 114, second cover layer 124 and the 3rd cover layer 134 thus can be prevented.
Simultaneously, as illustrated in figures 3 a and 3b, on the surface that carbon can be gathered in cover layer 124 or be gathered in be formed at the first flexible membrane 111 basal surface on the first cover layer 114 surface on and be formed at the 3rd cover layer 134 on the top surface of the 3rd flexible membrane 131 surface on to form surface roughness, and the carbon be preferably gathered on surface has and is of a size of 150nm to 500nm effectively to prevent the adhesion between the first cover layer 114, second cover layer 124 and the 3rd cover layer 134.
Also be, be included in cover layer 124 due to inorganic filler or be included in be formed at the first flexible membrane 111 basal surface on the first cover layer 114 and in being formed on the top surface of the 3rd flexible membrane 131 the 3rd cover layer 134 to form rough surface from the teeth outwards, thus can form air gap between the first cover layer 114, second cover layer 124 contacted with each other and the 3rd cover layer 134.
Therefore, in the prior art, because the first cover layer 114, second cover layer 124 and the 3rd cover layer 134 are adhering to each other, thus when flexible region F bends, flexible region F can be damaged, but in the present invention, when flexible region F bends by prevent between the first cover layer 114, second cover layer 124 and the 3rd cover layer 134 adhere to and between the first cover layer 114, second cover layer 124 and the 3rd cover layer 134, form air gap to prevent damage.
Meanwhile, external circuit layer 140 can be formed on the outside of the first bottom substrate 110, second bottom substrate 120 and the 3rd bottom substrate 130.
Here, external circuit layer 140 can be formed on the bottom of the top of the rigid insulation layers 113 of the first bottom substrate 110 and the rigid insulation layers 133 of the 3rd bottom substrate 130.At this moment, copper foil layer be formed at the top of the rigid insulation layers 113 of the first bottom substrate 110 and the rigid insulation layers 133 of the 3rd bottom substrate 130 by the mode of casting, lamination or sputtering bottom on and patterning to form external circuit layer 140.In addition, via hole (via) can be formed to be electrically connected the circuit layer 112 of external circuit layer 140 and the first bottom substrate 110 or to be electrically connected the circuit layer 132 of external circuit layer 140 and the 3rd bottom substrate 130.
Fig. 4 shows the sectional view of rigid flexible printed circuit board second embodiment of the invention.
As shown in Figure 4, rigid region R and flexible region F is comprised according to the rigid flexible printed circuit board of second embodiment of the invention, and by the first bottom substrate 110, second bottom substrate 120, with the 3rd bottom substrate 130, and the external circuit layer 140 be formed on outside the first bottom substrate 110 and the 3rd bottom substrate 130 forms, first bottom substrate, second bottom substrate, with the 3rd bottom substrate, there is the first circuit layer 112 laid respectively on two surfaces, second circuit layer 122, with tertiary circuit layer 132, first cover layer 114, second cover layer 124, with the 3rd cover layer 134, and first rigid insulation layers 113, second rigid insulation layers 123, with the 3rd rigid insulation layers 133.
Miscellaneous part is identical with the parts of the rigid flexible printed circuit board according to the first execution mode described above.Hereinafter, the parts different from the parts of the rigid flexible printed circuit board according to the first execution mode will only be described in detail.
The matte layer 150 between the first cover layer 114, second cover layer 124 and the 3rd cover layer 134 is also comprised according to the rigid flexible printed circuit board of second embodiment of the invention.
Here, matte layer 150 can comprise inorganic filler.Because inorganic filler is gathered on the surface of matte layer, thus on the surface of matte layer 150, form surface roughness.
In addition, matte layer 150 can be formed as the shape of film, effectively to perform manufacture process.
Also be, matte layer 150 is between the cover layer 114 and the cover layer 124 of the second bottom substrate 120 of the first bottom substrate 110 and between the cover layer 124 of the second bottom substrate 120 and the cover layer 134 of the 3rd bottom substrate 130, can be laminated to contact with each other form air gap between the first cover layer 114, second cover layer 124 and the 3rd cover layer 134, and the damage that causes due to the adhesion between the first cover layer 114, second cover layer 124 and the 3rd cover layer 134 when flexible region F bends can be prevented.
Fig. 5 a to Fig. 5 e shows the sectional view of the method for manufacture rigid flexible printed circuit board according to first embodiment of the invention.
As illustrated in fig. 5 a, according in the rigid flexible printed circuit board of first embodiment of the invention, be prepared at least two or more bottom substrates 110,120 and 130 that two has the first circuit layer 112, second circuit layer 122 and tertiary circuit layer 132 on the surface.
Here, bottom substrate 110,120 and 130 can be divided into the first bottom substrate 110, second bottom substrate 120 and the 3rd bottom substrate 130.
First, two surfaces being prepared in the first flexible membrane 111, second flexible membrane 121 and the 3rd flexible membrane 131 have the flexible copper-clad laminate of copper foil layer, and the copper foil layer be formed on two surfaces of the first flexible membrane 111, second flexible membrane 121 and the 3rd flexible membrane 131 by exposure, development etching technics patterning to form the first circuit layer 112, second circuit layer 122 and tertiary circuit layer 132.
Then; as illustrated in fig. 5b; lamination first cover layer 114, second cover layer 124 and the 3rd cover layer 134 manufacture the first bottom substrate 110, second bottom substrate 120 and the 3rd bottom substrate 130, to protect the first circuit layer 112, second circuit layer 122 and the tertiary circuit layer 132 on two surfaces being formed in corresponding first flexible membrane 111, second flexible membrane 121 and the 3rd flexible membrane 131 by lamination first rigid insulation layers 113, second rigid insulation layers 123 in rigid region R and the 3rd rigid insulation layers 133 and in flexible region.
At this moment, the second bottom substrate 120 is laminated between the first bottom substrate 110 and the 3rd bottom substrate 130 in subsequent technique, is subject to the first cover layer 114, second cover layer 124 and the 3rd cover layer 134 contacts with each other.
Therefore, in order to prevent the adhesion between the first cover layer 114, second cover layer 124 and the 3rd cover layer 134, the cover layer 124 of the second bottom substrate 120 can flood with inorganic filler.Because inorganic filler is gathered on the surface to form surface roughness on the surface of the cover layer 124 of the second bottom substrate 120, the adhesion between the first cover layer 114, second cover layer 124 and the 3rd cover layer 134 thus can be prevented.
Then, as shown in Figure 5 c, the first bottom substrate 110, second bottom substrate 120 and the 3rd bottom substrate 130 are laminated.
Then, as illustrated in figure 5d, the first bottom substrate 110, second bottom substrate 120 of lamination and the 3rd bottom substrate 130 are pressed.
After this, as shown in fig. 5e, external circuit layer 140 is formed on the top of the first bottom substrate 110 and the bottom of the 3rd bottom substrate 130.
Here, by the bottom of the top of the first rigid insulation layers 113 at the first bottom substrate 110 and the 3rd rigid insulation layers 133 of the 3rd bottom substrate 130 forming copper foil layer by casting, lamination, sputtering etc. and making this copper foil layer patterning form external circuit layer 140.
In addition, via hole can be formed to be electrically connected the first circuit layer 112 of external circuit layer 140 and the first bottom substrate 110 or to be electrically connected the tertiary circuit layer 132 of external circuit layer 140 and the 3rd bottom substrate 130.
Also be, according in the rigid flexible printed circuit board of first embodiment of the invention, by lamination, two has the first bottom substrate 110, second bottom substrate 120 of circuit layer 112,122 and 132 and the 3rd bottom substrate 130 on the surface and only once suppresses the bottom substrate of lamination and manufactures rigid flexible printed circuit board, can reduce in prior art due to lamination load that lamination repeatedly causes.In addition, reduce by simplifying manufacture process go into operation time and manufacturing cost.
As mentioned above, simplify manufacture method according to the rigid flexible printed circuit board of embodiment of the present invention and manufacture method thereof the bottom substrate that two has circuit layer on the surface by lamination, thus reduce go into operation time and manufacturing cost.
In addition, by inorganic filler being included in form surface roughness to prevent the adhesion between the cover layer that is laminated to and contacts with each other in cover surface in the cover layer that is laminated in the flexible region of rigid flexible printed circuit board, thus prevent the damage when rigid flexible printed circuit board bends to flexible region.
Although describe in detail the present invention with reference to preferred implementation, those skilled in the art are it is to be appreciated that can carry out various amendment to these execution modes in the case without departing from the scope of the present invention.
Therefore, scope of the present invention should not be limited to described execution mode, but is limited by claims and equivalent thereof.
Claims (11)
1. a rigid flexible printed circuit board, be pressed with at least two or more bottom substrates in described rigid flexible printed circuit board middle level, described bottom substrate has circuit layer on the surface at two, and described rigid flexible printed circuit board comprises:
Rigid region, in described rigid region, on two surfaces of described bottom substrate, lamination has rigid insulation layers respectively; And
Flexible region, in described flexible region, there is in the part of described rigid insulation layers lamination respectively have cover layer at two of described bottom substrate surperficial non-laminations, the tectal surface that being laminated to wherein in described cover layer contacts with each other forms surface roughness.
2. rigid flexible printed circuit board according to claim 1, wherein, the cover layer that being laminated in described cover layer contacts with each other comprises inorganic filler.
3. rigid flexible printed circuit board according to claim 1, also comprises:
Matte layer, is arranged between cover layer that being laminated in described cover layer contact with each other.
4. rigid flexible printed circuit board according to claim 3, wherein, described matte layer is formed as the shape of film.
5. rigid flexible printed circuit board according to claim 3, wherein, described matte layer comprises inorganic filler.
6. manufacture a method for rigid flexible printed circuit board, comprising:
Preparation at least two or more bottom substrates, described bottom substrate has circuit layer on the surface at two;
Cover cap rock on the flexible region upper strata of described bottom substrate and on rigid region lamination insulating barrier;
Bottom substrate described in lamination; And
Described bottom substrate after compacting lamination.
7. the method for manufacture rigid flexible printed circuit board according to claim 6, comprising: after the described bottom substrate after compacting lamination, the outermost rigid insulation layers of described bottom substrate after laminating forms external circuit layer.
8. the method for manufacture rigid flexible printed circuit board according to claim 6, wherein, the tectal surface that being laminated in described cover layer contacts with each other forms surface roughness.
9. the method for manufacture rigid flexible printed circuit board according to claim 6, wherein, the cover layer that being laminated in described cover layer contacts with each other comprises inorganic filler.
10. the method for manufacture rigid flexible printed circuit board according to claim 6, also comprises: after the described bottom substrate of preparation, insert matte layer between the cover layer that being laminated in described cover layer contacts with each other.
The method of 11. manufacture rigid flexible printed circuit boards according to claim 10, wherein, described matte layer comprises inorganic filler.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0071604 | 2013-06-21 | ||
| KR1020130071604A KR20140148111A (en) | 2013-06-21 | 2013-06-21 | Rigid flexible printed circuit board and method for manufacturing thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104244570A true CN104244570A (en) | 2014-12-24 |
Family
ID=52231655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410003683.6A Pending CN104244570A (en) | 2013-06-21 | 2014-01-03 | Rigid and flexible circuit board and manufacturing method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2015005717A (en) |
| KR (1) | KR20140148111A (en) |
| CN (1) | CN104244570A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105703065A (en) * | 2015-08-14 | 2016-06-22 | 京信通信技术(广州)有限公司 | Printed cable and preparation method thereof, connection cable and electrically-adjustable antenna system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112911834B (en) * | 2020-12-15 | 2022-12-13 | 惠州美锐电子科技有限公司 | Production method of soft-hard combined PCB |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3155565B2 (en) * | 1991-08-12 | 2001-04-09 | シャープ株式会社 | Manufacturing method of printed wiring board |
| JPH0637408A (en) * | 1992-07-13 | 1994-02-10 | Sumitomo Electric Ind Ltd | Flex-ridged printed wiring board |
| JPH11204896A (en) * | 1998-01-12 | 1999-07-30 | Toshiba Chem Corp | Printed wiring board with flexible part and its manufacture |
| JP4162659B2 (en) * | 2005-01-11 | 2008-10-08 | 株式会社有沢製作所 | Flexible printed wiring board, multilayer flexible printed wiring board, and mobile phone terminal using the multilayer flexible printed wiring board |
| JP4954111B2 (en) * | 2008-02-18 | 2012-06-13 | 株式会社有沢製作所 | Flexible printed wiring board, metal-clad laminate, and coverlay used for flexible printed wiring board |
-
2013
- 2013-06-21 KR KR1020130071604A patent/KR20140148111A/en not_active Application Discontinuation
- 2013-12-09 JP JP2013253874A patent/JP2015005717A/en active Pending
-
2014
- 2014-01-03 CN CN201410003683.6A patent/CN104244570A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105703065A (en) * | 2015-08-14 | 2016-06-22 | 京信通信技术(广州)有限公司 | Printed cable and preparation method thereof, connection cable and electrically-adjustable antenna system |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015005717A (en) | 2015-01-08 |
| KR20140148111A (en) | 2014-12-31 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141224 |