CN102143647A - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN102143647A CN102143647A CN2010105642783A CN201010564278A CN102143647A CN 102143647 A CN102143647 A CN 102143647A CN 2010105642783 A CN2010105642783 A CN 2010105642783A CN 201010564278 A CN201010564278 A CN 201010564278A CN 102143647 A CN102143647 A CN 102143647A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- dielectric layer
- adhesive linkage
- layer
- transmission line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 230000005540 biological transmission Effects 0.000 claims abstract description 52
- 230000001070 adhesive effect Effects 0.000 claims description 62
- 239000000853 adhesive Substances 0.000 claims description 61
- 238000000034 method Methods 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000011161 development Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 230000008054 signal transmission Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Credit Cards Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The embodiment of the invention provides a circuit board, comprising at least one bonding layer and at least one transmission line, wherein an air cavity is formed in the bonding layer; and the orthographic projection of the transmission line falls on the area in which the air cavity of the bonding layer is located. In the circuit board provided by the embodiment of the invention, the air cavity is arranged in the bonding layer of the circuit board, so that the characteristic that the air has low Df value and low Dk value is utilized for reducing the Dk and Df characteristics of the whole circuit board, and further the signal transmission quality of the circuit board is improved; and in addition, the step of arranging the air cavity on the bonding layer is simple, and is easy to realize, so that the manufacturing cost of the circuit board can be reduced.
Description
Technical field
The present invention relates to a kind of circuit board, particularly a kind of manufacture method with circuit board and this circuit board of higher signal transmission quality.
Background technology
Along with the high speed development of large scale integrated circuit, more and more higher to the requirement of message transmission rate, message transmission rate can reach 100Gbps at present, will realize 200Gbps, 400Gbps even higher message transmission rate in the near future.In order to arrive high transfer rate, very high to the requirement of printed circuit board (PCB) (PCB) material, require PCB to have low-k Df and low dielectric loss Dk characteristic usually.At present, reduce the Df of pcb board and the means of Dk, mainly carry out modification from glass and resin system, as: pottery filling, flat glass adopted, non-epoxy systems resin (PTFE) etc.Yet, be the PTFE material for the sheet material major part of Df＜0.003, be unfavorable for the processing of PCB multi-layer sheet; In addition, the price of the material of low Dk, Df costliness very causes the cost of product very high.
Summary of the invention
In view of this, the embodiment of the invention provides a kind of circuit board cheaply, and a kind of manufacture method of circuit board also is provided.
A kind of circuit board, it comprises at least one adhesive linkage and at least one transmission line, is formed with air chamber in the described adhesive linkage, the orthographic projection of described transmission line drops on the zone at the air chamber place of described adhesive linkage.
A kind of manufacture method of circuit board, it may further comprise the steps:
A central layer is provided, and this central layer comprises dielectric layer, and the conducting medium that covers described dielectric layer one side at least;
On the conducting medium of described central layer one side, form transmission line;
Another central layer is provided, and this central layer comprises dielectric layer, and the conducting medium that covers described dielectric layer one side at least;
On the conducting medium of this central layer one side, an adhesive linkage is set;
On described adhesive linkage, offer in order to form the fluting of air chamber;
Described central layer and the adhesive linkage pressing on every side of described fluting that is formed with transmission line formed described air chamber, and the orthographic projection of described transmission line and described air chamber are aligned.
In circuit board that the embodiment of the invention provides and the electroplax manufacture method, by in the adhesive linkage of circuit board, air chamber being set, thereby the characteristic of utilizing air to have low Df and low Dk value reduces the Dk and the Df characteristic of entire circuit plate, thereby improves the signal transmission quality of circuit board; In addition, the step that air chamber is set on described adhesive linkage is simple, realizes easily, thereby can reduce the manufacturing cost of circuit board.
Description of drawings
Fig. 1 is the schematic diagram of a kind of circuit board of providing of first embodiment of the invention;
Fig. 2 is the schematic diagram of another structure of a kind of circuit board of providing of first embodiment of the invention;
Fig. 3 is the schematic diagram of a kind of circuit board of providing of second embodiment of the invention;
Fig. 4 is the schematic diagram of a kind of circuit board of providing of third embodiment of the invention;
Fig. 5 is the schematic diagram of a kind of circuit board of providing of fourth embodiment of the invention;
Fig. 6 is the schematic diagram of a kind of circuit board of providing of fourth embodiment of the invention.
Embodiment
Below in conjunction with drawings and the specific embodiments the embodiment of the invention is elaborated.
The circuit board 100 that the embodiment of the invention provides comprises the circuit board unit that at least one is made of adhesive linkage 120 and transmission line 140.Be formed with air chamber 124 on the adhesive linkage 120 of each described circuit board unit, the orthographic projection of described transmission line 140 drops on the zone at air chamber 124 places of described adhesive linkage 120.
See also Fig. 1, a kind of circuit board 100 that the embodiment of the invention provides, this circuit board 100 is made of a circuit board unit, and this circuit board unit comprises a reference layer 110, described adhesive linkage 120, at least one dielectric layer 130 and described transmission line 140.Described adhesive linkage 120 is provided with the fluting 122 of corresponding described transmission line 140, and described reference layer 110 and dielectric layer 130 are laminated with described fluting 122 adhesive linkage 120 on every side respectively and form described air chamber 124.Described transmission line 140 is arranged on the described dielectric layer 130, and its orthographic projection drops on the zone at described air chamber 124 places.
Described reference layer 110 is made by electric conducting material, and reference layer described in the present embodiment 110 adopts Copper Foils.Described reference layer 110 comprises first surface 112 and the second surface 114 corresponding with described first surface 112.In order to improve the mechanical strength of described reference layer 110, on the second surface 114 of described reference layer 110, also be provided with an enhancement layer 150, this enhancement layer 150 can be made by insulating material.
The one side of described adhesive linkage 120 is bonded on the first surface of described reference layer 110 on 112.Adhesive linkage described in the present embodiment 120 adopts the material colloid that adhesive properties are strong, the gummosis amount is low, for example, has the polyimides of glue-line or photoresist etc.In the present embodiment, the width that is formed on the fluting 122 on the described adhesive linkage 120 is wider than the width of described transmission line 140, the projection that is described transmission line 140 can fall in the described fluting 122, and in the present embodiment, the width of described fluting 122 is than the wide 0.2mm～0.3mm of the width of described transmission line 140.
Described dielectric layer 130 is made by insulating material.Described dielectric layer 130 comprises upper surface 132 and the lower surface 134 corresponding with described upper surface 132.Described dielectric layer 130 pass through the another side that its lower surface 134 is bonded in described adhesive linkage 120.
In the present embodiment, described transmission line 140 is arranged on the lower surface 134 of described dielectric layer 130, and be contained in the described air chamber 124, in the circuit board unit of this structure, also a ground plane 160 can be set on the upper surface of described dielectric layer 130, described ground plane 160 adopts electric conducting material to make, and in the present embodiment, described ground plane 160 adopts Copper Foil.
Be appreciated that as shown in Figure 2 described transmission line 140 also can be formed on the upper surface 132 of described dielectric layer 130.
The circuit board 100 that provides in the embodiment of the invention is by forming the air chamber 124 over against described transmission line 140 on adhesive linkage 120, utilize the low Df of air and the characteristic of Dk, thereby reduce the dielectric constant and the dielectric loss of circuit board 100, improve signal transfer quality; In addition, on described adhesive linkage 120, form fluting 122, and thereby it is simple to be pressed together on the manufacture craft that forms air chamber 124 on the adhesive linkage 120 around the described fluting 122 by described reference layer 110 and dielectric layer 130, realizes easily, thereby can reduce manufacturing cost.
See also Fig. 3, a kind of circuit board 200 that second embodiment of the invention provides, this circuit board 200 comprises a plurality of superimposed successively circuit board units, particularly, this circuit board 200 comprise with first embodiment in the roughly the same first circuit board of structure unit 200a, second circuit board unit 200b and the tertiary circuit plate unit 200c of circuit board 100.The reference layer 210b of described second circuit board unit 200b is arranged on the dielectric layer 240a of described first circuit board unit 200a; The reference layer 210c of tertiary circuit plate unit 200c is arranged on the dielectric layer 240b of described second circuit board unit 200b.Be appreciated that, only constituting multilayer circuit board mutually with roughly the same circuit board unit 200a, 200b of three groups of structures and 200c in the present embodiment is that example illustrates the structure that how makes up the multilayer circuit board that contains a plurality of air chambers by a plurality of circuit board units, but the stack number that the number of plies of circuit board 200 is not limited in the present embodiment to be shown.In addition, in the present embodiment, on the dielectric layer 240c of described tertiary circuit plate unit 200c, be exposed in the just outermost circuit board unit on the outside dielectric layer, a ground plane 260 can be set equally.
See also Fig. 4, a kind of circuit board 300 that third embodiment of the invention provides, this circuit board 300 comprises a circuit board unit, this circuit board unit comprises a sub-circuit board 310,320, one reference layers 330 of one adhesive linkage, and one dielectric layer 340.
The structure of the circuit board 100 among described sub-circuit board 310 and first embodiment is identical, comprises 312, one dielectric layers 313 of 311, one adhesive linkages of a reference layer and a transmission lines 314.Its difference is that described dielectric layer 313 adopts thin type structure, the thickness of promptly described dielectric layer 313 time dielectric layer 340, and the thickness that originally is dielectric layer described in the embodiment is 2 mils (mil).
Described adhesive linkage 320 is arranged on the outside of the dielectric layer 313 of described circuit board 310, and described adhesive linkage 320 is provided with another fluting 322 relative with the transmission line 314 of described sub-circuit board 310.
Described reference layer 330 described dielectric layers 313 are pressed together on respectively on described another fluting 322 inferior adhesive linkage 320 on every side and form another air chamber 324.The orthographic projection of described transmission line 314 drops in described another air chamber 324.
Described dielectric layer 340 is arranged on described reference layer 330.
The circuit board 300 that provides in the present embodiment, by both sides air chamber is set at described transmission line 314, thereby thereby the reduction that the characteristic that can further utilize low Dk of air and Df reduces the dielectric constant and the dielectric loss of circuit board 300, thereby improve signal transfer quality.
See also Fig. 5, a kind of circuit board 400 that fourth embodiment of the invention provides, this circuit board 400 comprises a plurality of superimposed successively circuit board units, described circuit board unit is identical with circuit board 300 structures among the 3rd embodiment, it comprises first circuit board unit 400a, and second circuit board unit 400b.Thereby the reference layer 411b of wherein said second circuit board unit 400b is arranged on the inferior dielectric layer 440b of described first circuit board unit 400a and goes up formation multilayer circuit plate structure.
See also Fig. 6 a kind of circuit board manufacturing method provided by the invention,
It may further comprise the steps:
Step 1: a central layer 500 is provided, and this central layer 500 comprises dielectric layer 510, and the conducting medium 512 that covers described dielectric layer 510 1 sides at least;
In this step, described central layer 500 can adopt FR4
Or pottery is filled or PTFE
The core material of type, wherein conducting medium 512 can be a Copper Foil.
On the conducting medium 512 of described central layer 500 1 sides, form transmission line 540;
In this step, the formation of described transmission line 540 can adopt the mode of chemical etching or physical etch to realize.
Step 2: another central layer 500 is provided, and this central layer 500 comprises dielectric layer 510, and the conducting medium 512 that covers described dielectric layer 510 1 sides at least; One adhesive linkage 520 is set on the conducting medium 512 of these central layer 500 1 sides;
Step 3: on described adhesive linkage 520, offer in order to form the fluting 522 of air chamber 524;
Can adopt methods such as laser formation, development moulding or mould be pre-formed to form described fluting 522 in this step; Require when forming described fluting 522: on the conducting medium 512 of the described fluting 522 of correspondence, it is residual that the bottom of just described air chamber 524 does not have the glue stain.
Step 4: will form described air chamber 514 on the described central layer that the is formed with transmission line 540 500 superimposed adhesive linkages 520 around described fluting 522, and the orthographic projection of described transmission line 510 and described air chamber 524 are aligned.
Be appreciated that this circuit board manufacturing method, thereby comprise that also step as the various multilayer circuit boards that provided in the embodiment of the invention is provided to repeat above-mentioned making step.
In the circuit board manufacturing method that the embodiment of the invention provides, by the air chamber 524 corresponding with described transmission line 540 is set on the adhesive linkage 520 of described circuit board, utilize the characteristic of lower low Dk of air and Df to reduce the Dk and the Df characteristic of entire circuit plate, thereby improve the signal transmission quality of circuit board; In addition, the step that air chamber 524 is set on described adhesive linkage 520 is simple, realizes easily, thereby can reduce the manufacturing cost of circuit board.
The above only is preferred embodiment of the present invention, and is in order to restriction the present invention, within the spirit and principles in the present invention not all, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (17)
1. a circuit board is characterized in that, described circuit board comprises at least one adhesive linkage and at least one transmission line, is formed with air chamber in the described adhesive linkage, and the orthographic projection of described transmission line drops on the zone at the air chamber place of described adhesive linkage.
2. circuit board as claimed in claim 1, it is characterized in that, described circuit board also comprises a reference layer and a dielectric layer, and described adhesive linkage is provided with the fluting corresponding with transmission line, and described reference layer and dielectric layer are laminated with fluting adhesive linkage on every side respectively and form described air chamber.
3. circuit board as claimed in claim 2 is characterized in that the width of described fluting is greater than the width of described transmission line.
4. circuit board as claimed in claim 2 is characterized in that, the width of described fluting is than the wide 0.2mm～0.3mm of the width of described transmission line.
5. circuit board as claimed in claim 2, it is characterized in that, described reference layer comprises first surface and the second surface corresponding with described first surface, described adhesive linkage is bonded on the first surface of described reference layer, described circuit board also comprises an enhancement layer in order to improve the mechanical strength of described reference layer, and described enhancement layer is arranged on the second surface of described reference layer.
6. circuit board as claimed in claim 2 is characterized in that, described dielectric layer comprise a lower surface and by described lower surface bonds on described adhesive linkage, described transmission line is arranged on the lower surface of described dielectric layer.
7. circuit board as claimed in claim 2, it is characterized in that, described dielectric layer comprises upper surface and the lower surface corresponding with described upper surface, described dielectric layer pass through its lower surface bonds on described adhesive linkage, described transmission line is arranged on the upper surface of described dielectric layer.
8. circuit board as claimed in claim 2, it is characterized in that, described circuit board also comprises to inferior adhesive linkage, inferior reference layer, and inferior dielectric layer, described adhesive linkage is arranged on the outside of the dielectric layer of described circuit board, described adhesive linkage be provided with the orthographic projection of the transmission line of described sub-circuit board over against another fluting, described reference layer and described dielectric layer be pressed together on respectively described another fluting around inferior adhesive linkage on another air chamber of formation, the orthographic projection of described transmission line drops on the zone at described another air chamber place, and described dielectric layer is arranged on described reference layer.
9. circuit board as claimed in claim 8, it is characterized in that, described reference layer comprises first surface and the second surface corresponding with described first surface, the one side of described adhesive linkage is bonded on the first surface of described reference layer, described circuit board also comprises an enhancement layer in order to improve the mechanical strength of described reference layer, and described enhancement layer is arranged on the second surface of described reference layer.
10. circuit board as claimed in claim 8 is characterized in that, described dielectric layer comprise a lower surface and by described lower surface bonds on described adhesive linkage, described transmission line is arranged on the lower surface of described dielectric layer.
11., it is characterized in that described transmission line is contained in the described air chamber as claim 6 or 10 described circuit boards.
12. circuit board as claimed in claim 9 is characterized in that, described dielectric layer is thinner than inferior dielectric layer.
13. circuit board as claimed in claim 1, it is characterized in that, described circuit board comprises at least two circuit board units that are made of described at least one adhesive linkage and at least one transmission line, described circuit board unit is superimposed with each other successively, wherein be formed with air chamber in the adhesive linkage of each described circuit board unit, the orthographic projection of the transmission line of each described circuit board unit drops in the described air chamber.
14. circuit board as claimed in claim 13, it is characterized in that, described each circuit board unit also comprises a reference layer and a dielectric layer, described dielectric layer is overlapped into one by described adhesive linkage and described reference layer, described adhesive linkage is provided with the fluting corresponding with described transmission line, described reference layer and dielectric layer are laminated with described fluting adhesive linkage on every side respectively and form described air chamber, described transmission line is arranged on the described dielectric layer, and wherein the reference layer of a circuit board unit is arranged on the dielectric layer of another circuit board unit.
15. circuit board as claimed in claim 13 is characterized in that, each described circuit board unit also comprises and also comprises a reference layer, a dielectric layer, one adhesive linkage, one reference layer, and one dielectric layer; Described dielectric layer is overlapped into one by described adhesive linkage and described reference layer; Described adhesive linkage is provided with the fluting corresponding with described transmission line, and described reference layer and dielectric layer are laminated with described fluting adhesive linkage on every side respectively and form described air chamber; Described transmission line is arranged on the described dielectric layer; Described adhesive linkage is arranged on the outside of the dielectric layer of described circuit board; Described adhesive linkage is provided with another the corresponding fluting with described transmission line; Thereby described reference layer and described dielectric layer are pressed together on inferior adhesive linkage around described another fluting and constitute inferior air chamber; The orthographic projection of described transmission line drops in described air chamber; Described dielectric layer is arranged on described reference layer; Wherein the reference layer of a circuit board unit is arranged on the inferior dielectric layer of another circuit board unit.
16. the manufacture method of a circuit board is characterized in that may further comprise the steps:
A central layer is provided, and this central layer comprises dielectric layer, and the conducting medium that covers described dielectric layer one side at least;
On the described conducting medium of described central layer one side, form transmission line;
Another central layer is provided, and this central layer comprises dielectric layer, and the conducting medium that covers described dielectric layer one side at least;
On the conducting medium of this central layer one side, an adhesive linkage is set;
On described adhesive linkage, offer in order to form the fluting of air chamber;
Described central layer and the adhesive linkage pressing on every side of described fluting that is formed with transmission line formed described air chamber, and the orthographic projection of described transmission line and described air chamber are aligned.
17. the manufacture method of circuit board as claimed in claim 16, its feature exists, and the fluting on the described adhesive linkage is to form by the pre-formed method of laser formation, development moulding or mould.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010564278.3A CN102143647B (en) | 2010-11-25 | 2010-11-25 | Circuit board and manufacturing method thereof |
| MX2011013097A MX2011013097A (en) | 2010-11-25 | 2011-05-16 | Circuit board and manufacturing method thereof. |
| PCT/CN2011/074076 WO2011150738A1 (en) | 2010-11-25 | 2011-05-16 | Circuit board and manufacturing method thereof |
| HU1200255A HU230941B1 (en) | 2010-11-25 | 2011-05-16 | Printed circuit board and manufacturing method thereof |
| BRPI1105246A BRPI1105246B1 (en) | 2010-11-25 | 2011-05-16 | circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010564278.3A CN102143647B (en) | 2010-11-25 | 2010-11-25 | Circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102143647A true CN102143647A (en) | 2011-08-03 |
| CN102143647B CN102143647B (en) | 2014-08-20 |
Family
ID=44410785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010564278.3A Active CN102143647B (en) | 2010-11-25 | 2010-11-25 | Circuit board and manufacturing method thereof |
Country Status (5)
| Country | Link |
|---|---|
| CN (1) | CN102143647B (en) |
| BR (1) | BRPI1105246B1 (en) |
| HU (1) | HU230941B1 (en) |
| MX (1) | MX2011013097A (en) |
| WO (1) | WO2011150738A1 (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105636341A (en) * | 2016-01-01 | 2016-06-01 | 广州兴森快捷电路科技有限公司 | PCB with hollow cavity structure and manufacturing method therefor |
| CN106231801A (en) * | 2016-08-19 | 2016-12-14 | 深圳崇达多层线路板有限公司 | For the technique making pottery plate HDI plate |
| CN106470523A (en) * | 2015-08-19 | 2017-03-01 | 富葵精密组件(深圳)有限公司 | Flexible PCB and preparation method thereof |
| CN106488642A (en) * | 2015-08-27 | 2017-03-08 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and preparation method thereof |
| CN107666764A (en) * | 2016-07-27 | 2018-02-06 | 鹏鼎控股(深圳)股份有限公司 | Flexible PCB and preparation method thereof |
| CN108633167A (en) * | 2018-05-28 | 2018-10-09 | 维沃移动通信有限公司 | A kind of circuit board, signal transmssion line and preparation method thereof |
| CN109195311A (en) * | 2018-09-11 | 2019-01-11 | 番禺得意精密电子工业有限公司 | circuit board |
| CN109788648A (en) * | 2018-12-31 | 2019-05-21 | 广州添利电子科技有限公司 | Radar circuit plate air chamber manufacturing process |
| CN110139490A (en) * | 2019-05-31 | 2019-08-16 | 上海安费诺永亿通讯电子有限公司 | A kind of production method and transmission line plate of transmission line plate |
| CN110636718A (en) * | 2019-10-30 | 2019-12-31 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN112105150A (en) * | 2020-11-04 | 2020-12-18 | 生益电子股份有限公司 | Manufacturing method of embedded cavity and PCB |
| CN112261802A (en) * | 2020-11-04 | 2021-01-22 | 生益电子股份有限公司 | Manufacturing method of embedded cavity and PCB |
| CN114364168A (en) * | 2022-01-07 | 2022-04-15 | 安捷利（番禺）电子实业有限公司 | Preparation method of circuit board with built-in cavity, circuit board and electronic equipment |
| TWI785868B (en) * | 2021-10-25 | 2022-12-01 | 大陸商鵬鼎控股（深圳）股份有限公司 | Wiring substrate and method of manufacturing the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3820258A1 (en) | 2019-11-08 | 2021-05-12 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with exposed layer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020104681A1 (en) * | 2001-02-07 | 2002-08-08 | Masayuki Ishiwa | Multilayer circuit board |
| CN1543298A (en) * | 2000-06-27 | 2004-11-03 | ���µ�����ҵ��ʽ���� | Multilayer ceramic device |
| JP2007080858A (en) * | 2005-09-09 | 2007-03-29 | Fujikura Ltd | Multilayer printed wiring board and its manufacturing method |
| CN101841079A (en) * | 2010-04-21 | 2010-09-22 | 惠州Tcl移动通信有限公司 | Printed circuit board (PCB) for bearing feed pad in mobile phone antenna and antenna |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2479712Y (en) * | 2001-03-27 | 2002-02-27 | 安捷利（番禺）电子实业有限公司 | Sectional glued flexible printed circuit board |
| JP4540493B2 (en) * | 2005-02-02 | 2010-09-08 | 東北リコー株式会社 | Printed wiring board |
-
2010
- 2010-11-25 CN CN201010564278.3A patent/CN102143647B/en active Active
-
2011
- 2011-05-16 HU HU1200255A patent/HU230941B1/en unknown
- 2011-05-16 MX MX2011013097A patent/MX2011013097A/en active IP Right Grant
- 2011-05-16 BR BRPI1105246A patent/BRPI1105246B1/en active IP Right Grant
- 2011-05-16 WO PCT/CN2011/074076 patent/WO2011150738A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1543298A (en) * | 2000-06-27 | 2004-11-03 | ���µ�����ҵ��ʽ���� | Multilayer ceramic device |
| US20020104681A1 (en) * | 2001-02-07 | 2002-08-08 | Masayuki Ishiwa | Multilayer circuit board |
| JP2007080858A (en) * | 2005-09-09 | 2007-03-29 | Fujikura Ltd | Multilayer printed wiring board and its manufacturing method |
| CN101841079A (en) * | 2010-04-21 | 2010-09-22 | 惠州Tcl移动通信有限公司 | Printed circuit board (PCB) for bearing feed pad in mobile phone antenna and antenna |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106470523B (en) * | 2015-08-19 | 2019-04-26 | 鹏鼎控股(深圳)股份有限公司 | Flexible circuit board and preparation method thereof |
| CN106470523A (en) * | 2015-08-19 | 2017-03-01 | 富葵精密组件(深圳)有限公司 | Flexible PCB and preparation method thereof |
| TWI608770B (en) * | 2015-08-19 | 2017-12-11 | 鵬鼎科技股份有限公司 | Flexible print circuit board and method for manufacturing same |
| CN106488642A (en) * | 2015-08-27 | 2017-03-08 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and preparation method thereof |
| CN105636341A (en) * | 2016-01-01 | 2016-06-01 | 广州兴森快捷电路科技有限公司 | PCB with hollow cavity structure and manufacturing method therefor |
| CN107666764B (en) * | 2016-07-27 | 2021-02-09 | 庆鼎精密电子（淮安）有限公司 | Flexible circuit board and manufacturing method thereof |
| CN107666764A (en) * | 2016-07-27 | 2018-02-06 | 鹏鼎控股(深圳)股份有限公司 | Flexible PCB and preparation method thereof |
| CN106231801A (en) * | 2016-08-19 | 2016-12-14 | 深圳崇达多层线路板有限公司 | For the technique making pottery plate HDI plate |
| CN108633167A (en) * | 2018-05-28 | 2018-10-09 | 维沃移动通信有限公司 | A kind of circuit board, signal transmssion line and preparation method thereof |
| CN109195311A (en) * | 2018-09-11 | 2019-01-11 | 番禺得意精密电子工业有限公司 | circuit board |
| CN109195311B (en) * | 2018-09-11 | 2021-07-20 | 番禺得意精密电子工业有限公司 | Circuit board |
| CN109788648A (en) * | 2018-12-31 | 2019-05-21 | 广州添利电子科技有限公司 | Radar circuit plate air chamber manufacturing process |
| CN110139490A (en) * | 2019-05-31 | 2019-08-16 | 上海安费诺永亿通讯电子有限公司 | A kind of production method and transmission line plate of transmission line plate |
| CN110636718B (en) * | 2019-10-30 | 2021-01-05 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN110636718A (en) * | 2019-10-30 | 2019-12-31 | 生益电子股份有限公司 | Manufacturing method of PCB |
| CN112105150A (en) * | 2020-11-04 | 2020-12-18 | 生益电子股份有限公司 | Manufacturing method of embedded cavity and PCB |
| CN112261802A (en) * | 2020-11-04 | 2021-01-22 | 生益电子股份有限公司 | Manufacturing method of embedded cavity and PCB |
| TWI785868B (en) * | 2021-10-25 | 2022-12-01 | 大陸商鵬鼎控股（深圳）股份有限公司 | Wiring substrate and method of manufacturing the same |
| US11696391B2 (en) | 2021-10-25 | 2023-07-04 | Avary Holding (Shenzhen) Co., Ltd. | Wiring substrate and method of manufacturing the same |
| US12028967B2 (en) | 2021-10-25 | 2024-07-02 | Avary Holding(Shenzhen)Co., Ltd. | Method of manufacturing wiring substrate |
| CN114364168A (en) * | 2022-01-07 | 2022-04-15 | 安捷利（番禺）电子实业有限公司 | Preparation method of circuit board with built-in cavity, circuit board and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011150738A1 (en) | 2011-12-08 |
| MX2011013097A (en) | 2012-02-08 |
| BRPI1105246A2 (en) | 2016-05-03 |
| HU230941B1 (en) | 2019-05-28 |
| BRPI1105246B1 (en) | 2020-04-22 |
| HUP1200255A2 (en) | 2013-01-28 |
| CN102143647B (en) | 2014-08-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102143647B (en) | Circuit board and manufacturing method thereof | |
| CN102480837B (en) | Flexible circuit board | |
| KR101700397B1 (en) | Printed wiring board | |
| CN103906372A (en) | Circuit board having embedded components and manufacturing method thereof | |
| JP2010212669A (en) | High-voltage resistant coil transducer (coil transducer) | |
| CN103796445A (en) | Circuit board with buried element, and manufacturing method thereof | |
| CN103313530B (en) | The manufacture method of rigid-flexible circuit board | |
| JP5399995B2 (en) | Multilayer printed wiring board and multilayer metal-clad laminate | |
| CN103857209A (en) | Multi-layer circuit board and manufacture method for the same | |
| CN104427754A (en) | Rigid flexible pcb and method for manufacturing the same | |
| CN102970819B (en) | Multilayer board | |
| CN103327738A (en) | Softness-hardness combined circuit board and manufacturing method thereof | |
| US7378598B2 (en) | Printed circuit board substrate and method for constructing same | |
| US20120314390A1 (en) | Multilayer circuit board | |
| CN103889165A (en) | Circuit board with embedded element and manufacturing method thereof | |
| WO2013141339A1 (en) | Multilayer wiring board and method for manufacturing same | |
| JP5749235B2 (en) | Manufacturing method of circuit component built-in substrate | |
| CN103781281A (en) | Circuit board and manufacturing method thereof | |
| CN102083282B (en) | Method for manufacturing printed circuit board (PCB) | |
| CN107635349A (en) | circuit board and terminal device | |
| CN202514155U (en) | Improvement of multilayer soft circuit board structure | |
| CN110366329A (en) | A kind of manufacturing method and multilager base plate of multilager base plate | |
| JP2005285945A (en) | Electric conductive path formation method | |
| KR101872525B1 (en) | Printed circuit board and method for manufacturing the same | |
| KR20180104631A (en) | A multilayer printed wiring board and a multilayer metal clad laminate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: No. 2 Metro Avenue Songshan Lake Science and Technology Industrial Park 523808 Guangdong city of Dongguan Province Applicant after: Huawei Machine Co.,Ltd. Address before: No. 2 Metro Avenue Songshan Lake Science and Technology Industrial Park 523808 Guangdong city of Dongguan Province Applicant before: Juxin Technology Co., Ltd. |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: JUXIN TECHNOLOGY CO., LTD. TO: HUAWEI MACHINE CO., LTD. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |