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CN101191811B - 基板检查装置和基板检查方法 - Google Patents

基板检查装置和基板检查方法 Download PDF

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Publication number
CN101191811B
CN101191811B CN200710196206.6A CN200710196206A CN101191811B CN 101191811 B CN101191811 B CN 101191811B CN 200710196206 A CN200710196206 A CN 200710196206A CN 101191811 B CN101191811 B CN 101191811B
Authority
CN
China
Prior art keywords
potential difference
short circuit
checkpoint
circuit portion
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200710196206.6A
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English (en)
Chinese (zh)
Other versions
CN101191811A (zh
Inventor
山下宗宽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Corp
Original Assignee
Nidec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39486937&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN101191811(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nidec Corp filed Critical Nidec Corp
Publication of CN101191811A publication Critical patent/CN101191811A/zh
Application granted granted Critical
Publication of CN101191811B publication Critical patent/CN101191811B/zh
Active legal-status Critical Current
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
    • G01R19/0092—Arrangements for measuring currents or voltages or for indicating presence or sign thereof measuring current only
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
CN200710196206.6A 2006-11-30 2007-11-29 基板检查装置和基板检查方法 Active CN101191811B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006-322850 2006-11-30
JP2006322850A JP4918339B2 (ja) 2006-11-30 2006-11-30 基板検査装置
JP2006322850 2006-11-30

Publications (2)

Publication Number Publication Date
CN101191811A CN101191811A (zh) 2008-06-04
CN101191811B true CN101191811B (zh) 2014-07-30

Family

ID=39486937

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200710196206.6A Active CN101191811B (zh) 2006-11-30 2007-11-29 基板检查装置和基板检查方法

Country Status (4)

Country Link
JP (1) JP4918339B2 (ja)
KR (1) KR101222802B1 (ja)
CN (1) CN101191811B (ja)
TW (1) TWI412765B (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5487585B2 (ja) * 2008-09-19 2014-05-07 セイコーエプソン株式会社 電気光学装置、その駆動方法、および電子機器
JP5391869B2 (ja) * 2009-06-26 2014-01-15 日本電産リード株式会社 基板検査方法
JP2011258591A (ja) 2010-06-04 2011-12-22 Mitsubishi Electric Corp 半導体素子の検査方法、半導体素子の検査装置、及び半導体素子
JP5485100B2 (ja) * 2010-10-05 2014-05-07 日置電機株式会社 回路基板検査装置および回路基板検査方法
JP5485099B2 (ja) * 2010-10-05 2014-05-07 日置電機株式会社 回路基板検査装置および回路基板検査方法
JP5866943B2 (ja) * 2011-10-06 2016-02-24 日本電産リード株式会社 基板検査装置
JP6069884B2 (ja) 2012-05-08 2017-02-01 日本電産リード株式会社 絶縁検査方法及び絶縁検査装置
JP5991034B2 (ja) * 2012-06-08 2016-09-14 日本電産リード株式会社 電気特性検出方法及び検出装置
TWI498571B (zh) * 2013-03-29 2015-09-01 Nidec Read Corp 絕緣檢測裝置及絕緣檢測方法
JP6182974B2 (ja) * 2013-05-20 2017-08-23 日本電産リード株式会社 基板検査方法
JP6229877B2 (ja) * 2013-08-27 2017-11-15 日本電産リード株式会社 検査装置
JP6339834B2 (ja) * 2014-03-27 2018-06-06 東京エレクトロン株式会社 基板検査装置
JP6421463B2 (ja) * 2014-06-02 2018-11-14 日本電産リード株式会社 基板検査装置、及び基板検査方法
JP6819238B2 (ja) * 2016-11-21 2021-01-27 株式会社デンソー 配線異常検出装置
CN106824832B (zh) * 2017-02-15 2019-05-17 友达光电（苏州）有限公司 一种检测装置及其使用方法
JP7009814B2 (ja) * 2017-07-27 2022-02-10 日本電産リード株式会社 絶縁検査装置及び絶縁検査方法
CN112212782B (zh) * 2019-06-25 2023-01-17 合肥欣奕华智能机器股份有限公司 一种玻璃基板检测方法、装置及系统

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5006808A (en) * 1989-03-21 1991-04-09 Bath Scientific Limited Testing electrical circuits
US5087874A (en) * 1989-08-28 1992-02-11 David Robinson Apparatus and method for locating a short
US5438272A (en) * 1994-05-09 1995-08-01 International Business Machines Corporation Voltage-stressing and testing of networks using moving probes
JP2001153909A (ja) * 1999-11-24 2001-06-08 Ngk Spark Plug Co Ltd 基板検査装置、基板製造方法及びバンプ付き基板
JP2001201529A (ja) * 2000-01-21 2001-07-27 Hitachi Telecom Technol Ltd プリント配線板の試験方法及び試験装置
JP2002014134A (ja) * 2000-06-30 2002-01-18 Hioki Ee Corp 回路基板検査装置
JP2003043091A (ja) * 2002-04-23 2003-02-13 Ngk Spark Plug Co Ltd 基板検査装置、基板製造方法及びバンプ付き基板
JP2006010496A (ja) * 2004-06-25 2006-01-12 Nidec-Read Corp 基板検査装置及び基板検査方法
CN1726398A (zh) * 2002-12-12 2006-01-25 东京毅力科创株式会社 检验方法及检验装置
JP2006047172A (ja) * 2004-08-06 2006-02-16 Nidec-Read Corp 基板検査装置、基板検査プログラム及び基板検査方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05157798A (ja) * 1991-12-04 1993-06-25 Hitachi Ltd プリント基板の絶縁試験方法
JPH06230058A (ja) * 1993-02-04 1994-08-19 Hitachi Ltd プリント配線板の電気検査方法
TW589456B (en) * 1999-11-25 2004-06-01 Oht Inc Short-circuit inspection method of circuit board, inspection tool for the method, circuit board of the inspected object, short-circuit inspection apparatus of circuit board, and coil sensor for inspection
KR100721478B1 (ko) * 2003-01-17 2007-05-23 제이에스알 가부시끼가이샤 회로 기판의 검사 장치 및 회로 기판의 검사 방법
JP4257164B2 (ja) 2003-08-06 2009-04-22 日本電産リード株式会社 基板検査装置及び基板検査方法
JP4368704B2 (ja) * 2004-03-12 2009-11-18 三井金属鉱業株式会社 電子部品実装用プリント配線板の電気検査方法および電気検査装置ならびにコンピュータ読み取り可能な記録媒体
JP2006084249A (ja) * 2004-09-15 2006-03-30 Hioki Ee Corp 絶縁検査方法および絶縁検査装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5006808A (en) * 1989-03-21 1991-04-09 Bath Scientific Limited Testing electrical circuits
US5087874A (en) * 1989-08-28 1992-02-11 David Robinson Apparatus and method for locating a short
US5438272A (en) * 1994-05-09 1995-08-01 International Business Machines Corporation Voltage-stressing and testing of networks using moving probes
JP2001153909A (ja) * 1999-11-24 2001-06-08 Ngk Spark Plug Co Ltd 基板検査装置、基板製造方法及びバンプ付き基板
JP2001201529A (ja) * 2000-01-21 2001-07-27 Hitachi Telecom Technol Ltd プリント配線板の試験方法及び試験装置
JP2002014134A (ja) * 2000-06-30 2002-01-18 Hioki Ee Corp 回路基板検査装置
JP2003043091A (ja) * 2002-04-23 2003-02-13 Ngk Spark Plug Co Ltd 基板検査装置、基板製造方法及びバンプ付き基板
CN1726398A (zh) * 2002-12-12 2006-01-25 东京毅力科创株式会社 检验方法及检验装置
JP2006010496A (ja) * 2004-06-25 2006-01-12 Nidec-Read Corp 基板検査装置及び基板検査方法
JP2006047172A (ja) * 2004-08-06 2006-02-16 Nidec-Read Corp 基板検査装置、基板検査プログラム及び基板検査方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP6－230058A 1994.08.19

Also Published As

Publication number Publication date
JP2008139036A (ja) 2008-06-19
TW200841030A (en) 2008-10-16
CN101191811A (zh) 2008-06-04
KR101222802B1 (ko) 2013-01-15
TWI412765B (zh) 2013-10-21
JP4918339B2 (ja) 2012-04-18
KR20080049624A (ko) 2008-06-04

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