WO2011099452A1 - 薄膜型太陽電池モジュールの製造方法 - Google Patents
薄膜型太陽電池モジュールの製造方法 Download PDFInfo
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- WO2011099452A1 WO2011099452A1 PCT/JP2011/052535 JP2011052535W WO2011099452A1 WO 2011099452 A1 WO2011099452 A1 WO 2011099452A1 JP 2011052535 W JP2011052535 W JP 2011052535W WO 2011099452 A1 WO2011099452 A1 WO 2011099452A1
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- chamber
- solar cell
- resin
- conductive adhesive
- adhesive film
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 229920005989 resin Polymers 0.000 claims abstract description 83
- 239000011347 resin Substances 0.000 claims abstract description 83
- 238000007789 sealing Methods 0.000 claims abstract description 77
- 239000002313 adhesive film Substances 0.000 claims abstract description 60
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- 239000003094 microcapsule Substances 0.000 claims description 8
- 239000012298 atmosphere Substances 0.000 claims description 7
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 229910000679 solder Inorganic materials 0.000 description 11
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- 238000006243 chemical reaction Methods 0.000 description 5
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
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- 238000011156 evaluation Methods 0.000 description 4
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
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- 238000010030 laminating Methods 0.000 description 1
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- 239000002923 metal particle Substances 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
- H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/34—Inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a method of manufacturing a thin film solar cell module having a structure in which a thin film solar cell having a surface electrode to which a tab wire is connected is resin-sealed with a sealing resin.
- Patent Document 1 a method of performing a resin sealing process using a vacuum laminating apparatus having a flexible diaphragm as a constituent member is known (Patent Document 1).
- a thin-film solar cell having a surface electrode to which a tab wire is connected by solder is placed on a heating plate of a vacuum laminator main body, and further a sealing sheet is provided on the heating plate on the back plate.
- EVA resin polyethylene-vinyl acetate copolymer resin
- Patent Document 1 a tab wire connection process in which a copper tab wire previously solder-coated is solder-bonded to a surface electrode of a thin film solar cell at a temperature of about 240 ° C., and about 150 ° C. using EVA resin.
- the resin sealing process that performs resin sealing at a temperature is performed separately due to the difference in process temperature, which increases the manufacturing tact time, increases the number of times of handling, and consequently increases the manufacturing cost. There was a problem to do.
- the vacuum laminator used in the technique of Patent Document 1 is in a state in which the diaphragm is always released to the atmosphere with respect to the outside of the apparatus.
- the heated thin film solar cell and the sheet-shaped sealing resin are pressed.
- the present invention is intended to solve the above-described conventional problems.
- the surface electrode is used as the surface electrode.
- the tab wire connecting process for connecting the tab wires and the resin sealing process for sealing the solar cells with the sealing resin can be performed collectively at a relatively low temperature of the resin sealing process, and thermocompression bonding. The purpose is to prevent voids from occurring in the region.
- the tab wire is joined to the surface electrode of the thin-film solar cell using a conductive adhesive film in which conductive particles are dispersed in a thermoplastic resin, and the resin compatible with the thermoplastic resin is sealed.
- a resin has been found to be used as a resin.
- the present inventors can independently adjust the internal pressure of the apparatus main body so that the diaphragm of the vacuum laminator does not immediately press the thin film solar cell or the like inside the apparatus main body when the apparatus main body is in a reduced pressure state. The inventors have found that it is only necessary to divide into two rooms, and have completed the present invention.
- a thin film solar cell having a surface electrode to which tab wires are connected with a conductive adhesive film in which conductive particles are dispersed in a thermoplastic resin is sealed with a sealing resin.
- a solar battery cell having a surface electrode formed thereon is placed on the heating stage of the second chamber of the decompression laminator, and a conductive adhesive film and a tab wire are sequentially arranged on the surface electrode so as to cover the entire solar battery cell.
- a sheet-like sealing resin, a moisture-proof backsheet or a glass plate disposed thereon The solar cell is heated on the heating stage while pressing the moisture-proof backsheet or glass plate with the flexible sheet by increasing the internal pressure of the first chamber relative to the second chamber of the decompression laminator, thereby The surface electrode of the thin film solar cell and the tab wire are connected with a conductive adhesive film, and the thin film solar cell is resin-sealed with a sealing resin, thereby obtaining a solar cell module.
- a manufacturing method is provided.
- the tab wire connecting step and the resin sealing step can be performed at a time at a relatively low process temperature of the resin sealing step.
- a connection strength greater than the width of the tab wire can be obtained, sealing properties are improved, and long-term reliability of solar cell characteristics is improved.
- the vacuum laminator is divided into two chambers capable of independently adjusting the internal pressure. For this reason, since both chambers can be made into a pressure-reduced state simultaneously, it can prevent that a flexible sheet
- FIG. 1 It is a schematic sectional drawing of a pressure reduction laminator. It is use explanatory drawing of a pressure reduction laminator. It is use explanatory drawing of a pressure reduction laminator. It is use explanatory drawing of a pressure reduction laminator. It is use explanatory drawing of a pressure reduction laminator. It is use explanatory drawing of a pressure reduction laminator. It is process drawing of the manufacturing method of this invention. It is process drawing of the manufacturing method of this invention. It is a schematic sectional drawing of the thin film type solar cell module manufactured with the manufacturing method of this invention. It is a schematic top view of a thin film type solar cell unit. 6 is a temperature-viscosity characteristic diagram of conductive adhesive films of Reference Examples 4 and 5. FIG.
- a thin-film solar cell having a surface electrode to which tab wires are connected with a conductive adhesive film in which conductive particles are dispersed in a thermoplastic resin is resin-sealed with a sealing resin.
- the decompression laminator used in the present invention has a first chamber and a second chamber partitioned by a flexible sheet, and each chamber can independently adjust the internal pressure, and is heated in the second chamber. It has a heating stage capable of. An example of this decompression laminator will be described in more detail with reference to FIG.
- FIG. 1 shows a decompression laminator 10 before use, which is composed of an upper unit 11 and a lower unit 12. These units are detachably integrated through a seal member 13 such as an O-ring.
- the upper unit 11 is provided with a flexible sheet 14 such as silicon rubber, and the flexible sheet 14 divides the decompression laminator 10 into a first chamber 15 and a second chamber 16.
- a thin glass cloth reinforced Teflon (registered trademark) sheet can be disposed on the surface of the flexible sheet 14 on the second chamber 16 side so that a sealing resin such as melted EVA is not transferred.
- each of the upper unit 11 and the lower unit 12 has a pipe 17, so that each chamber can independently adjust the internal pressure, that is, can be depressurized, pressurized and further released to the atmosphere by a vacuum pump or a compressor. 18 is provided.
- the piping 17 is branched into two directions 17a and 17b by a switching valve 19, and the piping 18 is branched into two directions 18a and 18b by a switching valve 20.
- the lower unit 12 is provided with a stage 21 that can be heated.
- Such a decompression laminator 10 is used, for example, as shown in FIGS. 2A to 2E. First, as shown in FIG. 2A, the upper unit 11 and the lower unit 12 are separated, and a laminate 22 to be thermocompression bonded is placed on the stage 21.
- the upper unit 11 and the lower unit 12 are integrated so as to be separable via the seal member 13, and then a vacuum pump (not shown) is connected to each of the pipe 17a and the pipe 18a. Then, the first chamber 15 and the second chamber 16 are evacuated.
- the switching valve 19 is switched to introduce air into the first chamber 15 from the pipe 17b.
- the flexible sheet 14 is spread toward the second chamber 16, and as a result, the laminate 22 is pressed by the flexible sheet 14 while being heated by the stage 21.
- the switching valve 20 is switched to introduce the atmosphere into the second chamber 16 from the pipe 18b. Thereby, the flexible sheet 14 is pushed back toward the first chamber 15, and finally the internal pressures of the first chamber 15 and the second chamber 16 become the same.
- the laminate 22 is basically a thin film solar cell, a tab wire disposed on the surface electrode, a conductive adhesive film disposed between them, and a thin film in the present invention. It becomes the laminated body which consists of resin for sealing of the sheet
- the decompression laminator used in the present invention has been described. Not only the decompression laminator shown in FIG. 1 but also the upper unit 11 and the lower unit 12 as shown in FIG. It is also possible to use a decompression laminator configured to input and recover the laminate.
- the first chamber and the second chamber may introduce compressed air into the first chamber and pressurize at or above atmospheric pressure. Further, the indoor air may be simply exhausted without reducing the pressure in the second chamber.
- the surface electrode 31 is formed on the heating stage 21 of the second chamber 16 of the decompression laminator defined by the flexible sheet 14 from the first chamber 15.
- Thin film solar cell 32, conductive adhesive film 33 on surface electrode 31, tab wire 34 on conductive adhesive film 33, sealing resin sheet 35 on tab wire 34, sealing resin sheet 35 A moisture-proof back sheet 36 or a glass plate (not shown) is sequentially laminated on the substrate.
- the thin film solar cell 32 is heated by the heating stage 21. Thereby, the surface electrode 31 and the tab wire 34 of the thin film solar cell 32 are connected by the conductive adhesive film 33, and the thin film solar cell 32 is resin-sealed by the sealing resin sheet 35. Thereby, the thin film type solar cell module 30 can be obtained (FIG. 3C).
- the internal pressures of the first chamber 15 and the second chamber 16 are both reduced, and then the second chamber 16 For example, the first chamber 15 is released to the atmosphere while maintaining the reduced pressure state.
- conductive adhesive film 33 conductive particles are dispersed in a thermoplastic resin and formed into a film shape, and a known conductive adhesive film used for mounting electronic components on solar cells is used.
- a known conductive adhesive film used for mounting electronic components on solar cells is used.
- thermoplastic resin constituting the conductive adhesive film 33 and the sealing resin constituting the sealing resin sheet 35 are compatible with each other. This makes it possible to achieve good resin sealing without voids by being compatible with each other. Moreover, the desired properties (adhesion strength, moisture resistance, etc.) can be obtained without adding a curing agent to the sealing resin. It is because it becomes possible to obtain.
- the melt viscosity (B-type viscometer, 220 ° C.) of the thermoplastic resin constituting the conductive adhesive film 33 is too low, it becomes difficult to maintain the film shape, the heat resistance is lowered, and if it is too high, it is for sealing. Since the compatibility with the resin is reduced and the connection resistance is increased, it is preferably 1.0 ⁇ 10 2 to 1.0 ⁇ 10 5 Pa ⁇ s, more preferably 1.0 ⁇ 10 3 to 1.0 ⁇ 10. 5 Pa ⁇ s, but lower than the melt viscosity of the sealing resin constituting the sealing resin sheet 35 because the conductive adhesive film is more easily melted than the sealing resin sheet in the connection region. Is preferred.
- thermoplastic resin constituting the conductive adhesive film 33 and the sealing resin constituting the sealing resin sheet 35 in consideration of compatibility, melt viscosity and the like, it is independently selected from a large number of thermoplastic resins. It can be selected appropriately. Among them, it is preferable to use a polyurethane resin as a resin that exhibits good adhesive force and at the same time exhibits difficulty in hydrolysis and flame resistance in place of the EVA resin that has been used conventionally.
- a thermoplastic polyurethane resin hereinafter sometimes referred to as an ester polyol polyurethane having an ester polyol unit that has a relatively strong adhesive force but is easily hydrolyzed, and a relatively weak adhesive force.
- ether polyol polyurethane a blend polymer containing a thermoplastic polyurethane resin having an ether-based polyol unit that is difficult to hydrolyze
- ether polyol polyurethane a thermoplastic polyurethane resin having an ether-based polyol unit that is difficult to hydrolyze
- Such blended polymers strongly reflect their preferred properties (i.e., good adhesion and difficulty of hydrolysis), while the unfavorable properties are reduced, and good flame resistance. Showing gender.
- the blend mass ratio of ester polyol polyurethane and ether polyol polyurethane in this blend polymer is that if the former is too small, the adhesive strength is weak, and if it is too large, it is easily hydrolyzed and the surface electrode is easily corroded. Therefore, it is 10:90 to 50:50, preferably 10:90 to 30:70.
- thermoplastic resin that constitutes the conductive adhesive film 33 and the sealing resin that constitutes the sealing resin sheet 35 other thermoplastic resins, silane coupling agents, cross-linking agents, and antioxidants may be used as necessary.
- An agent or the like can be contained.
- a tackifier such as a petroleum-based tackifier to the thermoplastic resin constituting the conductive adhesive film 33.
- the conductive particles constituting the conductive adhesive film 33 the conductive particles used in a known conductive adhesive film (CF) used when an electronic component is mounted on a solar battery cell can be used.
- amorphous, spherical, or flaky conductive particles such as carbon, gold, copper, solder, or nickel, metal-coated resin particles, or the like can be used.
- the surface may be plated with gold.
- flaky nickel particles can be preferably used from the viewpoints of acquisition cost, connection reliability, and the like.
- the thickness is preferably 2 to 50 ⁇ m, more preferably 5 to 40 ⁇ m.
- the mixing ratio of the conductive particles and the thermoplastic resin in the conductive adhesive film 33 is usually 1: 5 to 15 parts by mass.
- the thickness of the conductive adhesive film 33 if it is too thin, poor initial adhesion occurs, and if it is too thick, the connection resistance increases, so it is preferably 15-30 ⁇ m, more preferably 15-20 ⁇ m.
- anisotropic conductivity can be imparted to the conductive adhesive film 33 by appropriately selecting the average particle diameter of the conductive particles, the blending ratio of the conductive particles and the thermoplastic resin, or the like.
- the conductive adhesive film 33 of the present invention has aluminum hydroxide particles, hollow solder particles, high-temperature expansion type micropores so that the current flowing between the electrodes can be interrupted when the solar cell module is overheated.
- a material that exhibits a current interrupting ability during overheating, such as a capsule, can be included.
- a high-temperature expansion type microcapsule can be preferably blended from the point that the cutoff temperature can be selected.
- the current interrupting mechanisms of these materials are different from each other.
- aluminum hydroxide particles when heated to 200 to 300 ° C., a dehydration reaction occurs, so that aluminum oxide and water are generated. Furthermore, in order to expand
- hollow solder particles that can also be used as conductive particles
- the aluminum hydroxide particles particles having a particle diameter of 3 to 5 ⁇ m can be preferably used.
- the amount is too small, the current blocking effect cannot be said to be sufficient, and if it is too large, conduction failure occurs, so preferably 2 parts per 100 parts by mass of the thermoplastic resin. -10 parts by mass, more preferably 5-7 parts by mass.
- the hollow solder particles particles having a particle size of 10 to 15 ⁇ m can be preferably used.
- the hollow part diameter of the solder particles is preferably 5 to 7 ⁇ m.
- Such hollow solder particles can be prepared by a known method.
- the high-temperature expansion type microcapsule is obtained by coating a foaming agent (for example, a low boiling point hydrocarbon such as hexane or octane) with a thermoplastic resin such as acrylonitrile polymer, and preferably has a particle size of 30 to 40 ⁇ m and a film thickness. Spherical particles having a size of 2 to 15 ⁇ m and a foaming ratio of 50 to 100 times.
- a foaming agent for example, a low boiling point hydrocarbon such as hexane or octane
- thermoplastic resin such as acrylonitrile polymer
- Examples include Die Form V series (V307, V-308, etc.), Kureha's Kureha Microsphere series, etc.
- Die Form V series V307, V-308, etc.
- Kureha's Kureha Microsphere series etc.
- it is preferably 2 to 7 parts by mass, more preferably 3 to 5 parts by mass.
- the tab wire 34 used in the production method of the present invention is used as an outer lead for the surface electrode of a thin film solar cell in a conventional thin film solar cell module, and is a metal foil ribbon, preferably copper.
- a foil ribbon can be used.
- the surface roughness (Rz (JIS B0601-2001)) of the tab wire 34 on the conductive adhesive film side is preferably 5 to 15 ⁇ m, more preferably 10 to 15 ⁇ m.
- the adhesiveness to the tab wire 34 of the electroconductive adhesive film 33 can be improved, and the effect of reducing connection resistance is acquired.
- the connection resistance increases, and when it exceeds, there is a tendency for initial adhesion failure to occur.
- the surface roughness of the tab wire 34 can be adjusted by a known method, a sand blast method, a soft etching method using a chemical abrasive, or the like.
- the conductive adhesive film 33 and the tab wire 34 used in the production method of the present invention can be integrated in advance according to a conventional method. Thereby, operation at the time of use of a vacuum laminator can be simplified.
- the integration can be performed by applying a conductive adhesive paint to the copper foil, drying, and curing as necessary.
- a moisture-proof back sheet 36 and a glass plate are laminated on the sealing resin sheet 35, and these are used in conventionally known thin-film solar cell modules. Can be appropriately selected and used.
- the sealing resin sheet 35 and the moisture-proof back sheet 36 or the glass plate can be integrated in advance. Thereby, operation at the time of use of a vacuum laminator can be simplified.
- the integration can be performed by applying a sealing resin solution to the moisture-proof back sheet 36 or the glass plate and drying it.
- the thin-film solar cell 32 having the surface electrode 31 examples include a thin-film solar cell using a thin-film photoelectric conversion element that is required to perform bonding of the tab wire 34 and resin sealing.
- conventionally well-known material can be employ
- FIG. As shown, a power extraction tab is connected to a photoelectric conversion element at both ends of a solar cell module in which long thin film photoelectric conversion elements are directly connected in the lateral direction and is resin-sealed (Japanese Patent Laid-Open No. 2000-340811). 3 and 4 of the publication) is also within the scope of the present invention.
- thin-film solar cells 32 made of thin-film light conversion elements are arrayed in series in a planar direction on a substrate 38, and the surface electrode (not shown) of the thin-film solar cell 32c at one end is arranged.
- a surface electrode (not shown) of the thin-film solar cell 32d at the other end a tab wire 34 for taking out electric power is pressed at room temperature or low temperature (about 30 to 120 through a conductive adhesive film). ° C) by applying pressure to temporarily attach the thin film solar cell unit 100.
- a thin film solar cell module can be obtained from a plurality of thin film solar cells.
- the surface electrodes at both ends and the power extraction tab line can be connected together.
- Reference Examples 1 to 3 (sealing resin sheet) and Reference Examples 4 to 6 (conductive adhesive film)
- Example 1 the components blended in Table 1 were melt-mixed, and a 0.5 mm thick sealing resin sheet was produced from the mixture by extrusion molding.
- Reference Examples 4 to 5 the components of the composition shown in Table 1 were mixed, and a mixture in which toluene was added to a solid content concentration of 30% was applied to a polyester base that had been subjected to release treatment using a roll coater.
- the conductive adhesive film was manufactured by applying to a dry thickness of 25 ⁇ m and drying in an oven at 80 ° C.
- the thickness is 30 mm, the length is 80 mm, and the thickness is 0 mm having a line-shaped Ag electrode, Al electrode or ITO electrode with a width of 2.0 mm and a pitch of 2.0 mm.
- a conductive adhesive film (width 2 mm, length 5 mm, thickness 0.05 mm) from which a glass substrate is placed and the polyester base is removed is placed on the heating stage in the second chamber of the decompression laminator shown in FIG. Further, a tab wire was overlaid thereon, and further a pressure film, a sealing resin sheet, and a moisture-proof backsheet were overlaid thereon. While maintaining the stage at 150 ° C., both the first chamber and the second chamber were decompressed to 133 Pa, and then the atmosphere was introduced into the first chamber while maintaining the decompression of the second chamber to atmospheric pressure. After maintaining this state for 5 minutes, the atmosphere was introduced into the second chamber to be atmospheric pressure. This obtained the thin film type solar cell module for a test. Tab wire connection and resin sealing could be performed at a relatively low process temperature in the resin sealing process.
- Comparative Example 1 The procedure of Example 1 is repeated except that a 30 mm ⁇ 80 mm ⁇ 0.5 mm ethylene-vinyl acetate copolymer sheet (PVC-TG, Sekisui Chemical Co., Ltd.) is used as the sealing resin sheet. Thus, a thin film type solar cell module for comparison was obtained.
- a 30 mm ⁇ 80 mm ⁇ 0.5 mm ethylene-vinyl acetate copolymer sheet PVC-TG, Sekisui Chemical Co., Ltd.
- the thin film type solar cell module was measured at 85 ° C. and 85% RH. The sample was left in the environment for 1000 hours, and the resistance value between adjacent electrodes was measured. Based on the measured value, the connection reliability of the thin film solar cell module was scored according to the following criteria. The obtained results are shown in Table 2. The higher the score, the better the connection reliability.
- connection reliability score is 14 points or more, it is evaluated as “AAA”, 11 to 13 points are evaluated as “AA”, and 9 to 10 points are evaluated as “A”. The case of 6-8 points was evaluated as “B”, and 5 points or less were evaluated as “C”. Practically, “AAA”, “AA”, “A” or “B” is desired.
- Example 1 The results of Examples 1 to 10 indicate that it is preferable to use flaky Ni as the conductive particles. Further, from the results of Examples 5 and 6, it can be seen that applying Au plating to the conductive particles is effective in improving the connection reliability. Particularly, in Example 1, since the conductive adhesive film was more easily melted than the sealing resin sheet and flaky Ni was used as the conductive particles, the connection reliability was the best. Especially, the connection reliability of the thin film type solar cell modules of Example 1 and Example 10 was particularly excellent.
- thermoplastic resin and the sealing resin are compatible with each other. For this reason, a tab wire connection process and a resin sealing process can be performed at a time at a relatively low process temperature of the resin sealing process. In addition, a connection strength greater than the width of the tab wire can be obtained, sealing properties are improved, and long-term reliability of solar cell characteristics is improved. Therefore, the manufacturing method of the present invention is useful for manufacturing a solar cell module with excellent long-term reliability.
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Abstract
Description
該封止用樹脂として、該導電性接着フィルムを構成する熱可塑性樹脂と互いに相溶するものを使用し、
減圧ラミネーターとして、可撓性シートにより区画された第1室と第2室とを有し、各室はそれぞれ独立的に内圧調整が可能となっており、第2室内に加熱が可能な加熱ステージを有するものを使用し、
減圧ラミネーターの第2室の加熱ステージ上に、表面電極が形成された太陽電池セルを置き、該表面電極上に導電性接着フィルム、タブ線を順次配置し、更に、太陽電池セル全体を覆うようにシート状の封止用樹脂、その上に防湿性バックシート又はガラスプレートを配置し、
減圧ラミネーターの第2室に対し第1室の内圧を相対的に高くすることにより可撓性シートで防湿性バックシート又はガラスプレートを押圧しつつ、加熱ステージで太陽電池セルを加熱し、それにより薄膜型太陽電池セルの表面電極とタブ線とを導電性接着フィルムで接続し、且つ薄膜型太陽電池セルを封止用樹脂で樹脂封止し、それにより太陽電池モジュールを得ることを特徴とする製造方法を提供する。
このような減圧ラミネーター10は、例えば、図2A~図2Eに示すように使用する。
まず、図2Aに示すように、上部ユニット11と下部ユニット12とを分離し、ステージ21上に、熱圧着すべき積層物22を載置する。
タブ線34の表面粗さの調整は、公知の手法、サンドブラスト法、化学研磨剤を使用するソフトエッチング法等により行うことができる。
参考例1~3(封止用樹脂シート)及び参考例4~6(導電性接着フィルム)
*1: エストランETHD95A、BASFジャパン(株)
*2: エストラン1175A-10W、BASFジャパン(株)
*3: エストランET370、BASFジャパン(株)
*4: ブラック880 M50、BASFジャパン(株)
*5: UNE、BASFジャパン(株)
*6: KE9463、ラインケミージャパン(株)
*7: KBE9007、信越化学工業(株)
*8: アルコンP125、荒川化学工業(株)
*9: F190D、松本油脂製薬(株)
*10:(後述する実施例、比較例指定の粒子)
表2に示す封止用樹脂シート及び導電性接着フィルムに加え、巾2.0mmで2.0mmピッチのライン状のAg電極、Al電極又はITO電極を有する厚さ30mm、長さ80mm、厚み0.7mmのガラス板を薄膜型太陽電池セルの代用として使用し、更に、表面粗度Rz(JIS B0601-2001)が10μm(2mm幅×0.15mm厚みのCu線)をタブ線として使用し、そして75μm厚のポリエチレンテレフタレートフィルム(X10S、東レ(株))を防湿性バックシートとして使用し、以下に説明するように試験用の薄膜型太陽電池モジュールを作成した。
封止用樹脂シートとして、30mm×80mm×0.5mmのエチレン-酢酸ビニル共重合体シート(PVC-TG、積水化学工業(株))を使用すること以外は、実施例1の操作を繰り返すことにより、比較のための薄膜型太陽電池モジュールを得た。
薄膜型太陽電池モジュールの長期信頼性、並びに薄膜型太陽電池モジュールにおける封止用樹脂シートの封止性、密着性を同時に評価するために、薄膜型太陽電池モジュールを、85℃、85%RHの環境下に1000時間放置し、隣接する電極間の抵抗値を測定し、その測定値に基づき、薄膜型太陽電池モジュールの接続信頼性を以下の基準にて点数化した。得られた結果を表2に示す。点数が高いほど良好な接続信頼性を示している。
5 抵抗値が0.03Ω未満である場合
4 抵抗値が0.03Ω以上0.1Ω未満である場合
3 抵抗値が0.1Ω以上0.3Ω未満である場合
2 抵抗値が0.3Ω以上1.0Ω未満である場合
1 抵抗値が1.0Ω以上である場合
接続信頼性の合計点が14点以上である場合を「AAA」と評価し、11~13点を「AA」と評価し、9~10点である場合を「A」と評価し、6~8点である場合を「B」と」評価し、5点以下を「C」と評価した。実用的には、「AAA」、「AA」、「A」又は「B」であることが望まれる。
*11: HCA-1、ノバメット(株)
*12: ニッケルパウダー(タイプ255、バーレインコ(株))を平均粒径が5μmとなるように分級後、置換メッキにより金をニッケル表面にメッキしたもの
*13: 導電性粒子(AUE-10μm、積水化学工業(株))
*14: ニッケルパウダー(タイプ255、バーレインコ(株))
*15: ニッケルパウダー(タイプ255、バーレインコ(株))を平均粒径が5μmとなるように分級したもの
*16: ニッケルパウダー(タイプ255、バーレインコ(株))を平均粒径が10μmとなるように分級したもの
11 上部ユニット
12 下部ユニット
13 シール部材
14 可撓性シート
15 第1室
16 第2室
17、17a、17b、18、18a、18b 配管
19、20 切替バルブ
30 太陽電池モジュール
31 表面電極
32、32a、32b、32c、32d 薄膜型太陽電池セル
33 導電性接着フィルム
34 タブ線
35 封止用樹脂シート
36 防湿性バックシート
100 薄膜型太陽電池ユニット
Claims (11)
- 導電粒子が熱可塑性樹脂中に分散してなる導電性接着フィルムでタブ線が接続された表面電極を有する薄膜型太陽電池セルが封止用樹脂で樹脂封止されてなる構造を有する薄膜型太陽電池モジュールを減圧ラミネーターを用いて製造する方法であって、
該封止用樹脂として、該導電性接着フィルムを構成する熱可塑性樹脂と互いに相溶するものを使用し、
減圧ラミネーターとして、可撓性シートにより区画された第1室と第2室とを有し、各室はそれぞれ独立的に内圧調整が可能となっており、第2室内に加熱が可能な加熱ステージを有するものを使用し、
減圧ラミネーターの第2室の加熱ステージ上に、表面電極が形成された太陽電池セルを置き、該表面電極上に導電性接着フィルム、タブ線を順次配置し、更に、太陽電池セル全体を覆うようにシート状の封止用樹脂、その上に防湿性バックシート又はガラスプレートを配置し、
減圧ラミネーターの第2室に対し第1室の内圧を相対的に高くすることにより可撓性シートで防湿性バックシート又はガラスプレートを押圧しつつ、加熱ステージで太陽電池セルを加熱し、それにより薄膜型太陽電池セルの表面電極とタブ線とを導電性接着フィルムで接続し、且つ薄膜型太陽電池セルを封止用樹脂で樹脂封止し、それにより太陽電池モジュールを得ることを特徴とする製造方法。 - 減圧ラミネーターの第2室に対し第1室の内圧を相対的に高くする操作が、第1室および第2室の内圧を共に減圧状態とした後、第2室の減圧状態を維持したまま第1室を大気に解放することである請求項1記載の製造方法。
- 該導電性接着フィルムを構成する熱可塑性樹脂の溶融粘度が、封止用樹脂の溶融粘度より低い請求項1又は2記載の製造方法。
- 熱可塑性樹脂及び封止用樹脂が、ポリウレタン樹脂である請求項1~3のいずれかに記載の製造方法。
- ポリウレタン樹脂が、エステルポリオールポリウレンとエーテルポリオールポリウレンとを、質量比10:90~30:70で含有するブレンドポリマーである請求項4記載の製造方法。
- タブ線の導電性接着フィルム側表面粗さ(Rz)が、5~15μmである請求項1~5のいずれかに記載の製造方法。
- 導電性接着フィルムとタブ線とが予め一体化されている請求項1~6のいずれかに記載の製造方法。
- 封止用樹脂と、防湿性バックシート又はガラスプレートとが予め一体化されている請求項1~6のいずれかに記載の製造方法。
- 複数の薄膜型太陽電池セルが直列に接続されている請求項1~8のいずれかに記載の製造方法。
- 導電性接着フィルムが、更に高温膨張型マイクロカプセルを含有する請求項1~9のいずれかに記載の製造方法。
- 請求項1~10のいずれかに記載の製造方法により製造された太陽電池モジュール。
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US13/574,125 US20120291866A1 (en) | 2010-02-15 | 2011-02-07 | Method of manufacturing thin-film solar cell module |
CN201180009644.1A CN102742028B (zh) | 2010-02-15 | 2011-02-07 | 薄膜型太阳电池模块的制造方法 |
EP11742196.6A EP2538451A4 (en) | 2010-02-15 | 2011-02-07 | METHOD FOR PRODUCING A THIN-LAYER SOLAR CELL MODULE |
KR1020127018174A KR101420031B1 (ko) | 2010-02-15 | 2011-02-07 | 박막형 태양 전지 모듈의 제조 방법 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013219338A (ja) * | 2012-03-16 | 2013-10-24 | Tokyo Univ Of Agriculture & Technology | 積層ソーラーセルの製造方法、積層ソーラーセル、及び積層ソーラーセルの製造装置 |
WO2014155973A1 (ja) * | 2013-03-25 | 2014-10-02 | 三洋電機株式会社 | タブ線の製造方法、太陽電池モジュールの製造方法、太陽電池モジュール |
US20140349438A1 (en) * | 2011-07-04 | 2014-11-27 | Nisshinbo Mechatronics Inc. | Diaphragm sheet, and method for manufacturing solar cell module using diaphragm sheet |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001177119A (ja) * | 1999-12-16 | 2001-06-29 | Canon Inc | 太陽電池モジュールの製造方法及び製造装置 |
JP2004179261A (ja) * | 2002-11-25 | 2004-06-24 | Kyocera Corp | 太陽電池モジュールの製造装置及び製造方法 |
JP2005101519A (ja) * | 2003-09-05 | 2005-04-14 | Hitachi Chem Co Ltd | 太陽電池ユニット及び太陽電池モジュール |
JP2005203577A (ja) * | 2004-01-15 | 2005-07-28 | Mitsubishi Heavy Ind Ltd | 太陽電池製造方法及び太陽電池 |
WO2008044357A1 (fr) * | 2006-10-10 | 2008-04-17 | Hitachi Chemical Company, Ltd. | Structure connectée et son procédé de fabrication |
JP2009224598A (ja) * | 2008-03-17 | 2009-10-01 | Sharp Corp | 太陽電池モジュールおよび太陽電池モジュールの製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0652801B2 (ja) * | 1984-09-12 | 1994-07-06 | 株式会社東芝 | 太陽電池パネルの製造方法 |
JPH01212480A (ja) * | 1988-02-19 | 1989-08-25 | Sanyo Electric Co Ltd | 太陽電池のモジュール化方法 |
GB8826702D0 (en) * | 1988-11-15 | 1988-12-21 | Bostik Ltd | Moisture-curing polyurethane hot-melt compositions |
ATE362656T1 (de) * | 1999-03-23 | 2007-06-15 | Kaneka Corp | Photovoltaisches modul |
EP1059675B1 (en) * | 1999-06-08 | 2009-05-20 | Kaneka Corporation | Method of encapsulating a photovoltaic module by an encapsulating material |
EP1194467A1 (en) * | 1999-06-11 | 2002-04-10 | Eastman Chemical Resins, Inc. | Polyols, polyurethane systems and polyurethane reactive hot melt adhesives produced thereon |
JP4727021B2 (ja) * | 2000-05-22 | 2011-07-20 | 株式会社クレハ | 電極及びそれを用いた非水系電池 |
US6613381B1 (en) * | 2000-10-20 | 2003-09-02 | 3M Innovative Properties Company | Thermoplastic additives for hot melt adhesives based on non-thermoplastic hydrocarbon elastomers |
AU2002301252B2 (en) * | 2001-10-12 | 2007-12-20 | Bayer Aktiengesellschaft | Photovoltaic modules with a thermoplastic hot-melt adhesive layer and a process for their production |
JP4927317B2 (ja) * | 2002-02-01 | 2012-05-09 | シェル・エルノイエルバーレ・エネルギエン・ゲーエムベーハー | 高分子量ポリオール含有硬化性樹脂製のバリヤー層 |
JP3875708B2 (ja) * | 2002-10-25 | 2007-01-31 | 中島硝子工業株式会社 | 太陽電池モジュールの製造方法 |
JP2006041349A (ja) * | 2004-07-29 | 2006-02-09 | Canon Inc | 光起電力素子およびその製造方法 |
US20070155859A1 (en) * | 2006-01-04 | 2007-07-05 | Zhengzhe Song | Reactive polyurethane hot melt adhesive |
JPWO2007125903A1 (ja) * | 2006-04-26 | 2009-09-10 | 日立化成工業株式会社 | 接着テープ及びそれを用いた太陽電池モジュール |
JP5115553B2 (ja) * | 2007-05-09 | 2013-01-09 | 日立化成工業株式会社 | 導電体接続用部材、接続構造及び太陽電池モジュール |
JP4974301B2 (ja) * | 2008-04-04 | 2012-07-11 | 昭和シェル石油株式会社 | 太陽電池モジュールの製造方法 |
JP2009295940A (ja) * | 2008-06-09 | 2009-12-17 | Mitsubishi Electric Corp | 太陽電池セルおよび太陽電池モジュール |
-
2011
- 2011-02-07 EP EP11742196.6A patent/EP2538451A4/en not_active Withdrawn
- 2011-02-07 KR KR1020127018174A patent/KR101420031B1/ko active IP Right Grant
- 2011-02-07 WO PCT/JP2011/052535 patent/WO2011099452A1/ja active Application Filing
- 2011-02-07 JP JP2011023690A patent/JP5488489B2/ja active Active
- 2011-02-07 US US13/574,125 patent/US20120291866A1/en not_active Abandoned
- 2011-02-07 CN CN201180009644.1A patent/CN102742028B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001177119A (ja) * | 1999-12-16 | 2001-06-29 | Canon Inc | 太陽電池モジュールの製造方法及び製造装置 |
JP2004179261A (ja) * | 2002-11-25 | 2004-06-24 | Kyocera Corp | 太陽電池モジュールの製造装置及び製造方法 |
JP2005101519A (ja) * | 2003-09-05 | 2005-04-14 | Hitachi Chem Co Ltd | 太陽電池ユニット及び太陽電池モジュール |
JP2005203577A (ja) * | 2004-01-15 | 2005-07-28 | Mitsubishi Heavy Ind Ltd | 太陽電池製造方法及び太陽電池 |
WO2008044357A1 (fr) * | 2006-10-10 | 2008-04-17 | Hitachi Chemical Company, Ltd. | Structure connectée et son procédé de fabrication |
JP2009224598A (ja) * | 2008-03-17 | 2009-10-01 | Sharp Corp | 太陽電池モジュールおよび太陽電池モジュールの製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2538451A4 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140349438A1 (en) * | 2011-07-04 | 2014-11-27 | Nisshinbo Mechatronics Inc. | Diaphragm sheet, and method for manufacturing solar cell module using diaphragm sheet |
JP2013219338A (ja) * | 2012-03-16 | 2013-10-24 | Tokyo Univ Of Agriculture & Technology | 積層ソーラーセルの製造方法、積層ソーラーセル、及び積層ソーラーセルの製造装置 |
WO2014155973A1 (ja) * | 2013-03-25 | 2014-10-02 | 三洋電機株式会社 | タブ線の製造方法、太陽電池モジュールの製造方法、太陽電池モジュール |
WO2014155413A1 (ja) * | 2013-03-25 | 2014-10-02 | 三洋電機株式会社 | タブ線の製造方法 |
Also Published As
Publication number | Publication date |
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KR101420031B1 (ko) | 2014-07-16 |
EP2538451A1 (en) | 2012-12-26 |
EP2538451A4 (en) | 2016-07-20 |
JP2011187943A (ja) | 2011-09-22 |
JP5488489B2 (ja) | 2014-05-14 |
KR20120120224A (ko) | 2012-11-01 |
US20120291866A1 (en) | 2012-11-22 |
CN102742028B (zh) | 2016-02-03 |
CN102742028A (zh) | 2012-10-17 |
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