US20180019292A1 - Element substrate and light-emitting device - Google Patents
Element substrate and light-emitting device Download PDFInfo
- Publication number
- US20180019292A1 US20180019292A1 US15/636,908 US201715636908A US2018019292A1 US 20180019292 A1 US20180019292 A1 US 20180019292A1 US 201715636908 A US201715636908 A US 201715636908A US 2018019292 A1 US2018019292 A1 US 2018019292A1
- Authority
- US
- United States
- Prior art keywords
- light
- transistor
- emitting element
- region
- pixel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000758 substrate Substances 0.000 title description 14
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 15
- 238000004804 winding Methods 0.000 claims 2
- 239000010408 film Substances 0.000 description 74
- 239000010410 layer Substances 0.000 description 72
- 239000012789 electroconductive film Substances 0.000 description 35
- 238000000034 method Methods 0.000 description 24
- 238000010586 diagram Methods 0.000 description 23
- 239000011229 interlayer Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 14
- 230000014759 maintenance of location Effects 0.000 description 12
- 239000012535 impurity Substances 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 7
- 230000008859 change Effects 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910052760 oxygen Inorganic materials 0.000 description 7
- 239000001301 oxygen Substances 0.000 description 7
- 229910021417 amorphous silicon Inorganic materials 0.000 description 5
- -1 silicon oxide nitride Chemical class 0.000 description 5
- 229910017073 AlLi Inorganic materials 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 4
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 4
- 229910003437 indium oxide Inorganic materials 0.000 description 4
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- AHLBNYSZXLDEJQ-FWEHEUNISA-N orlistat Chemical compound CCCCCCCCCCC[C@H](OC(=O)[C@H](CC(C)C)NC=O)C[C@@H]1OC(=O)[C@H]1CCCCCC AHLBNYSZXLDEJQ-FWEHEUNISA-N 0.000 description 4
- 230000000717 retained effect Effects 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 239000000872 buffer Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000005283 ground state Effects 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 238000002294 plasma sputter deposition Methods 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 101000666730 Homo sapiens T-complex protein 1 subunit alpha Proteins 0.000 description 1
- 101000777301 Homo sapiens Uteroglobin Proteins 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 102100038410 T-complex protein 1 subunit alpha Human genes 0.000 description 1
- 102100031083 Uteroglobin Human genes 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000005001 laminate film Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H01L27/3262—
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/04—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of a single character by selection from a plurality of characters, or by composing the character by combination of individual elements, e.g. segments using a combination of such display devices for composing words, rows or the like, in a frame with fixed character positions
- G09G3/06—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of a single character by selection from a plurality of characters, or by composing the character by combination of individual elements, e.g. segments using a combination of such display devices for composing words, rows or the like, in a frame with fixed character positions using controlled light sources
- G09G3/12—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of a single character by selection from a plurality of characters, or by composing the character by combination of individual elements, e.g. segments using a combination of such display devices for composing words, rows or the like, in a frame with fixed character positions using controlled light sources using electroluminescent elements
- G09G3/14—Semiconductor devices, e.g. diodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
- G09G3/3225—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
- G09G3/3233—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
- G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
- G09G3/3275—Details of drivers for data electrodes
- G09G3/3291—Details of drivers for data electrodes in which the data driver supplies a variable data voltage for setting the current through, or the voltage across, the light-emitting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
-
- H01L27/3248—
-
- H01L27/3276—
-
- H01L51/52—
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0421—Structural details of the set of electrodes
- G09G2300/0426—Layout of electrodes and connections
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/08—Active matrix structure, i.e. with use of active elements, inclusive of non-linear two terminal elements, in the pixels together with light emitting or modulating elements
- G09G2300/0809—Several active elements per pixel in active matrix panels
- G09G2300/0842—Several active elements per pixel in active matrix panels forming a memory circuit, e.g. a dynamic memory with one capacitor
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/08—Active matrix structure, i.e. with use of active elements, inclusive of non-linear two terminal elements, in the pixels together with light emitting or modulating elements
- G09G2300/0809—Several active elements per pixel in active matrix panels
- G09G2300/0842—Several active elements per pixel in active matrix panels forming a memory circuit, e.g. a dynamic memory with one capacitor
- G09G2300/0861—Several active elements per pixel in active matrix panels forming a memory circuit, e.g. a dynamic memory with one capacitor with additional control of the display period without amending the charge stored in a pixel memory, e.g. by means of additional select electrodes
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2310/00—Command of the display device
- G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
- G09G2310/0243—Details of the generation of driving signals
- G09G2310/0251—Precharge or discharge of pixel before applying new pixel voltage
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2320/00—Control of display operating conditions
- G09G2320/02—Improving the quality of display appearance
- G09G2320/0219—Reducing feedthrough effects in active matrix panels, i.e. voltage changes on the scan electrode influencing the pixel voltage due to capacitive coupling
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2320/00—Control of display operating conditions
- G09G2320/02—Improving the quality of display appearance
- G09G2320/0233—Improving the luminance or brightness uniformity across the screen
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/2007—Display of intermediate tones
- G09G3/2018—Display of intermediate tones by time modulation using two or more time intervals
- G09G3/2022—Display of intermediate tones by time modulation using two or more time intervals using sub-frames
-
- H01L2251/5323—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1222—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1251—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs comprising TFTs having a different architecture, e.g. top- and bottom gate TFTs
-
- H01L27/3244—
-
- H01L27/3246—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
- H01L29/78675—Polycrystalline or microcrystalline silicon transistor with normal-type structure, e.g. with top gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3031—Two-side emission, e.g. transparent OLEDs [TOLED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
Definitions
- the present invention relates to a light-emitting device in which each of pixels is provided with a light-emitting element and a means for supplying a current to the light-emitting element and an element substrate.
- a light-emitting element is high in visibility and optimum for low profiling since it emits light and does not require any backlight which is required in a liquid crystal display device (LCD), and that has no limitation in visual angle. Therefore, in recent years, a light-emitting device using the light-emitting element has attracted attention as a display device alternative to a CRT and the LCD.
- the light-emitting element means an element whose luminosity is controlled by a current or a voltage
- an OLED Organic Light Emitting Diode
- an MIM type electron source element electron emitting element
- FED Field Emission Display
- the light-emitting device includes a panel and a module having an IC or the like including a controller mounted on the panel.
- This invention also relates to an element substrate equivalent to one mode achieved before a completion of the panel in a process of manufacturing the light-emitting device, and each of pixels in the element substrate is provided with a means for supplying a current to the light-emitting element.
- the OLED Organic Light Emitting Diode
- the OLED which is a variation of the light-emitting element has a layer comprising an electro-luminescent material capable of obtaining luminescence (electro-luminescence) generated upon application of an electric field (hereinafter referred to as an electro-luminescent layer), an anode layer, and a cathode layer.
- the electro-luminescent layer is provided between the anode and the cathode and constituted of a layer or a plurality of layers. In some cases, an inorganic compound is contained in the layer or layers.
- a light emission (fluorescence) generated when a singlet excitation state returns to a ground state and a light emission (phosphorescence) generated when a triplet excitation state returns to a ground state are included in the luminescence in the electro-luminescent layer.
- the pixel shown in FIG. 7 has a switching transistor 700 , a driving transistor 701 , a capacitance element 702 , and a light-emitting element 703 .
- a gate of the switching transistor 700 is connected to a scan line 705 , and a source thereof is connected to a signal line 704 when a drain thereof is connected to a gate of the driving transistor 701 .
- a source of the driving transistor 701 is connected to a power line 706 , and a drain thereof is connected to an anode of the light-emitting element 703 .
- a cathode of the light-emitting element 703 is connected to a counter electrode 707 .
- the capacitance element 702 is provided in such a manner as to retain a potential difference between the gate and the source of the driving transistor 701 .
- Predetermined voltages are applied separately to the power line 706 and the counter electrode 707 , so that the power line 706 and the counter electrode 707 have a potential difference therebetween.
- a video signal input to the signal line 704 is input to the gate of the driving transistor 701 .
- a potential difference between a potential of the input video signal and the power line 706 becomes a gate/source voltage Vgs, so that a current is supplied to the light-emitting element 703 to cause the light-emitting element 703 to emit light.
- a transistor using polysilicon for example, is suitably used as a transistor of the light-emitting device since it has a high field effect mobility and a large on-current.
- the transistor using polysilicon has a drawback that a variation in characteristics tends to occur due to a defect formed in a grain boundary.
- Ids ⁇ ( Vgs ⁇ Vth ) 2 /2 (1)
- Vgs of the driving transistor 701 is changed by a switching of the switching transistor 700 , a change in potential of the signal line or the scan line, and so forth.
- the problem is attributable to stray capacitance at the gate of the driving transistor 701 .
- an object of this invention is to provide a light-emitting device which does not require the suppression of an off-current of the switching transistor 700 nor the increase in capacitance of the capacitance element 702 and is less subject to the influence of the stray capacitance and capable of suppressing irregularity in luminosity of light-emitting elements 703 of pixels and an element substrate.
- a potential of a gate of a driving transistor is fixed, and the driving transistor is operated in a saturation area so that a current is supplied thereto anytime.
- a current control transistor operating in a linear area is provided serially with the driving transistor, and a video signal for transmitting a signal of emission or non-emission of a pixel is input to a gate of the current control transistor via a switching transistor.
- a source/drain voltage Vds of the current control transistor is small since the current control transistor is operated in the linear area, and a slightest change in the gate/source voltage Vgs of the current control transistor does not influence on the current flowing to the light-emitting element.
- the current flowing to the light-emitting element is decided by the driving transistor operating in the saturation area.
- FIG. 1 is a diagram showing one embodiment of this invention.
- FIG. 2 is a diagram showing another embodiment of this invention.
- FIG. 3 is a diagram showing a general outline of an external circuit and a panel.
- FIG. 4 is a diagram showing one example of a signal line driving circuit.
- FIG. 5 is a diagram showing one example of a top view of this invention.
- FIG. 6 is a diagram showing one example of an electronic appliance to which this invention is applicable.
- FIG. 7 is a diagram showing a conventional example.
- FIG. 8 is a diagram showing another example of the top view of this invention.
- FIG. 9 is a diagram showing one example of a sectional structure of this invention.
- FIG. 10 is a diagram showing one example of an operation timing of this invention.
- FIG. 11 is a diagram showing another example of the sectional structure of this invention.
- FIG. 12 is a diagram showing another embodiment of this invention.
- FIG. 13 is a diagram showing another example of the top view of this invention.
- FIG. 14 is a diagram showing another embodiment of this invention.
- FIG. 15 is a diagram showing another embodiment of this invention.
- FIG. 16 is a diagram showing another example of the top view of this invention.
- FIG. 17 is a diagram showing another example of the top view of this invention.
- FIG. 18 is a diagram showing another example of the sectional structure of this invention.
- FIG. 19 is a diagram showing another example of the sectional structure of this invention.
- FIG. 20 is a diagram showing another example of the top view of this invention.
- FIG. 21 is an illustration of pixel driving methods of this invention.
- FIG. 22 is an illustration of driving methods of an active matrix type light-emitting device.
- FIG. 23 is an illustration of driving methods classified according to a video signal using a voltage and a video signal using a current.
- FIG. 1 One embodiment of a pixel included in a light-emitting device of this invention is shown in FIG. 1 .
- the pixel shown in FIG. 1 has a transistor (switching transistor) 101 used as a switching element for controlling an input of a video signal to the pixel, and a driving transistor 102 for controlling a value of a current flowing to a light-emitting element 104 , and a current control transistor 103 for controlling a supply of the current to the light-emitting element 104 .
- the pixel may be provided with a capacitance element 105 for maintaining a potential of the video signal, as is the case with this embodiment.
- the driving transistor 102 and the current control transistor 103 are identical in conductivity.
- the driving transistor 102 is operated in a saturation area while the current control transistor 103 is operated in a linear area.
- an L of the driving transistor 102 may be longer than a W thereof, and an L of the current control transistor 103 may be equal to or shorter than a W thereof. More preferably, a ratio of the L of the driving transistor 102 to the W thereof may be 5 or more.
- Either one of an enhancement transistor or a depletion transistor may be used as the driving transistor 102 .
- either one of an N-type transistor or a P-type transistor may be used as 20 the switching transistor 101 .
- the light-emitting element 104 is formed of an anode, a cathode, and an electro-luminescent layer provided therebetween.
- the anode serves as the pixel electrode while the cathode serves as a counter electrode.
- the counter electrode is connected to a third power line.
- the capacitance element 105 is provided for the purpose of maintaining a potential difference between the electrodes of the capacitance element 105 when the switching transistor 101 is in a non-selection state (off-state). Note that this invention is not limited to the constitution including the capacitance element 105 shown in FIG. 1 , and it is possible to use a constitution which does not include the capacitance element 105 .
- the P-type transistors are used as the driving transistor 102 and the current control transistor 103 and the drain of the driving transistor 102 is connected to the anode of the light-emitting element 104 .
- the source of the driving transistor 102 is connected to the cathode of the light-emitting element 104 .
- the cathode of the light-emitting element 104 serves as the pixel electrode and the anode thereof serves as the counter electrode.
- Operation of the pixel shown in FIG. 1 can be divided into a write period and a data retention period.
- the current flowing to the light-emitting element 104 is decided depending on the driving transistor 102 operating in the saturation area and a voltage/current characteristic of the light-emitting element 104 .
- the light-emitting element 104 emits light having luminosity corresponding to the supplied current.
- An element substrate is equivalent to one mode achieved before a completion of a formation of the light-emitting element in the course of manufacturing the light-emitting device of this invention.
- a transistor formed by using monocrystalline silicon, a transistor using an SOI, and a thin film transistor using polycrystalline silicon or amorphous silicon may be used as the transistors of this invention.
- a transistor using an organic semiconductor and a transistor using a carbon nanotube may also be used.
- Each of the transistors provided in the pixel of the light-emitting device of this invention may have a single gate structure, a double gate structure, or a multi-gate structure having more than 2 gate electrodes.
- the current control transistor 103 is operated in the linear area to achieve a small source/drain voltage Vds of the current control transistor 103 , and a slight fluctuation in the gate/source voltage Vgs of the current control transistor 103 does not influence on the current flowing to the light-emitting element 104 .
- the current flowing to the light-emitting element 104 is decided by the driving transistor 102 operating in the saturation area. Therefore, it is unnecessary to increase the capacitance of the capacitance element 105 provided between the gate and the source of the current control transistor 103 nor to suppress the off-current of the switching transistor 101 to keep the current flowing to the light-emitting element 104 free from adverse effects. Also, the current flowing to the light-emitting element 104 is free from adverse effects of stray capacitance at the gate of the current control transistor 103 . Since the factors for fluctuation is thus reduced, it is possible to greatly increase image quality.
- the active matrix type light-emitting device is capable of maintaining the current supply to the light-emitting element for a certain period of time after the input of the video signal, it has flexibility toward a large size panel and high definition and is becoming a mainstream product for near future.
- Specific pixel structures of the active matrix type light-emitting devices which have been proposed vary depending light-emitting device manufactures, and each of them has its specific technical contrivance. Shown in FIG. 22 is a systematic illustration of types of driving methods of the active matrix type light-emitting device.
- the driving methods in the active matrix type light-emitting device are generally divided into those using a digital video signal and those using an analog video signal.
- the analog light-emitting devices are further divided into those using current modulation wherein a value of a current to be supplied to the light-emitting element is modulated in an analog manner and those using time modulation wherein gradation is expressed by changing a length of each of on and off of an inverter.
- the current modulation type light-emitting devices can be divided into those having a Tr characteristic correction circuit and those do not have the Tr characteristic correction circuit.
- the Tr characteristic correction circuit is a circuit for correcting a variation in characteristics of driving transistors, and some Tr characteristic correction circuits correct only a threshold value while other Tr characteristic correction circuits correct a current value (threshold value, mobility, and so forth).
- the light-emitting devices having the Tr characteristic correction circuit classified into the current modulation type can be divided into those correcting the threshold value by voltage programming and those correcting the current value by current programming.
- the voltage programming is used for correcting a fluctuation in threshold value of the driving transistor.
- the current programming is used for correcting a fluctuation in current value (including threshold value, mobility, and so forth) of the driving transistor.
- the video signal is input by a current.
- the light-emitting element is a current driving element, and it is more straightforward to use the current value as date because light emission luminosity hinges upon the current.
- the light-emitting devices correcting the current value by the current programming can be divided into those of a current mirror type and those do not use any current mirror.
- the current mirror type has a pixel circuit using a current mirror circuit, and a transistor for setting a current is provided separately from a transistor for supplying a current. Identical characteristics of the two transistors constituting a mirror are a major premise.
- the light-emitting device without current mirror does not use the current mirror circuit, and one transistor performs the current setting and the current supply.
- the light-emitting devices classified into the digital light-emitting device can be divided into those of an area gradation and those of a time gradation.
- the area gradation is used for performing a gradation display by selecting among weights 1:2:4:8 and so forth set in light emission areas of sub-pixels provided in a pixel.
- the time gradation is used for performing a gradation display by selecting among weights 1:2:4:8 and so forth set in light emission periods of sub-frames provided in one frame.
- the time gradation is divided into a DPS (Display Period Separated) driving and an SES (Simultaneous Erasing Scan) driving.
- the sub-frame is constituted of an addressing period and a lighting period.
- the DPS driving is disclosed in M. Mizukami et al., 6-Bit Digital VGA OLED, SID '00 Digest, p. 912.
- the SES driving it is possible to overlap the addressing period with the lighting period by using an erasing transistor, so that the lighting period of the light-emitting element is increased.
- the SES driving is disclosed in K. Inukai et al., 4.0-in. TFT-OLED Displays and a Novel Digital Driving Method, SID '00 Digest, p. 924.
- the SES driving is divided into a constant current driving and a constant voltage driving.
- the constant current driving is used for driving a light-emitting element with a constant current, so that the constant current is supplied irrelevant from a change in resistance of the light-emitting element.
- the constant voltage driving is used for driving a light-emitting element with a constant voltage.
- the light-emitting device of the constant current driving is divided into a light-emitting device with Tr characteristic correction circuit and a light-emitting device without Tr characteristic correction circuit.
- a light-emitting device (CCT 1 ) driven by the method disclosed in PCT publication NO. WO 03/027997 and a light-emitting device (CCSP) driven by the method disclosed in Japanese Patent Application No. 2002-056555 are included in the light-emitting device with Tr characteristic correction circuit.
- the light-emitting device without Tr characteristic correction circuit is further divided into a long channel length driving Tr type and a fixed gate potential for light emission type.
- the long channel length driving Tr type is disclosed in Japanese Patent Application No. 2002-025065.
- the long channel length driving Tr type is used for suppressing a characteristics variation in driving transistors during the constant current driving. By greatly elongating the gate length, it is unnecessary to use Vgs near the threshold value, thereby suppressing a fluctuation in value of the current flowing to the light-emitting element of each of pixels.
- the fixed gate potential for light emission is used for fixing a potential of a gate of a driving transistor during the light emission period of the light emission element at a value with which the driving transistor is turned on to keep Vgs of the driving transistor at a constant value, thereby improving display defect.
- Data are input to a gate of a current control transistor disposed serially with the driving transistor.
- the light-emitting device of this invention is classified under the long channel length driving Tr type using the fixed gate potential for light emission.
- Shown in FIG. 23 is an illustration of driving methods classified according to a video signal using a voltage and a video signal using a current.
- the driving methods are divided into those wherein a video signal to be input to the pixel is at a constant voltage (CV) in the light emission of the light-emitting element and those wherein a video signal to be input to the pixel is at a constant current (CC) in the light emission of the light-emitting element.
- Those wherein the video signal is the constant current (CV) are divided into a driving method wherein a voltage applied to the light-emitting element has a constant value (CVCV) and a driving method wherein a current applied to the light-emitting element has a constant value (CCCC).
- a pixel shown in FIG. 2 has a light-emitting element 204 , a switching transistor 201 , a driving transistor 202 , a current control transistor 203 , and a transistor 206 (erasing transistor) for forcibly turning off the current control transistor 203 .
- the pixel may be provided with a capacitance element 205 in addition to the above elements.
- the driving transistor 202 and the current control transistor 203 are identical in conductivity.
- the driving transistor 202 is operated in a saturation area while the current control transistor 203 is operated in a linear area.
- an L of the driving transistor 202 may be longer than a W thereof, and an L of the current control transistor 203 may be equal to or shorter than a W thereof. More preferably, a ratio of the L of the driving transistor 202 to the W thereof may be 5 or more.
- Either one of an enhancement transistor or a depletion transistor may be used as the driving transistor 202 .
- Either one of an N-type transistor or a P-type transistor may be used as the switching transistor 201 and the erasing transistor 206 .
- the light-emitting element 204 is formed of an anode, a cathode, and an electro-luminescent layer provided between the anode and the cathode.
- the anode serves as the pixel electrode while the cathode serves as a counter electrode.
- the counter electrode is connected to a third power line.
- P-type transistors are used as the driving transistor 202 and the current control transistor 203 , and the drain of the driving transistor 202 is connected to the anode of the light-emitting element 204 .
- the source of the driving transistor 202 is connected to the cathode of the light-emitting element 204 .
- the cathode of the light-emitting element 204 serves as the pixel electrode, and the anode thereof serves as the counter electrode.
- Operation of the pixel shown in FIG. 2 can be divided into a write period, a data retention period, and an erasing period. Operations of the switching transistor 201 , the driving transistor 202 , and the current control transistor 203 in the write period and data retention period are the same as those of FIG. 1 .
- FIG. 21(A) Shown in FIG. 21(A) is an operation when the current control transistor 203 is turned on by a video signal during the write period, and shown in FIG. 21(B) is an operation when the current control transistor 203 is in an off-state during the write period. Shown in FIG. 21(C) is an operation when the current control transistor 203 is in an on-state during the data retention period, and shown in FIG. 21(D) is an operation during the erasing period.
- the switching transistor 210 , the current control transistor 203 , and the erasing transistor 206 used as switching elements are illustrated in FIGS. 21(A) to 21(D) as switches.
- the current flowing to the light-emitting element 204 is decided depending on the driving transistor 202 operating in the saturation area and a voltage/current characteristic of the light-emitting element 204 .
- the light-emitting element 204 emits light having luminosity corresponding to the supplied current.
- FIG. 3 Shown in FIG. 3 are a block diagram of an external circuit and a schematic view of a panel.
- the active matrix type display device has an external circuit 3004 and a panel 3010 .
- the external circuit 3004 has an A/D converter 3001 , a power unit 3002 , and a signal generation unit 3003 .
- the A/D converter 3001 converts an image signal which is input as an analog signal into a digital signal (video signal) to supply the digital signal to a signal line driving circuit 3006 .
- the power unit 3002 generates powers each having a desired voltage from a power supplied from a battery or an electric outlet to supply the powers separately to the signal driving circuit 3006 , a scan line driving circuit 3007 , a light-emitting element 3001 , the signal generation unit 3003 , and so forth.
- the power, the image signal, and a synchronizing signal are input to the signal generation unit 3003 , and the signal generation unit 3003 performs conversions of various signals to generate clock signals for driving the signal line driving circuit 3006 and the scan line driving circuit 3007 and like signals.
- a signal and a power sent from the external circuit 3004 are input from an FPC connecting unit 3005 disposed inside the panel 3010 to an internal circuit and the like through an FPC.
- the panel 3010 has a substrate 3008 on which the FPC connection unit 3005 , the internal circuit, and the light-emitting element 3011 are mounted.
- the internal circuit has the signal line driving circuit 3006 , the scan line driving circuit 3007 , and a pixel unit 3009 .
- the pixel which is described in Embodiment 1 is shown in FIG. 3 by way of example, it is possible to use any one of the pixels described in the embodiments of this invention as the pixel unit 3009 .
- the pixel unit 3009 is disposed on the center of the substrate, and the signal line driving circuit 3006 and the scan line driving circuit 3007 are disposed around the pixel unit 3009 .
- the light-emitting element 3011 and a counter electrode of the light-emitting element is formed on a whole surface of the pixel unit 3009 .
- FIG. 4 Shown in FIG. 4 is a block diagram showing the signal line driving circuit 3006 in detail.
- the signal line driving circuit 3006 has a shift resistor 4002 consisting of a plurality of D-flip flops 4001 , data latch circuits 4003 , latch circuits 4004 , level shifters 4005 , buffers 4006 , and the like.
- Signals used in this example as those input to the signal line driving circuit 3006 are a clock signal line (S-CK), a reverse clock signal line (S-CKB), a start pulse (S-SP), a video signal (DATA), and a latch pulse.
- S-CK clock signal line
- S-CKB reverse clock signal line
- S-SP start pulse
- DATA video signal
- latch pulse a latch pulse
- Sampling pulses are output from the shift register 4002 sequentially in accordance with timings of the clock signal, the clock reverse signal, and the start pulse.
- the sampling pulses are input to the data latch circuit 4003 , so that the video signal is fetched and retained at the timing of the input. This operation is performed for each of columns sequentially from left to right.
- the latch pulse is input during a horizontal retrace period, so that the video signals retained in the data latch circuits 4003 are transferred simultaneously to the latch circuits 4004 .
- the signals are level-shifted in the level shifters 4005 and reshaped in the buffers 4006 to be output simultaneously to the signal lines S 1 to Sn.
- an H level and an L level are input to the pixels in columns selected by the scan line driving circuit 3007 to control emission and non-emission of the light-emitting elements 3011 .
- the active matrix type display device described in this invention has the panel 3010 and the external circuit 3004 which are independent from each other, they may be integrally formed on an identical substrate. Also, though the display device using the OLEDs is described by way of example in this example, light-emitting elements other than the OLEDs may be used for the light-emitting device. Also, the level shifters 4005 and the buffers 4006 are not necessarily disposed inside the signal line driving circuit 3006 .
- FIG. 5 Shown in FIG. 5 is the pixel top view of this example.
- 5001 is a signal line
- 5002 is a first power line
- 5001 is a second power line
- denoted by 5004 is a first scan line
- denoted by 5003 is a second scan line.
- the signal line 5001 , the first power line 5002 , and the second power line 5011 are formed from an identical electro-conductive film
- the first scan line 5004 and the second scan line 5003 are formed from an identical electro-conductive film.
- 5005 is a switching transistor, and a part of the first scan line 5004 functions as a gate electrode of the switching transistor 5005 .
- 5006 is an erasing transistor, and a part of the second scan line 5003 functions as a gate electrode of the erasing transistor 5006 .
- 5007 is a driving transistor, and denoted by 5008 is a current control transistor.
- the driving transistor 5007 has a wound active layer used for maintaining an L/W thereof at a value larger than that of the current control transistor 5008 .
- 5009 is a pixel electrode, and light is emitted in an area (light-emitting area) 5010 which overlaps with an electro-luminescent layer and a cathode (both not shown).
- the top view of this invention is not more than one example, and it is needless to say that this invention is not limited thereto.
- FIG. 8 Shown in FIG. 8 is the pixel top view of this example.
- Denoted by 8001 is a signal line
- denoted by 8002 is a first power line
- denoted by 8011 is a second power line
- denoted by 8004 is a first scan line
- denoted by 8003 is a second scan line.
- the signal line 8001 , the first power line 8002 , and the second power line 8011 are formed from an identical electro-conductive film
- the first scan line 8004 and the second scan line 8003 are formed from an identical electro-conductive film.
- Denoted by 8005 is a switching transistor, and a part of the first scan line 8004 functions as a gate electrode of the switching transistor 8005 .
- Denoted by 8006 is an erasing transistor, and a part of the second scan line 8003 functions as a gate electrode of the erasing transistor 8006 .
- Denoted by 8007 is a driving transistor, and denoted by 8008 is a current control transistor.
- the driving transistor 8007 has a wound active layer used for maintaining an L/W thereof at a value larger than that of the current control transistor 8008 .
- Denoted by 8009 is a pixel electrode, and light is emitted in an area (light-emitting area) 8010 which overlaps with an electro-luminescent layer and a cathode (both not shown).
- Denoted by 8012 is a capacitance unit formed from an insulating film disposed between the second power line 8011 and the current control transistor 8008 .
- the top view of this invention is not more than one example, and it is needless to say that this invention is not limited thereto.
- FIG. 9(A) Shown in FIG. 9(A) is a sectional view of a pixel in the case where a driving transistor 9021 is of the P-type, and light emitted from a light-emitting element 9022 is ejected in a direction of an anode 9023 .
- the anode 9023 of the light-emitting element 9022 is electrically connected to the driving transistor 9021 , and an electro-luminescent layer 9024 and a cathode 9025 are formed in this order on the anode 9023 .
- Any known material may be used for the cathode 9025 so far as it is an electro-conductive film having a small work function and reflecting light.
- the electro-luminescent layer 9024 may be formed of either one of one layer or a stack of a plurality of layers. In the case where the electro-luminescent layer 9024 is formed of the plurality of layers, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer may be formed in this order on the anode 9023 . It is unnecessary to provide all of these layers.
- a transparent electro-conductive film capable of transmitting light is used for forming the anode 9023 , and examples of the transparent electro-conductive film may be ITO, an electro-conductive film formed by mixing indium oxide with 2 to 20 % of zinc oxide (ZnO).
- a portion at which the anode 9023 , the electro-luminescent layer 9024 , and the cathode 9025 are overlapped with one another corresponds to the light-emitting element 9022 .
- the light emitted from the light-emitting element 9022 is ejected in a direction of the anode 9023 as indicated by an white arrow
- FIG. 9(B) Shown in FIG. 9(B) is a sectional view of a pixel in the case where a driving transistor 9001 is of the N-type and light emitted from the light-emitting element 9002 is ejected in a direction of an anode 9005 .
- a cathode 9003 of the light-emitting element 9002 is electrically connected to the driving transistor 9001 , and an electro-luminescent layer 9004 and the anode 9005 are formed in this order on the cathode 9003 .
- Any known material may be used for the cathode 9003 so far as it is an electro-conductive film having a small work function and reflecting light.
- the electro-luminescent layer 9004 may be formed of either one of one layer or a stack of a plurality of layers. In the case where the electro-luminescent layer 9004 is formed of the plurality of layers, an electron injection layer, an electron transport layer, a light-emitting layer, a hole transport layer, and a hole injection layer may be formed in this order on the cathode 9003 . It is unnecessary to provide all of these layers.
- a transparent electro-conductive film capable of transmitting light is used for forming the anode 9005 , and examples of the transparent electro-conductive film may be ITO, an electro-conductive film formed by mixing indium oxide with 2 to 20% of zinc oxide (ZnO).
- a portion at which the cathode 9003 , the electro-luminescent layer 9004 , and the anode 9005 are overlapped with one another corresponds to the light-emitting element 9002 .
- the light emitted from the light-emitting element 9002 is ejected in a direction of the anode 9005 as indicated by an white arrow
- a current control transistor may be connected between the driving transistor and the light-emitting element.
- FIG. 10 One example of a driving timing using the pixel structure of this invention will be described using FIG. 10 .
- Shown in FIG. 10(A) is one example of a case of displaying a 4 -bit gradation using a digital time gradation method.
- a first scan line is selected in each of the rows sequentially in descending order during a write period Tb 1 to turn on switching transistors. Then, video signals are input from signal lines to pixels, so that emission and non-emission of the pixels are controlled by potentials of the video signals.
- transition to the data retention period Ts 1 is performed immediately. The same operation is performed in the rows, and a period Ta 1 terminates when the operation is performed in the last row.
- transition to a write period Tb 2 is performed in the rows sequentially in the order of termination of the data retention period Ts 1 .
- an erasing period 2102 is provided so that the next period does not start immediately after the termination of the data retention period.
- the light-emitting elements are forcibly kept in the non-emission state during the erasing period.
- the number of bits and the number of gradations are not limited thereto.
- the order of the light emission is not necessarily the order of from Ts 1 to Ts 4 , and a random order may be used, or may be divided into a plurality of sections.
- FIG. 10(B) Shown in FIG. 10(B) are examples of a write pulse and an erasing pulse.
- the erasing pulse is input to each of rows as illustrated as an erasing pulse 1 and may be retained by a capacitance unit during the erasing period or an H level may be input all through the erasing period as illustrated as an erasing pulse 2 .
- the pulses shown in FIG. 10 (B) are used in the case where both of the switching transistor and the erasing transistor are of the N-type, and, in the case where both of the switching transistor and the erasing transistor are of the P-type, the H level and the L level of the pulses shown in FIG. 10(B) are reversed.
- the display device using the light-emitting device of the invention can be used in display portions of various electronic apparatuses.
- the display device of the invention is desirably applied to a mobile device that preferably consumes less power.
- Electronic apparatuses using the display device of the invention include a portable information terminal (a cellular phone, a mobile computer, a portable game machine, an electronic book, and the like), a video camera, a digital camera, a goggle display, a display device, a navigation system, and the like. Specific examples of these electronic apparatuses are shown in FIGS. 6A to 6D .
- FIG. 6A illustrates a display device which includes a housing 6001 , an audio output portion 6002 , a display portion 6003 , and the like.
- the light-emitting device of the invention can be applied to the display portion 6003 .
- the display device includes all the information display devices for personal computers, television broadcast reception, advertisement, and the like.
- FIG. 6B illustrates a mobile computer which includes a main body 6101 , a stylus 6102 , a display portion 6103 , operation keys 6104 , an external interface 6105 , and the like.
- the light-emitting device of the invention can be applied to the display portion 6103 .
- FIG. 6C illustrates a game machine which includes a main body 6201 , a display portion 6202 , operation keys 6203 , and the like.
- the light-emitting device of the invention can be applied to the display portion 6202 .
- FIG. 6D illustrates a cellular phone which includes a main body 6301 , an audio output portion 6302 , a display portion 6304 , operation switches 6305 , an antenna 6306 , and the like.
- the light-emitting device of the invention can be applied to the display portion 6304 .
- an application range of the light-emitting device of the invention is so wide that the invention can be applied to electronic apparatuses in various fields.
- FIG. 11 a sectional structure of a pixel of the light-emitting device of 10 this invention will be described.
- a driving transistor 7001 which is formed on a substrate 7000 .
- the driving transistor 7001 is covered with a first interlayer insulating film 7002 , and a color filter 7003 formed from a resin or the like and a wiring 7004 electrically connected to a drain of the driving transistor 7001 via a contact hole are formed on the first interlayer insulating film 7002 .
- a current control transistor may be provided between the driving transistor 7001 and the wiring 7004 .
- a second interlayer insulating film 7005 is formed on the first interlayer insulating film 7002 in such a manner as to cover the color filter 7003 and the wiring 7004 .
- a silicon oxide film, a silicon nitride film, or a silicon oxide nitride film formed by plasma CVD or sputtering or a stack of these films formed by plasma CVD or sputtering may be used as the first interlayer insulating film 7002 or the second interlayer insulating film 7005 .
- a film obtained by stacking a silicon oxide nitride film wherein a molar ratio of oxygen is higher than that of nitrogen on a silicon oxide nitride film wherein a molar ratio of nitrogen is higher than that of oxygen may be used as the first interlayer insulating film 7002 or the second interlayer insulating film 7005 .
- an organic resin film may be used as the first interlayer insulating film 7002 or the second interlayer insulating film 7005 .
- a wiring 7006 electrically connected to the wiring 7004 via a contact hole is formed on the second interlayer insulating film 7005 .
- a part of the wiring 7006 functions as an anode of a light-emitting element.
- the wiring 7006 is formed in such a manner as to overlap with the color filter 7003 with the second interlayer insulating film 7005 being sandwiched therebetween.
- An organic resin film 7008 to be used as a partition is formed on the second interlayer insulating film 7005 .
- the organic resin film has an opening, and the wiring 7006 functioning as the anode, an electro-luminescent layer 7009 , and a cathode 7010 are formed in such a manner as to overlap with one another on the opening to form the light-emitting element 7011 .
- the electro-luminescent layer 7009 is formed of a single light-emitting layer or has a structure that a plurality of layers including the light-emitting layer are stacked.
- a protection film may be formed on the organic resin film 7008 and the cathode 7010 .
- a film less subject to permeation of substances promoting deterioration of the light-emitting element, such as moisture, oxygen, etc., as compared with other insulating films is used as the protection film.
- a DLC film, a carbon nitride film, a silicon nitride film formed by RF sputtering, or the like is used as the protection film. It is possible to use a film obtained by stacking the film less subject to the permeation of substances such as moisture and oxygen and a film subject to the permeation of substances such as moisture and oxygen as compared with the formerly mentioned film as the protection film.
- the organic resin film 7008 is heated under a vacuum atmosphere so as to eliminate absorbed moisture, oxygen, and so forth before forming the electro-luminescent layer 7009 . More specifically, a heat treatment at 100° C. to 200° C. is performed under a vacuum atmosphere for about 0.5 to 1 hour. It is desirable to perform the heat treatment under 3 ⁇ 10 ⁇ 7 Torr or less, most desirably under 3 ⁇ 10 ⁇ 8 Torr, if possible. In the case of forming the electro-luminescent layer after subjecting the organic resin film to the heat treatment under the vacuum atmosphere, it is possible to improve reliability by maintaining the vacuum atmosphere until shortly before the film formation.
- a radius of curvature of a curve of a section of the opening of the organic resin film is from 0.2 to 2 ⁇ m.
- a positive photosensitive acryl resin is used as the organic resin film 7008 .
- Photosensitive organic resins are broadly divided into a positive type in which a portion exposed to energy rays such as light, electrons, ions is removed and a negative type in which the exposed portion remains.
- the negative type organic resin film may be used in this invention.
- the organic resin film 7008 may be formed by using photosensitive polyimide.
- the edge of the opening has a section in the form of the letter “S”.
- it is desirable to set a radius of curvature of each of an upper end and a lower end of the opening to 0.2 to 2 ⁇ m.
- a transparent electro-conductive film may be used for the wiring 7006 .
- the transparent electro-conductive film is an ITO and a transparent electro-conductive film obtained by mixing 2 to 20% of indium oxide with zinc oxide (ZnO).
- the ITO is used as the wiring 7006 .
- the wiring 7006 may be polished by wiping using a CMP method and a polyvinyl alcohol-based porous material so as to smooth out its surface. Also, the surface of the wiring 7006 may be irradiated with ultraviolet rays or treated with oxygen plasma after undergoing the polishing using the CMP method.
- any known material may be used for the cathode 7010 so far as it is an electro-conductive film having a thickness capable of transmitting light and a small work function.
- Preferred examples of the material are Ca, Al, CaF, MgAg, AlLi, and the like.
- a method of using ITO which is reduced in work function by an addition of Li may be employed in addition to a method of thinning the film thickness.
- a structure of the light-emitting element used in this invention is not particularly limited so far as it enables light emission from both of the anode side and the cathode side.
- the packaging it is preferable to perform packaging (enclosure) with a protection film (laminate film, ultraviolet curing resin film, etc.) or a transparent glazing material 7012 which is high in air tightness and less subject to degasification.
- a protection film laminate film, ultraviolet curing resin film, etc.
- a transparent glazing material 7012 which is high in air tightness and less subject to degasification.
- the reliability of the light-emitting element is improved by maintaining an inside of the glazing material under an inert atmosphere or disposing an moisture absorbent (e.g., barium oxide) inside the glazing material.
- the glazing material 7012 may be provided with a color filter 7013 .
- FIG. 12 Shown in FIG. 12 is a circuit structure of the pixel of this example.
- the elements and wirings shown in FIG. 2 are denoted by the same reference numerals in FIG. 12 .
- a gate/source voltage Vgs of the driving transistor 202 is fixed by connecting the source of the driving transistor 202 to the first power line Vi as described in this example. That is, the gate/source voltage Vgs of the driving transistor 202 operating in the saturation area does not change and remains to be fixed even if the light-emitting element 204 is degraded. Therefore, in this example, it is possible to prevent a fluctuation in drain current of the driving transistor 202 operating in the saturation area even if the light-emitting element 204 is degraded.
- FIG. 12 one example of a top view of the pixel shown in FIG. 12 will be described. Note that a resistance is provided between the pixel electrode of the light-emitting element 204 and the drain of the current control transistor 203 in the pixel shown in FIG. 12 will be described in this example. Shown in FIG. 13 is the top view of the pixel of this example.
- Denoted by 5101 is a signal line
- denoted by 5102 is a first power line
- denoted by 5111 is a second power line
- denoted by 5104 is a first scan line
- denoted by 5103 is a second scan line.
- the signal line 5101 , the first power line 5102 , and the second power line 5111 are formed from an identical electro-conductive film
- the first scan line 5104 and the second scan line 5103 are formed from an identical electro-conductive film.
- Denoted by 5105 is a switching transistor, and a part of the first scan line 5104 functions as a gate electrode of the switching transistor 5105 .
- Denoted by 5106 is an erasing transistor, and a part of the second scan line 5103 functions as a gate electrode of the erasing transistor 5106 .
- Denoted by 5107 is a driving transistor, and denoted by 5108 is a current control transistor.
- Denoted by 5112 is a capacitance element, and denoted by 5113 is a resistance formed from a semiconductor film.
- Denoted by 5109 is a pixel electrode, and light is emitted in an area (light-emitting area) where the pixel electrode 5109 overlaps with an electro-luminescent layer (not shown) and a
- the driving transistor 5107 In the case of forming the pixel electrode 5109 by forming an electro-conductive film and then patterning the electro-conductive film, it is possible to prevent the driving transistor 5107 from being destroyed due to a sharp change in potential of the drain of the driving transistor 5107 caused by an electric charge charged on the electro-conductive film by using the resistance 5113 . Also, it is possible to use the resistance 5113 as an electrostatic countermeasure until a deposition of an EL.
- FIG. 14(A) A circuit diagram of the pixels of this example is shown in FIG. 14(A) .
- the elements and the wirings shown in FIG. 2 are denoted by same reference numerals in FIG. 14(A) .
- Shown in FIG. 14(B) is a pixel structure in the case of employing a method of adjusting a white balance by applying different voltages to the gates of the driving transistors 202 depending on a red pixel, a green pixel, and a blue pixel.
- a second power line Wrj for red (R) is connected to the gate of the driving transistor 202 in a pixel 210 corresponding to red.
- a second power line Wgj for green (G) is connected to the gate of the driving transistor 202 .
- a power line Wbj for blue (B) is connected to the gate of the driving transistor 202 .
- a pixel structure in the case of providing a resistance between a drain of the driving transistor 202 and a light-emitting element will be described using the pixels shown in FIGS. 14(A) and 14(B) .
- FIG. 15(A) Shown in FIG. 15(A) is the pixel structure in which the pixel shown in FIG. 14(A) is provided with a resistance.
- the elements and the wirings shown in FIG. 14(A) are denoted by the same reference numerals in FIG. 15(A) .
- FIG. 15(A) is different from FIG. 14(A) in that a resistance 209 is provided between the pixel electrode of the light-emitting element 104 and the drain of the driving transistor 202 .
- FIG. 15(B) Shown in FIG. 15(B) is a pixel structure in the case of employing a method of adjusting a white balance by applying different voltages to the gates of the driving 20 transistors 202 depending on a red pixel, a green pixel, and a blue pixel.
- a second power line Wrj for red (R) is connected to the gate of the driving transistor 202 in a pixel 210 corresponding to red.
- a second power line Wgj for green (G) is connected to the gate of the driving transistor 202 .
- a power line Wbj for blue (B) is connected to the gate of the driving transistor 202 .
- the driving transistor 202 In the case of forming the pixel electrode by forming an electro-conductive film and then patterning the electro-conductive film, it is possible to prevent the driving transistor 202 from being destroyed due to a sharp change in potential of the drain of the driving transistor 202 caused by an electric charge charged on the electro-conductive film by using the resistance 209 . Also, it is possible to use the resistance 5209 as an electrostatic countermeasure until a deposition of an EL.
- FIG. 16 The top view of this example is shown in FIG. 16 .
- Denoted by 5201 is a signal line
- denoted by 5202 is a first power line
- denoted by 5211 is a second power line
- denoted by 5204 is a first scan line
- denoted by 5203 is a second scan line.
- the signal line 5201 , and the first power line 5202 are formed from an identical electro-conductive film
- the first scan line 5204 , the second scan line 5203 , and the second power line 5211 are formed from an identical electro-conductive film.
- Denoted by 5205 is a switching transistor, and a part of the first scan line 5204 functions as a gate electrode of the switching transistor 5205 .
- Denoted by 5206 is an erasing transistor, and a part of the second scan line 5203 functions as a gate electrode of the erasing transistor 5206 .
- Denoted by 5207 is a driving transistor, and denoted by 5208 is a current control transistor.
- Denoted by 5212 is a capacitance element, and denoted by 5213 is a resistance formed from a semiconductor film.
- Denoted by 5209 is a pixel electrode, and light is emitted in an area (light-emitting area) where the pixel electrode 5209 overlaps with an electro-luminescent layer (not shown) and a
- FIG. 17 Shown in FIG. 17 is the pixel top view of this example.
- Denoted by 5301 is a signal line
- denoted by 5302 is a first power line
- denoted by 5311 r is a second power line corresponding to a red pixel
- denoted by 5311 g is a second power line corresponding to a green pixel
- denoted by 5311 b is a second power line corresponding to a blue pixel
- denoted by 5304 is a first scan line
- denoted by 5303 is a second scan line.
- the signal line 5301 and the first power line 5302 are formed from an identical electro-conductive film
- the first scan line 5304 , the second scan line 5303 , and the second power lines 5311 r, 5311 g, 5311 b are formed from an identical electro-conductive film.
- Denoted by 5305 is a switching transistor, and a part of the first scan line 5304 functions as a gate electrode of the switching transistor 5305 .
- Denoted by 5306 is an erasing transistor, and a part of the second scan line 5303 functions as a gate electrode of the erasing transistor 5306 .
- Denoted by 5307 is a driving transistor
- denoted by 5308 is a current control transistor.
- Denoted by 5312 is a capacitance element, and denoted by 5313 is a resistance formed from a semiconductor film.
- the driving transistor 5307 has a wound active layer used for maintaining an L/W thereof at a value larger than that of the current control transistor 5308 .
- Denoted by 5309 is a pixel electrode, and light is emitted in an area (light-emitting area) where the pixel electrode 5309 overlaps with an electro-luminescent layer (not shown) and a cathode (not shown).
- the number of transistors included in one pixel is 4 in the light-emitting device of this invention, it is possible to set a width across corner to 4 to 4.3 inches, a width of an interlayer used as a partition for separating adjacent light-emitting elements to 20 ⁇ m, a VGA to (640 ⁇ 480) 200 dpi, and the size of the pixel to 45 ⁇ 135 ⁇ m.
- FIG. 18(A) Shown in FIG. 18(A) is a sectional view of a pixel in the case where a driving transistor 9011 is of the N-type and light emitted from a light-emitting element 9012 is ejected in a direction of a cathode 9013 .
- the cathode 9013 of the light-emitting element 9012 is formed on a transparent electro-conductive film 9017 electrically connected to a drain of the driving transistor 9011 , and an electro-luminescent layer 9014 and an anode 9015 are formed on the cathode 9013 in this order.
- a shielding film 9016 for reflecting or shielding light is formed in such a manner as to cover the anode 9015 .
- any known material may be used for the cathode 9013 so far as it is an electro-conductive film having a small work function and reflecting light.
- Preferred examples of the material are Ca, Al, CaF, MgAg, AlLi, and the like.
- a thickness of the cathode 9013 is regulated to a value which allows light to pass therethrough.
- an Al film having a thickness of 20 nm may be used as the cathode 9013 .
- the electro-luminescent layer 9014 may be formed of either one of one layer or a stack of a plurality of layers.
- the anode 9015 is not required to transmit light, and a transparent electro-conductive film such as ITO, ITSO, IZO obtained by mixing indium oxide with 2 to 20% of zinc oxide (ZnO), Ti, or TiN may be used for the anode 9015 .
- a metal reflecting light for example, may be used as the shielding film 9016 without limitation thereto.
- a resin to which a black pigment is added may be used as the shielding film 9016 , for example.
- a portion at which the cathode 9013 , the electro-luminescent layer 9014 , and the anode 9015 are overlapped with one another corresponds to the light-emitting element 9012 .
- the light emitted from the light-emitting element 9012 is ejected in a direction of the cathode 9013 as indicated by an white arrow.
- FIG. 18(B) Shown in FIG. 18(B) is a sectional view of a pixel in the case where a driving transistor 9031 is of the P-type and light emitted from the light-emitting element 9032 is ejected in a direction of a cathode 9035 .
- an anode 9033 of the light-emitting element 9032 is formed on a wiring 9036 electrically connected to a drain of the driving transistor 9031 , and an electro-luminescent layer 9034 and the cathode 9035 are formed on the anode 9033 in this order.
- the light is reflected by the wiring 9036 .
- any known material may be used for the cathode 9035 so far as it is an electro-conductive film having a small work function and reflecting light as is the case with FIG. 18(A) .
- a thickness of the cathode 9035 is regulated to a value which allows light to pass therethrough.
- an Al film having a thickness of 20 nm may be used as the cathode 9035 .
- the electro-luminescent layer 9034 may be formed of either one of one layer or a stack of a plurality of layers, as is the case with FIG. 18(A) .
- the anode 9033 is not required to transmit light, and a transparent electro-conductive film or Ti, or TiN may be used for the anode 9033 as is the case with FIG. 18(A) .
- a portion at which the anode 9033 , the electro-luminescent layer 9034 , and the cathode 9035 are overlapped with one another corresponds to the light-emitting element 9032 .
- the light emitted from the light-emitting element 9032 is ejected in a direction of the cathode 9035 as indicated by an white arrow
- a current control transistor may be connected between the driving transistor an the light-emitting element.
- the transistor to be used in this invention may be formed from amorphous silicon. Since the transistor formed from the amorphous silicon contributes to an elimination of a process of crystallization, it is possible to simplify a manufacturing method and to reduce a cost. Note that a P-type amorphous silicon transistor is suitably used for the pixel of this invention since it has a higher mobility as compared with an N-type amorphous silicon transistor. In this example, a sectional structure of a pixel in the case of using the N-type driving transistor will be described.
- FIG. 19(A) Shown in FIG. 19(A) is a sectional view of a pixel of this example.
- 6501 is a driving transistor and denoted by 6502 is a current control transistor.
- the driving transistor 6501 has a gate electrode 6503 formed on a substrate 6500 having an isolating surface, a gate insulating film 6504 formed on the substrate 6500 in such a manner as to cover the gate electrode 6503 , and a semiconductor film 6505 formed at a position overlapping with the gate electrode 6503 with the gate insulating film being sandwiched therebetween.
- the semiconductor film 6505 has an impurity area 6506 a and 6506 b functioning as a source and a drain and having impurity for imparting an electro-conductivity.
- the impurity area 6506 a is connected to a wiring 6508 .
- the current control transistor 6502 has, like the driving transistor 6501 , a gate electrode 6510 formed on the substrate 6500 having the isolating surface, the gate insulating film 6504 formed on the substrate 6500 in such a manner as to cover the gate electrode 6510 , and a semiconductor film 6511 formed at a position overlapping with the gate electrode 6510 with the gate insulating film 6504 being sandwiched therebetween.
- the semiconductor film 6511 has an impurity area 6512 a and 6512 b functioning as a source and a drain and having impurity for imparting electro-conductivity.
- the impurity area 6512 a is connected, via a wiring 6513 , to the impurity area 6506 b included in the driving transistor 6501 .
- the driving transistor 6501 and the current control transistor 6502 are covered with a protection film 6507 formed from an insulating film.
- the wiring 6508 is connected to an anode 6509 via a contact hall formed on the protection film 6507 .
- the driving transistor 6501 , the current control transistor 6502 , and the protection film 6507 are covered with an interlayer insulating film 6520 .
- the interlayer insulating film 6520 has an opening, and the anode 6509 is exposed in the opening.
- An electro-luminescent layer 6521 and a cathode 6522 are formed on the anode 6509 .
- the driving transistor and the current control transistor are of the N-type is described with reference to FIG. 19(A) , they may be of the P-type.
- P-type impurity is used for controlling a threshold value of the driving transistor.
- FIG. 20 The pixel top view of this example is shown in FIG. 20 .
- Denoted by 5401 is a signal line
- denoted by 5402 is a first power line
- denoted by 5411 a and 5411 b are second power lines
- denoted by 5404 is a first scan line
- denoted by 5403 is a second scan line.
- the signal line 5401 , the first power line 5402 , and the second power line 5411 a are formed from an identical electro-conductive film
- the first scan line 5404 , the second scan line 5403 , and the second power line 5411 b are formed from an identical electro-conductive film.
- Denoted by 5405 is a switching transistor, and a part of the first scan line 5404 functions as a gate electrode of the switching transistor 5405 .
- Denoted by 5406 is an erasing transistor, and a part of the second scan line 5403 functions as a gate electrode of the erasing transistor 5406 .
- Denoted by 5407 is a driving transistor, and denoted by 5408 is a current control transistor.
- Denoted by 5412 is a capacitance element, and denoted by 5413 is a resistance formed from a semiconductor film.
- Denoted by 5409 is a pixel electrode, and light is emitted in an area (light-emitting area) 5410 where the pixel electrode 5409 overlaps with an electro-luminescent layer (not shown) and a cathode (not shown).
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Signal Processing (AREA)
- Geometry (AREA)
- Optics & Photonics (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
- Electroluminescent Light Sources (AREA)
- Control Of El Displays (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
- This application is a continuation of U.S. application Ser. No. 15,082,012, filed Mar. 28, 2016, now allowed, which is a continuation of U.S. application Ser. No. 14/183,679, filed Feb. 19, 2014, now U.S. Pat. No. 9,300,771, which is a continuation of U.S. application Ser. No. 13/243,034, filed Sep. 23, 2011, now U.S. Pat. No. 8,659,523, which is a continuation of U.S. application Ser. No. 10/807,545, filed Mar. 24, 2004, now U.S. Pat. No. 8,026,877, which claims the benefit of foreign priority applications filed in Japan as Serial No. 2003-086500 on Mar. 26, 2003, Serial No. 2003-139560 on May 16, 2003, and Serial No. 2003-174134 on Jun. 18, 2003, all of which are incorporated by reference.
- The present invention relates to a light-emitting device in which each of pixels is provided with a light-emitting element and a means for supplying a current to the light-emitting element and an element substrate.
- A light-emitting element is high in visibility and optimum for low profiling since it emits light and does not require any backlight which is required in a liquid crystal display device (LCD), and that has no limitation in visual angle. Therefore, in recent years, a light-emitting device using the light-emitting element has attracted attention as a display device alternative to a CRT and the LCD. In addition, as used herein, the light-emitting element means an element whose luminosity is controlled by a current or a voltage, and an OLED (Organic Light Emitting Diode), an MIM type electron source element (electron emitting element) used in and an FED (Field Emission Display), and the like are fall within the definition.
- The light-emitting device includes a panel and a module having an IC or the like including a controller mounted on the panel. This invention also relates to an element substrate equivalent to one mode achieved before a completion of the panel in a process of manufacturing the light-emitting device, and each of pixels in the element substrate is provided with a means for supplying a current to the light-emitting element.
- The OLED (Organic Light Emitting Diode) which is a variation of the light-emitting element has a layer comprising an electro-luminescent material capable of obtaining luminescence (electro-luminescence) generated upon application of an electric field (hereinafter referred to as an electro-luminescent layer), an anode layer, and a cathode layer. The electro-luminescent layer is provided between the anode and the cathode and constituted of a layer or a plurality of layers. In some cases, an inorganic compound is contained in the layer or layers. A light emission (fluorescence) generated when a singlet excitation state returns to a ground state and a light emission (phosphorescence) generated when a triplet excitation state returns to a ground state are included in the luminescence in the electro-luminescent layer.
- Hereinafter, a structure of a pixel of an ordinary light-emitting device and driving of the pixel will be described briefly. The pixel shown in
FIG. 7 has aswitching transistor 700, adriving transistor 701, acapacitance element 702, and a light-emittingelement 703. A gate of theswitching transistor 700 is connected to ascan line 705, and a source thereof is connected to asignal line 704 when a drain thereof is connected to a gate of thedriving transistor 701. A source of thedriving transistor 701 is connected to apower line 706, and a drain thereof is connected to an anode of the light-emittingelement 703. A cathode of the light-emittingelement 703 is connected to acounter electrode 707. Thecapacitance element 702 is provided in such a manner as to retain a potential difference between the gate and the source of thedriving transistor 701. Predetermined voltages are applied separately to thepower line 706 and thecounter electrode 707, so that thepower line 706 and thecounter electrode 707 have a potential difference therebetween. - When the
switching transistor 700 is turned on by a signal from thescan line 705, a video signal input to thesignal line 704 is input to the gate of thedriving transistor 701. A potential difference between a potential of the input video signal and thepower line 706 becomes a gate/source voltage Vgs, so that a current is supplied to the light-emittingelement 703 to cause the light-emittingelement 703 to emit light. - Incidentally, since a transistor using polysilicon, for example, is suitably used as a transistor of the light-emitting device since it has a high field effect mobility and a large on-current. In turn, the transistor using polysilicon has a drawback that a variation in characteristics tends to occur due to a defect formed in a grain boundary.
- Referring to the pixel shown in
FIG. 7 , when drain currents of thedriving transistors 701 vary pixel by pixel, irregularity in luminosity of the light-emitting elements 703 undesirably occurs because the drain currents of thedriving transistor 701 vary depending on the pixels. - As a measure for suppressing the variation in drain currents, a method of increasing an L/W (L: channel length, W: channel width) of the
driving transistor 701 proposed in Japanese Patent Application No. 2003-008719 is known. The drain current Ids in a saturation area of thedriving transistor 701 is given by the following equation (1). -
Ids=β(Vgs−Vth)2/2 (1) - From the equation (1), since the drain current Ids in the saturation area of the driving
transistor 701 influences greatly on the current flowing when there is a slightest change in Vgs, a precaution must be taken so as to prevent the voltage Vgs retained between the gate and the source of thedriving transistor 701 from being changed during the light emission of the light-emitting element 703. Therefore, it is necessary to increase capacitance of thecapacitance element 702 provided between the gate and the source of thedriving transistor 701 and to suppress an off-current of theswitching transistor 700 as low as required. - Achievement of both of the suppression of the off-current of the
switching transistor 700 and the increase in the on-current for charging large capacitance is a difficult task in a transistor manufacturing process. - Also, there is a problem that Vgs of the
driving transistor 701 is changed by a switching of theswitching transistor 700, a change in potential of the signal line or the scan line, and so forth. The problem is attributable to stray capacitance at the gate of thedriving transistor 701. - In view of the above problems, an object of this invention is to provide a light-emitting device which does not require the suppression of an off-current of the
switching transistor 700 nor the increase in capacitance of thecapacitance element 702 and is less subject to the influence of the stray capacitance and capable of suppressing irregularity in luminosity of light-emittingelements 703 of pixels and an element substrate. - In this invention, a potential of a gate of a driving transistor is fixed, and the driving transistor is operated in a saturation area so that a current is supplied thereto anytime. A current control transistor operating in a linear area is provided serially with the driving transistor, and a video signal for transmitting a signal of emission or non-emission of a pixel is input to a gate of the current control transistor via a switching transistor.
- A source/drain voltage Vds of the current control transistor is small since the current control transistor is operated in the linear area, and a slightest change in the gate/source voltage Vgs of the current control transistor does not influence on the current flowing to the light-emitting element. The current flowing to the light-emitting element is decided by the driving transistor operating in the saturation area.
- It is possible to avoid the influences to be otherwise exerted on the current flowing to the light-emitting element without increasing the capacitance of the capacitance element provided between the gate and the source of the current control transistor and suppressing an off-current of the switching transistor. Further, the current is free from the influence of stray capacitance at the gate of the current control transistor. Therefore, it is possible to reduce the variation factors to greatly increase image quality.
- Also, since it is unnecessary to suppress the off-current of the switching transistor, it is possible to simplify a transistor manufacturing process to contribute to a cost reduction and an improvement in yield.
-
FIG. 1 is a diagram showing one embodiment of this invention. -
FIG. 2 is a diagram showing another embodiment of this invention. -
FIG. 3 is a diagram showing a general outline of an external circuit and a panel. -
FIG. 4 is a diagram showing one example of a signal line driving circuit. -
FIG. 5 is a diagram showing one example of a top view of this invention. -
FIG. 6 is a diagram showing one example of an electronic appliance to which this invention is applicable. -
FIG. 7 is a diagram showing a conventional example. -
FIG. 8 is a diagram showing another example of the top view of this invention. -
FIG. 9 is a diagram showing one example of a sectional structure of this invention. -
FIG. 10 is a diagram showing one example of an operation timing of this invention. -
FIG. 11 is a diagram showing another example of the sectional structure of this invention. -
FIG. 12 is a diagram showing another embodiment of this invention. -
FIG. 13 is a diagram showing another example of the top view of this invention. -
FIG. 14 is a diagram showing another embodiment of this invention. -
FIG. 15 is a diagram showing another embodiment of this invention. -
FIG. 16 is a diagram showing another example of the top view of this invention. -
FIG. 17 is a diagram showing another example of the top view of this invention. -
FIG. 18 is a diagram showing another example of the sectional structure of this invention. -
FIG. 19 is a diagram showing another example of the sectional structure of this invention. -
FIG. 20 is a diagram showing another example of the top view of this invention. -
FIG. 21 is an illustration of pixel driving methods of this invention. -
FIG. 22 is an illustration of driving methods of an active matrix type light-emitting device. -
FIG. 23 is an illustration of driving methods classified according to a video signal using a voltage and a video signal using a current. - Hereinafter, embodiments of this invention will be described with reference to the drawings. Note that this invention can be carried out as various different embodiments, and those skilled in the art will readily understand that it is possible to modify modes and details of the embodiments without departing from the sprit and the scope of the invention.
- One embodiment of a pixel included in a light-emitting device of this invention is shown in
FIG. 1 . The pixel shown inFIG. 1 has a transistor (switching transistor) 101 used as a switching element for controlling an input of a video signal to the pixel, and a drivingtransistor 102 for controlling a value of a current flowing to a light-emittingelement 104, and acurrent control transistor 103 for controlling a supply of the current to the light-emittingelement 104. The pixel may be provided with acapacitance element 105 for maintaining a potential of the video signal, as is the case with this embodiment. - The driving
transistor 102 and thecurrent control transistor 103 are identical in conductivity. In this invention, the drivingtransistor 102 is operated in a saturation area while thecurrent control transistor 103 is operated in a linear area. - Further, an L of the driving
transistor 102 may be longer than a W thereof, and an L of thecurrent control transistor 103 may be equal to or shorter than a W thereof. More preferably, a ratio of the L of the drivingtransistor 102 to the W thereof may be 5 or more. Also, when L1/W1:L2/W2=X:1 holds (wherein, a channel length of the drivingtransistor 102, a channel width of the drivingtransistor 102, a channel length of thecurrent control transistor 103 and a channel width of thecurrent control transistor 103 are represented by L1, W1, L2, and W2), it is preferable to keep X in the range of 5 to 6,000. For instance, L1/W1=500 μm/3 μm, and L2/W2=3 μm/100 μm. - Either one of an enhancement transistor or a depletion transistor may be used as the driving
transistor 102. - Also, either one of an N-type transistor or a P-type transistor may be used as 20 the switching
transistor 101. - A gate of the switching
transistor 101 is connected to a scan line Gj (j=1 to y). A source of the switchingtransistor 101 is connected to a signal line Si (i=1 to x) when a drain of the switchingtransistor 101 is connected to a gate of thecurrent control transistor 103. A gate of the drivingtransistor 102 is connected to a second power line Wi (i=1 to x). The drivingtransistor 102 and thecurrent control transistor 103 are connected to a first power line Vi (i=1 to x) and the light-emittingelement 104 in such a manner that a current supplied from the first power line Vi (i=1 to x) is supplied to the light-emittingelement 104 as a drain current for the drivingtransistor 102 and thecurrent control transistor 103. In this embodiment, a source of thecurrent control transistor 103 is connected to the first power line Vi (i=1 to x), and a drain of the drivingtransistor 102 is connected to a pixel electrode of the light-emittingelement 104. - The source of the driving
transistor 102 may be connected to the first power line Vi (i=1 to x), and the drain of thecurrent control transistor 103 may be connected to the pixel of the light-emittingelement 104. - The light-emitting
element 104 is formed of an anode, a cathode, and an electro-luminescent layer provided therebetween. In the case where the anode is connected to the drivingtransistor 102 as shown inFIG. 1 , the anode serves as the pixel electrode while the cathode serves as a counter electrode. A potential difference is set between the counter electrode of the light-emittingelement 104 and the first power line Vi (i=1 to x) so that a current in a forward bias direction is supplied to the light-emittingelement 104. In addition, the counter electrode is connected to a third power line. - The
capacitance element 105 has two electrodes, one of which is connected to the first power line Vi (i=1 to x) and the other is connected to the gate of thecurrent control transistor 103. Thecapacitance element 105 is provided for the purpose of maintaining a potential difference between the electrodes of thecapacitance element 105 when the switchingtransistor 101 is in a non-selection state (off-state). Note that this invention is not limited to the constitution including thecapacitance element 105 shown inFIG. 1 , and it is possible to use a constitution which does not include thecapacitance element 105. - In
FIG. 1 , the P-type transistors are used as the drivingtransistor 102 and thecurrent control transistor 103 and the drain of the drivingtransistor 102 is connected to the anode of the light-emittingelement 104. In the case of using N-type transistors as the drivingtransistor 102 and thecurrent control transistor 103, the source of the drivingtransistor 102 is connected to the cathode of the light-emittingelement 104. In this case, the cathode of the light-emittingelement 104 serves as the pixel electrode and the anode thereof serves as the counter electrode. - Next, a method of driving the pixel shown in
FIG. 1 will be described. Operation of the pixel shown inFIG. 1 can be divided into a write period and a data retention period. - When the scan line Gj (j=1 to y) is selected in the write period, the switching
transistor 101 whose gate is connected to the scan line Gj (j=1 to y) is turned on. Then, a video signal is input to the signal line Si (i=1 to x) to be input to the gate of thecurrent control transistor 103 via the switchingtransistor 101. Note that the drivingtransistor 102 is always in an on-state because its gate is connected to the first power line Vi (i=1 to x). - In the case where the
current control transistor 103 is turned on by the video signal, a current is supplied to the light-emittingelement 104 via the first power line Vi (i=1 to x). Here, since thecurrent control transistor 103 operates in the linear area, the current flowing to the light-emittingelement 104 is decided depending on the drivingtransistor 102 operating in the saturation area and a voltage/current characteristic of the light-emittingelement 104. The light-emittingelement 104 emits light having luminosity corresponding to the supplied current. - In the case where the
current control transistor 103 is turned off by the video signal, no current is supplied to the light-emittingelement 104 so that the light-emittingelement 104 does not emit light. - In the data retention period, a potential of the scan line Gaj (j=1 to y) is so controlled as to turn off the switching
transistor 101, so that a potential of the video signal written during the write period is maintained. Since the potential of the video signal is maintained by thecapacitance element 105 in the case where thecurrent control transistor 103 is turned on during the write period, the current supply to the light-emittingelement 104 is maintained. In contrast, because the potential of the video signal is maintained by thecapacitance element 105 when thecurrent control transistor 103 is turned off during the write period, the current supply to the light-emittingelement 104 is not performed. - An element substrate is equivalent to one mode achieved before a completion of a formation of the light-emitting element in the course of manufacturing the light-emitting device of this invention.
- A transistor formed by using monocrystalline silicon, a transistor using an SOI, and a thin film transistor using polycrystalline silicon or amorphous silicon may be used as the transistors of this invention. A transistor using an organic semiconductor and a transistor using a carbon nanotube may also be used. Each of the transistors provided in the pixel of the light-emitting device of this invention may have a single gate structure, a double gate structure, or a multi-gate structure having more than 2 gate electrodes.
- With the above-described constitution, the
current control transistor 103 is operated in the linear area to achieve a small source/drain voltage Vds of thecurrent control transistor 103, and a slight fluctuation in the gate/source voltage Vgs of thecurrent control transistor 103 does not influence on the current flowing to the light-emittingelement 104. The current flowing to the light-emittingelement 104 is decided by the drivingtransistor 102 operating in the saturation area. Therefore, it is unnecessary to increase the capacitance of thecapacitance element 105 provided between the gate and the source of thecurrent control transistor 103 nor to suppress the off-current of the switchingtransistor 101 to keep the current flowing to the light-emittingelement 104 free from adverse effects. Also, the current flowing to the light-emittingelement 104 is free from adverse effects of stray capacitance at the gate of thecurrent control transistor 103. Since the factors for fluctuation is thus reduced, it is possible to greatly increase image quality. - In addition, since the active matrix type light-emitting device is capable of maintaining the current supply to the light-emitting element for a certain period of time after the input of the video signal, it has flexibility toward a large size panel and high definition and is becoming a mainstream product for near future. Specific pixel structures of the active matrix type light-emitting devices which have been proposed vary depending light-emitting device manufactures, and each of them has its specific technical contrivance. Shown in
FIG. 22 is a systematic illustration of types of driving methods of the active matrix type light-emitting device. - As shown in
FIG. 22 , the driving methods in the active matrix type light-emitting device are generally divided into those using a digital video signal and those using an analog video signal. The analog light-emitting devices are further divided into those using current modulation wherein a value of a current to be supplied to the light-emitting element is modulated in an analog manner and those using time modulation wherein gradation is expressed by changing a length of each of on and off of an inverter. The current modulation type light-emitting devices can be divided into those having a Tr characteristic correction circuit and those do not have the Tr characteristic correction circuit. The Tr characteristic correction circuit is a circuit for correcting a variation in characteristics of driving transistors, and some Tr characteristic correction circuits correct only a threshold value while other Tr characteristic correction circuits correct a current value (threshold value, mobility, and so forth). - The light-emitting devices having the Tr characteristic correction circuit classified into the current modulation type can be divided into those correcting the threshold value by voltage programming and those correcting the current value by current programming. The voltage programming is used for correcting a fluctuation in threshold value of the driving transistor. The current programming is used for correcting a fluctuation in current value (including threshold value, mobility, and so forth) of the driving transistor. The video signal is input by a current. The light-emitting element is a current driving element, and it is more straightforward to use the current value as date because light emission luminosity hinges upon the current.
- The light-emitting devices correcting the current value by the current programming can be divided into those of a current mirror type and those do not use any current mirror. The current mirror type has a pixel circuit using a current mirror circuit, and a transistor for setting a current is provided separately from a transistor for supplying a current. Identical characteristics of the two transistors constituting a mirror are a major premise. The light-emitting device without current mirror does not use the current mirror circuit, and one transistor performs the current setting and the current supply.
- The light-emitting devices classified into the digital light-emitting device can be divided into those of an area gradation and those of a time gradation. The area gradation is used for performing a gradation display by selecting among weights 1:2:4:8 and so forth set in light emission areas of sub-pixels provided in a pixel. The time gradation is used for performing a gradation display by selecting among weights 1:2:4:8 and so forth set in light emission periods of sub-frames provided in one frame.
- The time gradation is divided into a DPS (Display Period Separated) driving and an SES (Simultaneous Erasing Scan) driving. In the DPS driving, the sub-frame is constituted of an addressing period and a lighting period. The DPS driving is disclosed in M. Mizukami et al., 6-Bit Digital VGA OLED, SID '00 Digest, p. 912. In the SES driving, it is possible to overlap the addressing period with the lighting period by using an erasing transistor, so that the lighting period of the light-emitting element is increased. The SES driving is disclosed in K. Inukai et al., 4.0-in. TFT-OLED Displays and a Novel Digital Driving Method, SID '00 Digest, p. 924.
- The SES driving is divided into a constant current driving and a constant voltage driving. The constant current driving is used for driving a light-emitting element with a constant current, so that the constant current is supplied irrelevant from a change in resistance of the light-emitting element. The constant voltage driving is used for driving a light-emitting element with a constant voltage.
- The light-emitting device of the constant current driving is divided into a light-emitting device with Tr characteristic correction circuit and a light-emitting device without Tr characteristic correction circuit. A light-emitting device (CCT1) driven by the method disclosed in PCT publication NO. WO 03/027997 and a light-emitting device (CCSP) driven by the method disclosed in Japanese Patent Application No. 2002-056555 are included in the light-emitting device with Tr characteristic correction circuit. The light-emitting device without Tr characteristic correction circuit is further divided into a long channel length driving Tr type and a fixed gate potential for light emission type. The long channel length driving Tr type is disclosed in Japanese Patent Application No. 2002-025065. The long channel length driving Tr type is used for suppressing a characteristics variation in driving transistors during the constant current driving. By greatly elongating the gate length, it is unnecessary to use Vgs near the threshold value, thereby suppressing a fluctuation in value of the current flowing to the light-emitting element of each of pixels.
- The fixed gate potential for light emission is used for fixing a potential of a gate of a driving transistor during the light emission period of the light emission element at a value with which the driving transistor is turned on to keep Vgs of the driving transistor at a constant value, thereby improving display defect. Data are input to a gate of a current control transistor disposed serially with the driving transistor. There is a long channel length driving Tr type included among the light-emitting devices of the fixed gate potential for light emission type. The light-emitting device of this invention is classified under the long channel length driving Tr type using the fixed gate potential for light emission.
- Shown in
FIG. 23 is an illustration of driving methods classified according to a video signal using a voltage and a video signal using a current. As shown inFIG. 23 , the driving methods are divided into those wherein a video signal to be input to the pixel is at a constant voltage (CV) in the light emission of the light-emitting element and those wherein a video signal to be input to the pixel is at a constant current (CC) in the light emission of the light-emitting element. Those wherein the video signal is the constant current (CV) are divided into a driving method wherein a voltage applied to the light-emitting element has a constant value (CVCV) and a driving method wherein a current applied to the light-emitting element has a constant value (CCCC). - In this embodiment, a mode of pixels provided in the light-emitting device of this invention, which is different from that of
FIG. 1 , will be described. - A pixel shown in
FIG. 2 has a light-emittingelement 204, a switchingtransistor 201, a drivingtransistor 202, acurrent control transistor 203, and a transistor 206 (erasing transistor) for forcibly turning off thecurrent control transistor 203. The pixel may be provided with acapacitance element 205 in addition to the above elements. - The driving
transistor 202 and thecurrent control transistor 203 are identical in conductivity. In this invention, the drivingtransistor 202 is operated in a saturation area while thecurrent control transistor 203 is operated in a linear area. - Further, an L of the driving
transistor 202 may be longer than a W thereof, and an L of thecurrent control transistor 203 may be equal to or shorter than a W thereof. More preferably, a ratio of the L of the drivingtransistor 202 to the W thereof may be 5 or more. - Either one of an enhancement transistor or a depletion transistor may be used as the driving
transistor 202. - Either one of an N-type transistor or a P-type transistor may be used as the switching
transistor 201 and the erasingtransistor 206. - A gate of the switching
transistor 201 is connected to a first scan line Gaj (j=1 to y). A source of the switchingtransistor 201 is connected to a signal line Si (i=1 to x) when a drain of the switchingtransistor 201 is connected to a gate of thecurrent control transistor 203. A gate of the erasingtransistor 206 is connected to a second scan line Gej (j=1 to y), and a source thereof is connected to a first power line Vi (i=1 to x) when a drain thereof is connected to the gate of thecurrent control transistor 203. A gate of the drivingtransistor 202 is connected to a second power line Wi (i=1 to x). The drivingtransistor 202 and thecurrent control transistor 203 are connected to the first power line Vi (i=1 to x) and the light-emittingelement 204 in such a manner that a current supplied from the first power line Vi (i=1 to x) is supplied to the light-emittingelement 204 as a drain current of the drivingtransistor 202 and thecurrent control transistor 203. In this embodiment, a source of thecurrent control transistor 203 is connected to the first power line Vi (i=1 to x), and a drain of the drivingtransistor 202 is connected to a pixel electrode of the light-emittingelement 204. - The source of the driving
transistor 202 may be connected to the first power line Vi (i=1 to x), and the drain of thecurrent control transistor 203 may be connected to the pixel electrode of the light-emittingelement 204. - The light-emitting
element 204 is formed of an anode, a cathode, and an electro-luminescent layer provided between the anode and the cathode. In the case where the anode is connected to the drivingtransistor 202 as shown inFIG. 2 , the anode serves as the pixel electrode while the cathode serves as a counter electrode. A potential difference is set between the counter electrode of the light-emittingelement 204 and the first power line Vi (i=1 to x) so that a current in a forward bias direction is supplied to the light-emittingelement 204. In addition, the counter electrode is connected to a third power line. - The
capacitance element 205 has two electrodes, one of which is connected to the first power line Vi (i=1 to x) and the other is connected to the gate of thecurrent control transistor 203. - In
FIG. 2 , P-type transistors are used as the drivingtransistor 202 and thecurrent control transistor 203, and the drain of the drivingtransistor 202 is connected to the anode of the light-emittingelement 204. In the case of using N-type transistors as the drivingtransistor 202 and thecurrent control transistor 203, the source of the drivingtransistor 202 is connected to the cathode of the light-emittingelement 204. In this case, the cathode of the light-emittingelement 204 serves as the pixel electrode, and the anode thereof serves as the counter electrode. - Operation of the pixel shown in
FIG. 2 can be divided into a write period, a data retention period, and an erasing period. Operations of the switchingtransistor 201, the drivingtransistor 202, and thecurrent control transistor 203 in the write period and data retention period are the same as those ofFIG. 1 . - Shown in
FIG. 21(A) is an operation when thecurrent control transistor 203 is turned on by a video signal during the write period, and shown inFIG. 21(B) is an operation when thecurrent control transistor 203 is in an off-state during the write period. Shown inFIG. 21(C) is an operation when thecurrent control transistor 203 is in an on-state during the data retention period, and shown inFIG. 21(D) is an operation during the erasing period. In addition, in order to facilitate understanding of the operations, the switchingtransistor 210, thecurrent control transistor 203, and the erasingtransistor 206 used as switching elements are illustrated inFIGS. 21(A) to 21(D) as switches. - When the first scan line Gaj (j=1 to y) is selected during the write period, the switching
transistor 201 whose gate is connected to the first scan line Gaj (j=1 to y) is turned on. Then, a video signal input to a signal line Si (i =1 to x) is input to the gate of thecurrent control transistor 203 via the switchingtransistor 201. Since the gate of the drivingtransistor 202 is connected to the first power line Vi (i=1 to x), the drivingtransistor 202 is always in the on-state. - In the case where the
current control transistor 203 is turned on by the video signal, a current is supplied to the light-emittingelement 204 via the first power line Vi (i=1 to x) as shown inFIG. 21(A) . Here, since thecurrent control transistor 203 operates in the linear area, the current flowing to the light-emittingelement 204 is decided depending on the drivingtransistor 202 operating in the saturation area and a voltage/current characteristic of the light-emittingelement 204. The light-emittingelement 204 emits light having luminosity corresponding to the supplied current. - In the case where the
current control transistor 203 is turned off by the video signal as shown inFIG. 21(B) , no current is supplied to the light-emittingelement 204 so that the light-emittingelement 204 does not emit light. - In the data retention period, a potential of the first scan line Gj (j=1 to y) is so controlled as to turn off the switching
transistor 201, so that a potential of the video signal written during the write period is maintained. Since the potential of the video signal is maintained by thecapacitance element 205 in the case where thecurrent control transistor 203 is turned on during the write period, the current supply to the light-emittingelement 204 is maintained as shown inFIG. 21(C) . In contrast, because the potential of the video signal is maintained by thecapacitance element 205 when thecurrent control transistor 203 is turned off during the write period, the current supply to the light-emittingelement 204 is not performed. - During the erasing period, the second scan line Gej (j=1 to y) is selected to turn on the erasing
transistor 206 as shown inFIG. 21(D) , so that the potential of the 10 power line Vi (i=1 to x) is applied to the gate of thecurrent control transistor 203 via the erasingtransistor 206. Therefore, thecurrent control transistor 203 is turned off to forcibly create a state in which no current is supplied to the light-emittingelement 204. - Hereinafter, examples of this invention will be described.
- A constitution and a driving in the case where the pixel structure of this invention is used for an active matrix type display device will be described.
- Shown in
FIG. 3 are a block diagram of an external circuit and a schematic view of a panel. - As shown in
FIG. 3 , the active matrix type display device has anexternal circuit 3004 and apanel 3010. Theexternal circuit 3004 has an A/D converter 3001, apower unit 3002, and asignal generation unit 3003. The A/D converter 3001 converts an image signal which is input as an analog signal into a digital signal (video signal) to supply the digital signal to a signalline driving circuit 3006. Thepower unit 3002 generates powers each having a desired voltage from a power supplied from a battery or an electric outlet to supply the powers separately to thesignal driving circuit 3006, a scanline driving circuit 3007, a light-emittingelement 3001, thesignal generation unit 3003, and so forth. The power, the image signal, and a synchronizing signal are input to thesignal generation unit 3003, and thesignal generation unit 3003 performs conversions of various signals to generate clock signals for driving the signalline driving circuit 3006 and the scanline driving circuit 3007 and like signals. - A signal and a power sent from the
external circuit 3004 are input from anFPC connecting unit 3005 disposed inside thepanel 3010 to an internal circuit and the like through an FPC. - The
panel 3010 has asubstrate 3008 on which theFPC connection unit 3005, the internal circuit, and the light-emittingelement 3011 are mounted. The internal circuit has the signalline driving circuit 3006, the scanline driving circuit 3007, and apixel unit 3009. Though the pixel which is described inEmbodiment 1 is shown inFIG. 3 by way of example, it is possible to use any one of the pixels described in the embodiments of this invention as thepixel unit 3009. - The
pixel unit 3009 is disposed on the center of the substrate, and the signalline driving circuit 3006 and the scanline driving circuit 3007 are disposed around thepixel unit 3009. The light-emittingelement 3011 and a counter electrode of the light-emitting element is formed on a whole surface of thepixel unit 3009. - Shown in
FIG. 4 is a block diagram showing the signalline driving circuit 3006 in detail. - The signal
line driving circuit 3006 has ashift resistor 4002 consisting of a plurality of D-flip flops 4001,data latch circuits 4003,latch circuits 4004,level shifters 4005,buffers 4006, and the like. - Signals used in this example as those input to the signal
line driving circuit 3006 are a clock signal line (S-CK), a reverse clock signal line (S-CKB), a start pulse (S-SP), a video signal (DATA), and a latch pulse. - Sampling pulses are output from the
shift register 4002 sequentially in accordance with timings of the clock signal, the clock reverse signal, and the start pulse. The sampling pulses are input to thedata latch circuit 4003, so that the video signal is fetched and retained at the timing of the input. This operation is performed for each of columns sequentially from left to right. - After a completion of the video signal retention in the
data latch circuit 4003 of the last column, the latch pulse is input during a horizontal retrace period, so that the video signals retained in thedata latch circuits 4003 are transferred simultaneously to thelatch circuits 4004. After that, the signals are level-shifted in thelevel shifters 4005 and reshaped in thebuffers 4006 to be output simultaneously to the signal lines S1 to Sn. Here, an H level and an L level are input to the pixels in columns selected by the scanline driving circuit 3007 to control emission and non-emission of the light-emittingelements 3011. - Though the active matrix type display device described in this invention has the
panel 3010 and theexternal circuit 3004 which are independent from each other, they may be integrally formed on an identical substrate. Also, though the display device using the OLEDs is described by way of example in this example, light-emitting elements other than the OLEDs may be used for the light-emitting device. Also, thelevel shifters 4005 and thebuffers 4006 are not necessarily disposed inside the signalline driving circuit 3006. - In this example, one example of a top view of the pixels shown in
FIG. 2 will be described. Shown inFIG. 5 is the pixel top view of this example. - Denoted by 5001 is a signal line, denoted by 5002 is a first power line, denoted by 5001 is a second power line, denoted by 5004 is a first scan line, and denoted by 5003 is a second scan line. In this example, the
signal line 5001, thefirst power line 5002, and thesecond power line 5011 are formed from an identical electro-conductive film, and thefirst scan line 5004 and thesecond scan line 5003 are formed from an identical electro-conductive film. Denoted by 5005 is a switching transistor, and a part of thefirst scan line 5004 functions as a gate electrode of theswitching transistor 5005. Denoted by 5006 is an erasing transistor, and a part of thesecond scan line 5003 functions as a gate electrode of the erasingtransistor 5006. Denoted by 5007 is a driving transistor, and denoted by 5008 is a current control transistor. The drivingtransistor 5007 has a wound active layer used for maintaining an L/W thereof at a value larger than that of thecurrent control transistor 5008. For instance, the size of the drivingtransistor 5007 may be set to L=200 nm and W=4 nm, while the size of thecurrent control transistor 5008 may be set to L=6 nm and W=12 nm. Denoted by 5009 is a pixel electrode, and light is emitted in an area (light-emitting area) 5010 which overlaps with an electro-luminescent layer and a cathode (both not shown). - The top view of this invention is not more than one example, and it is needless to say that this invention is not limited thereto.
- In this example, another example of the top view of the pixels shown in
FIG. 2 will be described. Shown inFIG. 8 is the pixel top view of this example. - Denoted by 8001 is a signal line, denoted by 8002 is a first power line, denoted by 8011 is a second power line, denoted by 8004 is a first scan line, and denoted by 8003 is a second scan line. In this example, the
signal line 8001, thefirst power line 8002, and thesecond power line 8011 are formed from an identical electro-conductive film, and thefirst scan line 8004 and thesecond scan line 8003 are formed from an identical electro-conductive film. Denoted by 8005 is a switching transistor, and a part of thefirst scan line 8004 functions as a gate electrode of theswitching transistor 8005. Denoted by 8006 is an erasing transistor, and a part of thesecond scan line 8003 functions as a gate electrode of the erasingtransistor 8006. Denoted by 8007 is a driving transistor, and denoted by 8008 is a current control transistor. The drivingtransistor 8007 has a wound active layer used for maintaining an L/W thereof at a value larger than that of thecurrent control transistor 8008. For instance, the size of the drivingtransistor 8007 may be set to L=200 nm and W=4 nm, while the size of thecurrent control transistor 8008 may be set to L=6 nm and W=12 nm. Denoted by 8009 is a pixel electrode, and light is emitted in an area (light-emitting area) 8010 which overlaps with an electro-luminescent layer and a cathode (both not shown). Denoted by 8012 is a capacitance unit formed from an insulating film disposed between thesecond power line 8011 and thecurrent control transistor 8008. - The top view of this invention is not more than one example, and it is needless to say that this invention is not limited thereto.
- A sectional structure of a pixel will be described in this example.
- Shown in
FIG. 9(A) is a sectional view of a pixel in the case where a drivingtransistor 9021 is of the P-type, and light emitted from a light-emittingelement 9022 is ejected in a direction of ananode 9023. Referring toFIG. 9(A) , theanode 9023 of the light-emittingelement 9022 is electrically connected to the drivingtransistor 9021, and an electro-luminescent layer 9024 and acathode 9025 are formed in this order on theanode 9023. Any known material may be used for thecathode 9025 so far as it is an electro-conductive film having a small work function and reflecting light. Preferred examples of the material are Ca, Al, CaF, MgAg, AlLi, and the like. The electro-luminescent layer 9024 may be formed of either one of one layer or a stack of a plurality of layers. In the case where the electro-luminescent layer 9024 is formed of the plurality of layers, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer may be formed in this order on theanode 9023. It is unnecessary to provide all of these layers. A transparent electro-conductive film capable of transmitting light is used for forming theanode 9023, and examples of the transparent electro-conductive film may be ITO, an electro-conductive film formed by mixing indium oxide with 2 to 20% of zinc oxide (ZnO). - A portion at which the
anode 9023, the electro-luminescent layer 9024, and thecathode 9025 are overlapped with one another corresponds to the light-emittingelement 9022. In the case of the pixel shown inFIG. 9(A) , the light emitted from the light-emittingelement 9022 is ejected in a direction of theanode 9023 as indicated by an white arrow - Shown in
FIG. 9(B) is a sectional view of a pixel in the case where a drivingtransistor 9001 is of the N-type and light emitted from the light-emittingelement 9002 is ejected in a direction of ananode 9005. Referring toFIG. 9(B) , acathode 9003 of the light-emittingelement 9002 is electrically connected to the drivingtransistor 9001, and an electro-luminescent layer 9004 and theanode 9005 are formed in this order on thecathode 9003. Any known material may be used for thecathode 9003 so far as it is an electro-conductive film having a small work function and reflecting light. Preferred examples of the material are Ca, Al, CaF, MgAg, AlLi, and the like. The electro-luminescent layer 9004 may be formed of either one of one layer or a stack of a plurality of layers. In the case where the electro-luminescent layer 9004 is formed of the plurality of layers, an electron injection layer, an electron transport layer, a light-emitting layer, a hole transport layer, and a hole injection layer may be formed in this order on thecathode 9003. It is unnecessary to provide all of these layers. A transparent electro-conductive film capable of transmitting light is used for forming theanode 9005, and examples of the transparent electro-conductive film may be ITO, an electro-conductive film formed by mixing indium oxide with 2 to 20% of zinc oxide (ZnO). - A portion at which the
cathode 9003, the electro-luminescent layer 9004, and theanode 9005 are overlapped with one another corresponds to the light-emittingelement 9002. In the case of the pixel shown inFIG. 9(B) , the light emitted from the light-emittingelement 9002 is ejected in a direction of theanode 9005 as indicated by an white arrow - Though the driving transistor is electrically connected to the light-emitting element in this example, a current control transistor may be connected between the driving transistor and the light-emitting element.
- One example of a driving timing using the pixel structure of this invention will be described using
FIG. 10 . - Shown in
FIG. 10(A) is one example of a case of displaying a 4-bit gradation using a digital time gradation method. A length ratio among data retention periods Ts1 to Ts4 is set to Ts1:Ts2:Ts3:Ts4=23:22:21:20=8:4:2:1. - Operation will hereinafter be described. A first scan line is selected in each of the rows sequentially in descending order during a write period Tb1 to turn on switching transistors. Then, video signals are input from signal lines to pixels, so that emission and non-emission of the pixels are controlled by potentials of the video signals. In the row where the video signal writing has completed, transition to the data retention period Ts1 is performed immediately. The same operation is performed in the rows, and a period Ta1 terminates when the operation is performed in the last row. Here, transition to a write period Tb2 is performed in the rows sequentially in the order of termination of the data retention period Ts1.
- Here, in a sub-frame period (corresponding to Ts4 in this example) having a data retention period shorter than the write period, an erasing
period 2102 is provided so that the next period does not start immediately after the termination of the data retention period. The light-emitting elements are forcibly kept in the non-emission state during the erasing period. - Though the case of displaying the 4-bit gradation has been described in this example, the number of bits and the number of gradations are not limited thereto. The order of the light emission is not necessarily the order of from Ts1 to Ts4, and a random order may be used, or may be divided into a plurality of sections.
- Shown in
FIG. 10(B) are examples of a write pulse and an erasing pulse. The erasing pulse is input to each of rows as illustrated as an erasingpulse 1 and may be retained by a capacitance unit during the erasing period or an H level may be input all through the erasing period as illustrated as an erasingpulse 2. The pulses shown in FIG. 10(B) are used in the case where both of the switching transistor and the erasing transistor are of the N-type, and, in the case where both of the switching transistor and the erasing transistor are of the P-type, the H level and the L level of the pulses shown inFIG. 10(B) are reversed. - The display device using the light-emitting device of the invention can be used in display portions of various electronic apparatuses. In particular, the display device of the invention is desirably applied to a mobile device that preferably consumes less power.
- Electronic apparatuses using the display device of the invention include a portable information terminal (a cellular phone, a mobile computer, a portable game machine, an electronic book, and the like), a video camera, a digital camera, a goggle display, a display device, a navigation system, and the like. Specific examples of these electronic apparatuses are shown in
FIGS. 6A to 6D . -
FIG. 6A illustrates a display device which includes ahousing 6001, anaudio output portion 6002, adisplay portion 6003, and the like. The light-emitting device of the invention can be applied to thedisplay portion 6003. Note that the display device includes all the information display devices for personal computers, television broadcast reception, advertisement, and the like. -
FIG. 6B illustrates a mobile computer which includes amain body 6101, astylus 6102, a display portion 6103,operation keys 6104, anexternal interface 6105, and the like. The light-emitting device of the invention can be applied to the display portion 6103. -
FIG. 6C illustrates a game machine which includes amain body 6201, adisplay portion 6202,operation keys 6203, and the like. The light-emitting device of the invention can be applied to thedisplay portion 6202. -
FIG. 6D illustrates a cellular phone which includes amain body 6301, anaudio output portion 6302, adisplay portion 6304, operation switches 6305, anantenna 6306, and the like. The light-emitting device of the invention can be applied to thedisplay portion 6304. - As described above, an application range of the light-emitting device of the invention is so wide that the invention can be applied to electronic apparatuses in various fields.
- Using
FIG. 11 , a sectional structure of a pixel of the light-emitting device of 10 this invention will be described. Shown inFIG. 11 is a drivingtransistor 7001 which is formed on asubstrate 7000. The drivingtransistor 7001 is covered with a firstinterlayer insulating film 7002, and acolor filter 7003 formed from a resin or the like and awiring 7004 electrically connected to a drain of the drivingtransistor 7001 via a contact hole are formed on the firstinterlayer insulating film 7002. A current control transistor may be provided between the drivingtransistor 7001 and thewiring 7004. - A second
interlayer insulating film 7005 is formed on the firstinterlayer insulating film 7002 in such a manner as to cover thecolor filter 7003 and thewiring 7004. A silicon oxide film, a silicon nitride film, or a silicon oxide nitride film formed by plasma CVD or sputtering or a stack of these films formed by plasma CVD or sputtering may be used as the firstinterlayer insulating film 7002 or the secondinterlayer insulating film 7005. Also, a film obtained by stacking a silicon oxide nitride film wherein a molar ratio of oxygen is higher than that of nitrogen on a silicon oxide nitride film wherein a molar ratio of nitrogen is higher than that of oxygen may be used as the firstinterlayer insulating film 7002 or the secondinterlayer insulating film 7005. Alternatively, an organic resin film may be used as the firstinterlayer insulating film 7002 or the secondinterlayer insulating film 7005. - A
wiring 7006 electrically connected to thewiring 7004 via a contact hole is formed on the secondinterlayer insulating film 7005. A part of thewiring 7006 functions as an anode of a light-emitting element. Thewiring 7006 is formed in such a manner as to overlap with thecolor filter 7003 with the secondinterlayer insulating film 7005 being sandwiched therebetween. - An
organic resin film 7008 to be used as a partition is formed on the secondinterlayer insulating film 7005. The organic resin film has an opening, and thewiring 7006 functioning as the anode, an electro-luminescent layer 7009, and acathode 7010 are formed in such a manner as to overlap with one another on the opening to form the light-emittingelement 7011. The electro-luminescent layer 7009 is formed of a single light-emitting layer or has a structure that a plurality of layers including the light-emitting layer are stacked. A protection film may be formed on theorganic resin film 7008 and thecathode 7010. In this case, a film less subject to permeation of substances promoting deterioration of the light-emitting element, such as moisture, oxygen, etc., as compared with other insulating films is used as the protection film. Typically, it is desirable to use a DLC film, a carbon nitride film, a silicon nitride film formed by RF sputtering, or the like as the protection film. It is possible to use a film obtained by stacking the film less subject to the permeation of substances such as moisture and oxygen and a film subject to the permeation of substances such as moisture and oxygen as compared with the formerly mentioned film as the protection film. - The
organic resin film 7008 is heated under a vacuum atmosphere so as to eliminate absorbed moisture, oxygen, and so forth before forming the electro-luminescent layer 7009. More specifically, a heat treatment at 100° C. to 200° C. is performed under a vacuum atmosphere for about 0.5 to 1 hour. It is desirable to perform the heat treatment under 3×10−7 Torr or less, most desirably under 3×10−8 Torr, if possible. In the case of forming the electro-luminescent layer after subjecting the organic resin film to the heat treatment under the vacuum atmosphere, it is possible to improve reliability by maintaining the vacuum atmosphere until shortly before the film formation. - It is desirable to round an edge of the opening of the
organic resin film 7008 so that the electro-luminescent layer 7009 formed on theorganic resin film 7008 in the partially overlapping manner is not pierced at the edge. More specifically, it is desirable that a radius of curvature of a curve of a section of the opening of the organic resin film is from 0.2 to 2 μm. - With the above-described constitution, it is possible to achieve a satisfactory coverage of the electro-luminescent layer and the cathode to be formed afterward and to prevent the
wiring 7006 and thecathode 7010 from being short-circuited in the hole formed in the electro-luminescent layer 7009. Also, by mitigating stress of the electro-luminescent layer 7009, it is possible to reduce a defect called shrinkage, which is a reduction in light emission area, thereby enhancing the reliability. - In addition, in the example shown in
FIG. 11 , a positive photosensitive acryl resin is used as theorganic resin film 7008. Photosensitive organic resins are broadly divided into a positive type in which a portion exposed to energy rays such as light, electrons, ions is removed and a negative type in which the exposed portion remains. The negative type organic resin film may be used in this invention. Also, theorganic resin film 7008 may be formed by using photosensitive polyimide. In the case of forming theorganic resin film 7008 using a negative type acryl, the edge of the opening has a section in the form of the letter “S”. Here, it is desirable to set a radius of curvature of each of an upper end and a lower end of the opening to 0.2 to 2 μm. - A transparent electro-conductive film may be used for the
wiring 7006. Usable examples of the transparent electro-conductive film is an ITO and a transparent electro-conductive film obtained by mixing 2 to 20% of indium oxide with zinc oxide (ZnO). InFIG. 11 , the ITO is used as thewiring 7006. Thewiring 7006 may be polished by wiping using a CMP method and a polyvinyl alcohol-based porous material so as to smooth out its surface. Also, the surface of thewiring 7006 may be irradiated with ultraviolet rays or treated with oxygen plasma after undergoing the polishing using the CMP method. - Any known material may be used for the
cathode 7010 so far as it is an electro-conductive film having a thickness capable of transmitting light and a small work function. Preferred examples of the material are Ca, Al, CaF, MgAg, AlLi, and the like. In order to obtain light from the cathode side, a method of using ITO which is reduced in work function by an addition of Li may be employed in addition to a method of thinning the film thickness. A structure of the light-emitting element used in this invention is not particularly limited so far as it enables light emission from both of the anode side and the cathode side. - In practice, it is preferable to perform packaging (enclosure) with a protection film (laminate film, ultraviolet curing resin film, etc.) or a
transparent glazing material 7012 which is high in air tightness and less subject to degasification. In the packaging, the reliability of the light-emitting element is improved by maintaining an inside of the glazing material under an inert atmosphere or disposing an moisture absorbent (e.g., barium oxide) inside the glazing material. In this invention, theglazing material 7012 may be provided with acolor filter 7013. - Note that this invention is not limited to the above-described manufacturing process and that it is possible to use any known method for the manufacture.
- In this example, a pixel structure in the case where positions of the driving
transistor 202 and thecurrent control transistor 203 are exchanged in the pixel shown inFIG. 2 will be described. - Shown in
FIG. 12 is a circuit structure of the pixel of this example. The elements and wirings shown inFIG. 2 are denoted by the same reference numerals inFIG. 12 . The pixel shown inFIG. 12 and the pixel shown inFIG. 2 has a common point that the current supplied from the first power line Vi (i=1 to x) is supplied to the light-emittingelement 204 as the drain current of the drivingtransistor 202 and thecurrent control transistor 203. But the pixel shown inFIG. 12 is different from the pixel shown inFIG. 2 in that the source of the drivingtransistor 202 is connected to the first power line Vi (i=1 to x), while the drain of the current control transistor is connected to the pixel electrode of the light-emittingelement 204. - A gate/source voltage Vgs of the driving
transistor 202 is fixed by connecting the source of the drivingtransistor 202 to the first power line Vi as described in this example. That is, the gate/source voltage Vgs of the drivingtransistor 202 operating in the saturation area does not change and remains to be fixed even if the light-emittingelement 204 is degraded. Therefore, in this example, it is possible to prevent a fluctuation in drain current of the drivingtransistor 202 operating in the saturation area even if the light-emittingelement 204 is degraded. - In this example, one example of a top view of the pixel shown in
FIG. 12 will be described. Note that a resistance is provided between the pixel electrode of the light-emittingelement 204 and the drain of thecurrent control transistor 203 in the pixel shown inFIG. 12 will be described in this example. Shown inFIG. 13 is the top view of the pixel of this example. - Denoted by 5101 is a signal line, denoted by 5102 is a first power line, denoted by 5111 is a second power line, denoted by 5104 is a first scan line, and denoted by 5103 is a second scan line. In this example, the
signal line 5101, thefirst power line 5102, and thesecond power line 5111 are formed from an identical electro-conductive film, and thefirst scan line 5104 and thesecond scan line 5103 are formed from an identical electro-conductive film. Denoted by 5105 is a switching transistor, and a part of thefirst scan line 5104 functions as a gate electrode of theswitching transistor 5105. Denoted by 5106 is an erasing transistor, and a part of thesecond scan line 5103 functions as a gate electrode of the erasingtransistor 5106. Denoted by 5107 is a driving transistor, and denoted by 5108 is a current control transistor. Denoted by 5112 is a capacitance element, and denoted by 5113 is a resistance formed from a semiconductor film. The drivingtransistor 5107 has a wound active layer used for maintaining an L/W thereof at a value larger than that of thecurrent control transistor 5108. For instance, the size of the drivingtransistor 5107 may be set to L=200 nm and W=4 nm, while the size of thecurrent control transistor 5108 may be set to L=6 nm and W=12 nm. Denoted by 5109 is a pixel electrode, and light is emitted in an area (light-emitting area) where thepixel electrode 5109 overlaps with an electro-luminescent layer (not shown) and a cathode (not shown). - In the case of forming the
pixel electrode 5109 by forming an electro-conductive film and then patterning the electro-conductive film, it is possible to prevent thedriving transistor 5107 from being destroyed due to a sharp change in potential of the drain of the drivingtransistor 5107 caused by an electric charge charged on the electro-conductive film by using theresistance 5113. Also, it is possible to use theresistance 5113 as an electrostatic countermeasure until a deposition of an EL. - In addition, it is needless to say that the top view of this invention is described only by way of example and that the invention is not limited thereto.
- In this example, a pixel structure when pixels using the first scan line Gaj (j=1 to y) or the second scan line Gej (j =1 to y) further use the second power line Wj (i=1 to x) will be described using the pixel shown in
FIG. 2 . - A circuit diagram of the pixels of this example is shown in
FIG. 14(A) . The elements and the wirings shown inFIG. 2 are denoted by same reference numerals inFIG. 14(A) . Note that the pixels using the first scan line Gaj (j=1 to y) and the second scan line Gej (j=1 to y) in common further use the second power line Wj (i=1 to x) in common. The second power line Wj (i=1 to x) intersects with the signal line Si (i=1 to x) and the first power line Vi (i=1 to x), and the pixels using the second scan line Gej (j=1 to y) in common has signal lines Si (i=1 to x) which are different from one another. - Shown in
FIG. 14(B) is a pixel structure in the case of employing a method of adjusting a white balance by applying different voltages to the gates of the drivingtransistors 202 depending on a red pixel, a green pixel, and a blue pixel. Referring toFIG. 14(B) , in apixel 210 corresponding to red, a second power line Wrj for red (R) is connected to the gate of the drivingtransistor 202. In apixel 211 corresponding to green, a second power line Wgj for green (G) is connected to the gate of the drivingtransistor 202. In apixel 212 corresponding to blue, a power line Wbj for blue (B) is connected to the gate of the drivingtransistor 202. - In this example, a pixel structure in the case of providing a resistance between a drain of the driving
transistor 202 and a light-emitting element will be described using the pixels shown inFIGS. 14(A) and 14(B) . - Shown in
FIG. 15(A) is the pixel structure in which the pixel shown inFIG. 14(A) is provided with a resistance. The elements and the wirings shown inFIG. 14(A) are denoted by the same reference numerals inFIG. 15(A) .FIG. 15(A) is different fromFIG. 14(A) in that aresistance 209 is provided between the pixel electrode of the light-emittingelement 104 and the drain of the drivingtransistor 202. - Shown in
FIG. 15(B) is a pixel structure in the case of employing a method of adjusting a white balance by applying different voltages to the gates of the driving 20transistors 202 depending on a red pixel, a green pixel, and a blue pixel. Referring toFIG. 15(B) , in apixel 210 corresponding to red, a second power line Wrj for red (R) is connected to the gate of the drivingtransistor 202. In apixel 211 corresponding to green, a second power line Wgj for green (G) is connected to the gate of the drivingtransistor 202. In apixel 212 corresponding to blue, a power line Wbj for blue (B) is connected to the gate of the drivingtransistor 202. - In the case of forming the pixel electrode by forming an electro-conductive film and then patterning the electro-conductive film, it is possible to prevent the driving
transistor 202 from being destroyed due to a sharp change in potential of the drain of the drivingtransistor 202 caused by an electric charge charged on the electro-conductive film by using theresistance 209. Also, it is possible to use theresistance 5209 as an electrostatic countermeasure until a deposition of an EL. - Next, one example of a top view of the pixel shown in
FIG. 15(A) will be described. The top view of this example is shown inFIG. 16 . - Denoted by 5201 is a signal line, denoted by 5202 is a first power line, denoted by 5211 is a second power line, denoted by 5204 is a first scan line, and denoted by 5203 is a second scan line. In this example, the
signal line 5201, and thefirst power line 5202 are formed from an identical electro-conductive film, and thefirst scan line 5204, thesecond scan line 5203, and thesecond power line 5211 are formed from an identical electro-conductive film. Denoted by 5205 is a switching transistor, and a part of thefirst scan line 5204 functions as a gate electrode of theswitching transistor 5205. Denoted by 5206 is an erasing transistor, and a part of thesecond scan line 5203 functions as a gate electrode of the erasingtransistor 5206. Denoted by 5207 is a driving transistor, and denoted by 5208 is a current control transistor. Denoted by 5212 is a capacitance element, and denoted by 5213 is a resistance formed from a semiconductor film. The drivingtransistor 5207 has a wound active layer used for maintaining an L/W thereof at a value larger than that of thecurrent control transistor 5208. For instance, the size of the drivingtransistor 5207 may be set to L=200 nm and W=4 nm, while the size of thecurrent control transistor 5208 may be set to L=6 nm and W=12 nm. Denoted by 5209 is a pixel electrode, and light is emitted in an area (light-emitting area) where thepixel electrode 5209 overlaps with an electro-luminescent layer (not shown) and a cathode (not shown). - Next, one example of a top view of the pixel shown in
FIG. 15(B) will be described. Shown inFIG. 17 is the pixel top view of this example. - Denoted by 5301 is a signal line, denoted by 5302 is a first power line, denoted by 5311 r is a second power line corresponding to a red pixel, denoted by 5311 g is a second power line corresponding to a green pixel, denoted by 5311 b is a second power line corresponding to a blue pixel, denoted by 5304 is a first scan line, and denoted by 5303 is a second scan line. In this example, the
signal line 5301 and thefirst power line 5302 are formed from an identical electro-conductive film, and thefirst scan line 5304, thesecond scan line 5303, and thesecond power lines first scan line 5304 functions as a gate electrode of theswitching transistor 5305. Denoted by 5306 is an erasing transistor, and a part of thesecond scan line 5303 functions as a gate electrode of the erasingtransistor 5306. Denoted by 5307 is a driving transistor, and denoted by 5308 is a current control transistor. Denoted by 5312 is a capacitance element, and denoted by 5313 is a resistance formed from a semiconductor film. The drivingtransistor 5307 has a wound active layer used for maintaining an L/W thereof at a value larger than that of thecurrent control transistor 5308. For instance, the size of the drivingtransistor 5307 may be set to L=200 nm and W=4 nm, while the size of thecurrent control transistor 5308 may be set to L=6 nm and W=12 nm. Denoted by 5309 is a pixel electrode, and light is emitted in an area (light-emitting area) where thepixel electrode 5309 overlaps with an electro-luminescent layer (not shown) and a cathode (not shown). - It is needless to say that the top view of this invention is described only by way of example and that the invention is not limited thereto.
- Since the number of transistors included in one pixel is 4 in the light-emitting device of this invention, it is possible to set a width across corner to 4 to 4.3 inches, a width of an interlayer used as a partition for separating adjacent light-emitting elements to 20 μm, a VGA to (640×480) 200 dpi, and the size of the pixel to 45×135 μm.
- Shown in
FIG. 18(A) is a sectional view of a pixel in the case where a drivingtransistor 9011 is of the N-type and light emitted from a light-emittingelement 9012 is ejected in a direction of acathode 9013. InFIG. 18(A) , thecathode 9013 of the light-emittingelement 9012 is formed on a transparent electro-conductive film 9017 electrically connected to a drain of the drivingtransistor 9011, and an electro-luminescent layer 9014 and ananode 9015 are formed on thecathode 9013 in this order. Ashielding film 9016 for reflecting or shielding light is formed in such a manner as to cover theanode 9015. Any known material may be used for thecathode 9013 so far as it is an electro-conductive film having a small work function and reflecting light. Preferred examples of the material are Ca, Al, CaF, MgAg, AlLi, and the like. Note that a thickness of thecathode 9013 is regulated to a value which allows light to pass therethrough. For instance, an Al film having a thickness of 20 nm may be used as thecathode 9013. The electro-luminescent layer 9014 may be formed of either one of one layer or a stack of a plurality of layers. Theanode 9015 is not required to transmit light, and a transparent electro-conductive film such as ITO, ITSO, IZO obtained by mixing indium oxide with 2 to 20% of zinc oxide (ZnO), Ti, or TiN may be used for theanode 9015. A metal reflecting light, for example, may be used as theshielding film 9016 without limitation thereto. A resin to which a black pigment is added may be used as theshielding film 9016, for example. - A portion at which the
cathode 9013, the electro-luminescent layer 9014, and theanode 9015 are overlapped with one another corresponds to the light-emittingelement 9012. In the case of the pixel shown inFIG. 18(A) , the light emitted from the light-emittingelement 9012 is ejected in a direction of thecathode 9013 as indicated by an white arrow. - Shown in
FIG. 18(B) is a sectional view of a pixel in the case where a drivingtransistor 9031 is of the P-type and light emitted from the light-emittingelement 9032 is ejected in a direction of acathode 9035. Referring toFIG. 18(B) , ananode 9033 of the light-emittingelement 9032 is formed on awiring 9036 electrically connected to a drain of the drivingtransistor 9031, and an electro-luminescent layer 9034 and thecathode 9035 are formed on theanode 9033 in this order. With such constitution, when light has passed through theanode 9033, the light is reflected by thewiring 9036. Any known material may be used for thecathode 9035 so far as it is an electro-conductive film having a small work function and reflecting light as is the case withFIG. 18(A) . Note that a thickness of thecathode 9035 is regulated to a value which allows light to pass therethrough. For instance, an Al film having a thickness of 20 nm may be used as thecathode 9035. The electro-luminescent layer 9034 may be formed of either one of one layer or a stack of a plurality of layers, as is the case withFIG. 18(A) . Theanode 9033 is not required to transmit light, and a transparent electro-conductive film or Ti, or TiN may be used for theanode 9033 as is the case withFIG. 18(A) . - A portion at which the
anode 9033, the electro-luminescent layer 9034, and thecathode 9035 are overlapped with one another corresponds to the light-emittingelement 9032. In the case of the pixel shown inFIG. 18(B) , the light emitted from the light-emittingelement 9032 is ejected in a direction of thecathode 9035 as indicated by an white arrow - In addition, though the structure that the driving transistor is electrically connected to the light-emitting element is described in this example, a current control transistor may be connected between the driving transistor an the light-emitting element.
- In this example, a sectional structure of a pixel in the case where each of a driving transistor and a current control transistor is of a bottom gate type will be described.
- The transistor to be used in this invention may be formed from amorphous silicon. Since the transistor formed from the amorphous silicon contributes to an elimination of a process of crystallization, it is possible to simplify a manufacturing method and to reduce a cost. Note that a P-type amorphous silicon transistor is suitably used for the pixel of this invention since it has a higher mobility as compared with an N-type amorphous silicon transistor. In this example, a sectional structure of a pixel in the case of using the N-type driving transistor will be described.
- Shown in
FIG. 19(A) is a sectional view of a pixel of this example. Denoted by 6501 is a driving transistor and denoted by 6502 is a current control transistor. The drivingtransistor 6501 has agate electrode 6503 formed on asubstrate 6500 having an isolating surface, agate insulating film 6504 formed on thesubstrate 6500 in such a manner as to cover thegate electrode 6503, and asemiconductor film 6505 formed at a position overlapping with thegate electrode 6503 with the gate insulating film being sandwiched therebetween. Thesemiconductor film 6505 has animpurity area impurity area 6506 a is connected to awiring 6508. - The
current control transistor 6502 has, like the drivingtransistor 6501, agate electrode 6510 formed on thesubstrate 6500 having the isolating surface, thegate insulating film 6504 formed on thesubstrate 6500 in such a manner as to cover thegate electrode 6510, and asemiconductor film 6511 formed at a position overlapping with thegate electrode 6510 with thegate insulating film 6504 being sandwiched therebetween. Thesemiconductor film 6511 has animpurity area impurity area 6512 a is connected, via awiring 6513, to theimpurity area 6506 b included in the drivingtransistor 6501. - The driving
transistor 6501 and thecurrent control transistor 6502 are covered with aprotection film 6507 formed from an insulating film. Thewiring 6508 is connected to ananode 6509 via a contact hall formed on theprotection film 6507. The drivingtransistor 6501, thecurrent control transistor 6502, and theprotection film 6507 are covered with aninterlayer insulating film 6520. Theinterlayer insulating film 6520 has an opening, and theanode 6509 is exposed in the opening. An electro-luminescent layer 6521 and acathode 6522 are formed on theanode 6509. - In addition, the example in which the driving transistor and the current control transistor are of the N-type is described with reference to
FIG. 19(A) , they may be of the P-type. In this case, P-type impurity is used for controlling a threshold value of the driving transistor. - In this example, one example of a top view of the pixel shown in
FIG. 2 will be described. The pixel top view of this example is shown inFIG. 20 . - Denoted by 5401 is a signal line, denoted by 5402 is a first power line, denoted by 5411 a and 5411 b are second power lines, denoted by 5404 is a first scan line, and denoted by 5403 is a second scan line. In this example, the
signal line 5401, the first power line 5402, and thesecond power line 5411 a are formed from an identical electro-conductive film, and thefirst scan line 5404, thesecond scan line 5403, and thesecond power line 5411 b are formed from an identical electro-conductive film. Denoted by 5405 is a switching transistor, and a part of thefirst scan line 5404 functions as a gate electrode of theswitching transistor 5405. Denoted by 5406 is an erasing transistor, and a part of thesecond scan line 5403 functions as a gate electrode of the erasingtransistor 5406. Denoted by 5407 is a driving transistor, and denoted by 5408 is a current control transistor. Denoted by 5412 is a capacitance element, and denoted by 5413 is a resistance formed from a semiconductor film. The driving transistor 5407 has a wound active layer used for maintaining an L/W thereof at a value larger than that of the current control transistor 5408. For instance, the size of the driving transistor 5407 may be set to L=200 nm and W=4 nm, while the size of the current control transistor 5408 may be set to L=6 nm and W=12 nm. Denoted by 5409 is a pixel electrode, and light is emitted in an area (light-emitting area) 5410 where thepixel electrode 5409 overlaps with an electro-luminescent layer (not shown) and a cathode (not shown). - It is needless to say that the top view of this invention is described only by way of example and that the invention is not limited thereto.
Claims (7)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/636,908 US20180019292A1 (en) | 2003-03-26 | 2017-06-29 | Element substrate and light-emitting device |
US16/724,624 US11430845B2 (en) | 2003-03-26 | 2019-12-23 | Element substrate and light-emitting device |
US17/893,221 US20220406865A1 (en) | 2003-03-26 | 2022-08-23 | Element substrate and light-emitting device |
Applications Claiming Priority (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-086500 | 2003-03-26 | ||
JP2003086500 | 2003-03-26 | ||
JP2003-139560 | 2003-05-16 | ||
JP2003139560 | 2003-05-16 | ||
JP2003-174134 | 2003-06-18 | ||
JP2003174134 | 2003-06-18 | ||
US10/807,545 US8026877B2 (en) | 2003-03-26 | 2004-03-24 | Element substrate and light-emitting device |
US13/243,034 US8659523B2 (en) | 2003-03-26 | 2011-09-23 | Element substrate and light-emitting device |
US14/183,679 US9300771B2 (en) | 2003-03-26 | 2014-02-19 | Element substrate and light-emitting device |
US15/082,012 US9698207B2 (en) | 2003-03-26 | 2016-03-28 | Element substrate and light-emitting device |
US15/636,908 US20180019292A1 (en) | 2003-03-26 | 2017-06-29 | Element substrate and light-emitting device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/082,012 Continuation US9698207B2 (en) | 2003-03-26 | 2016-03-28 | Element substrate and light-emitting device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/724,624 Continuation US11430845B2 (en) | 2003-03-26 | 2019-12-23 | Element substrate and light-emitting device |
Publications (1)
Publication Number | Publication Date |
---|---|
US20180019292A1 true US20180019292A1 (en) | 2018-01-18 |
Family
ID=33101960
Family Applications (7)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/807,545 Expired - Fee Related US8026877B2 (en) | 2003-03-26 | 2004-03-24 | Element substrate and light-emitting device |
US13/243,034 Expired - Lifetime US8659523B2 (en) | 2003-03-26 | 2011-09-23 | Element substrate and light-emitting device |
US14/183,679 Expired - Fee Related US9300771B2 (en) | 2003-03-26 | 2014-02-19 | Element substrate and light-emitting device |
US15/082,012 Expired - Lifetime US9698207B2 (en) | 2003-03-26 | 2016-03-28 | Element substrate and light-emitting device |
US15/636,908 Abandoned US20180019292A1 (en) | 2003-03-26 | 2017-06-29 | Element substrate and light-emitting device |
US16/724,624 Expired - Lifetime US11430845B2 (en) | 2003-03-26 | 2019-12-23 | Element substrate and light-emitting device |
US17/893,221 Abandoned US20220406865A1 (en) | 2003-03-26 | 2022-08-23 | Element substrate and light-emitting device |
Family Applications Before (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/807,545 Expired - Fee Related US8026877B2 (en) | 2003-03-26 | 2004-03-24 | Element substrate and light-emitting device |
US13/243,034 Expired - Lifetime US8659523B2 (en) | 2003-03-26 | 2011-09-23 | Element substrate and light-emitting device |
US14/183,679 Expired - Fee Related US9300771B2 (en) | 2003-03-26 | 2014-02-19 | Element substrate and light-emitting device |
US15/082,012 Expired - Lifetime US9698207B2 (en) | 2003-03-26 | 2016-03-28 | Element substrate and light-emitting device |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/724,624 Expired - Lifetime US11430845B2 (en) | 2003-03-26 | 2019-12-23 | Element substrate and light-emitting device |
US17/893,221 Abandoned US20220406865A1 (en) | 2003-03-26 | 2022-08-23 | Element substrate and light-emitting device |
Country Status (7)
Country | Link |
---|---|
US (7) | US8026877B2 (en) |
EP (1) | EP1607931B1 (en) |
JP (13) | JP4166783B2 (en) |
KR (1) | KR101138806B1 (en) |
CN (1) | CN102709478B (en) |
TW (1) | TWI356389B (en) |
WO (1) | WO2004086343A1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10490671B2 (en) | 2009-10-16 | 2019-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Logic circuit and semiconductor device |
EP3657483A1 (en) * | 2018-11-20 | 2020-05-27 | InnoLux Corporation | Electronic device |
US11430845B2 (en) * | 2003-03-26 | 2022-08-30 | Semiconductor Energy Laboratory Co., Ltd. | Element substrate and light-emitting device |
US11450275B2 (en) * | 2020-10-15 | 2022-09-20 | Xiamen Tianma Micro-Electronics Co., Ltd. | Pixel driving circuit, display panel and driving method |
US20220358883A1 (en) * | 2020-10-15 | 2022-11-10 | Xiamen Tianma Micro-Electronics Co., Ltd. | Display panel |
US11508852B2 (en) | 2013-09-13 | 2022-11-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US11961842B2 (en) | 2009-11-06 | 2024-04-16 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device |
Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6753654B2 (en) | 2001-02-21 | 2004-06-22 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and electronic appliance |
JP2004361424A (en) * | 2003-03-19 | 2004-12-24 | Semiconductor Energy Lab Co Ltd | Element substrate, light emitting device and driving method of light emitting device |
JP4842381B2 (en) * | 2003-03-26 | 2011-12-21 | 株式会社半導体エネルギー研究所 | Semiconductor device |
TWI363574B (en) * | 2003-04-07 | 2012-05-01 | Semiconductor Energy Lab | Electronic apparatus |
US7250720B2 (en) | 2003-04-25 | 2007-07-31 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
JP4754772B2 (en) | 2003-05-16 | 2011-08-24 | 株式会社半導体エネルギー研究所 | LIGHT EMITTING DEVICE AND ELECTRONIC DEVICE USING THE LIGHT EMITTING DEVICE |
JP4755293B2 (en) * | 2003-05-16 | 2011-08-24 | 株式会社半導体エネルギー研究所 | LIGHT EMITTING DEVICE AND ELECTRONIC DEVICE |
JP4425574B2 (en) | 2003-05-16 | 2010-03-03 | 株式会社半導体エネルギー研究所 | Element substrate and light emitting device |
JP4641710B2 (en) * | 2003-06-18 | 2011-03-02 | 株式会社半導体エネルギー研究所 | Display device |
JP4801329B2 (en) * | 2003-06-18 | 2011-10-26 | 株式会社半導体エネルギー研究所 | Light emitting device |
US8552933B2 (en) * | 2003-06-30 | 2013-10-08 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and driving method of the same |
JP4583732B2 (en) * | 2003-06-30 | 2010-11-17 | 株式会社半導体エネルギー研究所 | Display device and driving method thereof |
US8884845B2 (en) * | 2003-10-28 | 2014-11-11 | Semiconductor Energy Laboratory Co., Ltd. | Display device and telecommunication system |
US7683860B2 (en) * | 2003-12-02 | 2010-03-23 | Semiconductor Energy Laboratory Co., Ltd. | Display device, driving method thereof, and element substrate |
JP4841831B2 (en) * | 2003-12-02 | 2011-12-21 | 株式会社半導体エネルギー研究所 | Display device and driving method thereof |
US7595775B2 (en) * | 2003-12-19 | 2009-09-29 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting display device with reverse biasing circuit |
JP5099974B2 (en) * | 2004-01-30 | 2012-12-19 | 株式会社半導体エネルギー研究所 | Light emitting device |
US7446742B2 (en) | 2004-01-30 | 2008-11-04 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
US8378930B2 (en) | 2004-05-28 | 2013-02-19 | Sony Corporation | Pixel circuit and display device having symmetric pixel circuits and shared voltage lines |
US20060066198A1 (en) * | 2004-09-24 | 2006-03-30 | Matsushita Toshiba Picture Display Co., Ltd. | Electron source apparatus |
DE102004059506B3 (en) * | 2004-12-10 | 2006-08-17 | X-Fab Semiconductor Foundries Ag | Arrangement for testing embedded circuits using a separate supply voltage |
TWI472037B (en) * | 2005-01-28 | 2015-02-01 | Semiconductor Energy Lab | Semiconductor device, electronic device, and method of manufacturing semiconductor device |
JP2006208743A (en) * | 2005-01-28 | 2006-08-10 | Sony Corp | Pixel circuit and display device |
JP4934964B2 (en) * | 2005-02-03 | 2012-05-23 | ソニー株式会社 | Display device and pixel driving method |
JP2006284915A (en) * | 2005-03-31 | 2006-10-19 | Toshiba Matsushita Display Technology Co Ltd | Display device and array substrate |
TW200701167A (en) * | 2005-04-15 | 2007-01-01 | Seiko Epson Corp | Electronic circuit, and driving method, electrooptical device, and electronic apparatus thereof |
JP4770267B2 (en) * | 2005-05-23 | 2011-09-14 | セイコーエプソン株式会社 | Display method and display device |
JP4797555B2 (en) * | 2005-10-11 | 2011-10-19 | ソニー株式会社 | Display device and driving method thereof |
JP4939045B2 (en) * | 2005-11-30 | 2012-05-23 | セイコーエプソン株式会社 | LIGHT EMITTING DEVICE AND ELECTRONIC DEVICE |
KR101358697B1 (en) * | 2005-12-02 | 2014-02-07 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Semiconductor device, display device, and electronic device |
EP1793264A1 (en) * | 2005-12-05 | 2007-06-06 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device |
WO2007072766A1 (en) * | 2005-12-22 | 2007-06-28 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
EP1804114B1 (en) | 2005-12-28 | 2014-03-05 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
EP1832915B1 (en) * | 2006-01-31 | 2012-04-18 | Semiconductor Energy Laboratory Co., Ltd. | Display device with improved contrast |
EP1816508A1 (en) | 2006-02-02 | 2007-08-08 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
EP1826606B1 (en) * | 2006-02-24 | 2012-12-26 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
EP1826605A1 (en) * | 2006-02-24 | 2007-08-29 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
JP4929891B2 (en) * | 2006-07-19 | 2012-05-09 | ソニー株式会社 | Display device |
JP4203773B2 (en) * | 2006-08-01 | 2009-01-07 | ソニー株式会社 | Display device |
JP4297169B2 (en) * | 2007-02-21 | 2009-07-15 | ソニー株式会社 | Display device, driving method thereof, and electronic apparatus |
KR101526475B1 (en) * | 2007-06-29 | 2015-06-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Display device and driving method thereof |
JP5414161B2 (en) | 2007-08-10 | 2014-02-12 | キヤノン株式会社 | Thin film transistor circuit, light emitting display device, and driving method thereof |
JP4826597B2 (en) * | 2008-03-31 | 2011-11-30 | ソニー株式会社 | Display device |
KR101458911B1 (en) | 2008-05-07 | 2014-11-12 | 삼성디스플레이 주식회사 | Display device |
CN101587269B (en) * | 2008-05-20 | 2012-01-18 | 上海天马微电子有限公司 | Liquid crystal display device having a plurality of pixel electrodes |
US8766269B2 (en) | 2009-07-02 | 2014-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device, lighting device, and electronic device |
JP2010160526A (en) * | 2010-04-23 | 2010-07-22 | Seiko Epson Corp | Light emitting device and electronic equipment |
KR20120062251A (en) * | 2010-12-06 | 2012-06-14 | 삼성모바일디스플레이주식회사 | Pixel and organic light emitting display device using the pixel |
JP2013029816A (en) * | 2011-06-20 | 2013-02-07 | Canon Inc | Display unit |
JP5141812B2 (en) * | 2011-11-09 | 2013-02-13 | セイコーエプソン株式会社 | LIGHT EMITTING DEVICE AND ELECTRONIC DEVICE |
JP6077280B2 (en) | 2011-11-29 | 2017-02-08 | 株式会社半導体エネルギー研究所 | Display device and electronic device |
US9379169B2 (en) * | 2012-09-14 | 2016-06-28 | Universal Display Corporation | Very high resolution AMOLED display |
KR102089052B1 (en) * | 2013-05-30 | 2020-03-16 | 삼성디스플레이 주식회사 | Organic Light Emitting Display Device |
JP6562608B2 (en) * | 2013-09-19 | 2019-08-21 | 株式会社半導体エネルギー研究所 | Electronic device and driving method of electronic device |
KR102174136B1 (en) * | 2013-09-30 | 2020-11-05 | 삼성디스플레이 주식회사 | Array substrate and liquid crystal display panel having the same |
US20150280043A1 (en) * | 2014-03-27 | 2015-10-01 | David D. Smith | Solar cell with trench-free emitter regions |
US9379166B2 (en) * | 2014-11-04 | 2016-06-28 | Atom Nanoelectronics, Inc. | Active matrix light emitting diodes display module with carbon nanotubes control circuits and methods of fabrication |
TWI556211B (en) * | 2015-05-15 | 2016-11-01 | 友達光電股份有限公司 | Pixel circuit and driving method thereof |
CN104965325B (en) * | 2015-08-03 | 2018-10-30 | 合肥鑫晟光电科技有限公司 | A kind of array substrate, its restorative procedure, display panel and display device |
KR102536628B1 (en) * | 2015-08-24 | 2023-05-26 | 엘지디스플레이 주식회사 | Transparent display device |
KR20180030363A (en) * | 2016-09-13 | 2018-03-22 | 삼성디스플레이 주식회사 | Display device |
US10909933B2 (en) * | 2016-12-22 | 2021-02-02 | Intel Corporation | Digital driver for displays |
US10839771B2 (en) | 2016-12-22 | 2020-11-17 | Intel Corporation | Display driver |
US20180182294A1 (en) * | 2016-12-22 | 2018-06-28 | Intel Corporation | Low power dissipation pixel for display |
US20210183307A1 (en) * | 2018-09-05 | 2021-06-17 | Hewlett-Packard Development Company, L.P. | Eight transistor/1 capacitor oled circuits |
CN111292676B (en) * | 2018-11-20 | 2021-09-07 | 群创光电股份有限公司 | Electronic device |
CN112913020B (en) * | 2019-07-31 | 2024-10-22 | 京东方科技集团股份有限公司 | Array substrate, display device and method of manufacturing array substrate |
CN110544711B (en) * | 2019-08-13 | 2022-09-27 | 深圳市华星光电半导体显示技术有限公司 | Display panel |
CN114270431B (en) * | 2020-06-04 | 2023-06-02 | 京东方科技集团股份有限公司 | Display substrate, manufacturing method and display device |
KR20230093619A (en) * | 2021-12-20 | 2023-06-27 | 엘지디스플레이 주식회사 | Subpixel circuit, display panwel and display device |
KR20230093616A (en) * | 2021-12-20 | 2023-06-27 | 엘지디스플레이 주식회사 | Subpixel circuit, display panwel and display device |
Family Cites Families (168)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3028718C2 (en) | 1979-07-31 | 1982-08-19 | Sharp K.K., Osaka | Thin film transistor in connection with a display device |
JPS5626468A (en) * | 1979-08-09 | 1981-03-14 | Sharp Corp | Structure of membrane transistor |
JPS57127989A (en) * | 1981-02-02 | 1982-08-09 | Hitachi Ltd | Mos static type ram |
US4608300A (en) | 1983-06-21 | 1986-08-26 | Ciba-Geigy Corporation | Fibre composite materials impregnated with a curable epoxide resin matrix |
JPS6216727A (en) | 1985-07-17 | 1987-01-24 | 松下電器産業株式会社 | Jar rice cooker |
EP0249954B1 (en) * | 1986-06-17 | 1992-12-02 | Fujitsu Limited | Driving a matrix type display device |
JPH0241113Y2 (en) | 1986-10-29 | 1990-11-01 | ||
US5204659A (en) * | 1987-11-13 | 1993-04-20 | Honeywell Inc. | Apparatus and method for providing a gray scale in liquid crystal flat panel displays |
US5233447A (en) * | 1988-10-26 | 1993-08-03 | Canon Kabushiki Kaisha | Liquid crystal apparatus and display system |
GB8909011D0 (en) * | 1989-04-20 | 1989-06-07 | Friend Richard H | Electroluminescent devices |
US6759680B1 (en) * | 1991-10-16 | 2004-07-06 | Semiconductor Energy Laboratory Co., Ltd. | Display device having thin film transistors |
EP0561469A3 (en) | 1992-03-18 | 1993-10-06 | National Semiconductor Corporation | Enhancement-depletion mode cascode current mirror |
JPH06216727A (en) | 1993-01-20 | 1994-08-05 | Mitsubishi Electric Corp | Delay time variable logic circuit |
US5837003A (en) * | 1993-02-10 | 1998-11-17 | Radiant Medical, Inc. | Method and apparatus for controlling a patient's body temperature by in situ blood temperature modification |
US6166768A (en) * | 1994-01-28 | 2000-12-26 | California Institute Of Technology | Active pixel sensor array with simple floating gate pixels |
US5949483A (en) * | 1994-01-28 | 1999-09-07 | California Institute Of Technology | Active pixel sensor array with multiresolution readout |
JPH07294961A (en) * | 1994-04-22 | 1995-11-10 | Semiconductor Energy Lab Co Ltd | Drive circuit and design method for active matrix type display device |
JPH08115136A (en) | 1994-10-17 | 1996-05-07 | Fujitsu Ltd | Current source circuit and voltage source circuit |
US5684365A (en) | 1994-12-14 | 1997-11-04 | Eastman Kodak Company | TFT-el display panel using organic electroluminescent media |
TW344901B (en) | 1995-02-15 | 1998-11-11 | Handotai Energy Kenkyusho Kk | Active matrix display device |
TW345654B (en) | 1995-02-15 | 1998-11-21 | Handotai Energy Kenkyusho Kk | Active matrix display device |
JP3522433B2 (en) | 1995-12-04 | 2004-04-26 | 株式会社半導体エネルギー研究所 | Thin film semiconductor device |
US5814834A (en) * | 1995-12-04 | 1998-09-29 | Semiconductor Energy Laboratory Co. | Thin film semiconductor device |
JPH09168119A (en) | 1995-12-15 | 1997-06-24 | Nec Corp | Solid-state image pickup device and its driving method |
JP3934173B2 (en) * | 1996-04-01 | 2007-06-20 | 株式会社半導体エネルギー研究所 | Display device |
US6352103B1 (en) * | 1996-05-22 | 2002-03-05 | Intel Corporation | High performance notebook PC cooling system |
JP3045071B2 (en) * | 1996-05-30 | 2000-05-22 | 日本電気株式会社 | Differential signal generation circuit |
JPH1012889A (en) * | 1996-06-18 | 1998-01-16 | Semiconductor Energy Lab Co Ltd | Semiconductor thin film and semiconductor device |
KR100230740B1 (en) * | 1996-06-29 | 1999-11-15 | 김영환 | A sram and manufacturing method thereof |
US5898235A (en) | 1996-12-31 | 1999-04-27 | Stmicroelectronics, Inc. | Integrated circuit with power dissipation control |
US5990629A (en) * | 1997-01-28 | 1999-11-23 | Casio Computer Co., Ltd. | Electroluminescent display device and a driving method thereof |
JPH10214060A (en) * | 1997-01-28 | 1998-08-11 | Casio Comput Co Ltd | Electric field light emission display device and its driving method |
KR100539988B1 (en) * | 1997-02-17 | 2006-01-10 | 세이코 엡슨 가부시키가이샤 | Display device |
JPH10239665A (en) | 1997-02-26 | 1998-09-11 | Fuji Photo Film Co Ltd | Multi-level exposing method using two-dimensional matrix type spatial optical modulating element |
US6124840A (en) * | 1997-04-07 | 2000-09-26 | Hyundai Electronics Industries Co., Ltd. | Low power gate driver circuit for thin film transistor-liquid crystal display (TFT-LCD) using electric charge recycling technique |
US6229506B1 (en) * | 1997-04-23 | 2001-05-08 | Sarnoff Corporation | Active matrix light emitting diode pixel structure and concomitant method |
JP3520396B2 (en) * | 1997-07-02 | 2004-04-19 | セイコーエプソン株式会社 | Active matrix substrate and display device |
JPH11176521A (en) | 1997-10-06 | 1999-07-02 | Kel Corp | Shielded contact and connector using it |
JP3279238B2 (en) * | 1997-12-01 | 2002-04-30 | 株式会社日立製作所 | Liquid crystal display |
JPH11194363A (en) * | 1997-12-26 | 1999-07-21 | Seiko Epson Corp | Pattern forming method, active matrix substrate and its production and electronic apparatus |
JPH11272235A (en) * | 1998-03-26 | 1999-10-08 | Sanyo Electric Co Ltd | Drive circuit of electroluminescent display device |
JP3252897B2 (en) | 1998-03-31 | 2002-02-04 | 日本電気株式会社 | Element driving device and method, image display device |
GB9812742D0 (en) * | 1998-06-12 | 1998-08-12 | Philips Electronics Nv | Active matrix electroluminescent display devices |
US6940300B1 (en) * | 1998-09-23 | 2005-09-06 | International Business Machines Corporation | Integrated circuits for testing an active matrix display array |
JP3512152B2 (en) * | 1998-10-14 | 2004-03-29 | 松下電器産業株式会社 | Amplification type solid-state imaging device and driving method thereof |
US6365917B1 (en) * | 1998-11-25 | 2002-04-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP3686769B2 (en) * | 1999-01-29 | 2005-08-24 | 日本電気株式会社 | Organic EL element driving apparatus and driving method |
JP2000227776A (en) | 1999-02-08 | 2000-08-15 | Matsushita Electric Ind Co Ltd | Current control type light emitting device |
JP2000252426A (en) | 1999-02-25 | 2000-09-14 | Hitachi Ltd | Semiconductor device and manufacture thereof |
JP4246845B2 (en) * | 1999-04-22 | 2009-04-02 | Tdk株式会社 | Drive device for organic EL element and organic EL display device |
JP2001052864A (en) * | 1999-06-04 | 2001-02-23 | Semiconductor Energy Lab Co Ltd | Making method of opto-electronical device |
US8853696B1 (en) | 1999-06-04 | 2014-10-07 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and electronic device |
US7288420B1 (en) | 1999-06-04 | 2007-10-30 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing an electro-optical device |
JP3259774B2 (en) * | 1999-06-09 | 2002-02-25 | 日本電気株式会社 | Image display method and apparatus |
JP4092857B2 (en) | 1999-06-17 | 2008-05-28 | ソニー株式会社 | Image display device |
JP4627822B2 (en) | 1999-06-23 | 2011-02-09 | 株式会社半導体エネルギー研究所 | Display device |
US7379039B2 (en) * | 1999-07-14 | 2008-05-27 | Sony Corporation | Current drive circuit and display device using same pixel circuit, and drive method |
US6950136B1 (en) | 1999-07-22 | 2005-09-27 | Minolta Co., Ltd. | Image-sensing apparatus |
JP2001044113A (en) * | 1999-08-02 | 2001-02-16 | Nikon Corp | Beam output control method, beam output device, exposure system, and manufacturing method of device using the exposure system |
TW468283B (en) | 1999-10-12 | 2001-12-11 | Semiconductor Energy Lab | EL display device and a method of manufacturing the same |
JP4854840B2 (en) * | 1999-10-12 | 2012-01-18 | 株式会社半導体エネルギー研究所 | Method for manufacturing light emitting device |
JP2001195016A (en) | 1999-10-29 | 2001-07-19 | Semiconductor Energy Lab Co Ltd | Electronic device |
US6580094B1 (en) * | 1999-10-29 | 2003-06-17 | Semiconductor Energy Laboratory Co., Ltd. | Electro luminescence display device |
EP1102323B1 (en) * | 1999-11-19 | 2012-08-15 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement | Method for detecting electromagnetic radiation using an optoelectronic sensor |
TW587239B (en) * | 1999-11-30 | 2004-05-11 | Semiconductor Energy Lab | Electric device |
JP4831862B2 (en) * | 1999-11-30 | 2011-12-07 | 株式会社半導体エネルギー研究所 | Electronic equipment |
JP2001176670A (en) * | 1999-12-14 | 2001-06-29 | Morio Taniguchi | Light transmission type organic electroluminescent element and its manufacturing method |
JP4748847B2 (en) | 1999-12-15 | 2011-08-17 | 株式会社半導体エネルギー研究所 | EL display device and electric appliance |
TW511298B (en) * | 1999-12-15 | 2002-11-21 | Semiconductor Energy Lab | EL display device |
US6750835B2 (en) * | 1999-12-27 | 2004-06-15 | Semiconductor Energy Laboratory Co., Ltd. | Image display device and driving method thereof |
TWM244584U (en) * | 2000-01-17 | 2004-09-21 | Semiconductor Energy Lab | Display system and electrical appliance |
JP2001318627A (en) | 2000-02-29 | 2001-11-16 | Semiconductor Energy Lab Co Ltd | Light emitting device |
KR100327374B1 (en) * | 2000-03-06 | 2002-03-06 | 구자홍 | an active driving circuit for a display panel |
JP2001324958A (en) | 2000-03-10 | 2001-11-22 | Semiconductor Energy Lab Co Ltd | Electronic device and driving method therefor |
US7129918B2 (en) * | 2000-03-10 | 2006-10-31 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device and method of driving electronic device |
TW484238B (en) * | 2000-03-27 | 2002-04-21 | Semiconductor Energy Lab | Light emitting device and a method of manufacturing the same |
TW521226B (en) * | 2000-03-27 | 2003-02-21 | Semiconductor Energy Lab | Electro-optical device |
TW521237B (en) | 2000-04-18 | 2003-02-21 | Semiconductor Energy Lab | Light emitting device |
US6847341B2 (en) * | 2000-04-19 | 2005-01-25 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device and method of driving the same |
JP2001306031A (en) | 2000-04-21 | 2001-11-02 | Matsushita Electric Ind Co Ltd | Current-controlled light-emitting device |
US6611108B2 (en) * | 2000-04-26 | 2003-08-26 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device and driving method thereof |
US6515310B2 (en) * | 2000-05-06 | 2003-02-04 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and electric apparatus |
TW554637B (en) * | 2000-05-12 | 2003-09-21 | Semiconductor Energy Lab | Display device and light emitting device |
US7633471B2 (en) * | 2000-05-12 | 2009-12-15 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and electric appliance |
US6872604B2 (en) * | 2000-06-05 | 2005-03-29 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating a light emitting device |
US6828587B2 (en) * | 2000-06-19 | 2004-12-07 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP2002083974A (en) * | 2000-06-19 | 2002-03-22 | Semiconductor Energy Lab Co Ltd | Semiconductor device |
TW522454B (en) | 2000-06-22 | 2003-03-01 | Semiconductor Energy Lab | Display device |
KR100710279B1 (en) * | 2000-07-15 | 2007-04-23 | 엘지.필립스 엘시디 주식회사 | Electro Luminescence Panel |
JP2002108285A (en) | 2000-07-27 | 2002-04-10 | Semiconductor Energy Lab Co Ltd | Drive method for display device |
US6879110B2 (en) | 2000-07-27 | 2005-04-12 | Semiconductor Energy Laboratory Co., Ltd. | Method of driving display device |
US6613620B2 (en) * | 2000-07-31 | 2003-09-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
JP4772228B2 (en) * | 2000-07-31 | 2011-09-14 | 株式会社半導体エネルギー研究所 | Method for manufacturing light emitting device |
US6690034B2 (en) | 2000-07-31 | 2004-02-10 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
JP2002076352A (en) * | 2000-08-31 | 2002-03-15 | Semiconductor Energy Lab Co Ltd | Display device and its manufacturing method |
JP4925528B2 (en) * | 2000-09-29 | 2012-04-25 | 三洋電機株式会社 | Display device |
JP3594126B2 (en) | 2000-10-13 | 2004-11-24 | 日本電気株式会社 | Current drive circuit |
KR20020042898A (en) * | 2000-12-01 | 2002-06-08 | 구본준, 론 위라하디락사 | Liquid crystal display device and method of manufacturing thereof |
TW525216B (en) | 2000-12-11 | 2003-03-21 | Semiconductor Energy Lab | Semiconductor device, and manufacturing method thereof |
SG111923A1 (en) | 2000-12-21 | 2005-06-29 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
KR100370286B1 (en) * | 2000-12-29 | 2003-01-29 | 삼성에스디아이 주식회사 | circuit of electroluminescent display pixel for voltage driving |
JP4212815B2 (en) | 2001-02-21 | 2009-01-21 | 株式会社半導体エネルギー研究所 | Light emitting device |
US6753654B2 (en) | 2001-02-21 | 2004-06-22 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and electronic appliance |
JP2002323873A (en) * | 2001-02-21 | 2002-11-08 | Semiconductor Energy Lab Co Ltd | Light emission device and electronic equipment |
US7061451B2 (en) * | 2001-02-21 | 2006-06-13 | Semiconductor Energy Laboratory Co., Ltd, | Light emitting device and electronic device |
JP2002278504A (en) * | 2001-03-19 | 2002-09-27 | Mitsubishi Electric Corp | Self-luminous display device |
JP2002278497A (en) * | 2001-03-22 | 2002-09-27 | Canon Inc | Display panel and driving method therefor |
US6661180B2 (en) * | 2001-03-22 | 2003-12-09 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device, driving method for the same and electronic apparatus |
JP4155389B2 (en) | 2001-03-22 | 2008-09-24 | 株式会社半導体エネルギー研究所 | LIGHT EMITTING DEVICE, ITS DRIVE METHOD, AND ELECTRONIC DEVICE |
JP3608613B2 (en) * | 2001-03-28 | 2005-01-12 | 株式会社日立製作所 | Display device |
JP2002297083A (en) * | 2001-03-30 | 2002-10-09 | Matsushita Electric Ind Co Ltd | Image display device |
US6906344B2 (en) * | 2001-05-24 | 2005-06-14 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor with plural channels and corresponding plural overlapping electrodes |
JP2003051599A (en) | 2001-05-24 | 2003-02-21 | Semiconductor Energy Lab Co Ltd | Semiconductor device and electronic apparatus |
JP2002358031A (en) * | 2001-06-01 | 2002-12-13 | Semiconductor Energy Lab Co Ltd | Light emitting device and its driving method |
JP2003005710A (en) * | 2001-06-25 | 2003-01-08 | Nec Corp | Current driving circuit and image display device |
JP2003008719A (en) | 2001-06-27 | 2003-01-10 | Matsushita Electric Ind Co Ltd | Portable electric equipment |
US6667580B2 (en) | 2001-07-06 | 2003-12-23 | Lg Electronics Inc. | Circuit and method for driving display of current driven type |
JP4126976B2 (en) | 2001-07-23 | 2008-07-30 | セイコーエプソン株式会社 | Discharge device and control method thereof, discharge method, microlens array manufacturing method, and electro-optical device manufacturing method |
JP4831892B2 (en) * | 2001-07-30 | 2011-12-07 | 株式会社半導体エネルギー研究所 | Semiconductor device |
JP2003043999A (en) | 2001-08-03 | 2003-02-14 | Toshiba Corp | Display pixel circuit and self-luminous display device |
JP4926346B2 (en) * | 2001-08-10 | 2012-05-09 | 株式会社半導体エネルギー研究所 | Light emitting device |
JP2003059650A (en) | 2001-08-13 | 2003-02-28 | Pioneer Electronic Corp | Drive circuit of organic electroluminescence element |
JP3909583B2 (en) | 2001-08-27 | 2007-04-25 | セイコーエプソン株式会社 | Manufacturing method of electro-optical device |
US7209101B2 (en) * | 2001-08-29 | 2007-04-24 | Nec Corporation | Current load device and method for driving the same |
JP5210478B2 (en) * | 2001-08-31 | 2013-06-12 | 株式会社半導体エネルギー研究所 | Display device |
JP2003092183A (en) * | 2001-09-17 | 2003-03-28 | Pioneer Electronic Corp | Electroluminescent (el) display unit |
WO2003027997A1 (en) * | 2001-09-21 | 2003-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Display apparatus and its driving method |
SG120075A1 (en) * | 2001-09-21 | 2006-03-28 | Semiconductor Energy Lab | Semiconductor device |
JP3899886B2 (en) * | 2001-10-10 | 2007-03-28 | 株式会社日立製作所 | Image display device |
US7365713B2 (en) * | 2001-10-24 | 2008-04-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
JP4149168B2 (en) * | 2001-11-09 | 2008-09-10 | 株式会社半導体エネルギー研究所 | Light emitting device |
JP3781672B2 (en) * | 2001-12-14 | 2006-05-31 | 株式会社東芝 | Solid-state imaging device |
TWI280532B (en) | 2002-01-18 | 2007-05-01 | Semiconductor Energy Lab | Light-emitting device |
JP3706107B2 (en) | 2002-01-18 | 2005-10-12 | 株式会社半導体エネルギー研究所 | LIGHT EMITTING DEVICE AND ELECTRONIC DEVICE |
EP2348502B1 (en) * | 2002-01-24 | 2013-04-03 | Semiconductor Energy Laboratory Co. Ltd. | Semiconductor device and method of driving the semiconductor device |
SG110023A1 (en) | 2002-03-01 | 2005-04-28 | Semiconductor Energy Lab | Display device, light emitting device, and electronic eqipment |
JP3986051B2 (en) | 2002-04-30 | 2007-10-03 | 株式会社半導体エネルギー研究所 | Light emitting device, electronic equipment |
KR100662296B1 (en) | 2002-05-09 | 2007-01-02 | 엘지전자 주식회사 | Aging Method of Organic Electro Luminescent Module |
TWI360098B (en) * | 2002-05-17 | 2012-03-11 | Semiconductor Energy Lab | Display apparatus and driving method thereof |
JP2004054238A (en) * | 2002-05-31 | 2004-02-19 | Seiko Epson Corp | Electronic circuit, optoelectronic device, driving method of the device and electronic equipment |
US7592980B2 (en) * | 2002-06-05 | 2009-09-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP4195337B2 (en) * | 2002-06-11 | 2008-12-10 | 三星エスディアイ株式会社 | Light emitting display device, display panel and driving method thereof |
US20030234392A1 (en) * | 2002-06-25 | 2003-12-25 | Nein-Hui Kung | Active matrix organic light emitting diode display pixel structure |
TWI318490B (en) | 2002-08-30 | 2009-12-11 | Semiconductor Energy Lab | Current source circuit, display device using the same and driving method thereof |
US7002302B2 (en) * | 2002-10-07 | 2006-02-21 | Samsung Sdi Co., Ltd. | Flat panel display |
JP2004138773A (en) * | 2002-10-17 | 2004-05-13 | Tohoku Pioneer Corp | Active type light emission display device |
US6975293B2 (en) * | 2003-01-31 | 2005-12-13 | Faraday Technology Corp. | Active matrix LED display driving circuit |
TW594635B (en) * | 2003-03-06 | 2004-06-21 | Toppoly Optoelectronics Corp | Pixel driving circuit of display device |
JP2004361424A (en) * | 2003-03-19 | 2004-12-24 | Semiconductor Energy Lab Co Ltd | Element substrate, light emitting device and driving method of light emitting device |
KR101138806B1 (en) * | 2003-03-26 | 2012-04-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Device substrate and light-emitting device |
JP4562997B2 (en) | 2003-03-26 | 2010-10-13 | 株式会社半導体エネルギー研究所 | Element substrate and light emitting device |
JP4574127B2 (en) * | 2003-03-26 | 2010-11-04 | 株式会社半導体エネルギー研究所 | Element substrate and light emitting device |
JP4531343B2 (en) * | 2003-03-26 | 2010-08-25 | 株式会社半導体エネルギー研究所 | Driving circuit |
JP4197287B2 (en) * | 2003-03-28 | 2008-12-17 | シャープ株式会社 | Display device |
US7285902B2 (en) * | 2003-04-17 | 2007-10-23 | Samsung Sdi Co., Ltd. | Flat panel display with improved white balance |
US7532184B2 (en) * | 2003-04-17 | 2009-05-12 | Samsung Mobile Display Co., Ltd. | Flat panel display with improved white balance |
JP4049010B2 (en) | 2003-04-30 | 2008-02-20 | ソニー株式会社 | Display device |
JP4754772B2 (en) * | 2003-05-16 | 2011-08-24 | 株式会社半導体エネルギー研究所 | LIGHT EMITTING DEVICE AND ELECTRONIC DEVICE USING THE LIGHT EMITTING DEVICE |
JP4425574B2 (en) * | 2003-05-16 | 2010-03-03 | 株式会社半導体エネルギー研究所 | Element substrate and light emitting device |
US6998788B2 (en) * | 2003-06-11 | 2006-02-14 | Au Optronics Corporation | Architecture of data driver applied at display elements with current-driven pixels |
JP4574130B2 (en) * | 2003-06-18 | 2010-11-04 | 株式会社半導体エネルギー研究所 | Semiconductor devices, electronic equipment |
US7122969B2 (en) | 2003-06-18 | 2006-10-17 | Semiconductor Energy Laboratory Co., Ltd. | Element substrate and light emitting device |
US8552933B2 (en) * | 2003-06-30 | 2013-10-08 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and driving method of the same |
KR100515306B1 (en) * | 2003-10-29 | 2005-09-15 | 삼성에스디아이 주식회사 | Electroluminescent display panel |
US7595775B2 (en) | 2003-12-19 | 2009-09-29 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting display device with reverse biasing circuit |
CN1304182C (en) | 2005-04-12 | 2007-03-14 | 黎忠 | Rattan node cutting machine |
JP5912857B2 (en) * | 2012-05-23 | 2016-04-27 | 株式会社平和 | Pachinko machine |
US11048105B1 (en) * | 2017-09-30 | 2021-06-29 | Matthew Roy | Visor-like tablet and tablet holder for automotive vehicle |
-
2004
- 2004-03-17 KR KR1020057018031A patent/KR101138806B1/en active IP Right Grant
- 2004-03-17 CN CN201210187148.1A patent/CN102709478B/en not_active Expired - Fee Related
- 2004-03-17 EP EP04721308.7A patent/EP1607931B1/en not_active Expired - Lifetime
- 2004-03-17 JP JP2005504008A patent/JP4166783B2/en not_active Expired - Fee Related
- 2004-03-17 WO PCT/JP2004/003546 patent/WO2004086343A1/en active Application Filing
- 2004-03-19 TW TW093107497A patent/TWI356389B/en not_active IP Right Cessation
- 2004-03-24 US US10/807,545 patent/US8026877B2/en not_active Expired - Fee Related
-
2008
- 2008-03-25 JP JP2008077366A patent/JP2008171021A/en not_active Withdrawn
-
2010
- 2010-12-09 JP JP2010274269A patent/JP5159868B2/en not_active Expired - Fee Related
-
2011
- 2011-09-23 US US13/243,034 patent/US8659523B2/en not_active Expired - Lifetime
-
2012
- 2012-11-13 JP JP2012249171A patent/JP5586678B2/en not_active Expired - Fee Related
-
2013
- 2013-11-26 JP JP2013244048A patent/JP5984785B2/en not_active Expired - Lifetime
-
2014
- 2014-02-19 US US14/183,679 patent/US9300771B2/en not_active Expired - Fee Related
-
2015
- 2015-04-17 JP JP2015084882A patent/JP5966052B2/en not_active Expired - Fee Related
- 2015-07-31 JP JP2015151759A patent/JP6101317B2/en not_active Expired - Fee Related
-
2016
- 2016-03-28 US US15/082,012 patent/US9698207B2/en not_active Expired - Lifetime
- 2016-10-10 JP JP2016199603A patent/JP2017058685A/en not_active Withdrawn
-
2017
- 2017-06-29 US US15/636,908 patent/US20180019292A1/en not_active Abandoned
-
2018
- 2018-06-01 JP JP2018105903A patent/JP2018146981A/en not_active Withdrawn
-
2019
- 2019-12-02 JP JP2019218210A patent/JP2020038394A/en not_active Withdrawn
- 2019-12-23 US US16/724,624 patent/US11430845B2/en not_active Expired - Lifetime
-
2021
- 2021-08-23 JP JP2021135631A patent/JP2021185430A/en not_active Withdrawn
-
2022
- 2022-03-08 JP JP2022035130A patent/JP7235907B2/en not_active Expired - Lifetime
- 2022-08-23 US US17/893,221 patent/US20220406865A1/en not_active Abandoned
- 2022-09-09 JP JP2022143529A patent/JP2022173273A/en not_active Withdrawn
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11430845B2 (en) * | 2003-03-26 | 2022-08-30 | Semiconductor Energy Laboratory Co., Ltd. | Element substrate and light-emitting device |
US10593810B2 (en) | 2009-10-16 | 2020-03-17 | Semiconductor Energy Laboratory Co., Ltd. | Logic circuit and semiconductor device |
US10770597B2 (en) | 2009-10-16 | 2020-09-08 | Semiconductor Energy Laboratory Co., Ltd. | Logic circuit and semiconductor device |
US10490671B2 (en) | 2009-10-16 | 2019-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Logic circuit and semiconductor device |
US11302824B2 (en) | 2009-10-16 | 2022-04-12 | Semiconductor Energy Laboratory Co., Ltd. | Logic circuit and semiconductor device |
US11742432B2 (en) | 2009-10-16 | 2023-08-29 | Semiconductor Energy Laboratory Co., Ltd. | Logic circuit and semiconductor device |
US11961842B2 (en) | 2009-11-06 | 2024-04-16 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device |
US11508852B2 (en) | 2013-09-13 | 2022-11-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US11869977B2 (en) | 2013-09-13 | 2024-01-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US11004398B2 (en) * | 2018-11-20 | 2021-05-11 | Innolux Corporation | Electronic device |
EP4060653A1 (en) * | 2018-11-20 | 2022-09-21 | InnoLux Corporation | Electronic device |
EP3657483A1 (en) * | 2018-11-20 | 2020-05-27 | InnoLux Corporation | Electronic device |
US20220358883A1 (en) * | 2020-10-15 | 2022-11-10 | Xiamen Tianma Micro-Electronics Co., Ltd. | Display panel |
US20220335890A1 (en) * | 2020-10-15 | 2022-10-20 | Xiamen Tianma Micro-Electronics Co., Ltd. | Display panel and driving method |
US11450275B2 (en) * | 2020-10-15 | 2022-09-20 | Xiamen Tianma Micro-Electronics Co., Ltd. | Pixel driving circuit, display panel and driving method |
US11869432B2 (en) * | 2020-10-15 | 2024-01-09 | Xiamen Tianma Micro-Electronics Co., Ltd. | Display panel and driving method |
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11430845B2 (en) | Element substrate and light-emitting device | |
US11189223B2 (en) | Element substrate and light emitting device | |
JP4174737B2 (en) | Light emitting device and element substrate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SEMICONDUCTOR ENERGY LABORATORY CO., LTD., JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:OSAME, MITSUAKI;ANZAI, AYA;YAMAZAKI, YU;AND OTHERS;REEL/FRAME:043196/0281 Effective date: 20040312 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |