TWI836205B - Installation method of light-emitting components and display device - Google Patents

Abstract

The present invention provides a method for mounting a light-emitting element using laser peeling and a display device. A method for mounting a light-emitting element in one embodiment is used to peel off a light-emitting element disposed on one side of a sapphire substrate for peeling using laser peeling and to mount the light-emitting element on an array substrate. The method comprises the following steps: fixing the array substrate and the sapphire substrate by a sealing member; applying pressure to the array substrate and the sapphire substrate to flatten the sapphire substrate, and fixing the array substrate and the sapphire substrate; irradiating the first laser light of the first wavelength band from the side of the sapphire substrate to join the first terminal portion of the array substrate with the terminal portion of the light-emitting element; and irradiating the second laser light of the second wavelength band from the side of the sapphire substrate to peel the light-emitting element from the sapphire substrate.

Description

Installation method of light-emitting components and display device

Embodiments of the present invention relate to an installation method of a light-emitting element and a display device.

Generally speaking, an LED display using a light emitting diode (LED) as a self-luminous element is known. However, in recent years, a display device using a tiny diode element called a micro LED (hereinafter referred to as a micro LED display) is being developed as a more sophisticated display device.

This micro LED display is different from the previous liquid crystal display or organic EL (Electro Luminescence) display. It is formed by installing multiple chip-shaped micro LEDs in the display area. Therefore, it is easy to achieve high precision and large size at the same time, and it has attracted attention as the next generation of display.

As a method of mounting a plurality of micro LEDs in a chip form on a display area, a method using laser lift off (LLO) is being studied.

One of the purposes of this disclosure is to provide a method for mounting micro-LEDs using laser lift-off and a micro-LED display (a method for mounting light-emitting elements and a display device).

A method for mounting a light-emitting element in one embodiment is a method for removing the light-emitting element disposed on a surface of a side of a sapphire substrate for removal by laser stripping and mounting the light-emitting element on an array substrate. The method comprises a first step, a second step, a third step, and a fourth step. In the first step, a first terminal portion formed on a surface of a side of the array substrate and a terminal portion of the light-emitting element are aligned, and the array substrate and the sapphire substrate are fixed by a sealing member. In the second step, pressure is applied to the array substrate and the sapphire substrate to flatten the sapphire substrate, and the array substrate and the sapphire substrate are fixed. In the third step, the bonding member disposed on the first terminal portion of the array substrate is irradiated with the first laser light of the first wavelength band from the sapphire substrate side to bond the first terminal portion of the array substrate to the terminal portion of the light-emitting element. In the fourth step, the light-emitting element is irradiated with the second laser light of the second wavelength band different from the first wavelength band from the sapphire substrate side to peel the light-emitting element from the sapphire substrate.

A display device according to one embodiment includes a first substrate and a second substrate. The first substrate includes an array substrate, a first terminal portion formed on one side surface of the array substrate, and a position disposed on one side surface of the array substrate so as not to overlap with the first terminal portion in plan view. of seals. The second substrate includes a sapphire substrate and a light-emitting element provided on one side surface of the sapphire substrate. The first substrate and the second substrate are fixed by the sealing member.

A display device in one embodiment includes an array substrate, a light emitting element disposed on a side surface of the array substrate, and a terminal portion formed on a side surface of the array substrate and formed at a position not overlapping the light emitting element when viewed from above. A residue of a sealing member melted during laser stripping for stripping the light emitting element from a sapphire substrate is attached to at least a portion of the terminal portion.

Several embodiments will be described with reference to the drawings.

In addition, the disclosure is only an example, and those skilled in the art can easily think of appropriate modifications to ensure the gist of the invention, and these are naturally included in the scope of the present invention. In addition, the drawings are for clearer explanation and may schematically show embodiments, but they are only examples and are not intended to limit the interpretation of the present invention. In addition, in this specification and each drawing, the same reference numerals are sometimes attached to the constituent elements that perform the same or similar functions as those described in the figures that have already appeared, and repeated detailed descriptions are omitted.

FIG. 1 is a three-dimensional diagram schematically showing the structure of a display device 1 in an embodiment. FIG. 1 shows a three-dimensional space defined by a first direction X, a second direction Y perpendicular to the first direction X, and a third direction Z perpendicular to the first direction X and the second direction Y. In addition, the first direction X and the second direction Y are orthogonal to each other, but may also intersect at an angle other than 90 degrees. In this specification, viewing the display device 1 from a direction parallel to the third direction Z is referred to as a top view.

Hereinafter, in the present embodiment, the case where the display device 1 is a micro LED display using micro LEDs as self-luminous elements will be mainly described.

As shown in FIG. 1 , a display device 1 includes a display panel 2 , a first circuit board 3 , a second circuit board 4 , and the like.

The display panel 2 is rectangular in one example. In the illustrated example, the short side EX of the display panel 2 is parallel to the first direction X, and the long side EY of the display panel 2 is parallel to the second direction. The third direction Z is equivalent to the thickness direction of the display panel 2. The first direction X may be renamed as a direction parallel to the short side of the display device 1, the second direction Y may be renamed as a direction parallel to the long side of the display device 1, and the third direction Z may be renamed as a thickness direction of the display device 1. The main surface of the display panel 2 is parallel to the X-Y plane defined by the first direction X and the second direction Y. The display panel 2 has a display area DA (display portion) and a non-display area NDA (non-display portion) outside the display area DA. The non-display area NDA has a terminal area MT. In the illustrated example, the non-display area NDA surrounds the display area DA.

The display area DA is a region for displaying images, and has a plurality of pixels PX arranged in a matrix, for example. The pixels PX include a light-emitting element (micro LED) and a switch element (driving transistor) for driving the light-emitting element.

The terminal region MT is disposed along the short side EX of the display panel 2 and includes terminals for electrically connecting the display panel 2 to external devices or the like.

The first circuit substrate 3 is mounted on the terminal area MT and is electrically connected to the display panel 2. The first circuit substrate 3 is, for example, a flexible printed circuit board (Flexible Printed Circuit Board). The first circuit substrate 3 has a driver IC chip (hereinafter referred to as a panel driver) 5 for driving the display panel 2. In addition, in the example shown in the figure, the panel driver 5 is arranged on the first circuit substrate 3, but it can also be arranged under the first circuit substrate 3. Or, the panel driver 5 can also be mounted outside the first circuit substrate 3. In this case, the panel driver 5 can be mounted on the non-display area NDA of the display panel 2, and can also be mounted on the second circuit substrate 4. The second circuit substrate 4 is, for example, a rigid printed circuit substrate. The second circuit substrate 4 is connected to the first circuit substrate 3, for example, below the first circuit substrate 3.

The panel driver 5 is connected to a control substrate (not shown) via the second circuit substrate 4, for example. The panel driver 5 controls the display panel 2 to display an image by driving a plurality of pixels PX based on an image signal output from the control substrate, for example.

In addition, the display panel 2 may also have a bending area BA with an additional diagonal line display. The bending area BA is an area that is bent when the display device 1 is accommodated in a housing of an electronic device or the like. The bending area BA is located on the terminal area MT side of the non-display area NDA. In a state where the bending area BA is bent, the first circuit board 3 and the second circuit board 4 are arranged to face the display panel 2 .

The method of installing light-emitting elements on the above-mentioned display panel 2 will be described below. More specifically, the method of peeling off the light-emitting element LED from the second substrate SUB2 shown in FIG. 3 by laser lift-off (LLO) and mounting it on the first substrate SUB1 shown in FIG. 2 is explained. First, the structure of the first substrate SUB1 on which the light-emitting element LED is mounted and the second substrate SUB2 for peeling is explained with reference to FIGS. 2 and 3 .

FIG. 2 is a cross-sectional view schematically showing the structure of the first substrate SUB1.

As shown in FIG. 2 , the first substrate SUB1 includes an array substrate 10 , a plurality of first terminal portions 11 , a bonding member 12 , a plurality of second terminal portions 13 , a sealing material 14 , and the like.

The array substrate 10 includes a first main surface 10A and a second main surface 10B located on the opposite side of the first main surface 10A. Although omitted in the illustrated example, switch elements and various wiring patterns for driving the light-emitting elements LED are formed on the array substrate 10. The array substrate 10 can also be called a backplane.

A plurality of first terminal portions 11 are formed on the first main surface 10A of the array substrate 10 . For example, the first terminal portion 11 is formed with the same number as the light emitting elements LED mounted on the display device 1 . The first terminal portion 11 is formed of, for example, a metal material such as Al (aluminum), Ti (titanium), Mo (molybdenum), or W (tungsten), or a laminate of these metal materials. The first terminal portion 11 may also be called a first bonding pad or a mounting electrode. A joining member 12 is arranged on each first terminal portion 11 .

The bonding member 12 is a member for bonding the first terminal portion 11 to the terminal portion 22 of the light-emitting element LED described later. The details will be described later. The bonding member 12 is formed of a metal material that is heated and melted by laser ablation when irradiated with laser light in a wavelength band of 400 nm to 3000 nm, for example, it is formed of a metal material such as Sn (tin) and Ag (silver). The bonding member 12 can also be called a solder member. In addition, in the present embodiment, the bonding member 12 is provided at the first terminal portion 11 of the array substrate 10, but it can also be provided at the terminal portion 22 of the light-emitting element LED.

A plurality of second terminal portions 13 are formed on the first main surface 10A of the array substrate 10 . The second terminal portion 13 is formed at a position not overlapping the first terminal portion 11 in a plan view, and is formed, for example, to surround a plurality of light emitting elements LED provided in the display device 1 . For example, the second terminal portion 13 is formed in the non-display area NDA. The second terminal portion 13 is formed to have a width W1. The width W1 is set to 0.1 mm~0.5 mm, for example. The second terminal portion 13 is not electrically connected to various wiring patterns formed on the array substrate 10 . However, the second terminal portion 13 may also be formed in the non-display area NDA to surround a plurality of light-emitting elements LED, and may be electrically connected to various wiring patterns formed on the array substrate 10 . Details will be described later. The second terminal portion 13 is formed of a metal material that causes laser ablation by laser light used to peel off the light-emitting element LED from the sapphire substrate 20 described below. For example, it is made of a metal such as Al (aluminum). Material formation. The second terminal portion 13 may also be called a second bonding pad, a metal portion, a metal wiring, or the like. A seal 14 is disposed on each second terminal portion 13 so as to cover the second terminal portion 13 .

The sealing member 14 is a member for fixing the first substrate SUB1 and the second substrate SUB2. The sealing member 14 is formed of a material that allows the laser light irradiated to the second terminal portion 13 to pass through.

For example, the sealing member 14 and the second terminal portion 13 may be formed in the non-display area NDA along the two short sides EX and the two long sides so as to surround the entire circumference of the display area DA of the first substrate SUB1. In addition, the sealing member 14 and the second terminal portion 13 may be formed along only the two short sides EX of the first substrate SUB1, or may be formed along only the two long sides EY. Furthermore, a plurality of the sealing members 14 and the second terminal portion 13 may be arranged in a dot shape in the non-display area, and may be formed to fix the first substrate SUB1 and the second substrate SUB2.

FIG. 3 is a cross-sectional view schematically showing the structure of the second substrate SUB2.

As shown in FIG. 3 , the second substrate SUB2 includes a sapphire substrate 20, a plurality of light emitting elements LED, and the like. The light-emitting element LED includes a light-emitting layer 21 and a terminal portion 22 .

The sapphire substrate 20 for peeling includes a first main surface 20A and a second main surface 20B located on the opposite side of the first main surface 20A. A plurality of light emitting elements LED are arranged on the first main surface 20A of the sapphire substrate 20 . The plurality of light-emitting elements LED include those having light-emitting colors of red (R), green (G), and blue (B).

The light-emitting layer 21 is fixed to the first main surface 20A of the sapphire substrate 20 via a peeling layer not shown in the figure. The light-emitting layer 21 emits R, G, and B light. A terminal portion 22 is arranged on the light-emitting layer 21. The terminal portion 22 is connected to the first terminal portion 11 by a bonding member 12 arranged on the side of the first substrate SUB1. Accordingly, the terminal portion 22 of the light-emitting element LED is electrically connected to the first terminal portion 11. The terminal portion 22 is equivalent to the anode terminal or the cathode terminal of the light-emitting element LED. The terminal portion 22 can also be called a bump.

FIG. 4 to FIG. 8 are schematic cross-sectional views showing an example of the installation steps of the light-emitting element LED in sequence.

First, an alignment step (step 1) is performed. Specifically, as shown in FIG. 4 , the first substrate SUB1 on which a plurality of first terminal portions 11, a bonding member 12, a plurality of second terminal portions 13, and a sealing member 14 are arranged on the array substrate 10 is opposed to the second substrate SUB2 on which a plurality of light-emitting elements LED are arranged on the sapphire substrate 20 in such a manner that the first principal surface 10A of the array substrate 10 faces the first principal surface 20A of the sapphire substrate 20. Furthermore, the plurality of first terminal portions 11 of the first substrate SUB1 and the terminal portions 22 of the plurality of light-emitting elements LED of the second substrate SUB2 are aligned. Furthermore, the first substrate SUB1 and the second substrate SUB2 are fixed by the sealing member 14.

In addition, in FIG. 4, since it is assumed that the sapphire substrate 20 of the second substrate SUB2 does not warp, in this stage, the plurality of first terminal portions 11 of the first substrate SUB1 and the plurality of terminal portions 22 of the light-emitting element LED of the second substrate SUB2 overlap in a plan view, but in this stage, the plurality of first terminal portions 11 of the first substrate SUB1 and the plurality of terminal portions 22 of the light-emitting element LED of the second substrate SUB2 may not overlap in a plan view. In this stage, at the stage where the fixing step described later is completed, alignment is performed so that the plurality of first terminal portions 11 of the first substrate SUB1 and the plurality of terminal portions 22 of the light-emitting element LED of the second substrate SUB2 overlap in a plan view.

Next, a fixation step (second step) is performed. Specifically, as shown in FIG. 5 , the buffer material 30 and the fixing member 40 are sequentially arranged on the second main surface 10B side of the array substrate 10 of the first substrate SUB1 , and are placed on the second main surface of the sapphire substrate 20 of the second substrate SUB2 . The fixing member 50 is arranged on the surface 20B side. Furthermore, pressure is applied from above and below to sandwich the first substrate SUB1 and the second substrate SUB2 (that is, the fixing members 40 and 50 are pressed in opposite directions to each other to apply pressure), and the warpage caused by the sapphire substrate 20 is controlled. flattened. Accordingly, the first substrate SUB1 and the second substrate SUB2 are in a state where the warpage caused by the sapphire substrate 20 is flattened, and the plurality of first terminal portions 11 of the first substrate SUB1 and the plurality of the second substrate SUB2 are viewed from above. The terminal portions 22 of the two light-emitting elements LED are fixed in a state where they overlap. In addition, in the fixing step, the gap between the first substrate SUB1 and the second substrate SUB2 is maintained by the sealing member 14 or the light-emitting element LED, but a spacer may also be provided on the first substrate SUB1 or the second substrate SUB2 (not shown). shown), while maintaining the gap between the first substrate SUB1 and the second substrate SUB2.

The fixing member 50 is made of a material that allows the laser light irradiated in the bonding step described later to pass through and has a rigidity that does not bend when pressure is applied, such as quartz glass. The fixing member 40 is made of a material that has a rigidity that does not bend when pressure is applied, such as quartz glass like the fixing member 50, or can be made of a material different from the fixing member 50.

As described above, by arranging the buffer material 30 between the first substrate SUB1 and the fixing member 40, damage to the array substrate 10 caused by the pressure for clamping the first substrate SUB1 and the second substrate SUB2 is suppressed. In addition, since the first substrate SUB1 and the second substrate SUB2 are fixed by the sealing member 14, positional deviation that may occur due to the sliding of one substrate when pressure is applied is suppressed.

Next, a bonding step (third step) is performed. Specifically, as shown in FIG. 6 , laser light LZ1 with a wavelength range of 400 nm to 3000 nm is irradiated from the side of the fixing member 50 to the joining member 12 to heat and melt the joining member 12 by laser ablation, whereby the joining member 12 is heated and melted. The plurality of first terminal portions 11 of the first substrate SUB1 are joined to the plurality of terminal portions 22 of the light-emitting elements LED of the second substrate SUB2. At the end of the joining step, the cushioning material 30, the fixing member 40 and the fixing member 50 may or may not be removed at this stage. In this embodiment, since it is assumed that the first substrate SUB1 and the second substrate SUB2 that have completed the bonding step are moved to the stage and then the next step is performed, the buffer material 30 , the fixing member 40 and the fixing member 50 are placed in the bonding stage. The stage at the end of the step is removed.

Then, the LLO step (step 4) is performed. Specifically, as shown in FIG. 7 , laser light LZ2 in a wavelength band of 200 nm to 366 nm is irradiated from the side of the sapphire substrate 20 toward the plurality of light-emitting element LEDs and the plurality of second terminal portions 13. Accordingly, the plurality of light-emitting element LEDs are fixed to the unillustrated peeling layer of the sapphire substrate 20 by laser ablation sublimation, and the plurality of light-emitting element LEDs are peeled off from the sapphire substrate 20. Furthermore, when the plurality of second terminal portions 13 are heated by laser ablation, the heat is respectively conducted to the sealing member 14 covering each second terminal portion 13, and the sealing member 14 is melted and removed.

By performing a series of mounting steps shown in FIG. 4 to FIG. 7 , the sapphire substrate 20 is peeled off, and as shown in FIG. 8 , a plurality of light-emitting elements LED are mounted on the first substrate SUB1 (array substrate 10 ).

As can be seen from the series of mounting steps described above, in the above-mentioned fixing step, the second terminal portion 13 is used to suppress one of the substrates from applying pressure to the first substrate SUB1 and the second substrate SUB2 by laser ablation. The seal 14 is formed by melting and disposing the seal 14 due to positional deviation that may occur due to sliding or the like. Therefore, after a series of mounting steps, the second terminal portion 13 basically becomes a useless structure for the display panel 2. However, for example, it can also be used for mounting the first circuit board 3 or the first circuit board 3 to the array substrate 10 after a series of mounting steps. 2. Use the alignment marks to align the circuit board 4 and panel driver 5.

The light-emitting element LED of this embodiment can be a micro-LED with an anode terminal 22AN and a cathode terminal 22CA arranged side by side on one side of the light-emitting layer 21 as shown in FIG9(A), or can be a micro-LED with an anode terminal 22AN arranged on one side of the light-emitting layer 21 and a cathode terminal CA arranged on the other side of the light-emitting layer 21 as shown in FIG9(B). In the case of the light-emitting element LED being a micro-LED of the form shown in FIG9(A), the number of the first terminal portion 11 is different from that of the light-emitting element LED, and the number of the anode terminal 22AN and the cathode terminal 22CA is the same as that formed on the array substrate 10. In addition, regarding the first terminal portion 11 corresponding to one light-emitting element LED, the first terminal portion 11 connected to the anode terminal 22AN and the first terminal portion 11 connected to the cathode terminal 22CA are formed at a specific interval. The light-emitting element LED can be mounted on the first substrate SUB1 (array substrate 10) through the above series of mounting steps, regardless of whether it is a micro LED in the form shown in FIG. 9 (A) or a micro LED in the form shown in FIG. 9 (B).

FIG8 illustrates a case where the sealing member 14 arranged to cover a plurality of second terminal portions 13 is completely removed by the above-mentioned LLO step, but in reality, it is estimated that the sealing member 14 is not completely melted, and as shown in FIG10(A), a portion of it remains as residue attached to the second terminal portion 13. However, as described above, after a series of mounting steps are completed, since the second terminal portion 13 is basically a useless structure for the display panel 2, there is no particular problem even if a portion of the sealing member 14 remains as residue attached to the second terminal portion 13. In addition, since the second terminal portion 13 is arranged in the non-display area NDA, for example, from the viewpoint of display quality, there is no particular problem even if a portion of the sealing member 14 remains as residue attached to the second terminal portion 13. However, as shown in FIG. 10(B) , the second terminal portion 13 may be cut together with the sealing member 14 attached as residue.

In the present embodiment, it is assumed that the second terminal portion 13 is formed on the array substrate 10, but the present invention is not limited thereto. For example, as shown in FIG. 11 , the second terminal portion 13 may be formed on a sapphire substrate 20. In this case, the light emitting element LED may be mounted on the first substrate SUB1 (array substrate 10) through the above-mentioned series of mounting steps, and since the second terminal portion 13 is heated by laser ablation in the LLO step, the sealing member 14 arranged so as to cover the second terminal portion 13 may be removed.

In one of the embodiments described above, the first substrate SUB1 and the second substrate SUB2 are fixed by applying pressure so as to sandwich the first substrate SUB1 on which the light-emitting element LED is mounted and the second substrate SUB2 for peeling. Therefore, even if warpage occurs in the second substrate SUB2 (sapphire substrate 20 ), the warpage can be flattened, and the first substrate SUB1 and the second substrate SUB2 can be fixed without gaps. In addition, since pressure is applied to the first substrate SUB1 after contacting the buffer material 30, damage to the array substrate 10 of the first substrate SUB1 caused by the pressure can be suppressed.

Furthermore, in one of the embodiments described above, after the first substrate SUB1 on which the light-emitting element LED is mounted and the second substrate SUB2 for peeling are fixed by the sealing member 14, pressure is applied in a manner of clamping the first substrate SUB1 and the second substrate SUB2, so that positional deviation that may occur due to the sliding of one substrate when the pressure is applied can be suppressed. Furthermore, by forming the second terminal portion 13 covered by the sealing member 14 and laser-etched by the laser light LZ2 irradiated during the LLO step, the sealing member 14 can be removed during the LLO step of peeling the light-emitting element LED from the second substrate SUB2. In other words, the sealing member 14 can be removed without adding an independent step for removing the sealing member 14.

According to one of the embodiments described above, a method for mounting micro-LEDs and a micro-LED display (a method for mounting light-emitting elements and a display device) using laser lift-off can be provided.

The above describes several embodiments of the present invention, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the scope of the invention. These embodiments or their variations are included in the scope or subject matter of the invention, and are also included in the scope of the invention described in the patent application.

This application is based on Japanese Patent Application No. 2020-067627 (filing date: 4/3/2020) and takes advantage of the priority of that application. This application incorporates all the contents of that application by reference.

1:Display device 2:Display panel 3: 1st circuit board 4: 2nd circuit board 5: Panel driver 10:Array substrate 10A: 1st main surface 10B: 2nd main side 11: 1st terminal part 12:joint components 13: 2nd terminal part 14:Seals 20: Sapphire substrate 20A: 1st main surface 20B: 2nd main side 21: Luminous layer 22:Terminal part 22AN: Anode terminal 22CA: Cathode terminal 30: Cushioning material 40: Fixed components 50: Fixed components BA: bend area CA: cathode terminal DA: display area EX: short side EY:long side LED: light emitting element LZ1: Laser light LZ2: Laser light MT: terminal area NDA: non-display area PX: pixel SUB1: 1st substrate SUB2: 2nd substrate W1: Width

FIG. 1 is a perspective view schematically showing the structure of the display device of the embodiment. FIG. 2 is a cross-sectional view schematically showing the structure of the first substrate of the embodiment. FIG. 3 is a cross-sectional view schematically showing the structure of the second substrate of the embodiment. FIG. 4 is a cross-sectional view schematically showing the installation step of the light-emitting element of the embodiment. FIG. 5 is a cross-sectional view schematically showing the installation step after FIG. 4. FIG. 6 is a cross-sectional view schematically showing the installation step after FIG. 5. FIG. 7 is a cross-sectional view schematically showing the installation step after FIG. 6. FIG. 8 is a cross-sectional view schematically showing the result of a series of installation steps shown in FIG. 4 to FIG. 7. FIG. 9 is a cross-sectional view schematically showing the structure of the light-emitting element of the embodiment. FIG. 10 (A) and (B) are another cross-sectional view schematically showing the result of a series of installation steps shown in FIG. 4 to FIG. 7. FIG. 11 is another cross-sectional view schematically showing the structure of the second substrate of the implementation form.

10: Array substrate

11: Terminal 1

12:joint components

13: 2nd terminal part

14: Seals

20: Sapphire substrate

21: Luminous layer

22:Terminal part

30: Buffer material

40:Fixed components

50:Fixed components

LED: light emitting element

Claims (13)

A method of mounting a light-emitting element, which is used to peel off a light-emitting element provided on one side of a sapphire substrate for peeling using laser peeling, and install it on an array substrate, and includes: a first step of forming The first terminal portion on one side of the array substrate is aligned with the terminal portion of the light-emitting element, and the array substrate and the sapphire substrate are fixed by a sealing member; in the second step, the array substrate and the sapphire substrate are fixed The above-mentioned sapphire substrate applies pressure to planarize the above-mentioned sapphire substrate, and fix the above-mentioned array substrate and the above-mentioned sapphire substrate; in the third step, the bonding member provided on the first terminal part of the above-mentioned array substrate is moved from the side of the above-mentioned sapphire substrate irradiating the first laser light of the first wavelength to join the first terminal part of the above-mentioned array substrate and the terminal part of the above-mentioned light-emitting element; and the fourth step, irradiating the above-mentioned first wavelength to the above-mentioned light-emitting element from the side of the above-mentioned sapphire substrate The second laser light of a different second wavelength peels off the above-mentioned light-emitting element from the above-mentioned sapphire substrate. The method of mounting a light-emitting element according to claim 1, wherein the second step includes: after abutting the buffer material on the other side of the array substrate, and then arranging the fixing member on the other side of the array substrate. Between the surface side and the other side of the sapphire substrate, the fixing members are pressed in opposite directions to apply pressure to the array substrate and the sapphire substrate. The method of mounting a light-emitting element according to claim 2, wherein the fixing member disposed on the other side of the sapphire substrate allows the first laser light irradiated in the third step to penetrate. The method of mounting a light-emitting element according to any one of claims 1 to 3, wherein the fourth step includes: removing the second terminal portion formed on one side of the array substrate and covered by the sealing member from the above-mentioned The sapphire substrate side is irradiated with the second laser light to heat the second terminal portion and melt the sealing material. A method for mounting a light-emitting element as claimed in any one of claims 1 to 3, wherein the fourth step comprises: irradiating the second terminal portion formed on one side of the sapphire substrate and covered by the sealing member from the sapphire substrate side with the second laser light to heat the second terminal portion and melt the sealing member. A method for mounting a light-emitting element as claimed in any one of claims 1 to 3, wherein the first wavelength band is 400nm to 3000nm; and the second wavelength band is 200nm to 366nm. A method for installing a light-emitting element as claimed in any one of claims 1 to 3, wherein the light-emitting element is a micro LED. A display device, which includes a first substrate including an array substrate, a first terminal portion formed on one side of the array substrate, and a first terminal portion provided on one side of the array substrate and not in contact with the array substrate when viewed from above. a sealing member at a position where the above-mentioned first terminal portion overlaps; and a second substrate including a sapphire substrate and a light-emitting element provided on one side of the sapphire substrate; and the above-mentioned first substrate and the above-mentioned second substrate are connected by The sealing member is fixed; the first substrate further includes a second terminal portion formed on one side surface of the array substrate and covered by the sealing member; the first terminal portion is formed in a display area where an image is displayed; 2. The terminal portion is formed in a non-display area arranged to surround the display area. The display device of claim 8, wherein the light-emitting element includes a light-emitting layer that emits light and a terminal portion; the first terminal portion of the first substrate and the terminal portion of the light-emitting element are bonded via a bonding member. A display device as claimed in claim 8 or 9, wherein the light-emitting element is a micro LED. A display device comprising: An array substrate; a light-emitting element provided on one side of the array substrate; and a terminal portion formed on one side of the array substrate at a position that does not overlap the light-emitting element when viewed from above; and At least part of the terminal portion has residues of the sealing material melted during laser peeling for peeling off the light-emitting element from the sapphire substrate. The display device according to claim 11, wherein the light-emitting element is provided in a display area that displays an image; and the terminal portion is formed in a non-display area arranged to surround the display area. The display device of claim 11 or 12, wherein the light-emitting element is a micro-LED.