CN113497165A - Method for mounting light emitting element and display device - Google Patents
Method for mounting light emitting element and display device Download PDFInfo
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- CN113497165A CN113497165A CN202110354292.9A CN202110354292A CN113497165A CN 113497165 A CN113497165 A CN 113497165A CN 202110354292 A CN202110354292 A CN 202110354292A CN 113497165 A CN113497165 A CN 113497165A
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- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 203
- 229910052594 sapphire Inorganic materials 0.000 claims abstract description 54
- 239000010980 sapphire Substances 0.000 claims abstract description 54
- 239000003566 sealing material Substances 0.000 claims abstract description 30
- 230000001678 irradiating effect Effects 0.000 claims abstract description 7
- 238000007789 sealing Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000003825 pressing Methods 0.000 abstract description 5
- 238000000926 separation method Methods 0.000 abstract description 4
- 102100036464 Activated RNA polymerase II transcriptional coactivator p15 Human genes 0.000 description 38
- 101000713904 Homo sapiens Activated RNA polymerase II transcriptional coactivator p15 Proteins 0.000 description 38
- 229910004444 SUB1 Inorganic materials 0.000 description 38
- 229910004438 SUB2 Inorganic materials 0.000 description 26
- 101100311330 Schizosaccharomyces pombe (strain 972 / ATCC 24843) uap56 gene Proteins 0.000 description 26
- 101150018444 sub2 gene Proteins 0.000 description 26
- 238000000608 laser ablation Methods 0.000 description 8
- 239000007769 metal material Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000005452 bending Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Laser Beam Processing (AREA)
Abstract
Provided are a method for mounting a light emitting element by laser lift-off and a display device. A method for mounting a light emitting element according to an embodiment is a method for mounting an array substrate by separating a light emitting element provided on one surface of a sapphire substrate for separation by laser separation. The method comprises: the method includes a step of fixing the array substrate and the sapphire substrate by a sealing material, a step of flattening the sapphire substrate by applying pressure to the array substrate and the sapphire substrate and fixing the array substrate and the sapphire substrate, a step of irradiating a 1 st laser beam of a 1 st wavelength band from the sapphire substrate side and bonding a 1 st terminal portion of the array substrate and a terminal portion of the light-emitting element, and a step of irradiating a 2 nd laser beam of a 2 nd wavelength band from the sapphire substrate side and peeling the light-emitting element from the sapphire substrate.
Description
This application is based on Japanese patent application No. 2020-. This application incorporates by reference the entirety of this application.
Technical Field
Embodiments of the present invention relate to a method of mounting a light emitting element and a display device.
Background
In general, an LED display using a Light Emitting Diode (LED) as a self-Light Emitting element is known, but in recent years, a display device using a minute Diode element called a micro LED (hereinafter referred to as a micro LED display) has been developed as a more miniaturized display device.
Unlike conventional liquid crystal displays and organic EL displays, the micro LED display is focused as a next-generation display because a plurality of chip-shaped micro LEDs are mounted and formed in a display region, and thus both high definition and large size can be easily achieved.
As a method for mounting a plurality of chip-like micro LEDs on a display area, a method using Laser Lift Off (LLO) has been studied.
Disclosure of Invention
An object of the present disclosure is to provide a method of mounting a micro LED using laser lift-off and a micro LED display (a method of mounting a light emitting element and a display device).
A method of mounting a light emitting element according to an embodiment is a method of mounting a light emitting element on an array substrate by laser lift-off in which the light emitting element provided on one surface of a sapphire substrate for lift-off is lifted off. The method comprises the 1 st step, the 2 nd step, the 3 rd step and the 4 th step. In the 1 st step, the alignment between the 1 st terminal portion formed on one surface of the array substrate and the terminal portion of the light emitting element is performed, and the array substrate and the sapphire substrate are fixed to each other by a sealing material. The 2 nd step of applying a pressure to the array substrate and the sapphire substrate to flatten the sapphire substrate and fixing the array substrate and the sapphire substrate. In the 3 rd step, a 1 st laser beam of a 1 st wavelength band is irradiated from the sapphire substrate side to a bonding member provided on a 1 st terminal portion of the array substrate, and the 1 st terminal portion of the array substrate is bonded to a terminal portion of the light emitting element. The 4 th step irradiates the light emitting element with 2 nd laser light of a 2 nd wavelength band different from the 1 st wavelength band from the sapphire substrate side, and peels the light emitting element from the sapphire substrate.
A display device according to one embodiment includes a 1 st substrate and a 2 nd substrate. The 1 st substrate includes an array substrate, a 1 st terminal portion formed on one surface of the array substrate, and a sealing member provided on the one surface of the array substrate and provided at a position not overlapping with the 1 st terminal portion in a plan view. The 2 nd substrate includes a sapphire substrate and a light emitting element provided on one surface of the sapphire substrate. The 1 st substrate and the 2 nd substrate are fixed to each other by the sealing member.
The display device according to one embodiment includes an array substrate, a light-emitting element provided on one surface of the array substrate, and a terminal portion formed on one surface of the array substrate and formed at a position not overlapping with the light-emitting element in a plan view. At least a part of the terminal portion is attached with a residue of a sealing material melted at the time of laser lift-off for peeling the light emitting element from the sapphire substrate.
Drawings
Fig. 1 is a perspective view schematically showing the configuration of a display device according to an embodiment.
Fig. 2 is a sectional view schematically showing the structure of the 1 st substrate according to the embodiment.
Fig. 3 is a sectional view schematically showing the structure of the 2 nd substrate of the embodiment.
Fig. 4 is a sectional view schematically showing a mounting process of the light emitting element according to the embodiment.
Fig. 5 is a sectional view schematically showing a mounting process following fig. 4.
Fig. 6 is a sectional view schematically showing a mounting process following fig. 5.
Fig. 7 is a sectional view schematically showing a mounting process following fig. 6.
Fig. 8 is a sectional view schematically showing a result of a series of mounting steps shown in fig. 4 to 7.
Fig. 9 is a sectional view schematically showing the structure of the light-emitting element according to the embodiment.
Fig. 10 is another sectional view schematically showing a result of a series of mounting steps shown in fig. 4 to 7.
Fig. 11 is another sectional view schematically showing the structure of the 2 nd substrate according to the embodiment.
Detailed Description
Several embodiments are described with reference to the accompanying drawings.
The disclosure is merely an example, and it is needless to say that the modifications can be made by those skilled in the art without departing from the spirit of the invention, and the modifications are included in the scope of the invention. The drawings are only for illustrative purposes and are not intended to limit the scope of the present invention, but may be schematically illustrated in comparison with the embodiments for the sake of clarity. In the present specification and the drawings, the same reference numerals are given to the components that exhibit the same or similar functions to the components described in connection with the existing drawings, and the overlapping detailed description may be omitted.
Fig. 1 is a perspective view schematically showing the configuration of a display device 1 according to an embodiment. Fig. 1 shows a three-dimensional space defined by a 1 st direction X, a 2 nd direction Y perpendicular to the 1 st direction X, and a 3 rd direction Z perpendicular to the 1 st direction X and the 2 nd direction Y. The 1 st direction X and the 2 nd direction Y are orthogonal to each other, but may intersect at an angle other than 90 degrees. In this specification, a case where the display device 1 is viewed from a direction parallel to the 3 rd direction Z is referred to as a plan view.
Hereinafter, a case where the display device 1 is a micro LED display using micro LEDs as self-light emitting elements in the present embodiment will be mainly described.
As shown in fig. 1, the display device 1 includes a display panel 2, a 1 st circuit board 3, a 2 nd circuit board 4, and the like.
The display panel 2 has a rectangular shape in one example. In the illustrated example, the short side EX of the display panel 2 is parallel to the 1 st direction X, and the long side EY of the display panel 2 is parallel to the 2 nd direction Y. The 3 rd direction Z corresponds to the thickness direction of the display panel 2. The 1 st direction X may be interpreted as a direction parallel to a short side of the display device 1, the 2 nd direction Y may be interpreted as a direction parallel to a long side of the display device 1, and the 3 rd direction Z may be interpreted as a thickness direction of the display device 1. The main surface of the display panel 2 is parallel to an X-Y plane defined by the 1 st direction X and the 2 nd direction Y. The display panel 2 includes a display area DA (display portion) and a non-display area NDA (non-display portion) outside the display area DA. The non-display area NDA has a terminal area MT. In the illustrated example, the non-display area NDA surrounds the display area DA.
The display area DA is an area for displaying an image, and includes a plurality of pixels PX arranged in a matrix, for example. The pixel PX includes a light emitting element (micro LED), a switching element (driving transistor) for driving the light emitting element, and the like.
The terminal area MT is provided along the short side EX of the display panel 2, and includes terminals for electrically connecting the display panel 2 to an external device or the like.
The 1 st circuit board 3 is mounted on the terminal area MT and electrically connected to the display panel 2. The 1 st Circuit Board 3 is, for example, a Flexible Printed Circuit Board (Flexible Printed Circuit Board). The 1 st circuit board 3 includes a driver IC chip (hereinafter referred to as a panel driver) 5 and the like for driving the display panel 2. In the illustrated example, the panel driver 5 is disposed above the 1 st circuit board 3, but may be disposed below the 1 st circuit board 3. Alternatively, the panel driver 5 may be mounted on a portion other than the 1 st circuit board 3. In this case, the panel driver 5 may be mounted on the non-display area NDA of the display panel 2 or may be mounted on the 2 nd circuit board 4. The 2 nd circuit board 4 is, for example, a rigid printed circuit board. The 2 nd circuit board 4 is connected to the 1 st circuit board 3, for example, below the 1 st circuit board 3.
The panel driver 5 is connected to a control board, not shown, via, for example, the 2 nd circuit board 4. The panel driver 5 drives the plurality of pixels PX based on a video signal output from, for example, a control substrate, thereby performing control for displaying an image on the display panel 2.
The display panel 2 may have a curved area BA indicated by hatching. The bending area BA is an area where the display device 1 is bent when it is housed in a case of an electronic apparatus or the like. The bending area BA is located on the terminal area MT side in the non-display area NDA. In a state where the bending area BA is bent, the 1 st circuit board 3 and the 2 nd circuit board 4 are arranged to face the display panel 2.
A method of mounting the light emitting element on the display panel 2 will be described below. More specifically, a method of peeling the light emitting element LED from the 2 nd substrate SUB2 shown in fig. 3 by laser lift-off (LLO) and mounting the light emitting element LED on the 1 st substrate SUB1 shown in fig. 2 will be described. First, with reference to fig. 2 and 3, the structure of the 1 st substrate SUB1 on which the light emitting element LED is mounted and the 2 nd substrate SUB2 for peeling will be described.
Fig. 2 is a sectional view schematically showing the structure of the 1 st substrate SUB 1.
As shown in fig. 2, the 1 st substrate SUB1 includes an array substrate 10, a plurality of 1 st terminal portions 11, a bonding member 12, a plurality of 2 nd terminal portions 13, a sealing material 14, and the like.
The array substrate 10 includes a 1 st main surface 10A and a 2 nd main surface 10B located on the opposite side of the 1 st main surface 10A. Although not shown in the illustrated example, the array substrate 10 is provided with switching elements and various wiring patterns for driving the light emitting elements LED. The array substrate 10 may also be referred to as a back plate.
The 1 st terminal portions 11 are formed on the 1 st main surface 10A of the array substrate 10. The 1 st terminal portions 11 are formed in the same number as the light emitting elements LED mounted on the display device 1, for example. The 1 st terminal portion 11 is formed of a metal material such as Al (aluminum), Ti (titanium), Mo (molybdenum), W (tungsten), or a laminate of these metal materials. The 1 st terminal portion 11 is also referred to as a 1 st pad or a mounting electrode. A bonding member 12 is disposed on each of the 1 st terminal portions 11.
The bonding member 12 is a member for bonding the 1 st terminal portion 11 to a terminal portion 22 of a light emitting element LED described later. As will be described in detail later, the joining member 12 is made of a metal material that is heated and melted by laser ablation when irradiated with laser light in a wavelength band of 400nm to 3000nm, for example, a metal material such as Sn (tin) or Ag (silver). The joint member 12 may also be referred to as a brazed member. In the present embodiment, the bonding member 12 is provided on the 1 st terminal portion 11 of the array substrate 10, but may be provided on the terminal portion 22 of the light emitting element LED.
The plurality of 2 nd terminal portions 13 are formed on the 1 st main surface 10A of the array substrate 10. The 2 nd terminal portion 13 is formed at a position not overlapping with the 1 st terminal portion 11 in a plan view, and is formed so as to surround a plurality of light emitting elements LED provided in the display device 1, for example. For example, the 2 nd terminal portion 13 is formed in the non-display area NDA. The 2 nd terminal portion 13 is formed to have a width W1. The width W1 is set to 0.1mm to 0.5mm, for example. The 2 nd terminal portion 13 is not electrically connected to various wiring patterns formed on the array substrate 10. However, the 2 nd terminal portion 13 may be a terminal portion formed so as to surround the plurality of light emitting elements LED in the non-display area NDA and electrically connected to various wiring patterns formed on the array substrate 10. As will be described in detail later, the 2 nd terminal portion 13 is formed of a metal material that generates laser ablation by laser light irradiated for peeling the light emitting element LED from the sapphire substrate 20 described later, for example, a metal material such as Al (aluminum). The 2 nd terminal portion 13 may also be referred to as a 2 nd pad, a metal portion, a metal wiring, or the like. A sealing material 14 is disposed on each 2 nd terminal portion 13 so as to cover the 2 nd terminal portion 13.
The seal 14 is a member for fixing the 1 st substrate SUB1 and the 2 nd substrate SUB 2. The sealing material 14 is formed of a material that transmits the laser light applied to the 2 nd terminal portion 13.
The sealing material 14 and the 2 nd terminal portions 13 may be formed along the 2 short sides EX and the 2 long sides in the non-display region NDA so as to surround the entire circumference of the display region DA of the 1 st substrate SUB1, for example. The sealing material 14 and the 2 nd terminal portion 13 may be formed along only the 2 short sides EX of the 1 st substrate SUB1, or may be formed along only the 2 long sides EY. Further, the sealing material 14 and the 2 nd terminal portion 13 may be disposed in a plurality of dots in the non-display region, and the 1 st substrate SUB1 and the 2 nd substrate SUB2 may be fixed to each other.
Fig. 3 is a sectional view schematically showing the structure of the 2 nd substrate SUB 2.
As shown in fig. 3, the 2 nd substrate SUB2 includes a sapphire substrate 20 and a plurality of light emitting elements LEDs. The light emitting element LED includes a light emitting layer 21 and a terminal portion 22.
The sapphire substrate 20 for separation includes a 1 st main surface 20A and a 2 nd main surface 20B located on the opposite side of the 1 st main surface 20A. The plurality of light emitting elements LEDs are arranged on the 1 st main surface 20A of the sapphire substrate 20. The plurality of light emitting elements LED include light emitting elements LED having emission colors of red (R), green (G), and blue (B).
The light-emitting layer 21 is fixed to the 1 st main surface 20A of the sapphire substrate 20 via a peeling layer not shown. The light emitting layer 21 emits R, G, B light. A terminal portion 22 is disposed on the light-emitting layer 21. The terminal portion 22 is joined to the 1 st terminal portion 11 by the joining member 12 disposed on the 1 st substrate SUB1 side. Thereby, the terminal portion 22 of the light emitting element LED is electrically connected to the 1 st terminal portion 11. The terminal portion 22 corresponds to an anode terminal or a cathode terminal of the light emitting element LED. The terminal portions 22 may also be referred to as bumps.
Fig. 4 to 8 are schematic cross-sectional views sequentially showing an example of a mounting process of the light emitting element LED.
First, a positioning step (step 1) is performed. Specifically, as shown in fig. 4, the 1 st substrate SUB1 in a state where the plurality of 1 st terminal portions 11, the bonding member 12, the plurality of 2 nd terminal portions 13, and the sealing member 14 are arranged on the array substrate 10 is opposed to the 2 nd substrate SUB2 in a state where the plurality of light emitting elements LED are arranged on the sapphire substrate 20, so that the 1 st main surface 10A of the array substrate 10 is opposed to the 1 st main surface 20A of the sapphire substrate 20. In addition, the plural 1 st terminal portions 11 of the 1 st substrate SUB1 and the plural light emitting element LEDs 22 of the 2 nd substrate SUB2 are aligned with each other. The 1 st substrate SUB1 and the 2 nd substrate SUB2 are fixed to each other by a seal 14.
In fig. 4, it is assumed that no warp occurs in the sapphire substrate 20 of the 2 nd substrate SUB2, and therefore, at this stage, the plurality of 1 st terminal portions 11 of the 1 st substrate SUB1 and the terminal portions 22 of the plurality of light-emitting element LEDs of the 2 nd substrate SUB2 overlap in a plan view, but at this stage, the plurality of 1 st terminal portions 11 of the 1 st substrate SUB1 and the terminal portions 22 of the plurality of light-emitting element LEDs of the 2 nd substrate SUB2 may not overlap in a plan view. At this stage, at the end of the fixing step described later, alignment is performed for overlapping the plurality of 1 st terminal portions 11 of the 1 st substrate SUB1 with the plurality of terminal portions 22 of the light emitting elements LED of the 2 nd substrate SUB2 in a plan view.
Subsequently, a fixing step (step 2) is performed. Specifically, as shown in fig. 5, the cushion 30 and the fixing member 40 are disposed in this order on the 2 nd main surface 10B side of the array substrate 10 of the 1 st substrate SUB1, and the fixing member 50 is disposed on the 2 nd main surface 20B side of the sapphire substrate 20 of the 2 nd substrate SUB 2. Then, the warpage generated on the sapphire substrate 20 is flattened by applying pressure from the top and bottom so as to sandwich the 1 st substrate SUB1 and the 2 nd substrate SUB2 (that is, by pressing the fixing members 40 and 50 in opposite directions to each other to apply pressure). Thereby, the 1 st substrate SUB1 and the 2 nd substrate SUB2 are fixed in the following state: the warpage generated on the sapphire substrate 20 is flattened, and the plurality of 1 st terminal portions 11 of the 1 st substrate SUB1 and the plurality of terminal portions 22 of the light emitting element LEDs of the 2 nd substrate SUB2 are overlapped in a plan view. In the fixing step, the gap between the 1 st substrate SUB1 and the 2 nd substrate SUB2 is maintained by the sealing material 14 and the light emitting element LED, but the gap between the 1 st substrate SUB1 and the 2 nd substrate SUB2 may be maintained by providing a spacer (not shown) on the 1 st substrate SUB1 or the 2 nd substrate SUB 2.
The fixing member 50 is made of a material that transmits laser light irradiated in a bonding step described later and has rigidity to such an extent that it does not bend when pressure is applied, and is made of, for example, quartz glass. The fixing member 40 is formed of a material having such rigidity that it does not bend when pressure is applied thereto, and may be formed of, for example, quartz glass as in the fixing member 50 or a material different from the fixing member 50.
As described above, by disposing the cushion 30 between the 1 st substrate SUB1 and the fixing member 40, the array substrate 10 is prevented from being damaged by the pressure for sandwiching the 1 st substrate SUB1 and the 2 nd substrate SUB 2. Further, since the 1 st substrate SUB1 and the 2 nd substrate SUB2 are fixed to each other by the seal 14, positional displacement that may occur due to slipping of one substrate or the like when pressure is applied can be suppressed.
Subsequently, a bonding step (step 3) is performed. Specifically, as shown in fig. 6, the bonding member 12 is heated and melted by laser ablation by irradiating the fixing member 50 side with laser LZ1 in a wavelength band of 400nm to 3000nm toward the bonding member 12, whereby the plurality of 1 st terminal portions 11 of the 1 st substrate SUB1 and the plurality of terminal portions 22 of the light emitting element LEDs of the 2 nd substrate SUB2 are bonded. At the end of the bonding process, the cushion 30, the fixing member 40, and the fixing member 50 may be removed, or may not be removed at this stage. In the present embodiment, it is assumed that the 1 st substrate SUB1 and the 2 nd substrate SUB2 in a state where the bonding process is completed are moved to the stage, and the next process is performed, and therefore the cushion 30, the fixing member 40, and the fixing member 50 are removed at the stage where the bonding process is completed.
Thereafter, the LLO process (4 th process) is performed. Specifically, as shown in fig. 7, the laser LZ2 in the wavelength band of 200nm to 366nm is irradiated from the sapphire substrate 20 side toward the plurality of light-emitting elements LED and the plurality of 2 nd terminal portions 13. Thus, a peeling layer, not shown, which fixes the plurality of light emitting elements LED to the sapphire substrate 20 is sublimated by laser ablation, and the plurality of light emitting elements LED are peeled from the sapphire substrate 20. When the plurality of 2 nd terminal portions 13 are heated by laser ablation, the heat is transferred to the sealing material 14 covering the 2 nd terminal portions 13, and the sealing material 14 is melted and removed.
By performing a series of mounting steps shown in fig. 4 to 7, the sapphire substrate 20 is peeled off, and as shown in fig. 8, a plurality of light emitting element LEDs are mounted on the 1 st substrate SUB1 (array substrate 10).
As is clear from the above-described series of mounting steps, the 2 nd terminal portion 13 is formed by melting the sealing material 14 by laser ablation, and the sealing material 14 is disposed in the fixing step so as to suppress positional displacement that may occur due to one substrate slipping or the like when pressure is applied to the 1 st substrate SUB1 and the 2 nd substrate SUB 2. Therefore, the 2 nd terminal portion 13 basically has an unnecessary configuration for the display panel 2 after the series of mounting steps are completed, but may be used as an alignment mark for alignment when mounting the 1 st circuit board 3, the 2 nd circuit board 4, and the panel driver 5 on the array substrate 10 after the series of mounting steps.
The light emitting element LED of the present embodiment may be a micro LED in which the anode terminal 22AN and the cathode terminal 22CA are arranged in parallel on one surface of the light emitting layer 21 as shown in fig. 9 (a), or may be a micro LED in which the anode terminal 22AN is arranged on one surface of the light emitting layer 21 and the cathode terminal CA is arranged on the other surface of the light emitting layer 21 as shown in fig. 9 (B). In the case where the light emitting elements LEDs are micro LEDs of the type shown in fig. 9 (a), the 1 st terminal portions 11 are formed on the array substrate 10 not in the same number as the light emitting elements LEDs but in the same number as the anode terminals 22AN and the cathode terminals 22 CA. In addition, the 1 st terminal portion 11 corresponding to one light emitting element LED is formed such that the 1 st terminal portion 11 joined to the anode terminal 22AN and the 1 st terminal portion 11 joined to the cathode terminal 22CA are separated by a predetermined interval. Even if the light emitting element LED is a micro LED of the type shown in fig. 9 (a) or a micro LED of the type shown in fig. 9 (B), the light emitting element LED can be mounted on the 1 st substrate SUB1 (array substrate 10) through the above-described series of mounting steps.
In fig. 8, the case where the sealing material 14 disposed so as to cover the plurality of 2 nd terminal portions 13 is completely removed by the LLO step is exemplified, but the sealing material 14 is not completely melted in practice, and it is expected that a part of the sealing material is left as a residue to adhere to the 2 nd terminal portions 13 as shown in fig. 10 (a). However, since the 2 nd terminal portion 13 is basically an unnecessary configuration for the display panel 2 after the completion of the series of mounting steps as described above, there is no particular problem even if a part of the sealing material 14 is left as a residue to adhere to the 2 nd terminal portion 13. Further, since the 2 nd terminal portion 13 is disposed in the non-display region NDA, for example, a part of the sealing material 14 remains as a residue attached to the 2 nd terminal portion 13 from the viewpoint of display quality, and there is no particular problem. However, as shown in fig. 10 (B), the 2 nd terminal portion 13 may be cut out together with the seal 14 attached as a residue.
In the present embodiment, the case where the 2 nd terminal portion 13 is formed on the array substrate 10 is assumed, but the present invention is not limited thereto, and the 2 nd terminal portion 13 may be formed on the sapphire substrate 20 as shown in fig. 11, for example. In this case, the light emitting element LED can be mounted on the 1 st substrate SUB1 (array substrate 10) by the above-described series of mounting steps, and the 2 nd terminal portion 13 is heated by laser ablation in the stage of the LLO step, so that the sealing material 14 disposed so as to cover the 2 nd terminal portion 13 can be removed.
In the embodiment described above, the 1 st substrate SUB1 and the 2 nd substrate SUB2 are fixed by applying pressure so as to sandwich the 1 st substrate SUB1 on which the light emitting element LED is mounted and the 2 nd substrate SUB2 for peeling. Therefore, even if warpage occurs in the 2 nd substrate SUB2 (sapphire substrate 20), the warpage can be flattened and the 1 st substrate SUB1 and the 2 nd substrate SUB2 can be fixed without a gap. Further, since the 1 st substrate SUB1 is pressed against the cushion material 30, the array substrate 10 of the 1 st substrate SUB1 is prevented from being damaged by the pressing force.
In the embodiment described above, since the 1 st substrate SUB1 on which the light emitting element LED is mounted and the 2 nd substrate SUB2 for separation are fixed to each other by the sealing material 14 and pressure is applied so as to sandwich the 1 st substrate SUB1 and the 2 nd substrate SUB2, positional displacement that may occur due to, for example, slipping of one substrate when pressure is applied can be suppressed. Further, by forming the 2 nd terminal portion 13 which is covered with the sealing material 14 and generates laser ablation by the laser light LZ2 irradiated at the time of the LLO process, the sealing material 14 can be removed at the time of the LLO process of peeling the light emitting element LED from the 2 nd substrate SUB 2. In other words, the removal of the seal 14 can be achieved without adding a separate process for removing the seal 14 alone.
According to the above-described embodiment, it is possible to provide a method of mounting a micro LED using laser lift-off and a micro LED display (a method of mounting a light emitting element and a display device).
Several embodiments of the present invention have been described, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other embodiments, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalent scope thereof.
Description of the reference numerals
SUB1 … 1 st substrate, 10 … array substrate, 11 … 1 st terminal portion, 12 … bonding member, 13 … 2 nd terminal portion, 14 … sealing member, SUB2 … nd 2 nd substrate, 20 … sapphire substrate, LED … light emitting element, 21 … light emitting layer, 22 … terminal portion, LZ1, LZ2 … laser light.
Claims (15)
1. A method for mounting a light emitting element by peeling a light emitting element provided on one surface of a sapphire substrate for peeling by laser peeling and mounting an array substrate, comprising:
a 1 st step of performing alignment between a 1 st terminal portion formed on one surface of the array substrate and a terminal portion of the light emitting element, and fixing the array substrate and the sapphire substrate by a sealing material;
a 2 nd step of applying a pressure to the array substrate and the sapphire substrate to flatten the sapphire substrate and fix the array substrate and the sapphire substrate;
a 3 rd step of irradiating a 1 st laser beam of a 1 st wavelength band from the sapphire substrate side to a bonding member provided on a 1 st terminal portion of the array substrate to bond the 1 st terminal portion of the array substrate and a terminal portion of the light emitting element; and
and a 4 th step of irradiating the light emitting element with a 2 nd laser beam having a 2 nd wavelength band different from the 1 st wavelength band from the sapphire substrate side to peel the light emitting element from the sapphire substrate.
2. The method of mounting a light emitting element according to claim 1,
the step 2 includes the steps of:
after the cushion member is brought into contact with the other surface of the array substrate, fixing members are further disposed on the other surface side of the array substrate and the other surface side of the sapphire substrate, and the fixing members are pressed against each other in the opposite direction to apply pressure to the array substrate and the sapphire substrate.
3. The method of mounting a light emitting element according to claim 2,
a fixing member disposed on the other surface side of the sapphire substrate, and through which the 1 st laser beam irradiated in the 3 rd step is transmitted.
4. The method of mounting a light-emitting element according to any one of claims 1 to 3,
the 4 th step includes the steps of:
and irradiating the 2 nd terminal portion formed on one surface of the array substrate and covered with the sealing material with the 2 nd laser beam from the sapphire substrate side, and heating the 2 nd terminal portion to melt the sealing material.
5. The method of mounting a light-emitting element according to any one of claims 1 to 3,
the 4 th step includes the steps of:
and irradiating the 2 nd terminal portion formed on one surface of the sapphire substrate and covered with the sealing material with the 2 nd laser beam from the sapphire substrate side, and heating the 2 nd terminal portion to melt the sealing material.
6. The method of mounting a light-emitting element according to any one of claims 1 to 3,
the 1 st wavelength band is 400nm to 3000nm,
the 2 nd wavelength band is 200nm to 366 nm.
7. The method of mounting a light-emitting element according to any one of claims 1 to 3,
the light emitting element is a micro LED.
8. A display device is provided with:
a 1 st substrate including an array substrate, a 1 st terminal portion formed on one surface of the array substrate, and a sealing member provided on the one surface of the array substrate and provided at a position not overlapping with the 1 st terminal portion in a plan view; and
a 2 nd substrate, the 2 nd substrate including a sapphire substrate and a light emitting element provided on one surface of the sapphire substrate,
the 1 st substrate and the 2 nd substrate are fixed to each other by the sealing member.
9. The display device according to claim 8,
the light emitting element includes a light emitting layer which emits light and a terminal portion,
the 1 st terminal portion of the 1 st substrate and the terminal portion of the light emitting element are bonded via a bonding member.
10. The display device according to claim 8 or 9,
the 1 st substrate further includes a 2 nd terminal portion formed on one surface of the array substrate and covered with the sealing material.
11. The display device according to claim 10,
the 1 st terminal part is formed in a display area for displaying an image,
the 2 nd terminal portion is formed in a non-display region disposed so as to surround the display region.
12. The display device according to claim 8 or 9,
the light emitting element is a micro LED.
13. A display device is provided with:
an array substrate;
a light emitting element provided on one surface of the array substrate; and
a terminal portion formed on one surface of the array substrate and at a position not overlapping with the light emitting element in a plan view,
at least a part of the terminal portion is attached with a residue of a sealing material melted at the time of laser lift-off for peeling the light emitting element from the sapphire substrate.
14. The display device according to claim 13,
the light emitting element is provided in a display region where an image is displayed,
the terminal portion is formed in a non-display region disposed so as to surround the display region.
15. The display device according to claim 13 or 14,
the light emitting element is a micro LED.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020067627A JP7434037B2 (en) | 2020-04-03 | 2020-04-03 | Mounting method of light emitting element and display device |
| JP2020-067627 | 2020-04-03 |
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| CN113497165A true CN113497165A (en) | 2021-10-12 |
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| JP (1) | JP7434037B2 (en) |
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| WO2023207661A1 (en) * | 2022-04-29 | 2023-11-02 | 成都辰显光电有限公司 | Display panel, and preparation method for display panel |
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| CN114122225A (en) * | 2021-11-09 | 2022-03-01 | Tcl华星光电技术有限公司 | Preparation method of Micro LED display panel |
| TWI848733B (en) * | 2023-06-02 | 2024-07-11 | 前源科技股份有限公司 | Bonding method of electronic device and method of mass transferring electronic devices |
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| JP7434037B2 (en) | 2024-02-20 |
| TWI836205B (en) | 2024-03-21 |
| JP2021163945A (en) | 2021-10-11 |
| TW202205694A (en) | 2022-02-01 |
| CN113497165B (en) | 2024-06-18 |
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