CN117012783A - Display panel and preparation method thereof - Google Patents
Display panel and preparation method thereof Download PDFInfo
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- CN117012783A CN117012783A CN202210476327.0A CN202210476327A CN117012783A CN 117012783 A CN117012783 A CN 117012783A CN 202210476327 A CN202210476327 A CN 202210476327A CN 117012783 A CN117012783 A CN 117012783A
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- 238000002360 preparation method Methods 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000003825 pressing Methods 0.000 claims abstract description 16
- 239000010410 layer Substances 0.000 claims description 144
- 230000008093 supporting effect Effects 0.000 claims description 88
- 239000003292 glue Substances 0.000 claims description 12
- 239000012780 transparent material Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 16
- 239000002245 particle Substances 0.000 description 12
- 238000004220 aggregation Methods 0.000 description 5
- 230000002776 aggregation Effects 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
The application provides a display panel and a preparation method of the display panel, wherein the display panel comprises the following components: a substrate including a light emitting element region and a non-light emitting element region, and a support provided to the non-light emitting element region; or, the support is disposed between the light emitting elements of the light emitting element region; or, the support is disposed between the non-light emitting element region and the light emitting element of the light emitting element region. The buffer layer is supported by the support piece in the process of pressing, so that the buffer layer is prevented from deforming, or the buffer layer is adhered to the substrate to cause the light-emitting element to deviate or rotate, and the Micro-LED lighting yield is improved.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel and a preparation method of the display panel.
Background
When manufacturing a display panel such as a Micro-LED panel, the Micro-LED and the back plate are generally electrically connected using a bonding method such as ACF (Anisotropic Conductive Film ) bonding method. When bonding is carried out, an ACF (active surface film) pressing process is needed, but the LEDs rotate or shift in the ACF pressing stage, and finally the Micro-LED lighting yield is affected.
Disclosure of Invention
The application provides a display panel and a preparation method of the display panel, which can prevent a light-emitting element from rotating or shifting and improve the lighting yield of Micro-LEDs.
In order to solve the technical problems, the first technical scheme provided by the application is as follows: provided is a display panel including a substrate and a support member: the substrate comprises a light-emitting element area and a non-light-emitting element area, and the support piece is arranged in the non-light-emitting element area; or, the support is disposed between the light emitting elements of the light emitting element region; or, the support is disposed between the non-light emitting element region and the light emitting element of the light emitting element region.
Wherein the support extends at least partially in a vertical direction for supporting a buffer layer for protecting the light emitting element at the time of lamination.
Wherein the substrate comprises: a back plate; a bonding layer, which is positioned on one surface of the back plate, which is close to the light-emitting element; the support member is grown or arranged on the surface of the bonding layer, and/or the support member is grown or arranged on the surface of the backboard and penetrates through the bonding layer.
The arrangement mode of the supporting pieces comprises any one or any combination of a rice-shaped arrangement, a cross-shaped arrangement, an arch-shaped arrangement, an X-shaped arrangement and a hexagonal arrangement; the support piece is arranged between the two light-emitting elements which are transversely arranged; and/or the support is arranged between two light-emitting elements which are longitudinally arranged; and/or the supporting piece is arranged at the center positions of the three light-emitting elements in the triangular arrangement; and/or the supporting piece is arranged at the center position of the four light-emitting elements which are arranged in a rectangular mode.
Wherein the supporting piece is any one or any combination of columnar, spherical, step-shaped and virtual circuits; or, the cross section of the support piece is any one or any combination of rectangle, trapezoid, triangle, circle and polygon.
The support piece is of a whole-layer structure and comprises a through groove area, and the through groove area corresponds to the light-emitting element area, so that the light-emitting element area is exposed from the through groove area; and/or the support member is provided with a plurality of through holes at positions corresponding to the light-emitting element regions, so that the light-emitting elements are exposed from the through holes, and preferably the support member is made of transparent material.
Wherein, the support piece is far away from the back plate and is parallel and level with the light-emitting element far away from the back plate.
Wherein the side surface of the support far from the back plate is higher than the side surface of the light-emitting element far from the back plate, and the height difference is less than or equal to 2 micrometers; and/or the side surface of the support far from the back plate is lower than the side surface of the light-emitting element far from the back plate, and the height difference is less than 7 microns; and/or the side surface of the support piece away from the back plate is flush with the side surface of the light-emitting element away from the back plate.
Wherein, the display panel still includes: and the packaging layer is arranged on one side of the light-emitting element far away from the substrate, so that the light-emitting element is packaged.
Wherein the support is disposed in the non-light emitting element region when the buffer layer at least partially coincides with the projection of the non-light emitting element region on the substrate; when the density of the light-emitting elements is smaller than a preset value and/or the arrangement of the light-emitting elements is uneven, the supporting piece is arranged between the light-emitting elements; when the density of the light-emitting elements is smaller than a preset value and/or the arrangement of the light-emitting elements is uneven, and the projection of the buffer layer and the non-light-emitting element area on the substrate is at least partially overlapped, the supporting piece is arranged in the non-light-emitting element area and between the light-emitting elements.
Wherein, the support piece is set up in the non-light emitting component district, the distance between the support piece is: 20-200 micrometers; preferably, the distance between the supporting members is the same as the distance between the light emitting elements.
Wherein, when the supporting piece is arranged between the light-emitting elements, the supporting piece is made of transparent material; preferably, the material of the support column is silicon oxide; and/or the support is arranged in the non-luminous element region, and the hardness of the support is greater than or equal to 5B; preferably, the material of the support member is at least one of copper, plastic and a light-emitting element or any combination of the copper, plastic and the light-emitting element.
In order to solve the technical problems, a second technical scheme provided by the application is as follows: provided is a method of manufacturing a display panel, including: providing a substrate, wherein the substrate comprises a light-emitting element area and a non-light-emitting element area, and the non-light-emitting element area is positioned outside the light-emitting element area; providing a support at the non-light emitting element region and/or the light emitting element region; arranging light-emitting elements in the light-emitting element areas, wherein the positions of the light-emitting elements are staggered from the positions of the supporting pieces; a buffer layer is arranged on one side, far away from the substrate, of the light-emitting element, and the supporting piece is used for supporting the buffer layer; applying pressure to the buffer layer so that the light emitting element is electrically connected to the substrate; and removing the buffer layer.
The substrate comprises a back plate and a bonding layer, wherein the bonding layer is positioned on one surface of the back plate; the step of providing a support in the non-light emitting element region and/or the light emitting element region includes: growing or disposing the support on the bonding layer surface; or growing or disposing the support on the surface of the back plate, wherein the support passes through the bonding layer, preferably, the step of disposing the support on the non-light emitting element region and/or the light emitting element region includes: arranging a glue layer in the non-light-emitting element area and/or the light-emitting element area; a through groove area is arranged at the position of the adhesive layer corresponding to the light-emitting element area; or a through hole is arranged at the position of the glue layer corresponding to the light-emitting element.
According to the display panel and the preparation method of the display panel, the support piece is arranged in the non-light-emitting element area and/or the light-emitting element area, and the buffer layer in the pressing process is supported by the support piece, so that the rotation or the deviation of the light-emitting element caused by the deformation of the buffer layer is avoided, and the Micro-led lighting yield is improved.
Drawings
For a clearer description of the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the description below are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art, wherein:
FIG. 1 is a schematic diagram of a first embodiment of a display panel according to the present application;
FIG. 2 is a top view of the display panel of the present application;
FIG. 3 is a schematic structural diagram of a second embodiment of the display panel of the present application;
FIG. 4 is a schematic structural diagram of a third embodiment of a display panel according to the present application;
FIG. 5 is a schematic diagram of a fourth embodiment of a display panel according to the present application;
FIG. 6 is a schematic view of a structure of a light emitting device region support;
FIG. 7a is a schematic structural diagram of a fifth embodiment of a display panel according to the present application;
FIG. 7b is a schematic view of the support of FIG. 7 a;
FIG. 8a is a schematic structural diagram of a display panel according to a sixth embodiment of the present application;
FIG. 8b is a schematic view of the support member of FIG. 8 a;
FIG. 9 is a schematic diagram of a seventh embodiment of a display panel according to the present application;
FIG. 10 is a schematic diagram of an eighth embodiment of a display panel according to the present application;
fig. 11 is a schematic structural diagram of an embodiment of a method for manufacturing a display panel according to the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The ACF present compression process is typically used to electrically connect the LED to the back plane. However, in the case of performing the present pressure, a buffer layer is generally provided on the surface of the LED in order to prevent damage to the LED. However, the buffer layer cannot have the same area as the light emitting device region due to the limitation of cost and manufacturing process. If the buffer layer is larger than the area of the light-emitting element region, the buffer layer outside the light-emitting element region lacks support and is deformed when the light-emitting element region is subjected to the present pressure; in more severe cases, the buffer layer may adhere to the bonding layer on the back plate, resulting in a change in the bonding layer thickness. It should be noted that, if the bonding layer has conductive particles, the buffer layer is adhered to the bonding layer, which on one hand can cause aggregation or random arrangement of the conductive particles in the bonding layer, and on the other hand can cause rotation or offset of the LED, thereby affecting the lighting yield of the LED; or if the bonding layer does not have conductive particles, the buffer layer is adhered to the bonding layer, so that the LED rotates or shifts, and the lighting yield of the LED is affected; or if the gap between the LEDs in the light-emitting element area is larger or the LEDs are missing, the buffer layer at the position where the gap is large or the LEDs are missing is also deformed or is adhered with the bonding layer in the process of pressing, so that the lighting yield of the LEDs is affected.
To solve this problem, the present application proposes a display panel provided with a substrate and a support member disposed outside the LED, i.e., a non-light emitting element region, to support a buffer layer outside the LED; or, the supporting piece is arranged between the LEDs to support the buffer layer; alternatively, the supporting member is disposed between the non-light emitting element region and the LED, which is described with reference to the drawings and the embodiments.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a first embodiment of a display panel according to the present application, specifically, the display panel includes a substrate 10, the substrate 10 includes a light emitting element region 17 and a non-light emitting element region 16, the non-light emitting element region 16 is located outside the light emitting element region 17, for example, around the periphery of the light emitting element region 17, and may also be located inside the light emitting element region 17, which is not limited herein. Please refer to fig. 2 in detail. The light emitting element region 17 is provided with a light emitting element 14, and the light emitting element 14 is electrically connected to the substrate 10. Further, the display panel further includes a support member 13, and the support member 13 is disposed in the non-light emitting element region 16; or the support 13 is disposed between the light emitting elements 14; or the support 13 is disposed between the light emitting elements 14 of both the non-light emitting element region 16 and the light emitting element region 17. The support 13 extends at least partially in the vertical direction to support the cushioning layer 20.
Specifically, in one embodiment, if the area of the buffer layer 20 used in the present pressing process is the same as the area of the light emitting element region 17, and the gap between the light emitting elements 14 in the light emitting element region 17 is too large and the light emitting elements 14 are missing, the supporting member 13 is only disposed between the light emitting elements 14 with too large gap or at the location where the light emitting elements 14 are missing. In another embodiment, if the area of the buffer layer 20 used in the present pressing process is larger than the area of the light emitting element region 17, that is, the projection of the buffer layer 20 and the non-light emitting element region 16 on the substrate at least partially coincides, and the gap between the light emitting elements 14 in the light emitting element region 17 is small, and the light emitting elements 14 are not missing, the supporting member 13 may be disposed only in the non-light emitting element region 16. In yet another embodiment, the supporting member 13 may be disposed in the non-light-emitting element region 16, or the supporting member 13 may be disposed between the light-emitting elements 14 with too large a gap and/or in the absence of the light-emitting elements 14, when the gap between the light-emitting elements 14 is relatively large due to the excessive gap between the light-emitting elements 14 in the light-emitting element region 17, and the buffer layer area used in the present pressing process is larger than the area of the light-emitting element region 17, i.e., the buffer layer 14 at least partially overlaps with the projection of the non-light-emitting element region 16 on the substrate. The embodiment shown in fig. 1 is such that the support 13 is provided only in the non-light emitting element region 16.
In another embodiment, the substrate 10 includes: a back plate 11 and a bonding layer 12. The bonding layer 12 is located on one surface of the back plate 11, and the bonding layer 12 has conductive particles 15 therein; the support 13 grows or is disposed on the surface of the bonding layer 12; or the support 13 is grown or disposed on the surface of the back plate 11 and passes through the bonding layer 12. The above-described arrangement relationship of the support 13 and the substrate 10 can be applied to any embodiment of the present application.
In the embodiment shown in fig. 1, the support 13 is grown or provided on the surface of the back plate 11 and passes through the bonding layer 12. In another embodiment, as shown in fig. 3, the support 13 is grown or disposed on the surface of the bonding layer 12. It should be noted that, fig. 3 is a schematic structural diagram of a second embodiment of the display panel according to the present application, and the difference between the present embodiment and the first embodiment shown in fig. 1 is that: in this embodiment, the support 13 is grown on the surface of the bonding layer 12.
In one embodiment, the support 13 comprises a plurality of columnar support columns. As particularly shown in fig. 1 and 3.
In the embodiment shown in fig. 1 and 3, the supporting member 13 is disposed in the non-light emitting element region 16. In another embodiment of the present application, the supporting member 13 is disposed between the plurality of light emitting elements 14, as shown in fig. 4. Fig. 4 is a schematic structural diagram of a third embodiment of the display panel of the present application. In the present embodiment, the area of the buffer layer 20 is equal to the area of the light emitting element region 17. However, in the present embodiment, the light emitting elements 14 in the light emitting element region 17 are unevenly arranged. For example, the gap between the light emitting elements 14 is large, or the light emitting element 14 is absent, for example, the gap between the first light emitting element 14 of the left number and the second light emitting element 14 of the left number is large, or the light emitting element 14 is absent, and the gap between the fourth light emitting element 14 of the left number and the fifth light emitting element 14 of the left number is large, or the light emitting element 14 is absent. In the present embodiment, the supporting member 13 is provided between the first light emitting element 14 of the left number and the second light emitting element 14 of the left number, and the supporting member 13 is provided between the fourth light emitting element 14 of the left number and the fifth light emitting element 14 of the left number.
In another embodiment of the present application, a support 13 is provided between each of the non-light emitting element region 16 and the plurality of light emitting elements 14, as particularly shown in fig. 5. Fig. 5 is a schematic structural diagram of a fourth embodiment of the display panel of the present application. Specifically, in the present embodiment, the area of the buffer layer 20 is larger than the area of the light emitting element region 17, and thus the non-light emitting element region 16 is provided with the support 13. The gap between the first light emitting element 14 of the left number and the second light emitting element 14 of the left number is large or the light emitting element 14 is missing, so the support 13 is provided between the first light emitting element 14 of the left number and the second light emitting element 14 of the left number. The support 13 of the non-light emitting element region 16 is disposed at a position where the buffer layer 20 coincides with at least a portion of the projection of the substrate 10. It will be appreciated that the support 13 need not be provided in a position where the projection of the buffer layer 20 and the substrate 10 do not coincide.
Specifically, in the embodiments shown in fig. 1, 3, 4 and 5, the supporting members 13 are all columnar supporting columns, and the cross-sectional area of each supporting column may be at least one of rectangular, circular, triangular, diamond-shaped, or hexagonal, or any combination thereof, which is not particularly limited. The supporting member 13 may be provided in any one or any combination of other shapes such as a sphere, a step, a dummy line, and the like, as long as the buffer layer 20 can be supported. In an embodiment, the cross section of the support member may be any one or any combination of rectangular, trapezoidal, triangular, circular, polygonal (e.g., pentagonal, hexagonal). It should be noted that the virtual circuit is not connected with the driving chip, i.e. does not receive signals, and only performs a supporting function.
In one embodiment, as shown in fig. 6, the supporting member 13 is disposed between two light emitting elements 14 arranged laterally, as shown in fig. 6 a (black is a supporting column, and white is a light emitting element 14). Alternatively, the support 13 is disposed between two light emitting elements 14 arranged longitudinally, as shown in fig. 6B. Alternatively, the support 13 is provided at the center position of three light emitting elements 14 arranged in a triangle, as shown in fig. 6C. Alternatively, the support is provided at the center position of the four light emitting elements 14 arranged in a rectangular shape, as shown by D in fig. 6. In some other embodiments, the support 13 may be any combination of two or more of the four arrangements described above.
It will be appreciated that the support 13 of the light emitting element region 17 is determined by the position of the light emitting element 14. The arrangement of the supporting members 13 in the non-light emitting element region 16 may be set according to the distribution situation and the stress situation of the light emitting elements 14. In a specific embodiment, the arrangement mode of the support columns comprises any one or any combination of a rice-shaped arrangement, a cross-shaped arrangement, a bow-shaped arrangement, an X-shaped arrangement and a hexagonal arrangement.
In a specific application scenario, if the local pressure mode is air pressure, the supporting member 13 is disposed in the non-light emitting device region 16. It can be understood that when the present pressure is performed in an air pressure manner, the air flow direction is the direction vertical to the substrate, the buffer layer 20 located in the non-light-emitting element region 16 is vertically oriented to the substrate at the edge of the non-light-emitting element region 16, and at the same time, the buffer layer 20 of the light-emitting element region 17 is pulled, so that the buffer layer 20 of the light-emitting element region 17 will not deform or adhere to the bonding layer during the air pressure process.
In another application scenario, if the density of the light emitting element 14 is smaller than the preset value; and/or the light-emitting elements 14 are unevenly arranged, for example, when part of the light-emitting elements 14 are absent or the light-emitting elements 14 are unevenly arranged, the supporting members 13 are arranged between the light-emitting elements 14 to support the buffer layer 20 in the present pressing process, so that the buffer layer 20 is prevented from deforming or adhering to the bonding layer in the light-emitting element region 17 in the present pressing process.
In yet another scenario, if the density of the light emitting elements 14 is less than the predetermined value and/or the light emitting elements 14 are unevenly arranged, and the buffer layer 20 at least partially coincides with the projection of the non-light emitting element region 16 on the substrate, the support 13 is disposed between the non-light emitting element region 16 and the light emitting elements 14. That is, when the light emitting elements 14 satisfy at least one of the two conditions of the density being less than the preset value and the arrangement being uneven, and simultaneously satisfy at least partial coincidence of the projection of the buffer layer 20 and the non-light emitting element region 16 on the substrate, the support 13 is disposed both in the non-light emitting element region 16 and between the light emitting elements 14. For example, if the projections of the buffer layer 20 and the non-light-emitting element region 16 on the substrate are at least partially overlapped, and the arrangement between the light-emitting elements 14 is uneven (some light-emitting elements 14 are absent, and the gaps between the light-emitting elements 14 are large), or if the projections of the buffer layer 20 and the non-light-emitting element region 16 on the substrate are at least partially overlapped, and the density between the light-emitting elements 14 is smaller than a predetermined value, the supporting member 13 is disposed between the non-light-emitting element region 16 and the light-emitting elements 14.
It should be noted that, when the supporting members 13 are disposed in the non-light emitting element region 16, in order to make the stress of the buffer layer 20 uniform, and considering the size of the non-light emitting element region 16, the number of the supporting members 13 is generally 2 to 8, and the distance between the plurality of supporting members 13 is 20 to 200 micrometers. Specifically, the greater the number of support members 13, the smaller the distance between the plurality of members. For example, when the number of the supports 13 is 2, the distance between the two supports 13 is 200 micrometers; when the number of the supporting pieces 13 is 8, the distance between each two supporting pieces 13 is 20 μm. In a preferred embodiment, the distance between the supporting members 13 is the same as the distance between the light emitting elements 14, which is advantageous for uniform stress of the whole buffer layer 20.
When the supporting member 13 is disposed in the light emitting element region 17 and/or the non-light emitting element region 16, the height of the supporting member 13 may be slightly higher than the height of the light emitting element 14, or may be slightly lower than the height of the light emitting element 14, or the height of the supporting member 13 is the same as the height of the light emitting element 14, so as to facilitate the uniform stress of the buffer layer 20. Preferably, the side surface of the support 13 facing away from the back plate is flush with the side surface of the light emitting element 14 facing away from the back plate. When the surface of the support 13 on the side far from the back plate is higher than the surface of the light emitting element 14 on the side far from the back plate, the height difference should be 2 micrometers or less, such as 1.9 micrometers, 1.5 micrometers, 1.2 micrometers, 1 micrometer, 0.5 micrometer, etc. When the support 13 is lower in the side surface away from the back plate than the light emitting element 14, the height difference should be 7 microns or less, such as 6.9 microns, 5 microns, 3.5 microns, 2 microns, etc.
In another embodiment, the support 13 may also be a monolithic structure. Fig. 7a and 7b show a schematic structural view of a fifth embodiment of the display panel of the present application, and fig. 7b shows a schematic structural view of an embodiment of the supporting member 13 in the embodiment shown in fig. 7 a. Specifically, the support member 13 includes a through-groove region 18, and the through-groove region 18 corresponds to the light emitting element region 17, so that the light emitting element region 17 is exposed from the through-groove region 18. The support 13 located in the non-light emitting element region 16 supports the buffer layer 20.
In another embodiment of the present application, as shown in fig. 8a and 8b, fig. 8a is a schematic structural diagram of a sixth embodiment of a display panel of the present application; fig. 8b is a schematic structural view of an embodiment of the supporting member 13 in the embodiment shown in fig. 8 a. Specifically, in the present embodiment, the support 13 is provided to the non-light emitting element region 16 and the light emitting element region 17. Specifically, the support 13 is provided with a plurality of through holes 19 at positions corresponding to the light emitting element regions 17, so that the light emitting elements 14 are exposed from the through holes 19.
In another embodiment, the support member 13 may be disposed only in the light emitting element region 17, and the support member 13 may be provided with a through hole corresponding to the position of the light emitting element region 17 to expose the light emitting element 14. It will be appreciated that since the non-light emitting element region 16 is not provided with the support member 13, the area of the support member 13 is the same as the area of the light emitting element region 17.
In one embodiment, the support is made of transparent material so as not to affect the light emitting effect of the light emitting element 14. Of course, the support 13 provided in the non-light emitting element region 16 may not be limited to a transparent material.
In one embodiment, to achieve a good supporting effect, a surface of the support 13 away from the back plate 11 is flush with a surface of the light emitting element 14 away from the back plate 11. It is understood that when the support 13 is of a monolithic structure, the height of the corresponding support 13 at the position where the gap of the light emitting element 14 is small may be slightly smaller than the height of the light emitting element 14.
In the display panel of the application, the supporting member 13 is arranged between the non-light-emitting element region 16 and/or the light-emitting element 14, so that the buffer layer 20 is prevented from deforming or contacting the bonding layer 12, further, the aggregation or scattering of conductive particles is prevented, the rotation or the deflection of the LEDs is prevented, and the lighting yield of the display panel is improved. In the present application, the supporting members 13 between the light emitting elements 14 are made of colorless transparent materials, such as silicon oxide, so as to avoid the supporting members 13 from affecting the transparency of the display panel and the display effect. When the supporting member 13 is disposed in the non-light-emitting element region 16, the material of the supporting member 13 may be a non-transparent material, so long as the hardness of the supporting member 13 is ensured to be greater than or equal to 5B; for example, the material of the support 13 is at least one of copper, plastic, light emitting element 14, or any combination thereof.
In one embodiment, the back plate 11 may be a TFT back plate or a CMOS back plate. The bonding layer 12 is a film material for assisting bonding, which may be a film formed by coating, and the bonding layer 12 contains conductive particles.
In one embodiment, the support 13 may be formed by vapor deposition or by a photolithography process. Specifically, the supporting member 13 may be a pattern formed by vapor deposition, which is formed by SIO or SIN, or a pattern formed by photolithography, which is formed by photoresist. It will be appreciated that the photoresist may be either positive or negative. The buffer layer 20 may be one or a combination of tetrafluoro, PI material, leveling film, etc., and the thickness of the buffer layer 20 ranges from 6 to 10um, such as 6 micrometers, 6.5 micrometers, 8 micrometers, 8.5 micrometers, 9 micrometers, 10 micrometers, etc.
In an embodiment, the width of the non-light emitting element region 16 is greater than or equal to a predetermined multiple of the gap distance of the LED, preferably, the width of the non-light emitting element region 16 is greater than or equal to 6 times the gap distance of the LED, but may be other multiple, such as 5.5 times, 7 times, etc.
Referring to fig. 9, fig. 9 is a schematic structural diagram of a seventh embodiment of the display panel according to the present application, and compared with the first embodiment shown in fig. 1, the display panel according to the present application further includes: encapsulation layer 30. The encapsulation layer 30 is disposed on a side of the light emitting element 14 away from the substrate 10, thereby encapsulating the light emitting element 14. The encapsulation layer 30 may also encapsulate the support 13 at the same time.
The above embodiments shown in fig. 1 to 9 are each described by taking the conductive particles 15 in the bonding layer 12 as an example; in another embodiment, the bonding layer 12 does not have conductive particles 15, as shown in fig. 10, and fig. 10 is a schematic structural diagram of an eighth embodiment of the display panel of the present application, in this embodiment, the bonding layer 12 does not have conductive particles 15, and if the supporting member 13 is not provided, the buffer layer 20 is deformed or adhered to the bonding layer 12 during the pressing process, so that the light emitting element 14 rotates or deviates, thereby reducing the lighting yield of the display panel. In the present embodiment, the supporting member 13 is disposed in the non-light-emitting element region 16, and the supporting member 13 is disposed between the light-emitting elements 14 with larger gaps or without LEDs, so that the buffer layer 20 is prevented from being deformed or adhered to the bonding layer 12 during the pressing process, and the rotation or offset of the light-emitting elements 14 is prevented, thereby the lighting yield of the display panel is improved. The structure, shape, arrangement, and fitting manner with the back plate of the supporting member 13 in the first to seventh embodiments of the present application are also applicable to this embodiment.
Referring to fig. 11, fig. 11 is a flow chart of an embodiment of a method for manufacturing a display panel according to the present application, which specifically includes:
step S101: a substrate is provided.
Specifically, the substrate includes a light emitting element region and a non-light emitting element region, the non-light emitting element region being located outside the light emitting element region, for example, the non-light emitting element region surrounding the light emitting element region.
Step S102: the support member is provided in the non-light emitting element region and/or the light emitting element region.
In one embodiment, the substrate includes a back plate and a bonding layer, wherein the back plate is defined with a light emitting element region and a non-light emitting element region. The bonding layer is positioned on one surface of the backboard, and the supporting piece grows or is arranged on the surface of the bonding layer; or the support is grown or disposed on the surface of the back plate and through the bonding layer.
Specifically, the step of providing the support member in the non-light emitting element region and/or the light emitting element region includes: arranging a supporting piece on the surface of the bonding layer; or a supporting piece is arranged on the surface of the backboard and penetrates through the bonding layer. It will be appreciated that when the support is provided on the surface of the bonding layer, the back plate is provided first, the bonding layer is provided on the back plate, and then the support is provided on the bonding layer. When the support piece is arranged on the surface of the backboard and penetrates through the bonding layer, the substrate is arranged first, the support piece is arranged on the substrate, and then the bonding layer is arranged.
It should be noted that the supporting member of the non-light-emitting element region may be a column-shaped supporting column, and the arrangement manner of the supporting column includes any one or any combination of a rice-shaped arrangement, a cross-shaped arrangement, a bow-shaped arrangement, an X-shaped arrangement, and a hexagonal arrangement. The support columns of the light-emitting element area are determined according to the positions of the light-emitting elements, and specifically, the support columns of the light-emitting element area are staggered with the positions of the light-emitting elements. In one embodiment, the support posts are disposed between two light emitting elements 14 arranged laterally, as shown in fig. 6 a (black is the support post, and white is the light emitting element 14). Alternatively, the support column is disposed between two light emitting elements 14 arranged longitudinally, as shown in fig. 6B. Alternatively, the support column is provided at the center position of three light emitting elements 14 arranged in a triangle, as shown in fig. 6C. Alternatively, the support column is provided at the center position of four light emitting elements 14 arranged in a rectangular shape, as shown in fig. 6D. In some other embodiments, the support 13 may be any combination of two or more of the four arrangements described above. In an embodiment, the support may be any one or any combination of columnar, spherical, stepped. The cross section of the supporting piece is any one or any combination of rectangle, trapezoid, triangle, circle and polygon (such as pentagon and hexagon).
In an embodiment, the supporting member is a whole layer structure, and when the supporting member is disposed, a glue layer may be disposed in the non-light-emitting element region and/or the light-emitting element region; a through groove area is arranged at the position of the glue layer corresponding to the light-emitting element area; or a through hole is arranged at the position of the glue layer corresponding to the light-emitting element. Specifically, if only the non-light-emitting element region needs to be provided with the support, depositing a glue layer, and arranging a through groove at a position corresponding to the light-emitting element region by etching or the like, so as to expose the position of the light-emitting element region. If only the light-emitting element area is provided with the supporting piece, depositing a glue layer on the light-emitting element area, and arranging a through hole at a position corresponding to the light-emitting element by etching and the like so as to expose the light-emitting element. If the support is arranged in both the light-emitting element area and the non-light-emitting element area, depositing a glue layer, and etching the glue layer at the position of the light-emitting element in the light-emitting element area to expose the light-emitting element. The positions of the light emitting elements with large gaps or missing light emitting elements need to be supported, and the glue layer at the positions with small gaps can be etched away during etching, but the glue layer can also be reserved, and the method is not limited in detail. In order not to affect the transparency of the display panel, the adhesive layer may be provided as a transparent material in the present application.
In an embodiment, the surface of the support away from the back plate is flush with the surface of the light emitting element away from the back plate, i.e. the height of the support is the same as the height of the light emitting element. It should be noted that, when the support member is in a monolithic structure, the height of the support member at the position where the support member is not required may be slightly smaller than the height of the light emitting element, which is not particularly limited.
In one embodiment, the support 13 may be formed by vapor deposition or by a photolithography process. Specifically, the supporting member 13 may be a pattern formed by vapor deposition, which is formed by SIO or SIN, or a pattern formed by photolithography, which is formed by photoresist. It will be appreciated that the photoresist may be either positive or negative. The buffer layer 20 may be one or more of tetrafluoro, PI material, leveling film, etc., and the thickness of the buffer layer 20 ranges from 6 to 10um, such as 6 micrometers, 6.5 micrometers, 8 micrometers, 8.5 micrometers, 9 micrometers, 10 micrometers, etc.
In an embodiment, the width of the non-light emitting element region 16 is greater than or equal to a predetermined multiple of the gap distance of the LED, preferably, the width of the non-light emitting element region 16 is greater than or equal to 6 times the gap distance of the LED, but may be other multiple, such as 5.5 times, 7 times, etc.
Step S103: light emitting elements are provided in the light emitting element region.
Specifically, after the support member is provided, the light emitting element is provided in the light emitting element region. The light emitting element is positioned offset from the support.
Of course, the light emitting element may be arranged first, then the supporting member may be arranged, or both may be arranged at the same time, as required.
Step S104: a buffer layer is disposed on a side of the light emitting element away from the substrate.
In order to electrically connect the light emitting element and the back plate, an ACF technology is generally adopted. In the present pressing process, in order to avoid damaging the light emitting element, a buffer layer is disposed on a side of the light emitting element away from the substrate. The supporting member supports the buffer layer.
Step S105: pressure is applied to the buffer layer so that the light emitting element is electrically connected to the substrate.
Pressure is applied to the buffer layer so that the light emitting element is electrically connected to the substrate. Because the non-light-emitting element region is provided with the supporting piece, if the area of the buffer layer is larger than that of the light-emitting element region and extends to the non-light-emitting element region, the buffer layer cannot be in contact with the bonding layer under the support of the supporting piece, so that the aggregation or scattering of conductive particles in the bonding layer is avoided, the rotation or the deviation of the light-emitting element is also avoided, and the lighting yield of the display panel is improved.
In addition, the support piece is arranged between the light-emitting elements with larger gaps or at the missing positions of the light-emitting elements, and the buffer layer cannot deform or contact with the bonding layer under the support of the support piece, so that the aggregation or scattering of conductive particles in the bonding layer is avoided, the rotation or deflection of the light-emitting elements is avoided, and the lighting yield of the display panel is improved.
In order not to affect the transparency and display effect of the display panel, the support members between the light emitting elements are made of transparent materials.
Step S106: and removing the buffer layer.
After the present pressing process is completed, the light emitting element is electrically connected with the back plate. At this time, an encapsulation layer is disposed on a side of the light emitting element away from the substrate. The light emitting element is encapsulated by an encapsulation layer.
In the display panel of the application, the supporting member 13 is arranged between the non-luminous element region 16 and/or the luminous element 14, so that the buffer layer 20 of the non-luminous element region 16 is prevented from deforming or contacting the bonding layer 12, the aggregation or scattering of conductive particles is prevented, the rotation or the deflection of the LEDs is prevented, and the lighting yield of the display panel is improved. In the application, the supporting pieces 13 between the light emitting elements 14 or at the missing parts of the light emitting elements 14 are made of colorless transparent materials, so that the supporting pieces 13 are prevented from influencing the transparency of the display panel and the display effect.
The foregoing is only the embodiments of the present application, and therefore, the patent scope of the application is not limited thereto, and all equivalent structures or equivalent processes using the descriptions of the present application and the accompanying drawings, or direct or indirect application in other related technical fields, are included in the scope of the application.
Claims (13)
1. A display panel, comprising a substrate and a support member;
the substrate includes a light emitting element region and a non-light emitting element region;
the support is arranged in the non-light-emitting element area; or alternatively, the first and second heat exchangers may be,
the support is arranged between the light emitting elements of the light emitting element region; or alternatively, the first and second heat exchangers may be,
the support is disposed between the non-light emitting element region and the light emitting elements of the light emitting element region.
2. The display panel according to claim 1, wherein the support extends at least partially in a vertical direction for supporting a buffer layer for protecting the light emitting element at the time of lamination.
3. The display panel of claim 1, wherein the substrate comprises:
a back plate;
a bonding layer, which is positioned on one surface of the back plate, which is close to the light-emitting element; the support member is grown or arranged on the surface of the bonding layer, and/or the support member is grown or arranged on the surface of the backboard and penetrates through the bonding layer.
4. The display panel according to claim 1, wherein the arrangement of the supporting members includes any one or any combination of a rice-shaped arrangement, a cross-shaped arrangement, a bow-shaped arrangement, an X-shaped arrangement, a hexagonal arrangement;
the support piece is arranged between the two light-emitting elements which are transversely arranged; and/or the number of the groups of groups,
the support piece is arranged between the two light-emitting elements which are longitudinally arranged; and/or the number of the groups of groups,
the supporting piece is arranged at the center positions of the three light-emitting elements which are arranged in a triangular mode; and/or the number of the groups of groups,
the support piece is arranged at the center of the four light-emitting elements which are arranged in a rectangular mode.
5. The display panel according to claim 1, wherein the support is any one or any combination of a column, a sphere, a step, a virtual line; or alternatively, the first and second heat exchangers may be,
the cross section of the support piece is any one or any combination of rectangle, trapezoid, triangle, circle and polygon.
6. The display panel according to claim 1 or 2, wherein the support member is a monolithic structure,
the support comprises a through groove region, and the through groove region corresponds to the light-emitting element region, so that the light-emitting element region is exposed from the through groove region; and/or the number of the groups of groups,
a plurality of through holes are formed in the support piece at positions corresponding to the light-emitting element areas, so that the light-emitting elements are exposed from the through holes;
preferably, the support is a transparent material.
7. The display panel according to claim 1, wherein a side surface of the support away from the back plate is higher than a side surface of the light emitting element away from the back plate, and a height difference is less than or equal to 2 μm; and/or
A side surface of the support member away from the back plate is lower than a side surface of the light-emitting element away from the back plate, and a height difference is less than 7 micrometers; and/or
The side surface of the support piece, which is far away from the back plate, is flush with the side surface of the light-emitting element, which is far away from the back plate.
8. The display panel of claim 1, further comprising:
and the packaging layer is arranged on one side of the light-emitting element far away from the substrate, so that the light-emitting element is packaged.
9. The display panel according to any one of claims 1 to 8, wherein,
the support is arranged in the non-light-emitting element region when the buffer layer is at least partially overlapped with the projection of the non-light-emitting element region on the substrate;
when the density of the light-emitting elements is smaller than a preset value and/or the arrangement of the light-emitting elements is uneven, the supporting piece is arranged between the light-emitting elements;
when the density of the light-emitting elements is smaller than a preset value and/or the arrangement of the light-emitting elements is uneven, and the projection of the buffer layer and the non-light-emitting element area on the substrate is at least partially overlapped, the supporting piece is arranged in the non-light-emitting element area and between the light-emitting elements.
10. The display panel according to any one of claims 1 to 8, wherein the supporting members are provided in the non-light emitting element region, and a distance between the supporting members is: 20-200 micrometers;
preferably, the distance between the supporting members is the same as the distance between the light emitting elements.
11. The display panel according to any one of claims 1 to 8, wherein the support is a transparent material when the support is disposed between the light emitting elements; preferably, the material of the support column is silicon oxide; and/or the number of the groups of groups,
the support piece is arranged in the non-luminous element area, and the hardness of the support piece is greater than or equal to 5B; preferably, the material of the support member is at least one of copper, plastic and a light-emitting element or any combination of the copper, plastic and the light-emitting element.
12. A method for manufacturing a display panel, comprising:
providing a substrate, wherein the substrate comprises a light-emitting element area and a non-light-emitting element area, and the non-light-emitting element area is positioned outside the light-emitting element area;
providing a support at the non-light emitting element region and/or the light emitting element region;
arranging light-emitting elements in the light-emitting element areas, wherein the positions of the light-emitting elements are staggered from the positions of the supporting pieces;
a buffer layer is arranged on one side, far away from the substrate, of the light-emitting element, and the supporting piece is used for supporting the buffer layer;
applying pressure to the buffer layer so that the light emitting element is electrically connected to the substrate;
and removing the buffer layer.
13. The method of claim 12, wherein the substrate comprises a back plate and a bonding layer, the bonding layer being located on a surface of the back plate;
the step of providing a support in the non-light emitting element region and/or the light emitting element region includes:
growing or disposing the support on the bonding layer surface; or (b)
Growing or arranging the supporting piece on the surface of the backboard, enabling the supporting piece to penetrate through the bonding layer,
preferably, the step of providing a support in the non-light emitting element region and/or the light emitting element region includes:
arranging a glue layer in the non-light-emitting element area and/or the light-emitting element area;
a through groove area is arranged at the position of the adhesive layer corresponding to the light-emitting element area; or (b)
And a through hole is arranged at the position of the adhesive layer corresponding to the light-emitting element.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210476327.0A CN117012783A (en) | 2022-04-29 | 2022-04-29 | Display panel and preparation method thereof |
| PCT/CN2023/088772 WO2023207661A1 (en) | 2022-04-29 | 2023-04-17 | Display panel, and preparation method for display panel |
| TW112114821A TW202339250A (en) | 2022-04-29 | 2023-04-20 | Display panel and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210476327.0A CN117012783A (en) | 2022-04-29 | 2022-04-29 | Display panel and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN117012783A true CN117012783A (en) | 2023-11-07 |
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|---|---|---|---|
| CN202210476327.0A Pending CN117012783A (en) | 2022-04-29 | 2022-04-29 | Display panel and preparation method thereof |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN117012783A (en) |
| TW (1) | TW202339250A (en) |
| WO (1) | WO2023207661A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003149649A (en) * | 2001-11-15 | 2003-05-21 | Sony Corp | Spacer, image display device, method for keeping interval, method for transferring element, and method for arraying element |
| CN111863832B (en) * | 2019-04-30 | 2024-04-09 | 成都辰显光电有限公司 | Display panel, manufacturing method thereof and electronic equipment |
| JP7434037B2 (en) * | 2020-04-03 | 2024-02-20 | 株式会社ジャパンディスプレイ | Mounting method of light emitting element and display device |
| CN112114703B (en) * | 2020-09-10 | 2022-10-04 | 厦门天马微电子有限公司 | Display panel and display device |
| JP2022158612A (en) * | 2021-04-02 | 2022-10-17 | 株式会社ジャパンディスプレイ | Mount method for electronic component, display device, and circuit board |
| CN216354207U (en) * | 2021-09-27 | 2022-04-19 | 常州明耀半导体科技有限公司 | Light-emitting semiconductor transparent display panel |
-
2022
- 2022-04-29 CN CN202210476327.0A patent/CN117012783A/en active Pending
-
2023
- 2023-04-17 WO PCT/CN2023/088772 patent/WO2023207661A1/en unknown
- 2023-04-20 TW TW112114821A patent/TW202339250A/en unknown
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| TW202339250A (en) | 2023-10-01 |
| WO2023207661A1 (en) | 2023-11-02 |
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