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CN216054768U - Mounting device for electronic component - Google Patents

Mounting device for electronic component Download PDF

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Publication number
CN216054768U
CN216054768U CN202122599637.5U CN202122599637U CN216054768U CN 216054768 U CN216054768 U CN 216054768U CN 202122599637 U CN202122599637 U CN 202122599637U CN 216054768 U CN216054768 U CN 216054768U
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CN
China
Prior art keywords
jig
pressing jig
pressing
circuit board
workpiece
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Active
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CN202122599637.5U
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Chinese (zh)
Inventor
武政健一
山田一幸
浅田圭介
矶野大树
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Japan Display Inc
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Japan Display Inc
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention provides a mounting device for electronic components, which comprises: a table having a support surface for supporting a workpiece; and a pressing jig opposed to the table, the pressing jig being configured to press a part of the workpiece between the pressing jig and the table, and having a window portion opposed to the support surface and transmitting the laser light.

Description

Mounting device for electronic component
Cross Reference to Related Applications
This application is based on and claims priority from Japanese patent application No. 2020-180580 filed on 28.10.2020, which is hereby incorporated by reference in its entirety.
Technical Field
Embodiments of the present invention relate to a mounting device for electronic components.
Background
In general, an LED display device using a Light Emitting Diode (LED) as a self-Light Emitting element is known, but in recent years, a display device using a minute Diode element called a micro LED has been developed as a more miniaturized display device. Unlike conventional liquid crystal display devices and organic EL display devices, the micro LED display device is focused as a next-generation display device because a plurality of chip-shaped micro LEDs are mounted and formed in a display region, and thus high definition and large size can be easily achieved at the same time.
As a method of mounting a plurality of chip-shaped micro LEDs in a display region, a method using Laser Lift Off (LLO) is known. A plurality of micro LEDs are formed on a sapphire substrate before being mounted on a display area. However, when the micro LED is peeled from the sapphire substrate by the LLO, if the sapphire substrate is warped, the laser light may not be irradiated to a desired position. In order to eliminate this problem, a method of pressing the entire surface of the sapphire substrate to flatten the warp of the sapphire substrate is known.
SUMMERY OF THE UTILITY MODEL
According to the present embodiment, there is provided an electronic component mounting apparatus including: a table having a support surface for supporting a workpiece; and a pressing jig facing the table, the pressing jig being configured to press a part of the workpiece between the pressing jig and the table, and having a window portion facing the support surface and transmitting laser light.
According to the present embodiment, there is provided an electronic component mounting apparatus including: a first pressing jig; and a second pressing jig facing the first pressing jig, wherein the first pressing jig is configured to clamp a part of the workpiece between the first pressing jig and the second pressing jig, and has a window portion facing the second pressing jig and transmitting laser light.
The electronic component mounting apparatus further includes a driving unit that moves the pressing jig in a horizontal direction with respect to the support surface and in a vertical direction with respect to the support surface.
The electronic component mounting apparatus further includes a fixing jig that fixes the workpiece between the fixing jig and the table by pressing a peripheral edge portion of the workpiece, and the pressing jig is movable inside the fixing jig.
According to the present embodiment, there is provided an electronic component mounting method in which a first pressing jig is disposed on a workpiece formed by stacking a circuit board and a wafer including an electronic component, a part of the wafer is pressed toward the circuit board side by the first pressing jig, a first laser beam is irradiated to the workpiece through a window portion of the first pressing jig, the light emitting element is bonded to the circuit board, a second laser beam having a wavelength band different from that of the first laser beam is irradiated to the workpiece through the window portion, the electronic component is peeled from the wafer, and the first pressing jig is separated from the workpiece.
The electronic component mounting apparatus further includes a driving unit that moves the first pressing jig and the second pressing jig in the horizontal direction and the vertical direction.
The electronic component mounting apparatus further includes a first fixing jig and a second fixing jig opposed to the first fixing jig, the first fixing jig and the second fixing jig clamp a peripheral portion of the workpiece to fix the workpiece, the first pressing jig is movable inside the first fixing jig, and the second pressing jig is movable inside the second fixing jig.
The electronic component mounting apparatus further includes a laser device including a first laser light source that emits a first laser light and a second laser light source that emits a second laser light, and a wavelength band of the first laser light is different from a wavelength band of the second laser light.
The present embodiment can provide an electronic component mounting apparatus that can mount an electronic component on a circuit board while suppressing the influence of warpage of a wafer and the circuit board.
Drawings
Fig. 1 is a perspective view schematically showing the configuration of a display device.
Fig. 2 is a sectional view schematically showing the configuration of the circuit board.
Fig. 3 is a cross-sectional view schematically showing the structure of a wafer.
Fig. 4 is a sectional view schematically showing the structure of the mounting device of the first embodiment.
Fig. 5 is a diagram showing a first step of the mounting method according to the first embodiment.
Fig. 6 is a diagram showing a second step of the mounting method according to the first embodiment.
Fig. 7 is a diagram showing a third step of the mounting method according to the first embodiment.
Fig. 8 is a diagram showing a fourth process of the mounting method according to the first embodiment.
Fig. 9 is a diagram showing a fifth step of the mounting method according to the first embodiment.
Fig. 10 is a diagram illustrating a sixth step of the mounting method according to the first embodiment.
Fig. 11 is a plan view showing a fixing clip according to the first embodiment.
Fig. 12 is a plan view showing a modification of the fixing clip of the first embodiment.
Fig. 13 is a sectional view schematically showing the structure of the mounting device of the second embodiment.
Fig. 14 is a diagram showing a first step of the mounting method according to the second embodiment.
Fig. 15 is a diagram showing a second step of the mounting method according to the second embodiment.
Fig. 16 is a diagram showing a third step of the mounting method according to the second embodiment.
Fig. 17 is a diagram showing a fourth process of the mounting method according to the second embodiment.
Fig. 18 is a diagram showing a fifth step of the mounting method according to the second embodiment.
Fig. 19 is a diagram showing a sixth step of the mounting method according to the second embodiment.
Fig. 20 is a plan view showing a fixing clip according to a second embodiment.
Fig. 21 is a plan view showing a modification of the fixing clip according to the second embodiment.
Fig. 22 is a sectional view schematically showing the structure of the mounting device of the third embodiment.
Fig. 23 is a plan view showing an adhesive layer of a workpiece according to a third embodiment.
Detailed Description
The present embodiment will be described below with reference to the drawings. The disclosure is merely an example, and it is needless to say that an appropriate modification for keeping the gist of the utility model can be conceived by those skilled in the art, and the utility model is included in the scope of the utility model. In addition, the drawings schematically show the width, thickness, shape, and the like of each part as compared with an actual form in order to make the description clearer, but the drawings are only an example and do not limit the explanation of the present invention. In the present specification and the drawings, the same reference numerals are given to the components that exhibit the same or similar functions to the components described in the figures that have already appeared, and the overlapping detailed description may be omitted as appropriate.
Fig. 1 is a perspective view schematically showing the configuration of the display device DSP.
In the present specification, the first direction X, the second direction Y, and the third direction Z are defined as illustrated in the drawings. The second direction Y is a direction perpendicular to the first direction X, and the third direction Z is a direction perpendicular to the first direction X and the second direction Y. The first direction X intersects the second direction Y perpendicularly, but may intersect at an angle other than perpendicular. In the present specification, a direction toward the tip of an arrow indicating the third direction Z is referred to as "up", and a direction from the tip of the arrow toward the opposite direction is referred to as "down". Further, it is assumed that the display device DSP and the manufacturing device are observed at the front end side of the arrow indicating the third direction Z, and the observation from the observation position to the X-Y plane defined by the first direction X and the second direction Y is referred to as a plan view.
In this specification, a mounting apparatus of an electronic component and a mounting method of an electronic component will be described, and an LED chip (light emitting element) used in a display device DSP will be described as an example of an electronic component.
Hereinafter, in this specification, a case where the display device DSP is a micro LED display device using micro LEDs as self-light emitting elements will be described.
As shown in fig. 1, the display device DSP includes a display panel PNL, printed circuit boards PCB1 and PCB2, and a driving IC chip 2.
The display panel PNL has a rectangular shape in one example. In the illustrated example, the short side EX of the display panel PNL is parallel to the first direction X, and the long side EY of the display panel PNL is parallel to the second direction Y. The third direction Z corresponds to the thickness direction of the display panel PNL. The main surface of the display panel PNL is parallel to an X-Y plane defined by the first direction X and the second direction Y. The display panel PNL has a display area DA and a non-display area NDA outside the display area DA. In the illustrated example, the non-display area NDA surrounds the display area DA. The display panel PNL has a terminal area MT in the non-display area NDA. The terminal area MT is provided along the short side EX of the display panel PNL and includes terminals for electrically connecting the display panel PNL to an external device or the like.
The display area DA is an area for displaying an image, and includes a plurality of pixels PX arranged in a matrix, for example. The pixel PX includes a light emitting element (micro LED), a switching element for driving the light emitting element, and the like.
The PCB1 is mounted on the terminal area MT and electrically connected to the display panel PNL. The PCB1 is, for example, a flexible PCB. The PCB2 is connected to the PCB1, for example, below the PCB 1. The printed circuit substrate PCB2 is, for example, a rigid printed circuit substrate.
The driver IC chip 2 is mounted on the printed circuit board PCB 1. The driver IC chip 2 may be mounted under the printed circuit board PCB1, may be mounted in the non-display area NDA of the display panel PNL, or may be mounted on the printed circuit board PCB 2. The driver IC chip 2 is connected to a control board, not shown, via the printed circuit board PCB1 and the PCB2, for example. The drive IC chip 2 performs control of driving the plurality of pixels PX and displaying an image on the display panel PNL based on a video signal output from the control substrate.
A method of mounting the light emitting element LED on the circuit board CB serving as the base substrate of the display panel PNL will be described below. More specifically, a method of mounting the light-emitting element LED on the circuit board CB shown in fig. 2 by peeling the light-emitting element LED from the wafer WF shown in fig. 3 by laser lift-off (LLO) will be described.
First, the structure of the circuit board CB and the wafer WF will be described with reference to fig. 2 and 3.
Fig. 2 is a sectional view schematically showing the structure of the circuit board CB.
The circuit board CB includes an insulating substrate 10, a plurality of terminal portions 11, and a plurality of bonding members 12.
The insulating substrate 10 has a first main surface 10A and a second main surface 10B opposite to the first main surface 10A. Although not shown, a switching element for driving the light emitting element LED and various wiring patterns are formed on the insulating substrate 10.
The plurality of terminal portions 11 are formed on the first main surface 10A of the insulating substrate 10. The number of terminal portions 11 is the same as the number of terminal portions 22 of the light emitting element LED mounted on the display device DSP, for example. The terminal portion 11 is formed of a metal material such as Al (aluminum), Ti (titanium), Mo (molybdenum), W (tungsten), or a laminate of these metal materials.
The plurality of bonding members 12 are respectively disposed on the terminal portions 11. The bonding member 12 is a member for bonding the terminal portion 11 to a terminal portion 22 of a light emitting element LED described later. As will be described in detail later, the joining member 12 is formed of a metal material that is heated and melted by laser ablation when irradiated with laser light in a wavelength band of 400nm to 3000nm, for example, a metal material such as Sn (tin) or Ag (silver). The joint member 12 may also be referred to as a brazed member. In the illustrated example, the bonding member 12 is provided on the terminal portion 11, but may be provided on a terminal portion 22 of a light emitting element LED described later.
Fig. 3 is a sectional view schematically showing the structure of the wafer WF.
The wafer WF includes a sapphire substrate 20 and a plurality of light emitting elements LED. The light emitting element LED includes a light emitting layer 21 and a terminal portion 22.
The sapphire substrate 20 has a first main surface 20A and a second main surface 20B opposite to the first main surface 20A. The plurality of light emitting elements LEDs are arranged on the first main surface 20A of the sapphire substrate 20. The plurality of light emitting elements LED include light emitting elements LED having emission colors of red (R), green (G), and blue (B).
The light-emitting layer 21 is fixed to the first main surface 20A of the sapphire substrate 20 via a release layer not shown. The light emitting layer 21 emits R, G, B light. The terminal portion 22 is disposed on the light-emitting layer 21. The terminal portions 22 are joined to the terminal portions 11 by the joining member 12 disposed on the circuit board CB side, and are electrically connected to the terminal portions 11. The terminal portion 22 corresponds to an anode terminal or a cathode terminal of the light emitting element LED. The terminal portions 22 may also be referred to as bumps.
Hereinafter, in the present specification, a member in which the circuit board CB and the wafer WF are stacked is referred to as a workpiece.
[ first embodiment ]
Next, the structure of the mounting device 100 according to the first embodiment will be described with reference to fig. 4. The mounting apparatus 100 is an apparatus for mounting the light emitting elements LED on the wafer WF on the circuit board CB.
Fig. 4 is a sectional view schematically showing the structure of the mounting device 100 according to the first embodiment.
The mounting apparatus 100 includes a table ST on which a workpiece is placed, a pressing jig 31, a fixing jig 41, a laser device 60, and a driving unit DR.
The table ST has a support surface STA that supports the workpiece.
The pressing jig 31 is opposed to the table ST in the third direction Z. The pressing jig 31 is configured to press a part of the workpiece between the pressing jig and the table ST. The pressing jig 31 has a window portion 31A facing the support surface STA in the third direction Z. The window 31A is made of, for example, a transparent material and transmits laser light. The window 31A may not be formed, or a part of the window 31A may be opened.
The fixing jig 41 is configured to press the peripheral edge portion of the workpiece and fix the workpiece to the table ST. The fixing jig 41 has an opening OP1 at a position overlapping the table ST.
The laser device 60 includes a first laser light source LS1, a second laser light source LS2, an optical system OS, and a laser head 60A. The first laser light source LS1 emits first laser light LZ 1. The second laser light source LS2 emits second laser light LZ2 (see fig. 8 and 9). The optical system OS includes, for example, a mirror or the like for adjusting the optical paths of the first laser beam LZ1 and the second laser beam LZ 2. The laser device 60 emits a first laser beam LZ1 and a second laser beam LZ2 from the laser head 60A.
The driving unit DR includes a first driving unit DR1 for controlling the driving of the fixing jig 41, a second driving unit DR2 for controlling the driving of the pressing jig 31, and a third driving unit DR3 for controlling the driving of the laser device 60. The first driving portion DR1 moves the fixing jig 41 in the vertical direction V with respect to the support surface STA. Here, the vertical direction V is a direction parallel to the third direction Z. The second driving portion DR2 moves the pressing jig 31 in the horizontal direction H with respect to the support surface STA and in the vertical direction V with respect to the support surface STA. Here, the horizontal direction H is a direction parallel to an X-Y plane defined by the first direction X and the second direction Y. The movement of the pressing jig 31 in the horizontal direction H can be moved inside the fixing jig 41. In other words, the pressing jig 31 is movable at a position overlapping the opening OP1 of the fixing jig 41. The third driving unit DR3 causes the laser device 60 to emit the first laser beam LZ1 and the second laser beam LZ 2. The third driving unit DR3 moves the laser head 60A according to the movement of the pressing jig 31, for example.
Next, a mounting method of mounting the light emitting element LED on the circuit board CB using the mounting apparatus 100 of the first embodiment will be described with reference to fig. 5 to 10.
Fig. 5 is a diagram showing a first step of the mounting method according to the first embodiment. The first step represents a step of placing the workpiece WK on the table ST. The terminal portions 11 and the bonding members 12 of the circuit board CB and the light-emitting elements LED of the wafer WF are illustrated as simplified layers.
A workpiece WK formed by stacking the circuit board CB and the wafer WF is placed on the support surface STA of the table ST. The circuit board CB and the wafer WF are stacked such that the first main surface 10A of the insulating substrate 10 faces the first main surface 20A of the sapphire substrate 20. The second main surface 10B of the insulating substrate 10 is in contact with the support surface STA. The second main surface 20B of the sapphire substrate 20 faces the fixing jig 41. When the workpiece WK is placed on the table ST, the circuit board CB and the wafer WF are aligned.
In the present embodiment, a case is assumed where warpage occurs in at least one of the circuit board CB and the wafer WF. That is, a gap GP is locally generated between the circuit board CB and the wafer WF. In the illustrated example, the gap GP increases toward the peripheral edge CA of the workpiece WK. On the other hand, in the central portion MA of the workpiece WK, the circuit board CB is in contact with the wafer WF.
Fig. 6 is a diagram showing a second step of the mounting method according to the first embodiment. The second step is a step of fixing the workpiece WK on the table ST by the fixing jig 41.
The first driving portion DR1 moves the fixing jig 41 toward the table ST in the vertical direction V. The fixing jig 41 presses the peripheral edge CA of the workpiece WK to fix the workpiece WK to the table ST. Thus, the work WK is fixed in a state where the circuit board CB and the wafer WF are aligned. The fixing jig 41 is in contact with the second main surface 20B of the sapphire substrate 20.
By pressing the peripheral edge CA of the workpiece WK with the fixing jig 41, the gap GP between the circuit board CB and the wafer WF increases toward the central portion MA of the workpiece WK. The circuit board CB and the wafer WF are in contact with each other at the peripheral edge CA.
In the illustrated example, the pressing jig 31 is already disposed at the position overlapping the opening OP1 from the first step, but the pressing jig 31 may not be disposed at the position overlapping the opening OP1 before the workpiece WK is disposed. In this case, after the first step or the second step, the pressing jig 31 is disposed at a position overlapping the opening OP 1. That is, the pressing jig 31 is disposed above the work WK.
Fig. 7 is a diagram showing a third step of the mounting method according to the first embodiment. The third step is a step of pressing the workpiece WK toward the table ST by the pressing jig 31.
The second driving portion DR2 moves the pressing jig 31 in the vertical direction V toward the stage ST. The pressing jig 31 presses a part of the wafer WF toward the circuit board CB. That is, the pressing jig 31 locally applies pressure to the workpiece WK, and the circuit board CB is brought into close contact with the wafer WF at a position overlapping the pressing jig 31. At the position overlapping the pressing jig 31, the warp occurring in the work WK is flattened. At the position overlapping the pressing jig 31, the terminal portion 11 of the circuit board CB and the terminal portion 22 of the wafer WF are fixed in a state of overlapping in plan view. The window 31A is in contact with the second principal surface 20B of the sapphire substrate 20. A gap GP between the circuit board CB and the wafer WF is generated between the portion pressed by the pressing jig 31 and the peripheral edge CA.
Fig. 8 is a diagram showing a fourth process of the mounting method according to the first embodiment. The fourth step is a step of irradiating the workpiece WK with the first laser beam LZ 1.
The third driving unit DR3 drives the laser device 60 so that the first laser beam LZ1 is emitted from the laser torch 60A. The laser apparatus 60 irradiates the work WK with the first laser light LZ1 through the window 31A of the pressing jig 31, and bonds the light emitting element LED to the circuit board CB. That is, the joining member 12 is heated and melted by laser ablation, and the terminal portion 11 of the circuit board CB and the terminal portion 22 of the wafer WF are joined at a position overlapping the pressing jig 31. The wave band of the first laser light LZ1 is 400 nm-3000 nm.
Fig. 9 is a diagram showing a fifth step of the mounting method according to the first embodiment. The fifth step is a step of irradiating the work WK with the second laser LZ 2.
The third driving unit DR3 drives the laser device 60 so that the second laser beam LZ2 is emitted from the laser torch 60A. The laser apparatus 60 irradiates the workpiece WK with the second laser LZ2 through the window 31A of the pressing jig 31, and peels the light emitting element LED from the wafer WF. That is, a peeling layer, not shown, which fixes the light emitting element LED to the sapphire substrate 20 is sublimated by laser ablation, and the light emitting element LED is peeled from the sapphire substrate 20 at a position overlapping with the pressing jig 31. The second laser beam LZ2 has a different wavelength band from the first laser beam LZ 1. The wave band of the second laser LZ2 is 200 nm-366 nm.
Fig. 10 is a diagram illustrating a sixth step of the mounting method according to the first embodiment. The sixth step represents a step of moving the pressing jig 31.
The second driving portion DR2 moves the pressing jig 31 in the vertical direction V to separate it from the workpiece WK. That is, the pressing jig 31 moves in the vertical direction V to the side away from the table ST. By separating the pressing jig 31 from the workpiece WK, the state of warpage of the circuit board CB and the wafer WF is returned to the state shown in fig. 6. In the fifth step, the light emitting element LED is separated from the sapphire substrate 20 in the region irradiated with the second laser LZ 2. Then, the second driving portion DR2 moves the pressing jig 31 in the horizontal direction H. That is, the pressing jig 31 moves to a region where the light emitting element LED is not bonded or peeled in a region overlapping with the opening OP1 of the fixing jig 41. Then, the third to sixth steps are repeated to mount the light emitting element LED on a desired region of the circuit board CB.
The positional relationship between the workpiece WK and the pressing jig 31 may be moved relatively in the horizontal direction H, and the table ST and the fixing jig 41 may be moved while the pressing jig 31 is fixed. When the pressing jig 31 moves in the horizontal direction H, the laser head 60A may also move in accordance with the movement of the pressing jig 31.
According to the present embodiment, the circuit board CB and the wafer WF are fixed at positions overlapping the pressing jigs 31 in order to apply pressure between the pressing jigs 31 and the table ST while sandwiching the circuit board CB and the wafer WF therebetween. Therefore, even if at least one of the circuit board CB and the wafer WF is warped, the warping is flattened at the position overlapping the pressing jig 31, and the occurrence of defective bonding and positional deviation of the light emitting element LED can be suppressed. This enables the light-emitting element LED to be mounted while suppressing the influence of warpage of the work WK. In addition, compared with the method of flattening the warp by pressing the entire surface of the workpiece WK, the load required does not increase even if the size of the workpiece WK is enlarged, and the load on the workpiece WK does not increase.
Further, since the circuit board CB and the wafer WF are fixed by the fixing jig 41, positional displacement that may occur due to one side sliding or the like when pressure is applied by the pressurizing jig 31 can be suppressed.
Fig. 11 is a plan view showing a fixing jig 41 according to the first embodiment.
Fig. 11 (a) shows the fixing jig 41, the table ST, and the pressing jig 31. The fixing jig 41 has an annular shape in plan view. Therefore, the outer shape of the opening OP1 of the fixing jig 41 is circular. The table ST has a rectangular shape in plan view. The pressing jig 31 has an annular shape in plan view. The area of the pressing jig 31 is smaller than the area of the opening OP 1.
Fig. 11 (b) is a diagram in which the circuit board CB and the wafer WF are arranged in fig. 11 (a). The outline of each of the circuit board CB and the wafer WF is shown by a dotted line. The wafer WF has a circular outer shape. That is, the outer shape of the sapphire substrate 20 of the wafer WF is circular. The circuit board CB has a rectangular outer shape. That is, the insulating substrate 10 of the circuit board CB has a rectangular outer shape. In the illustrated example, the circuit board CB has an area larger than that of the wafer WF, and the circuit board CB extends outward from the outer shape of the wafer WF. Since the fixing jig 41 presses the position where the circuit board CB and the wafer WF are overlapped, the outer edge of the wafer WF having a size smaller than that of the circuit board CB can be pressed.
In the illustrated example, one wafer WF is used for one circuit board CB, but when the area of the circuit board CB corresponds to the area of a plurality of wafers WF, for example, the light-emitting elements LED are mounted while replacing the wafer WF. The direction in which the pressing jig 31 moves may be clockwise or counterclockwise, or may be a direction parallel to the first direction X or a direction parallel to the second direction Y. The planar shapes of the fixing jig 41, the table ST, the pressing jig 31, the circuit board CB, and the wafer WF are not limited to the above examples.
Fig. 12 is a plan view showing a modification of the fixing jig 41 according to the first embodiment. The configuration shown in fig. 12 is different from the configuration shown in fig. 11 in the shape of the fixing jig 41.
Fig. 12 (a) shows the fixing jig 41, the table ST, and the pressing jig 31. The fixing jig 41 has a first portion 41A, a second portion 41B, a third portion 41C, and a fourth portion 41D. The first portion 41A and the second portion 41B extend and protrude in the second direction Y. The third portion 41C and the fourth portion 41D extend and protrude in the first direction X. The first portion 41A, the second portion 41B, the third portion 41C, and the fourth portion 41D are rectangular in plan view.
Fig. 12 (b) is a diagram in which the circuit board CB and the wafer WF are arranged in fig. 12 (a). The outline of each of the circuit board CB and the wafer WF is shown by a dotted line. In the illustrated example, the area of the wafer WF is larger than the area of the circuit board CB, and the wafer WF extends outward from the outer shape of the circuit board CB. Since the fixing jig 41 presses the position where the circuit board CB and the wafer WF are overlapped, the outer edge of the circuit board CB having a size smaller than that of the wafer WF can be pressed.
[ second embodiment ]
Next, the structure of the mounting device 100 according to the second embodiment will be described with reference to fig. 13. The mounting device 100 of the second embodiment differs from the mounting device 100 of the first embodiment in that a pressing jig 32 is provided in addition to the pressing jig 31. The mounting device 100 according to the second embodiment does not include the table ST, and includes the fixing jig 42 in addition to the fixing jig 41.
Fig. 13 is a sectional view schematically showing the structure of the mounting device 100 according to the second embodiment.
The mounting apparatus 100 includes pressing jigs 31 and 32, fixing jigs 41 and 42, a laser device 60, and a driving unit DR. The configuration of the laser device 60 is the same as that of the laser device 60 described in the first embodiment, and therefore, the description thereof is omitted.
The pressing jigs 31 and 32 face each other in the third direction Z. The pressing jig 31 is configured to clamp a part of the workpiece between the pressing jig 32 and the pressing jig. The pressing jig 31 has a window portion 31A facing the pressing jig 32 in the third direction Z. The window 31A is made of, for example, a transparent material and transmits laser light. The window 31A may not be formed, or a part of the window 31A may be opened.
The fixing jigs 41 and 42 face each other in the third direction Z. The fixing jigs 41 and 42 are configured to clamp the peripheral edge portion of the workpiece and fix the workpiece. The fixing clip 41 has an opening OP1, and the fixing clip 42 has an opening OP2 in an area overlapping with the opening OP 1.
The driving unit DR includes a first driving unit DR1 for controlling the driving of the fixing jig 41, a second driving unit DR2 for controlling the driving of the pressing jigs 31 and 32, and a third driving unit DR3 for controlling the driving of the laser device 60. The first driving portion DR1 moves the fixing jig 41 in the vertical direction V. The second driving portion DR2 moves the pressing jigs 31 and 32 in the horizontal direction H and the vertical direction V. The movement of the pressing jig 31 in the horizontal direction H can be moved inside the fixing jig 41. In other words, the pressing jig 31 is movable at a position overlapping the opening OP1 of the fixing jig 41. The movement of the pressing jig 32 in the horizontal direction H can be moved inside the fixing jig 42. In other words, the pressing jig 32 can move at a position overlapping the opening OP2 of the fixing jig 42. The third driving unit DR3 causes the laser device 60 to emit the first laser beam and the second laser beam. The third driving unit DR3 moves the laser torch 60A according to the movement of the pressing jigs 31 and 32, for example.
Next, a mounting method of mounting the light emitting element LED on the circuit board CB using the mounting apparatus 100 of the second embodiment will be described with reference to fig. 14 to 19.
Fig. 14 is a diagram showing a first step of the mounting method according to the second embodiment. The first step is a step of placing the workpiece WK on the fixing jig 42.
A workpiece WK formed by stacking the circuit board CB and the wafer WF is placed on the fixing jig 42. The circuit board CB and the wafer WF are stacked such that the first main surface 10A of the insulating substrate 10 faces the first main surface 20A of the sapphire substrate 20. The second main surface 10B of the insulating substrate 10 is in contact with the fixing jig 42. The second main surface 20B of the sapphire substrate 20 faces the fixing jig 41. When the workpiece WK is placed on the fixing jig 42, the circuit board CB and the wafer WF are aligned.
In the present embodiment, a case is assumed where warpage occurs in at least one of the circuit board CB and the wafer WF. That is, a gap GP is locally generated between the circuit board CB and the wafer WF. In the illustrated example, the gap GP increases toward the peripheral edge CA of the workpiece WK. On the other hand, in the central portion MA of the workpiece WK, the circuit board CB is in contact with the wafer WF.
Fig. 15 is a diagram showing a second step of the mounting method according to the second embodiment. The second step is a step of fixing the workpiece WK by the fixing jigs 41 and 42.
The first driving portion DR1 moves the fixing jig 41 toward the fixing jig 42 in the vertical direction V. The fixing jig 41 and the fixing jig 42 clamp the peripheral edge CA of the workpiece WK to fix the workpiece WK. Thus, the work WK is fixed in a state where the circuit board CB and the wafer WF are aligned. The fixing jig 41 is in contact with the second main surface 20B of the sapphire substrate 20.
By pressing the peripheral edge CA of the workpiece WK with the fixing jigs 41 and 42, the gap GP between the circuit board CB and the wafer WF increases toward the central portion MA of the workpiece WK. The circuit board CB and the wafer WF are in contact with each other at the peripheral edge CA.
In the illustrated example, the pressing jigs 31 and 32 are disposed at positions overlapping the openings OP1 and OP2 from the beginning of the first step, but the pressing jigs 31 and 32 may not be disposed at positions overlapping the openings OP1 and OP2 before the workpiece WK is disposed. In this case, after the first step or the second step, the pressing jigs 31 and 32 are disposed at positions overlapping the openings OP1 and OP 2. That is, the pressing jig 31 is disposed above the work WK, and the pressing jig 32 is disposed below the work WK.
Fig. 16 is a diagram showing a third step of the mounting method according to the second embodiment. The third step is a step of pressing the workpiece WK by the pressing jigs 31 and 32.
The second driving portion DR2 moves the pressing jig 31 toward the pressing jig 32 in the vertical direction V, and moves the pressing jig 32 toward the pressing jig 31 in the vertical direction V. The pressing jig 31 presses a part of the wafer WF toward the circuit board CB, and the pressing jig 32 presses a part of the circuit board CB toward the wafer WF. The pressing jigs 31 and 32 clamp a part of the work WK therebetween. That is, the pressing jigs 31 and 32 apply pressure locally to the workpiece WK, and the circuit board CB is brought into close contact with the wafer WF at a position overlapping the pressing jigs 31 and 32. The warping occurring in the work WK is flattened at the position overlapping the pressing jigs 31 and 32. Then, the terminal portions 11 of the circuit board CB and the terminal portions 22 of the wafer WF are fixed in a state of overlapping in plan view at positions overlapping the pressing jigs 31 and 32. The window 31A is in contact with the second principal surface 20B of the sapphire substrate 20. The pressing jig 32 is in contact with the second main surface 10B of the insulating substrate 10. A gap GP between the circuit board CB and the wafer WF is generated between the portion pressed by the pressing jigs 31 and 32 and the peripheral edge CA.
Fig. 17 is a diagram showing a fourth process of the mounting method according to the second embodiment. The fourth step is a step of irradiating the workpiece WK with the first laser beam LZ 1.
The third driving unit DR3 drives the laser device 60 so that the first laser beam LZ1 is emitted from the laser torch 60A. The laser apparatus 60 irradiates the work WK with the first laser light LZ1 through the window 31A of the pressing jig 31, and bonds the light emitting element LED to the circuit board CB. That is, the bonding member 12 is heated and melted by laser ablation, and the terminal portion 11 of the circuit board CB and the terminal portion 22 of the wafer WF are bonded at positions overlapping the pressing jigs 31 and 32. The wave band of the first laser light LZ1 is 400 nm-3000 nm.
Fig. 18 is a diagram showing a fifth step of the mounting method according to the second embodiment. The fifth step is a step of irradiating the work WK with the second laser LZ 2.
The third driving unit DR3 drives the laser device 60 so that the second laser beam LZ2 is emitted from the laser torch 60A. The laser apparatus 60 irradiates the workpiece WK with the second laser LZ2 through the window 31A of the pressing jig 31, and peels the light emitting element LED from the wafer WF. That is, a peeling layer, not shown, which fixes the light emitting element LED to the sapphire substrate 20 is sublimated by laser ablation, and the light emitting element LED is peeled from the sapphire substrate 20 at a position overlapping with the pressing jigs 31 and 32. The second laser beam LZ2 has a different wavelength band from the first laser beam LZ 1. The wave band of the second laser LZ2 is 200 nm-366 nm.
Fig. 19 is a diagram showing a sixth step of the mounting method according to the second embodiment. The sixth step shows a step of moving the pressing jigs 31 and 32.
The second driving portion DR2 moves the pressing jigs 31 and 32 in the vertical direction V to separate them from the workpiece WK. That is, the pressing jig 31 moves in the vertical direction V toward the side separated from the pressing jig 32, and the pressing jig 32 moves in the vertical direction V toward the side separated from the pressing jig 31. By separating the pressing jigs 31 and 32 from the workpiece WK, the state of warpage of the circuit board CB and the wafer WF is returned to the state shown in fig. 15. In the fifth step, the light emitting element LED is separated from the sapphire substrate 20 in the region irradiated with the second laser LZ 2. Then, the second driving portion DR2 moves the pressing jigs 31 and 32 in the horizontal direction H. That is, the pressing jig 31 moves to a region where the light emitting element LED is not bonded or peeled in a region overlapping with the opening OP1 of the fixing jig 41, and the pressing jig 32 moves to the same position in accordance with the movement of the pressing jig 31. Then, the third to sixth steps are repeated to mount the light emitting element LED on a desired region of the circuit board CB.
The positional relationship between the workpiece WK and the pressing jigs 31 and 32 may be moved relatively in the horizontal direction H, and the fixing jigs 41 and 42 may be moved with the pressing jigs 31 and 32 fixed. When the pressing jigs 31 and 32 are moved in the horizontal direction H, the laser head 60A may be moved in accordance with the movement of the pressing jigs 31 and 32.
Fig. 20 is a plan view showing fixing jigs 41 and 42 according to the second embodiment.
Fig. 20 (a) shows the fixing jigs 41 and 42, and the pressing jigs 31 and 32. The fixing jigs 41 and 42 are annular in plan view. Therefore, the outer shapes of the opening OP1 of the fixing jig 41 and the opening OP2 of the fixing jig 42 are circular. The pressing jig 31 is annular in plan view, and the pressing jig 32 is circular in plan view. The areas of the pressing jigs 31 and 32 are smaller than the areas of the openings OP1 and OP 2.
Fig. 20 (b) is a diagram in which the circuit board CB and the wafer WF are arranged in fig. 20 (a). The outline of each of the circuit board CB and the wafer WF is shown by a dotted line. The outer shape of the wafer WF is circular. The circuit board CB has a rectangular outer shape. In the illustrated example, the circuit board CB has an area larger than that of the wafer WF, and the circuit board CB extends outward from the outer shape of the wafer WF. Since the fixing jigs 41 and 42 press the positions where the circuit board CB and the wafer WF overlap each other, the outer edge portion of the wafer WF having a size smaller than that of the circuit board CB can be pressed.
Fig. 21 is a plan view showing a modification of the fixing jigs 41 and 42 according to the second embodiment. The configuration shown in fig. 21 is different from the configuration shown in fig. 20 in the shape of the fixing jigs 41 and 42.
Fig. 21 (a) shows the fixing jigs 41 and 42, and the pressing jigs 31 and 32. The fixing jig 41 has a first portion 41A, a second portion 41B, a third portion 41C, and a fourth portion 41D. The first portion 41A and the second portion 41B extend and protrude in the second direction Y. The third portion 41C and the fourth portion 41D extend and protrude in the first direction X. The first portion 41A, the second portion 41B, the third portion 41C, and the fourth portion 41D are rectangular in plan view.
The fixing jig 42 has a first portion 42A, a second portion 42B, a third portion 42C, and a fourth portion 42D. The first portion 42A and the second portion 42B extend and protrude in the second direction Y. The third portion 42C and the fourth portion 42D extend and protrude in the first direction X. The first portion 42A, the second portion 42B, the third portion 42C, and the fourth portion 42D are rectangular in plan view.
The first portions 41A and 42A overlap each other. The second portions 41B and 42B overlap each other. The third portions 41C and 42C overlap each other. The fourth portions 41D and 42D overlap each other.
Fig. 21 (b) is a diagram in which the circuit board CB and the wafer WF are arranged in fig. 21 (a). The outline of each of the circuit board CB and the wafer WF is shown by a dotted line. In the illustrated example, the wafer WF is formed to have an area larger than that of the circuit board CB, and the wafer WF extends outward from the outer shape of the circuit board CB. Since the fixing jigs 41 and 42 press the positions where the circuit board CB and the wafer WF overlap each other, the outer edge portion of the circuit board CB having a size smaller than that of the wafer WF can be pressed.
In the second embodiment described above, the same effects as those of the first embodiment can be obtained.
[ third embodiment ]
Next, the structure of the mounting apparatus 100 and the workpiece WK according to the third embodiment will be described with reference to fig. 22 and 23. The mounting apparatus 100 according to the third embodiment differs from the mounting apparatus 100 according to the first embodiment in that the fixing jig 41 is not provided.
Fig. 22 is a sectional view schematically showing the structure of the mounting device 100 according to the third embodiment.
The mounting apparatus 100 includes a pressing jig 31, a table ST, a laser device 60, and a driving unit DR. The configurations of the pressing jig 31, the table ST, and the laser device 60 are the same as those of the first embodiment, and therefore, the description thereof is omitted. Since the mounting device 100 of the third embodiment does not include the fixing jig 41, the driving portion DR does not include the first driving portion DR 1.
The circuit board CB and the wafer WF are temporarily fixed to each other at the peripheral edge CA by the adhesive layer AD in an aligned state. By temporarily fixing the peripheral edge CA of the workpiece WK, the gap GP between the circuit board CB and the wafer WF increases toward the central portion MA of the workpiece WK.
Fig. 23 is a plan view showing an adhesive layer AD of a work WK according to a third embodiment. Fig. 23 (a) and 23 (b) show the adhesive layer AD, the stage ST, and the pressing jig 31. The outline of each of the circuit board CB and the wafer WF is indicated by a broken line.
As shown in fig. 23 (a), the adhesive layer AD has an annular shape in plan view. The pressing jig 31 moves inside the adhesive layer AD. In the illustrated example, the circuit board CB has an area larger than that of the wafer WF, and the circuit board CB extends outward from the outer shape of the wafer WF. The adhesive layer AD temporarily fixes the position where the circuit board CB and the wafer WF overlap each other, and thus has a shape suitable for the outer edge portion of the wafer WF having a smaller size than the circuit board CB.
As shown in fig. 23 (b), the adhesive layer AD has a rectangular frame shape in plan view. The pressing jig 31 moves inside the adhesive layer AD. In the illustrated example, the wafer WF is formed to have an area larger than that of the circuit board CB, and the wafer WF extends outward from the outer shape of the circuit board CB. The adhesive layer AD temporarily fixes the overlapping positions of the circuit board CB and the wafer WF, and thus has a shape suitable for the outer edge portion of the circuit board CB having a size smaller than that of the wafer WF.
As described above, according to the present embodiment, it is possible to obtain an electronic component mounting apparatus and an electronic component mounting method that can mount an electronic component on a circuit board while suppressing the influence of warpage of a wafer and the circuit board. In addition, although the mounting apparatus and the mounting method of the light emitting element on the circuit board have been described in the present embodiment, the present embodiment can also be applied to a mounting apparatus and a mounting method of mounting electronic components other than the light emitting element on the circuit board.
Although the embodiments of the present invention have been described, these embodiments are provided as examples, and are not intended to limit the scope of the present invention. These new embodiments can be implemented in other various ways, and various omissions, substitutions, and changes can be made without departing from the spirit of the utility model. These embodiments and modifications are included in the scope and gist of the utility model, and are included in the utility model described in the claims and the equivalent scope thereof.

Claims (7)

1. An electronic component mounting apparatus, comprising:
a table having a support surface for supporting a workpiece; and
a pressing jig opposed to the table,
the pressing jig is configured to press a part of the workpiece between the pressing jig and the table, and the pressing jig has a window portion facing the support surface and transmitting laser light.
2. The mounting device of electronic parts according to claim 1,
the electronic component mounting apparatus further includes a driving unit that moves the pressing jig in a horizontal direction with respect to the support surface and in a vertical direction with respect to the support surface.
3. The mounting device of electronic parts according to claim 1,
the electronic component mounting apparatus further includes a fixing jig that fixes the workpiece between the fixing jig and the table by pressing a peripheral edge portion of the workpiece,
the pressing jig is movable inside the fixing jig.
4. An electronic component mounting apparatus, comprising:
a first pressing jig; and
a second pressing jig opposed to the first pressing jig,
the first pressing jig is configured to clamp a part of the workpiece between the first pressing jig and the second pressing jig, and the first pressing jig has a window portion facing the second pressing jig and transmitting the laser beam.
5. The mounting device of electronic parts according to claim 4,
the electronic component mounting apparatus further includes a driving unit that moves the first pressing jig and the second pressing jig in the horizontal direction and the vertical direction.
6. The mounting device of electronic parts according to claim 4,
the electronic component mounting apparatus further includes a first fixing jig and a second fixing jig opposed to the first fixing jig,
the first fixing jig and the second fixing jig clamp a peripheral edge portion of the workpiece to fix the workpiece,
the first pressing jig is movable inside the first fixing jig,
the second pressing jig is movable inside the second fixing jig.
7. The mounting device of electronic parts according to claim 1,
the electronic component mounting apparatus further comprises a laser device,
the laser device includes a first laser light source for emitting a first laser beam and a second laser light source for emitting a second laser beam,
the wavelength band of the first laser light is different from the wavelength band of the second laser light.
CN202122599637.5U 2020-10-28 2021-10-26 Mounting device for electronic component Active CN216054768U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-180580 2020-10-28
JP2020180580A JP2022071551A (en) 2020-10-28 2020-10-28 Device and method for mounting electronic component

Publications (1)

Publication Number Publication Date
CN216054768U true CN216054768U (en) 2022-03-15

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Application Number Title Priority Date Filing Date
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JP (1) JP2022071551A (en)
CN (1) CN216054768U (en)

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