TWI833500B - Two-phase immersion-cooling type heat-dissipation structure having skived fins with high surface roughness - Google Patents

Abstract

A two-phase immersion-cooling type heat-dissipation structure having skived fins with high surface roughness is provided. The structure includes an immersion-cooling type substrate and a plurality of skived fins. The substrate has opposite top and bottom surfaces. The bottom surface is used for contacting the heat source immersed in the two-phase coolant, and the top surface is connected with the skived fins. The center line average roughness Ra of the surface of the skived fin is great than 10μm, and the ten point average roughness Rz of the surface of the skived fin is great than 20μm, so that the ratio between the surface area of the skived fins in contact with the two-phase coolant and the volume of the skived fins is greater than 400.

Description

Two-phase immersed heat dissipation structure with spade fins with high roughness surface

The present invention relates to a heat dissipation structure, and specifically to a two-phase immersed heat dissipation structure with spade-shaped fins having a high roughness surface.

Immersion cooling technology immerses heating components (such as servers, disk arrays, etc.) directly in a non-conductive two-phase coolant, so that the two-phase coolant absorbs heat and vaporizes it, taking away the heating components for operation. The heat energy generated. However, how to dissipate heat more effectively through immersion cooling technology has always been a problem that the industry needs to solve.

In view of this, the inventor has been engaged in the development and design of related products for many years. He felt that the above deficiencies could be improved, so he devoted himself to research and applied academic theories, and finally proposed an invention that is reasonably designed and effectively improves the above deficiencies.

The technical problem to be solved by the present invention is to provide a two-phase immersed heat dissipation structure with spade-shaped fins having a high roughness surface in view of the shortcomings of the existing technology.

An embodiment of the present invention discloses a two-phase immersed heat dissipation structure with spade-type fins on a high-roughness surface, which includes an immersed substrate and a plurality of spade-type fins. The immersed substrate has opposite The upper surface and the lower surface, the lower surface of the immersed substrate is used to form contact with the heating element immersed in the two-phase cooling liquid, the upper surface of the immersed substrate is connected to a plurality of the spade fins, and the The centerline average roughness Ra of the surface of the spade-type fin is greater than 10 μm, and the ten-point average roughness Rz of the surface of the spade-type fin is greater than 20 μm, so that a plurality of the spade-type fins are consistent with the The ratio of the surface area of the two-phase cooling liquid in contact with the volume of the plurality of spade-type fins is greater than 400.

In a preferred embodiment, the spade-shaped fins are one of pin-shaped fins and plate-shaped fins.

In a preferred embodiment, the spade-shaped fins are made of one of copper, copper alloy, and aluminum alloy.

In a preferred embodiment, the surface of the spade-shaped fin is a rough machined surface formed by mechanical processing.

In a preferred embodiment, the surface of the spade fin is a rough etched surface formed by etching.

In a preferred embodiment, the surface of the spade-shaped fin is a rough deposition surface formed by deposition.

In a preferred embodiment, the size of the spade-shaped fins is 100-800 microns, and the fin spacing between adjacent spade-shaped fins is 100-500 microns.

In a preferred embodiment, the ratio of the centerline average roughness Ra of the surface of the spade-shaped fins to the fin spacing is in the range of 1:10 to 1:50, and the surface of the spade-shaped fins The ratio of the ten-point average roughness Rz to the fin spacing is in the range of 1:10 to 1:30.

In a preferred embodiment, the two-phase immersed heat dissipation structure with spade-type fins with high roughness surfaces further includes: a high thermal conductivity structure, which is combined to the lower surface of the immersed substrate, so that the immersed The substrate is in indirect contact with the heating element through the highly thermally conductive structure. A vacuum sealed cavity is formed inside the highly thermally conductive structure, and the vacuum sealed cavity contains liquid.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not used to limit the present invention.

The following is a description of the relevant implementation modes disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. In addition, the same or similar parts in the drawings are labeled with the same reference numerals. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.

[First Embodiment]

Please refer to FIGS. 1 to 2 , which are the first embodiment of the present invention. The embodiment of the present invention provides a two-phase immersed heat dissipation structure with spade-shaped fins with high roughness surfaces for contact and immersion between two Heating element (heat source) of phase coolant. As shown in the figure, a two-phase immersed heat dissipation structure with scooped fins with high roughness surfaces provided according to an embodiment of the present invention includes an immersed substrate 10 and a plurality of skipped fins 20. ).

In this embodiment, the immersed substrate 10 can be made of a material with high thermal conductivity, such as aluminum, copper or alloys thereof. The immersed substrate 10 may be a non-porous heat dissipation material or a porous heat dissipation material. Preferably, the immersed substrate 10 can be a porous metal heat dissipation plate immersed in the two-phase cooling liquid 900 (non-conductive electronic fluoride liquid) with a porosity greater than 8%, so that more bubbles can be generated in multiple Micro holes to enhance the immersion heat dissipation effect.

In this embodiment, the immersed substrate 10 has an upper surface 101 and a lower surface 102 opposite to each other. The lower surface 102 of the immersed substrate 10 is used to make contact with the heating element 800 immersed in the two-phase cooling liquid. The contact may be direct contact or indirect contact through an interlayer. A plurality of spade fins 20 are connected to the upper surface 101 of the immersed substrate 10, and the plurality of spade fins 20 are integrally formed on the upper surface 101 of the immersed substrate 10 by a spade molding method and are arranged in an extremely high density. . Furthermore, the spade fins 20 may be pin fins or plate fins, and may be made of copper, copper alloy or aluminum alloy.

Moreover, when the size of the shovel-shaped fins 20 is small (the thickness T is less than 800 microns), the surface area of the shovel-shaped fins 20 in contact with the two-phase coolant 900 will have a great impact on the immersion heat dissipation effect. The center line average roughness Ra (center line average roughness Ra) of the surface 201 of the spade type fin 20 is greater than 10 μm, and the ten-point average roughness Rz (ten-point average roughness Rz) of the surface 201 of the spade type fin 20 It is to be greater than 20 μm, so that the ratio (ratio) of the surface area of the plurality of spade-type fins 20 in contact with the two-phase coolant 900 and the volume of the plurality of spade-type fins 20 is greater than 400, so as to increase the surface roughness. It can effectively increase the surface area for contact, and the highly rough surface is also conducive to the generation of bubbles, which further enhances the immersion heat dissipation effect.

Furthermore, when the size (thickness T) of the spade fin 20 is 100 to 800 microns, and the fin spacing D between adjacent fins is 100 to 500 microns, the surface 201 of the spade fin 20 The ratio of the centerline average roughness Ra to the fin spacing D is in the range of 1:10 to 1:50, and the ratio of the ten-point average roughness Rz of the surface 201 of the spade fin 20 to the fin spacing D is 1: The range of 10 to 1:30 can make the effect more significant.

In this embodiment, the surface 201 of the shovel fin 20 can be a rough surface formed by mechanical processing, such as shot peening, that is, hard sand can be used to impact the shovel fin 20 at high speed. The spade fin 20 is formed with a predetermined surface 201 .

In this embodiment, the surface 201 of the spade fin 20 may be a rough etched surface formed by etching. Furthermore, the surface 201 of the spade fin 20 may be formed by physical etching, such as ion etching. In addition, the surface 201 of the spade fin 20 may be formed by chemical etching, for example, by the corrosion of a chemical etching solution, and may be formed by phosphoric acid-based micro-etching agent, sulfuric acid-based micro-etching agent or ferric chloride. Formed by chemical corrosion with corrosive agents.

In this embodiment, the surface 201 of the spade fin 20 may also be a rough deposition surface formed by deposition. Furthermore, the surface 201 of the spade fin 20 may be formed by liquid deposition or vapor deposition (physical or chemical vapor deposition).

[Second Embodiment]

Please refer to Figure 3, which is a second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are explained as follows.

In this embodiment, a high thermal conductivity structure 30 is further included. Furthermore, the high thermal conductivity structure 30 is coupled to the lower surface 102 of the immersed substrate 10 so that the immersed substrate 10 is in indirect contact with the heating element 800 immersed in the two-phase cooling liquid 900 through the high thermal conductivity structure 30 . In detail, the high thermal conductivity structure 30 may be bonded to the lower surface 102 of the immersed substrate 10 through welding, friction stir welding, gluing, or diffusion bonding. In other embodiments, the immersed substrate 10 may be integrally formed with the high thermal conductivity structure 30 .

Furthermore, a vacuum sealed cavity 301 is formed inside the high thermal conductivity structure 30, and the top wall and bottom wall of the vacuum sealed cavity 301 can also be formed with sintered bodies, and the vacuum sealed cavity 301 contains an appropriate amount of liquid, and the liquid Can be water or acetone. Moreover, the bottom surface of the high thermal conductivity structure 30 can be used to contact the heating element 800 immersed in the two-phase cooling liquid 900, so that the heating element 800 immersed in the two-phase cooling liquid 900 can absorb heat and vaporize through the two-phase cooling liquid 900. The heat energy generated by the heating element 800 is taken away, and the heat energy generated by the heating element 800 can be contacted and absorbed through the high thermal conductivity structure 30, causing the liquid in the vacuum sealed chamber 301 to vaporize and evaporate into steam, which is then distributed to the immersed substrate 10 and The heat energy is quickly transferred to the shovel-shaped fins 20 that are integrally formed with the immersed substrate 10 and arranged at an extremely high density, and the two-phase coolant 900 is used to absorb heat and vaporize to take away the heat energy absorbed by the shovel-shaped fins 20, while the vacuum-tight cavity The steam in 301 surrenders heat energy and condenses on the top wall of the cavity before flowing back to the bottom wall of the cavity. Such a high-speed loop can quickly dissipate the heat energy generated by the heating element 800, thus enhancing the immersion heat dissipation effect.

Based on the above, the two-phase immersed heat dissipation structure with spade fins with high roughness surface provided by the present invention can at least pass through "immersed substrate", "multiple spade fins", "immersed substrate" It has an upper surface and a lower surface that are opposite to each other. The lower surface of the immersed substrate is used to form contact with the heating element immersed in the two-phase cooling liquid. The upper surface of the immersed substrate is connected with a plurality of spade-shaped fins. The centerline average roughness Ra of the surface of the fins is greater than 10 μm, and the ten-point average roughness Rz of the surface of the spade fins is greater than 20 μm, so that the surface area of multiple spade fins is in contact with the two-phase coolant. The technical solution of "the volume ratio of multiple spade fins is greater than 400" can effectively increase the surface area of contact between the spade fins and the two-phase coolant, and can facilitate the generation of bubbles, thereby effectively strengthening the whole Immersion cooling effect.

The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10: Immersed substrate 101: Upper surface 102: Lower surface 20:Spade type fins 201: Surface 30: High thermal conductivity structure 301: Vacuum sealed chamber 800: Heating element 900: Two-phase coolant T:Thickness D: Fin spacing

Figure 1 is a schematic side view of the structure of the first embodiment of the present invention.

FIG. 2 is an enlarged schematic diagram of part II of FIG. 1 .

Figure 3 is a schematic side view of the structure of the second embodiment of the present invention.

10: Immersed substrate

101: Upper surface

102: Lower surface

20:Spade type fins

201: Surface

800: Heating element

900: Two-phase coolant

T:Thickness

D: Fin spacing

Claims (7)

A two-phase immersed heat dissipation structure with spade-type fins on a high-roughness surface, which includes an immersed substrate and a plurality of spade-type fins. The immersed substrate has opposite upper and lower surfaces, The lower surface of the immersed substrate is used to make contact with the heating element immersed in the two-phase cooling liquid. A plurality of the spade fins are connected to the upper surface of the immersed substrate, and the spade fins are The centerline average roughness Ra of the surface is greater than 10 μm, and the ten-point average roughness Rz of the surface of the spade-type fins is greater than 20 μm, so that multiple spade-type fins come into contact with the two-phase coolant The ratio of the surface area to the volume of the plurality of spade-shaped fins is greater than 400; wherein the size of the spade-shaped fins is between 100 and 800 microns, and is between adjacent spade-shaped fins. The fin spacing is between 100 and 500 microns, the ratio of the centerline average roughness Ra of the surface of the spade fins to the fin spacing is in the range of 1:10 to 1:50, and the spade The ratio of the ten-point average roughness Rz of the surface of the fins to the fin spacing is in the range of 1:10 to 1:30. The two-phase immersed heat dissipation structure of spade-shaped fins with high roughness surfaces as claimed in claim 1, wherein the spade-shaped fins are one of pin-cylindrical fins and plate-shaped fins. The two-phase immersed heat dissipation structure with spade-shaped fins with high roughness surfaces as claimed in claim 1, wherein the spade-shaped fins are made of one of copper, copper alloy, and aluminum alloy. The two-phase immersed heat dissipation structure of spade-shaped fins with high roughness surfaces as claimed in claim 1, wherein the surface of the spade-shaped fins is a rough processed surface formed by mechanical processing. The two-phase immersed heat dissipation structure with spade-shaped fins with high roughness surfaces as claimed in claim 1, wherein the surface of the spade-shaped fins is a rough etched surface formed by etching. The two-phase immersed heat dissipation structure of spade-shaped fins with high roughness surfaces as claimed in claim 1, wherein the surface of the spade-shaped fins is a rough deposition surface formed by deposition. The two-phase immersed heat dissipation structure of spade-type fins with high roughness surfaces as described in claim 1 further includes: a high thermal conductivity structure, which is combined to the lower surface of the immersed substrate to make the immersed The substrate is in indirect contact with the heating element through the highly thermally conductive structure. A vacuum sealed cavity is formed inside the highly thermally conductive structure, and the vacuum sealed cavity contains liquid.

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