TWI833342B - Two-phase immersion-cooling heat-dissipation structure having porous structure - Google Patents

Abstract

A two-phase immersion-cooling heat-dissipation structure having a porous structure is provided. The structure includes a heat-dissipation substrate, a plurality of fins, and a reinforced frame. The heat-dissipation substrate has opposite fin and non-fin surfaces. The non-fin surface is used for contacting the heat source immersed in the two-phase coolant, and the fin surface is integrally connected with the fins. At least part of the fin surface and at least some of the fins are covered with a porous structure. The porous structure has a porosity in the range of from 10% to 50% and a thickness of between 0.1 mm and 1 mm. The reinforced frame is coupled to the heat-dissipation substrate and surrounds at least some of the fins.

Description

Two-phase immersed heat dissipation structure with porous structure

The present invention relates to a heat dissipation structure, specifically to a two-phase immersed heat dissipation structure with a porous structure.

Immersion cooling technology directly immerses heating components (such as servers, disk arrays, etc.) in non-conductive cooling liquid, so that the cooling liquid absorbs heat and vaporizes to take away the heat energy generated by the operation of the heating components. However, how to dissipate heat more effectively through immersion cooling technology has always been a problem that the industry needs to solve.

In view of this, the inventor has been engaged in the development and design of related products for many years. He felt that the above deficiencies could be improved, so he devoted himself to research and applied academic theories, and finally proposed an invention that is reasonably designed and effectively improves the above deficiencies.

The technical problem to be solved by the present invention is to provide a two-phase immersed heat dissipation structure with a porous structure in view of the shortcomings of the existing technology.

An embodiment of the present invention discloses a two-phase immersed heat dissipation structure with a porous structure, which includes a heat dissipation base, a plurality of fins, and a reinforced outer frame. The heat dissipation base has opposite fin surfaces and non-fin surfaces. The non-fin surface is used to form contact with the heat source immersed in the two-phase cooling liquid. The plurality of fins are respectively scraped fins integrally formed on the fin surface by scraping molding, and the fin surface At least a part of and at least a part of the plurality of fins are covered with a porous structure, the porosity of the porous structure is between 10%~50%, and the thickness is between 0.1mm~1mm, and the thickness of the fins is between is between 0.1mm~0.35mm, the fin pitch is between 0.1mm~0.35mm, and the fin height is between 5mm~10mm, and the reinforced outer frame is bonded to the heat dissipation base and surrounds at least one of the plurality of fins. part.

In a preferred embodiment, the fins are made of copper or copper alloy.

In a preferred embodiment, the porous structure is made of one of copper, copper alloy, silver, and silver alloy.

In a preferred embodiment, the porous structure is formed by sintering metal powder particles, and the median particle diameter (D50) of the metal powder particles is 10 μm ~ 30 μm.

In a preferred embodiment, the porous structure is formed by mixing metal powder with polymer materials and then sintering, and the median particle size (D50) of the metal powder is 10 μm ~ 30 μm.

In a preferred embodiment, the porous structure is formed by mixing metal powder particles into a metal powder paste or powder liquid and then sintering, and the median particle size (D50) of the metal powder paste or powder liquid is 1 μm~ 10μm.

In a preferred embodiment, the porous structure is formed by mixing metal powder particles into a metal powder paste or powder liquid and then sintering, and the median particle size (D50) of the metal powder paste or powder liquid is 0.01 μm. ~0.5μm.

In a preferred embodiment, the porous structure is a multi-layer composite structure made of different materials.

In a preferred embodiment, the porous structure is a copper mesh structure.

In a preferred embodiment, the average thickness of the porous structure at positions corresponding to the heat source is greater than the average thickness corresponding to positions other than the heat source.

In a preferred embodiment, the thickness of the porous structure at a central position between the two fins is greater than the thickness at both side edges adjacent to the two fins.

In a preferred embodiment, the heat source includes a plurality of local heat sources distributed at intervals, and the average thickness of the porous structure at positions corresponding to the plurality of local heat sources is greater than at positions corresponding to non-said plurality of local heat sources. The average thickness.

In a preferred embodiment, the porous structure is divided into a first porous structure covering the surface of the fin and a second porous structure covering the side edge of the fin, and the first porous structure and The second porous structures are respectively formed by at least one of different materials and manufacturing methods.

In a preferred embodiment, at least one of the heat dissipation base and the reinforced outer frame is formed with a plurality of through holes, and a plurality of spring screws pass through the plurality of through holes correspondingly.

In a preferred embodiment, the two-phase immersed heat dissipation structure with a porous structure further includes: a high thermal conductivity structure, which is bonded to the non-fin surface of the heat dissipation base so that the heat dissipation base can pass through the The highly thermally conductive structure is in indirect contact with the heat source, a vacuum sealed cavity is formed inside the highly thermally conductive structure, and the vacuum sealed cavity contains liquid.

An embodiment of the present invention further discloses a two-phase immersed heat dissipation structure with a porous structure, which includes a heat dissipation base, a plurality of fins, and a reinforced outer frame. The heat dissipation base has opposite fin surfaces and non-fin surfaces. The non-fin surface is used to form contact with the heat source immersed in the two-phase cooling liquid. The plurality of fins are respectively pin fins integrally formed on the fin surface, and at least a part of the fin surface and the At least a part of the plurality of fins is covered with a porous structure, the porosity of the porous structure is between 10% and 50%, and the thickness is between 0.1mm and 1mm, and the diameter of the fins is between 0.3mm and 1mm. The fin pitch ranges from 0.3mm to 0.6mm, the fin height ranges from 3mm to 7mm, and the reinforced outer frame is coupled to the heat dissipation base and surrounds at least a part of the plurality of fins.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not used to limit the present invention.

The following is a description of the relevant implementation modes disclosed in the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depictions based on actual dimensions, as is stated in advance. In addition, the same or similar parts in the drawings are labeled with the same reference numerals. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention. In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.

[First Embodiment]

Please refer to FIG. 1 to FIG. 2 , which is one embodiment of the present invention. The embodiment of the present invention provides a two-phase immersed heat dissipation structure with a porous structure, which can be used to contact a heat source immersed in a two-phase cooling liquid. As shown in FIGS. 1 and 2 , a two-phase immersed heat dissipation structure with a porous structure provided according to an embodiment of the present invention basically includes a heat dissipation base 10 and a plurality of fins 20 .

In this embodiment, the heat dissipation substrate 10 can be made of a material with high thermal conductivity, such as aluminum, copper or alloys thereof. The heat dissipation substrate 10 may be a non-porous heat dissipation material or a porous heat dissipation material. Preferably, the heat dissipation substrate 10 can be a porous heat dissipation plate immersed in a two-phase cooling liquid (such as electronic fluoride liquid) with a porosity greater than 8%, which is used to increase the generation of bubbles and enhance the immersion heat dissipation effect.

In this embodiment, the heat dissipation substrate 10 has opposite fin surfaces 101 and non-fin surfaces 102 . The non-fin surface 102 of the heat dissipation substrate 10 is used to make contact with the heat source 800 immersed in the two-phase cooling liquid. This contact may be direct contact or indirect contact through an interlayer. Fins 20 may be made of copper or copper alloy. Moreover, each of the plurality of fins 20 is integrally formed on the fin surface 101 by cutting. That is to say, the fin surface 101 of the heat dissipation base 10 of this embodiment is integrally formed with extremely high-density arranged skived fins through skiving molding. Furthermore, the fin thickness T of the fin 20 is between 0.1 mm and 0.35 mm. The fin thickness T here refers to the center thickness of a single fin. The fin spacing D is between 0.1mm~0.35mm. The fin spacing D here refers to the normal distance from the side of the fin to the side of the other fin. The fin height H is between 5mm and 10mm. The fin height H here refers to the vertical distance from the fin surface 101 to the highest point of the fin.

Furthermore, at least part of the fin surface 101 of the heat dissipation base 10 and at least part of the plurality of fins 20 of this embodiment are covered with the porous structure 30 . The porous structure 30 has a porosity between 10% and 50% and a thickness between 0.1mm and 1mm to increase bubble nucleation points around the fin surface 101 and the fins 20 and enable the heat source 800 to transfer heat to the fins 20 at a higher position, thereby increasing the utilization of the higher position of the fins 20 .

In detail, the porous structure 30 may be made of metal such as copper, copper alloy, silver or silver alloy. Furthermore, the porous structure 30 may be formed by sintering metal powder particles, and the sintering referred to here may be loose sintering. In addition, the porous structure 30 may be formed by mixing metal powder with a polymer material and then sintering. The polymer material here may be a binder or a pore-forming agent. The porous structure 30 may also be formed by mixing metal powder particles into a spreadable metal powder paste (liquid) and then sintering. The median particle diameter (D50) of the metal powder is preferably 10 μm to 30 μm or 30 μm to 500 μm. The median particle diameter (D50) of the metal powder paste or powder liquid is preferably 1 μm to 10 μm, or 0.01 μm to 0.5 μm.

In addition, the porous structure 30 can be further divided into a first porous structure 30a covering the fin surface 101 and a second porous structure 30b covering the side edge of the fin 20, and the first porous structure 30a and the second porous structure 30b The structures 30b may be formed of different materials or manufacturing methods. Furthermore, the side edges of the fins 20 directly above the heat source 800 among the plurality of fins 20 may be completely covered with the second porous structure 30b, and the side edges of the fins 20 far away from the heat source 800 may not be covered with the second porous structure 30b. Porous structure 30b.

[Second Embodiment]

Please refer to Figure 3, which is a second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are explained as follows.

In this embodiment, the heat dissipation base 10 is also combined with a reinforced outer frame 40 that surrounds at least part of the plurality of fins 20 to enhance the overall structural strength and avoid problems and damage caused by warping. The reinforced outer frame 40 may be made of aluminum alloy or stainless steel. Furthermore, the reinforced outer frame 40 may be joined to the heat dissipation base 10 by means of press fit, welding, friction stir welding (FSW), gluing, or diffusion bonding.

[Third Embodiment]

Please refer to Figure 4, which is a third embodiment of the present invention. This embodiment is substantially the same as the first and second embodiments, and the differences are explained as follows.

In this embodiment, a plurality of through holes 15 can be formed on both sides of the heat dissipation base 10 or both sides of the reinforced outer frame 40, and a plurality of spring screws 25 can pass through the plurality of through holes 15 to better fix the device. Heat source 800 on the motherboard.

[Fourth Embodiment]

Please refer to Figure 5, which is a fourth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are explained as follows.

In this embodiment, a high thermal conductivity structure 50 is further included. Furthermore, the high thermal conductivity structure 50 is coupled to the non-fin surface 102 of the heat dissipation base 10 so that the heat dissipation base 10 forms indirect contact with the heat source 800 immersed in the two-phase cooling liquid through the high thermal conductivity structure 50 . In detail, the high thermal conductivity structure 50 may be bonded to the non-fin surface 102 of the heat dissipation substrate 10 through welding, friction stir welding (FSW), gluing, or diffusion bonding. In other embodiments, the heat dissipation base 10 may be integrally formed with the high thermal conductivity structure 50 .

Furthermore, a vacuum sealed cavity 501 is formed inside the high thermal conductivity structure 50, and the top wall and bottom wall of the vacuum sealed cavity 501 can also be formed with sintered bodies, and the vacuum sealed cavity 501 contains an appropriate amount of liquid, and the liquid Can be water or acetone. Moreover, the bottom surface of the high thermal conductivity structure 50 can be used to contact the heat source 800 immersed in the two-phase cooling liquid, so that the heat source 800 immersed in the two-phase cooling liquid can absorb heat and vaporize away the heat source 800 to generate electricity. The heat energy can also contact and absorb the heat energy generated by the heat source 800 through the high thermal conductivity structure 50, causing the liquid in the vacuum sealed chamber 501 to vaporize and evaporate into steam, which is distributed to the heat dissipation base 10 and the heat energy is quickly transferred to the heat dissipation base 10 The scraped fins are formed in one piece and arranged at an extremely high density, and use the two-phase coolant to absorb heat and vaporize to take away the heat energy absorbed by the scraping fins, and the steam in the vacuum sealed cavity 501 surrenders the heat energy and circulates it in the cavity. After condensation on the top wall, it flows back to the bottom wall of the cavity. Such a high-speed loop can quickly dissipate the heat energy generated by the heat source 800, thereby enhancing the immersion heat dissipation effect.

[Fifth Embodiment]

Please refer to FIG. 6 , which is a fifth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are explained as follows.

In this embodiment, the porous structure 30 may be a copper mesh structure.

[Sixth Embodiment]

Please refer to FIG. 7 , which is a sixth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are explained as follows.

In this embodiment, the average thickness of the porous structure 30 at the position corresponding to the heat source 800 is greater than the average thickness at the position corresponding to the non-heat source 800, which can increase the amount of bubble generation of the porous structure 30 at the position corresponding to the heat source 800 to enhance the immersion type. Heat dissipation effect.

[Seventh Embodiment]

Please refer to FIG. 8 , which is a seventh embodiment of the present invention. This embodiment is substantially the same as the first and sixth embodiments, and the differences are explained as follows.

In this embodiment, the thickness of the porous structure 30 at the center position between the two fins 20 is greater than the thickness at the two edge positions adjacent to the two fins 20 . That is to say, the thickness of the porous structure 30 at the center position between the two fins 20 A convex structure is formed between them. Compared with the flat structure and the concave structure, the convex structure of this embodiment can make the generated bubbles break away from the surface more quickly and enhance the immersion heat dissipation effect.

[Eighth Embodiment]

Please refer to FIG. 9 , which is an eighth embodiment of the present invention. This embodiment is substantially the same as the first and sixth embodiments, and the differences are explained as follows.

In this embodiment, the porous structure 30 may be a multi-layer composite structure made of different materials.

[Ninth Embodiment]

Please refer to Figure 10, which is a ninth embodiment of the present invention. This embodiment is substantially the same as the first and seventh embodiments, and the differences are explained as follows.

In this embodiment, the heat source 800 includes a first local heat source 801 and a second local heat source 802 distributed at intervals. Of course, it may also include a third local heat source, a fourth local heat source, etc., and the number and distribution method are not limited. Here it is. The average thickness of the porous structure 30 at the positions corresponding to the first local heat source 801 and the second local heat source 802 is greater than the average thickness at the positions corresponding to the non-first local heat source 801 and the non-second local heat source 802 . That is to say, the average thickness of the porous structure 30 at positions corresponding to multiple local heat sources is greater than the average thickness corresponding to positions without multiple local heat sources.

[Tenth Embodiment]

Please refer to Figure 11, which is a tenth embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are explained as follows.

In this embodiment, the plurality of fins 20 are pin fins integrally formed on the fin surface 101 of the heat dissipation base 10 . Furthermore, the fin diameter d of the fin 20 is between 0.3 mm and 1 mm, and the fin diameter d here refers to the center diameter of a single fin. The fin spacing D is between 0.3mm~0.6mm. The fin spacing D here refers to the shortest distance from the side of a fin to the side of another fin. The fin height is between 3mm~7mm. The fin height here refers to the vertical distance from the fin surface to the highest point of the fin. Refer to Figure 2.

Based on the above, the present invention provides a two-phase immersed heat dissipation structure with a porous structure, which can at least pass through a "heat dissipation base", "multiple fins", "reinforced outer frame", and "the heat dissipation base has opposite fin surfaces". "With the non-fin surface", "the non-fin surface is used to form contact with the heat source immersed in the two-phase coolant", "at least a part of the fin surface and at least a part of the plurality of fins are covered with a porous structure, and the pores of the porous structure The efficiency is between 10%~50% and the thickness is between 0.1mm~1mm" and the technical solution of "reinforced outer frame is combined with the heat dissipation base and surrounds at least a part of the multiple fins", which can effectively enhance the immersion heat dissipation effect and Structural strength.

The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10:Heat dissipation base 101: Fin surface 102:Non-fin side 15:Perforation 20:fins 25:Spring screw 30: Porous structure 30a: First porous structure 30b: Second porous structure 40: Strengthen the frame 50: High thermal conductivity structure 501: Vacuum sealed chamber T: fin thickness d: fin diameter D: Fin spacing H: fin height 800:Heat source 801: First local heat source 802: Second local heat source

Figure 1 is a schematic structural top view of the first embodiment of the present invention.

Figure 2 is a schematic side view of the structure of the first embodiment of the present invention.

Figure 3 is a schematic side view of the structure of the second embodiment of the present invention.

Figure 4 is a schematic side view of the structure of the third embodiment of the present invention.

Figure 5 is a schematic side view of the structure of the fourth embodiment of the present invention.

Figure 6 is a schematic side view of the structure of the fifth embodiment of the present invention.

Figure 7 is a schematic side view of the structure of the sixth embodiment of the present invention.

Figure 8 is a schematic side view of the structure of the seventh embodiment of the present invention.

Figure 9 is a schematic side view of the structure of the eighth embodiment of the present invention.

Figure 10 is a schematic side view of the structure of the ninth embodiment of the present invention.

Figure 11 is a schematic structural top view of the tenth embodiment of the present invention.

10:Heat dissipation base

101: Fin surface

102:Non-fin side

20:fins

30: Porous structure

30a: First porous structure

30b: Second porous structure

800:Heat source

H: fin height

Claims (28)

A two-phase immersed heat dissipation structure with a porous structure, which includes a heat dissipation base, a plurality of fins, and a reinforced outer frame. The heat dissipation base has opposite fin surfaces and non-fin surfaces, and the non-fin surface is used for In contact with the heat source immersed in the two-phase coolant, the plurality of fins are respectively scraped fins integrally formed on the fin surface in a scraping molding manner, and at least a part of the fin surface and the At least a part of the plurality of fins is covered with a porous structure, the porosity of the porous structure is between 10% and 50%, and the thickness is between 0.1mm and 1mm, and the thickness of the fins is between 0.1mm and 0.35mm. , the fin spacing is between 0.1mm~0.35mm, the fin height is between 5mm~10mm, and the reinforced outer frame is coupled to the heat dissipation base and surrounds at least a part of the plurality of fins; wherein, the The average thickness of the porous structure at positions corresponding to the heat source is greater than the average thickness corresponding to positions other than the heat source. The two-phase immersed heat dissipation structure with a porous structure as described in claim 1, wherein the fins are made of one of copper or copper alloy. The two-phase immersed heat dissipation structure with a porous structure as described in claim 1, wherein the porous structure is made of one of copper, copper alloy, silver, and silver alloy. The two-phase immersed heat dissipation structure with a porous structure as described in claim 1, wherein the porous structure is formed by sintering metal powder particles, and the median particle size (D50) of the metal powder particles is 10 μm. ~30μm. The two-phase immersed heat dissipation structure with a porous structure as described in claim 1, wherein the porous structure is made by mixing metal powder particles with polymer materials and then sintering formed, and the median particle size (D50) of the metal powder is 10 μm ~ 30 μm. The two-phase immersed heat dissipation structure with a porous structure as described in claim 1, wherein the porous structure is formed by mixing metal powder particles into a metal powder paste or powder liquid and then sintering, and the metal powder paste or The median particle size (D50) of powder liquid is 1μm~10μm. The two-phase immersed heat dissipation structure with a porous structure as described in claim 1, wherein the porous structure is formed by mixing metal powder particles into a metal powder paste or powder liquid and then sintering, and the metal powder paste or The median particle size (D50) of the powder liquid is 0.01μm~0.5μm. The two-phase immersed heat dissipation structure with a porous structure as described in claim 1, wherein the porous structure is a multi-layer composite structure formed by superimposing different materials. The two-phase immersed heat dissipation structure with a porous structure as described in claim 1, wherein the porous structure is a copper mesh structure. The two-phase immersed heat dissipation structure with a porous structure as claimed in claim 1, wherein the thickness of the porous structure at the center between the two fins is greater than that at both sides of the adjacent fins. Thickness at location. The two-phase immersed heat dissipation structure with a porous structure as described in claim 1, wherein the heat source includes a plurality of local heat sources distributed at intervals, and the average thickness of the porous structure at positions corresponding to the plurality of local heat sources is greater than the average thickness corresponding to locations other than the plurality of local heat sources. The two-phase immersed heat dissipation structure with a porous structure as claimed in claim 1, wherein the porous structure is divided into a first porous structure covering the fin surface and a second porous structure covering the side edge of the fin. Porous structure, and the first porous structure and the second porous structure are respectively formed by at least one of different materials and manufacturing methods. The two-phase immersed heat dissipation structure with a porous structure as claimed in claim 1, wherein at least one of the heat dissipation base and the reinforced outer frame is formed with a plurality of through holes, and a plurality of spring screws pass through the corresponding holes. Multiple perforations. The two-phase immersed heat dissipation structure with a porous structure as claimed in claim 1, further comprising: a high thermal conductivity structure, which is combined to the non-fin surface of the heat dissipation base so that the heat dissipation base passes through the high thermal conductivity structure. The thermally conductive structure is in indirect contact with the heat source, a vacuum sealed cavity is formed inside the highly thermally conductive structure, and the vacuum sealed cavity contains liquid. A two-phase immersed heat dissipation structure with a porous structure, which includes a heat dissipation base, a plurality of fins, and a reinforced outer frame. The heat dissipation base has opposite fin surfaces and non-fin surfaces, and the non-fin surface is used for In contact with the heat source immersed in the two-phase cooling liquid, the plurality of fins are respectively pin fins integrally formed on the fin surface, and at least a part of the fin surface and at least one of the plurality of fins A part is covered with a porous structure. The porosity of the porous structure is between 10% and 50%, and the thickness is between 0.1mm and 1mm. The diameter of the fins is between 0.3mm and 1mm, and the fin spacing is between 0.3mm. ~0.6mm, the fin height is between 3mm~7mm, and the reinforced outer frame is bonded to the heat dissipation base and surrounds at least a part of the plurality of fins; wherein, the porous structure The average thickness at the position corresponding to the heat source is greater than the average thickness corresponding to the position other than the heat source. The two-phase immersed heat dissipation structure with a porous structure as described in claim 15, wherein the fins are made of one of copper or copper alloy. The two-phase immersed heat dissipation structure with a porous structure as described in claim 15, wherein the porous structure is made of one of copper, copper alloy, silver, and silver alloy. The two-phase immersed heat dissipation structure with a porous structure as described in claim 15, wherein the porous structure is formed by sintering metal powder particles, and the median particle size (D50) of the metal powder particles is 30 μm. ~500μm. The two-phase immersed heat dissipation structure with a porous structure as described in claim 15, wherein the porous structure is formed by mixing metal powder with a polymer material and then sintering, and the median particle size of the metal powder is ( D50) is 10μm~30μm. The two-phase immersed heat dissipation structure with a porous structure as described in claim 15, wherein the porous structure is formed by mixing metal powder particles into a metal powder paste or powder liquid and then sintering, and the metal powder paste or The median particle size (D50) of powder liquid is 1μm~10μm. The two-phase immersed heat dissipation structure with a porous structure as described in claim 15, wherein the porous structure is formed by mixing metal powder particles into a metal powder paste or powder liquid and then sintering, and the metal powder paste or The median particle size (D50) of the powder liquid is 0.01μm~0.5μm. The two-phase immersed heat dissipation structure with a porous structure as described in claim 15, wherein the porous structure is a multi-layer composite structure formed by superimposing different materials. The two-phase immersed heat dissipation structure with a porous structure as described in claim 15, wherein the porous structure is a copper mesh structure. The two-phase immersed heat dissipation structure with a porous structure as described in claim 15, wherein the thickness of the porous structure at the center between the two fins is greater than that at both sides of the edges adjacent to the two fins. Thickness at location. The two-phase immersed heat dissipation structure with a porous structure as described in claim 15, wherein the heat source includes a plurality of local heat sources distributed at intervals, and the average thickness of the porous structure at positions corresponding to the plurality of local heat sources is greater than the average thickness corresponding to locations other than the plurality of local heat sources. The two-phase immersed heat dissipation structure with a porous structure as claimed in claim 15, wherein the porous structure is divided into a first porous structure covering the fin surface and a second porous structure covering the side edge of the fin. Porous structure, and the first porous structure and the second porous structure are respectively formed by at least one of different materials and manufacturing methods. The two-phase immersed heat dissipation structure with a porous structure as described in claim 15, wherein at least one of the heat dissipation base and the reinforced outer frame is formed with a plurality of through holes, and a plurality of spring screws pass through the corresponding holes. Multiple perforations. The two-phase immersed heat dissipation structure with a porous structure as claimed in claim 15, further comprising: a high thermal conductivity structure, which is coupled to the non-fin surface of the heat dissipation base, so that the heat dissipation base passes through the high thermal conductivity The thermally conductive structure is in indirect contact with the heat source, a vacuum sealed cavity is formed inside the highly thermally conductive structure, and the vacuum sealed cavity contains liquid.

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