TW202426841A - Two-phase immersion-cooling type heat-dissipation structure having skived fins with high surface roughness - Google Patents

Abstract

A two-phase immersion-cooling type heat-dissipation structure having skived fins with high surface roughness is provided. The structure includes an immersion-cooling type substrate and a plurality of skived fins. The substrate has opposite top and bottom surfaces. The bottom surface is used for contacting the heat source immersed in the two-phase coolant, and the top surface is connected with the skived fins. The center line average roughness Ra of the surface of the skived fin is great than 10[mu]m, and the ten point average roughness Rz of the surface of the skived fin is great than 20[mu]m, so that the ratio between the surface area of the skived fins in contact with the two-phase coolant and the volume of the skived fins is greater than 400.

Description

Two-phase immersion heat sink structure with high roughness scoop-shaped fins

The present invention relates to a heat dissipation structure, and more particularly to a two-phase immersion heat dissipation structure with a scoop-shaped fin having a high-roughness surface.

Immersion cooling technology is to immerse heat-generating components (such as servers, disk arrays, etc.) directly in a non-conductive two-phase coolant to absorb heat and vaporize the two-phase coolant to remove the heat energy generated by the operation of the heat-generating components. However, how to dissipate heat more effectively through immersion cooling technology has always been a problem that the industry needs to solve.

In view of this, the inventor has been engaged in the development and design of related products for many years and feels that the above-mentioned deficiencies can be improved. Therefore, he has conducted intensive research and applied academic theories, and finally proposed the present invention which has a reasonable design and effectively improves the above-mentioned deficiencies.

The technical problem to be solved by the present invention is to provide a two-phase immersion heat dissipation structure with a scoop-shaped fin having a high-roughness surface in view of the shortcomings of the prior art.

The embodiment of the present invention discloses a two-phase immersion heat dissipation structure with scoop-shaped fins having a high-roughness surface, which includes an immersion substrate and a plurality of scoop-shaped fins. The immersion substrate has an upper surface and a lower surface opposite to each other. The lower surface of the immersion substrate is used to form contact with a heat generating element immersed in a two-phase cooling liquid. The upper surface of the immersion substrate is connected to a plurality of the scoop-shaped fins, and the centerline average roughness Ra of the surface of the scoop-shaped fin is greater than 10μm, and the ten-point average roughness Rz of the surface of the scoop-shaped fin is greater than 20μm, so that the ratio of the surface area of the plurality of the scoop-shaped fins in contact with the two-phase cooling liquid to the volume of the plurality of the scoop-shaped fins is greater than 400.

In a preferred embodiment, the scoop-shaped fin is one of a needle-shaped fin and a plate-shaped fin.

In a preferred embodiment, the scoop-shaped fin is made of one of copper, copper alloy and aluminum alloy.

In a preferred embodiment, the surface of the scoop-shaped fin is a rough processed surface formed by machining.

In a preferred embodiment, the surface of the shovel-shaped fin is a rough etched surface formed by etching.

In a preferred embodiment, the surface of the scoop-shaped fin is a rough deposition surface formed by deposition.

In a preferred embodiment, the size of the scoop-shaped fin is 100-800 microns, and the distance between the fins of the adjacent scoop-shaped fins is 100-500 microns.

In a preferred embodiment, the ratio of the centerline average roughness Ra of the surface of the scoop-shaped fin to the fin spacing is in the range of 1:10 to 1:50, and the ratio of the ten-point average roughness Rz of the surface of the scoop-shaped fin to the fin spacing is in the range of 1:10 to 1:30.

In a preferred embodiment, the two-phase immersion heat dissipation structure with a scoop-shaped fin having a high-roughness surface further includes: a high thermal conductivity structure, which is bonded to the lower surface of the immersion substrate, so that the immersion substrate forms an indirect contact with the heat generating element through the high thermal conductivity structure, and a vacuum-sealed cavity is formed inside the high thermal conductivity structure, and the vacuum-sealed cavity contains a liquid.

To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only used for reference and description and are not used to limit the present invention.

The following is a specific embodiment to illustrate the implementation methods disclosed by the present invention. The technical personnel in this field can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments. The details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple schematic illustrations and are not depicted according to actual sizes. Please note in advance. Moreover, the same or similar parts in the drawings are marked with the same reference numerals. The following implementation methods will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used herein may include any one or more combinations of the associated listed items as appropriate.

[First embodiment]

Please refer to FIG. 1 and FIG. 2, which are the first embodiment of the present invention. The embodiment of the present invention provides a two-phase immersion heat dissipation structure with a skived fin having a high roughness surface, which is used to contact a heat generating element (heat source) immersed in a two-phase cooling liquid. As shown in the figure, the two-phase immersion heat dissipation structure with a skived fin having a high roughness surface provided by the embodiment of the present invention includes an immersion substrate 10 and a plurality of skived fins 20.

In this embodiment, the immersion substrate 10 can be made of a high thermal conductivity material, such as aluminum, copper or their alloys. The immersion substrate 10 can be a non-porous heat sink material or a porous heat sink material. Preferably, the immersion substrate 10 can be a porous metal heat sink immersed in the two-phase cooling liquid 900 (non-conductive electronic fluoride liquid) with a porosity greater than 8%, so that more bubbles can be generated in multiple micropores to enhance the immersion heat dissipation effect.

In this embodiment, the immersion substrate 10 has an upper surface 101 and a lower surface 102 facing each other. The lower surface 102 of the immersion substrate 10 is used to form contact with the heating element 800 immersed in the two-phase cooling liquid, and this contact can be formed directly or indirectly through an intermediate layer. The upper surface 101 of the immersion substrate 10 is connected to a plurality of shovel-shaped fins 20, and the plurality of shovel-shaped fins 20 are integrally formed on the upper surface 101 of the immersion substrate 10 by shoveling forming so as to be arranged at a very high density. In addition, the shovel-shaped fins 20 can be pin fins or plate fins, and can be made of copper, copper alloy or aluminum alloy.

Furthermore, when the scoop-shaped fin 20 is relatively small (thickness T is less than 800 μm), the surface area of the scoop-shaped fin 20 in contact with the two-phase cooling liquid 900 will have a significant impact on the immersion cooling effect. Therefore, the center line average roughness Ra of the surface 201 of the scoop-shaped fin 20 is greater than 10 μm, and the ten-point average roughness Rz of the surface 201 of the scoop-shaped fin 20 is greater than 10 μm. Rz) is to be greater than 20μm, so that the ratio of the surface area of the multiple scoop-shaped fins 20 in contact with the two-phase cooling liquid 900 to the volume of the multiple scoop-shaped fins 20 is greater than 400, so that the surface area of contact can be effectively increased by increasing the surface roughness, and the surface with high roughness is also conducive to the generation of bubbles, thereby enhancing the immersion heat dissipation effect.

Specifically, when the size (thickness T) of the scoop-shaped fin 20 is 100-800 microns and the fin spacing D between adjacent fins is 100-500 microns, the ratio of the centerline average roughness Ra of the surface 201 of the scoop-shaped fin 20 to the fin spacing D is in the range of 1:10 to 1:50, and the ratio of the ten-point average roughness Rz of the surface 201 of the scoop-shaped fin 20 to the fin spacing D is in the range of 1:10 to 1:30, so that the effect can be more significant.

In this embodiment, the surface 201 of the scoop-shaped fin 20 can be a rough processed surface formed by mechanical processing, such as shot peening, that is, the scoop-shaped fin 20 can be formed with a predetermined surface 201 by using hard sand particles to hit the scoop-shaped fin 20 at high speed.

In this embodiment, the surface 201 of the scoop-shaped fin 20 may be a rough etched surface formed by etching. In other words, the surface 201 of the scoop-shaped fin 20 may be formed by physical etching, such as ion etching. In addition, the surface 201 of the scoop-shaped fin 20 may be formed by chemical etching, such as by the corrosion of a chemical etching solution, and may be formed by chemical etching using a phosphoric acid-based micro-etching agent, a sulfuric acid-based micro-etching agent, or a ferric chloride-based micro-etching agent.

In this embodiment, the surface 201 of the shovel-shaped fin 20 may also be a rough deposition surface formed by deposition. Specifically, the surface 201 of the shovel-shaped fin 20 may be formed by liquid phase deposition or vapor phase deposition (physical or chemical vapor phase deposition).

[Second embodiment]

Please refer to FIG3 , which is a second embodiment of the present invention. This embodiment is substantially the same as the first embodiment, and the differences are described as follows.

In this embodiment, a high thermal conductivity structure 30 is further included. Furthermore, the high thermal conductivity structure 30 is bonded to the lower surface 102 of the immersion substrate 10, so that the immersion substrate 10 forms indirect contact with the heating element 800 immersed in the two-phase cooling liquid 900 through the high thermal conductivity structure 30. In detail, the high thermal conductivity structure 30 can be bonded to the lower surface 102 of the immersion substrate 10 by welding, friction stirring bonding, adhesive bonding, or diffusion bonding. In other embodiments, the immersion substrate 10 can be integrally formed with the high thermal conductivity structure 30.

Furthermore, a vacuum sealed cavity 301 is formed inside the high thermal conductivity structure 30, and the cavity top wall and cavity bottom wall of the vacuum sealed cavity 301 may also form a sintered body, and the vacuum sealed cavity 301 contains a proper amount of liquid, which may be water or acetone. Furthermore, the bottom surface of the high thermal conductivity structure 30 may be used to contact the heating element 800 immersed in the two-phase cooling liquid 900, so that the heating element 800 immersed in the two-phase cooling liquid 900 can not only absorb heat and vaporize the two-phase cooling liquid 900 to take away the heat energy generated by the heating element 800, but also contact and absorb the heat energy generated by the heating element 800 through the high thermal conductivity structure 30, so that the liquid in the vacuum sealed cavity 301 is vaporized and evaporated into steam. , dissipating to the immersion substrate 10 and quickly transferring the heat energy to the scoop-shaped fins 20 which are integrally formed with the immersion substrate 10 and arranged at a very high density, and utilizing the two-phase cooling liquid 900 to absorb heat and vaporize to take away the heat energy absorbed by the scoop-shaped fins 20, while the steam in the vacuum sealed chamber 301 hands over the heat energy and condenses on the top wall of the chamber and then flows back to the bottom wall of the chamber. With such a high-speed cycle, the heat energy generated by the heating element 800 can be quickly exported, thereby enhancing the immersion heat dissipation effect.

In summary, the two-phase immersion heat dissipation structure with scoop-shaped fins having a high roughness surface provided by the present invention can at least be achieved through "immersion substrate", "multiple scoop-shaped fins", "immersion substrate having an upper surface and a lower surface opposite to each other, the lower surface of the immersion substrate being used to form contact with a heat generating element immersed in a two-phase cooling liquid, the upper surface of the immersion substrate being connected to multiple scoop-shaped fins", "the center line of the surface of the scoop-shaped fin The average roughness Ra is greater than 10μm, and the ten-point average roughness Rz of the surface of the scoop-type fin is greater than 20μm, so that the ratio of the surface area of the multiple scoop-type fins in contact with the two-phase cooling liquid to the volume of the multiple scoop-type fins is greater than 400". This technical solution can effectively increase the surface area of the scoop-type fins in contact with the two-phase cooling liquid and is conducive to the generation of bubbles, thereby effectively enhancing the overall immersion heat dissipation effect.

The contents disclosed above are only preferred feasible embodiments of the present invention and are not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the specification and drawings of the present invention are included in the scope of the patent application of the present invention.

10: Immersed substrate 101: Upper surface 102: Lower surface 20: Scoop-shaped fins 201: Surface 30: High thermal conductivity structure 301: Vacuum sealed chamber 800: Heating element 900: Two-phase cooling liquid T: Thickness D: Fin spacing

FIG1 is a schematic side view of the structure of the first embodiment of the present invention.

FIG. 2 is an enlarged schematic diagram of part II of FIG. 1 .

FIG3 is a schematic side view of the structure of the second embodiment of the present invention.

10: Immersed substrate

101: Upper surface

102: Lower surface

20: Shovel-shaped fins

201: Surface

800:Heating element

900: Two-phase cooling liquid

T:Thickness

D: Fin spacing

Claims (9)

A two-phase immersion heat dissipation structure with scoop-shaped fins having a high-roughness surface includes an immersion substrate and a plurality of scoop-shaped fins. The immersion substrate has an upper surface and a lower surface opposite to each other. The lower surface of the immersion substrate is used to form contact with a heat generating element immersed in a two-phase cooling liquid. The upper surface of the immersion substrate is connected to a plurality of the scoop-shaped fins, and the centerline average roughness Ra of the surface of the scoop-shaped fin is greater than 10 μm, and the ten-point average roughness Rz of the surface of the scoop-shaped fin is greater than 20 μm, so that the ratio of the surface area of the plurality of the scoop-shaped fins in contact with the two-phase cooling liquid to the volume of the plurality of the scoop-shaped fins is greater than 400. A two-phase immersion heat dissipation structure with scoop-shaped fins having a high-roughness surface as described in claim 1, wherein the scoop-shaped fins are one of needle-column fins and plate-shaped fins. A two-phase immersion heat dissipation structure with a scoop-shaped fin having a high-roughness surface as described in claim 1, wherein the scoop-shaped fin is made of one metal selected from the group consisting of copper, copper alloy, and aluminum alloy. A two-phase immersion heat dissipation structure with a scoop-shaped fin having a high-roughness surface as described in claim 1, wherein the surface of the scoop-shaped fin is a rough processed surface formed by mechanical processing. A two-phase immersion heat dissipation structure with a scoop-shaped fin having a high-roughness surface as described in claim 1, wherein the surface of the scoop-shaped fin is a rough etched surface formed by etching. A two-phase immersion heat dissipation structure with a scoop-shaped fin having a high-roughness surface as described in claim 1, wherein the surface of the scoop-shaped fin is a rough deposition surface formed by deposition. A two-phase immersion heat dissipation structure with scoop-shaped fins having a high-roughness surface as described in claim 1, wherein the size of the scoop-shaped fins is 100-800 microns, and the fin spacing between adjacent scoop-shaped fins is 100-500 microns. A two-phase immersion heat dissipation structure with scoop-shaped fins having a high roughness surface as described in claim 7, wherein the ratio of the centerline average roughness Ra of the surface of the scoop-shaped fin to the fin spacing is in the range of 1:10 to 1:50, and the ratio of the ten-point average roughness Rz of the surface of the scoop-shaped fin to the fin spacing is in the range of 1:10 to 1:30. The two-phase immersion heat dissipation structure with a scoop-shaped fin having a high-roughness surface as described in claim 1 further includes: a high thermal conductivity structure, which is bonded to the lower surface of the immersion substrate, so that the immersion substrate forms an indirect contact with the heat generating element through the high thermal conductivity structure, and a vacuum-sealed cavity is formed inside the high thermal conductivity structure, and the vacuum-sealed cavity contains a liquid.

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