TWI787895B - Immersion-cooled porous heat-dissipation substrate structure - Google Patents

Abstract

An immersion-cooled porous heat-dissipation substrate structure is provided. The porous heat-dissipation substrate is formed by sintering powder metal and is immersed in a two-phase cooling liquid for increasing the number of bubbles generated. The porosity of the porous heat-dissipation substrate is controlled between 5% and 50%, or the porous heat-dissipation substrate has different porosities.

Description

Porous immersion heat dissipation substrate structure

The invention relates to a heat dissipation base material structure, in particular to a porous submerged heat dissipation base material structure.

The immersion cooling technology is to immerse the heating element (such as server, disk array, etc.) directly in the non-conductive cooling liquid, so as to take away the heat energy generated by the heating element through the heat absorption and vaporization of the cooling liquid. However, how to dissipate heat more effectively through immersion cooling technology has always been a problem to be solved in the industry.

In view of this, the inventor has been engaged in the development and design of related products for many years, and felt that the above-mentioned defects can be improved, so he devoted himself to research and combined with the application of theories, and finally proposed an invention with a reasonable design and effective improvement of the above-mentioned defects.

The technical problem to be solved by the present invention is to provide a porous submerged heat dissipation base material structure in view of the deficiencies of the prior art.

In order to solve the above technical problems, the present invention provides a porous submerged heat dissipation substrate structure, including: a porous heat dissipation substrate, which is formed by sintering metal powder and immersed in a two-phase cooling liquid to increase the generation of air bubbles ; Wherein, the porosity of the porous heat dissipation substrate is controlled between 5% and 50%.

In a preferred embodiment, the metal powder is selected from one or a combination of copper, aluminum, silver, and gold.

In order to solve the above technical problems, the present invention further provides a porous submerged heat dissipation substrate structure, including: a porous heat dissipation substrate, which is formed by sintering metal powder and immersed in a two-phase cooling liquid to increase the generation of air bubbles amount; wherein, the porous heat dissipation substrate has more than one porosity.

In a preferred embodiment, the metal powder is selected from one or a combination of copper, aluminum, silver, and gold.

In a preferred embodiment, the porous heat dissipation substrate includes a surface layer and an inner layer below the surface layer, the surface layer has a first porosity, the inner layer has a second porosity, and the The first porosity is higher than the second porosity.

In a preferred embodiment, the surface layer is in contact with the two-phase cooling liquid, and the inner layer is not in contact with the two-phase cooling liquid.

In a preferred embodiment, the holed heat dissipation base includes a base and a fin structure formed on the base, and the fin structure includes a plurality of fins arranged at intervals, which are connected to the The surface of the substrate, the substrate has a first porosity, the fin structure has a second porosity, and the second porosity is higher than the first porosity.

In a preferred embodiment, the porous heat dissipation substrate includes a central structure and a peripheral structure formed on the periphery of the central structure, the central structure has a first porosity, and the peripheral structure has a second porosity ratio, and the second porosity is higher than the first porosity.

The beneficial effect of the present invention lies at least in that the porous submerged heat dissipation substrate structure provided by the present invention can be formed by "the porous heat dissipation substrate is sintered with metal powder and immersed in a two-phase cooling liquid", "porous heat dissipation The porosity of the substrate is controlled between 5% and 50%, or the porous heat dissipation substrate has more than one porosity" technical solution, in addition to enhancing the number of bubbles generated, it can also achieve both high mechanical strength and enhanced heat dissipation. Effect.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

The following are specific examples to illustrate the implementation methods disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

[first embodiment]

Please refer to FIG. 1 , which is one embodiment of the present invention. The embodiment of the present invention provides a porous submerged heat dissipation substrate structure, which can be used to contact heating elements. As shown in FIG. 1 , according to the embodiment of the present invention, the porous submerged heat dissipation substrate structure includes a porous heat dissipation substrate 10 formed by sintering metal powder, and can be completely submerged in a two-phase cooling liquid 20 (such as electronic fluorinated fluid). Therefore, the embodiment of the present invention forms a submerged heat dissipation substrate structure with a porous structure through metal powder sintering and is immersed in the two-phase cooling liquid, so that the number of bubbles formed by the two-phase cooling liquid during the endothermic gasification can be greatly increased, thereby greatly Enhanced cooling effect.

The metal powder in this embodiment may be selected from one or a combination of copper, aluminum, silver, and gold. Moreover, it is worth mentioning that the porosity of the holed heat dissipation substrate 10 of this embodiment is controlled between 5% and 50%, so that the holed heat dissipation substrate 10 of this embodiment can achieve both High mechanical strength and enhanced heat dissipation effect.

In addition, it should be noted that FIG. 1 of this embodiment shows the hole structure in an exaggerated or enlarged manner, so as to better understand the present invention.

[Second Embodiment]

Please refer to FIG. 2 , which is one embodiment of the present invention. The embodiment of the present invention provides a porous submerged heat dissipation substrate structure, which can be used to contact heating elements. As shown in FIG. 2 , according to the structure of the porous submerged heat dissipation base material provided by the embodiment of the present invention, it includes a porous heat dissipation base 10 formed by sintering metal powder, and may be partially immersed in a two-phase cooling liquid 20 middle. Furthermore, the holed heat dissipation substrate 10 of this embodiment has more than one porosity.

Further, in this embodiment, the holed heat dissipation substrate 10 includes a surface layer 101 and an inner layer 102 under the surface layer 101 . Wherein, the surface layer 101 has a first porosity, the inner layer 102 has a second porosity, and the first porosity (such as 50% ~ 95%) is higher than the second porosity (such as 50% or less) , so that the mechanical strength of the inner layer 102 can be higher than that of the surface layer 101, that is, the mechanical strength of the main structure can be higher than that of the non-main structure.

Furthermore, the surface layer 101 of this embodiment may be in contact with the two-phase cooling liquid 20, and the inner layer 102 may not be in contact with the two-phase cooling liquid 20, so that the porous heat dissipation substrate 10 of this embodiment is partially submerged in In the two-phase cooling liquid, the generation of air bubbles on the surface layer 101 of the porous heat dissipation substrate 10 is increased to enhance the heat dissipation effect.

In addition, it should be noted that FIG. 2 of this embodiment shows the hole structure in an exaggerated or enlarged manner, so as to better understand the present invention.

[Third embodiment]

Please refer to FIG. 3 , which is one embodiment of the present invention. The embodiment of the present invention provides a porous submerged heat dissipation substrate structure, which can be used to contact heating elements. As shown in FIG. 3 , the porous submerged heat dissipation substrate structure provided according to the embodiment of the present invention includes a porous heat dissipation substrate 10 formed by sintering metal powder, and can be completely immersed in a two-phase cooling liquid 20 middle. Furthermore, the holed heat dissipation substrate 10 of this embodiment has more than one porosity.

Further, in this embodiment, the holed heat dissipation base 10 includes a base 103 and a fin structure 104 formed on the base 103 . Moreover, the fin structure 104 may include a plurality of fins 1041 arranged at intervals, which are connected to the surface of the base 103 . Wherein, the base 103 has a first porosity, the fin structure 104 has a second porosity, and the second porosity (such as 50%~95%) is higher than the first porosity (such as 50% or less ), so that the mechanical strength of the base 103 can be higher than that of the fin structure 104, that is, the mechanical strength of the main structure can be higher than that of the non-main structure. Therefore, the holed heat dissipation base 10 of this embodiment can enhance the heat dissipation effect through the fin structure 104, and can increase the generation amount of air bubbles through the fin structure 104 to further enhance the heat dissipation effect, and further make this embodiment The holed heat dissipation substrate 10 can achieve both high mechanical strength and enhanced heat dissipation.

In addition, it should be noted that FIG. 3 of this embodiment shows the hole structure in an exaggerated or enlarged manner, so as to better understand the present invention.

[Fourth embodiment]

Please refer to FIG. 4 , which is one embodiment of the present invention. The embodiment of the present invention provides a porous submerged heat dissipation substrate structure, which can be used to contact heating elements. As shown in FIG. 4 , according to the embodiment of the present invention, the porous submerged heat dissipation substrate structure includes a porous heat dissipation substrate 10 which is formed by sintering metal powder and can be completely immersed in a two-phase cooling liquid. . Furthermore, the holed heat dissipation substrate 10 of this embodiment has more than one porosity.

Further, in this embodiment, the holed heat dissipation base 10 includes a central structure 105 and a peripheral structure 106 formed around the central structure 105 . Wherein, the central structure 105 has a first porosity, the peripheral structure 106 has a second porosity, and the second porosity (such as 50% ~ 95%) is higher than the first porosity (such as 50% or less ), so that the mechanical strength of the central structure 105 of the holed heat dissipation substrate 10 can be higher than that of the peripheral structure 106, that is, the mechanical strength of the main structure can be higher than that of the non-main structures. Therefore, the porous heat dissipation substrate 10 of this embodiment can enhance the heat dissipation effect through the peripheral structure 106, and can increase the generation of air bubbles through the peripheral structure 106 to further enhance the heat dissipation effect, so that all the heat dissipation effects of the present embodiment can be improved. The perforated heat dissipation base 10 can achieve both high mechanical strength and enhanced heat dissipation.

In addition, it should be noted that FIG. 4 of this embodiment shows the hole structure in an exaggerated or enlarged manner, so as to better understand the present invention.

Based on the above, the porous submerged heat dissipation substrate structure provided by the embodiment of the present invention can be formed by "the porous heat dissipation substrate 10 is formed by sintering metal powder and immersed in a two-phase cooling liquid", "porous heat dissipation The porosity of the substrate 10 is controlled between 5% and 50%, or the porosity heat dissipation substrate 10 has more than one kind of porosity" technical solution, in addition to strengthening the number of bubbles generated, it can also achieve high mechanical strength and reinforcement at the same time. cooling effect.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

10: Porous heat dissipation base 101: surface layer 102: inner layer 103: Base 104: Fin structure 1041: fins 105: Central structure 106: Peripheral structure 20: Two-phase coolant

FIG. 1 is a schematic side view of a porous submerged heat dissipation substrate structure according to a first embodiment of the present invention.

FIG. 2 is a schematic side view of a porous submerged heat dissipation substrate structure according to a second embodiment of the present invention.

FIG. 3 is a schematic side view of a porous submerged heat dissipation substrate structure according to a third embodiment of the present invention.

FIG. 4 is a schematic perspective view of a structure of a porous submerged heat dissipation substrate according to a fourth embodiment of the present invention.

10: Porous heat dissipation base

20: Two-phase coolant

Claims (4)

A porous submerged heat dissipation substrate structure, comprising: a porous heat dissipation substrate, which is formed by sintering metal powder and immersed in a two-phase cooling liquid to increase the generation of air bubbles; wherein, the porous heat dissipation substrate includes There is a surface layer and an inner layer under the surface layer, the surface layer has a first porosity, the inner layer has a second porosity, and the first porosity is higher than the second porosity. The perforated immersion heat dissipation substrate structure according to claim 1, wherein the metal powder is selected from one or a combination of copper, aluminum, silver, and gold. The porous submerged heat dissipation substrate structure according to claim 1, wherein the surface layer is in contact with the two-phase cooling liquid, and the inner layer is not in contact with the two-phase cooling liquid. The perforated submerged heat dissipation substrate structure according to claim 1 further includes: a fin structure formed on the perforated heat dissipation substrate, and the fin structure includes a plurality of fins arranged at intervals. It is connected to the holed heat dissipation base.

Images