[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

TWI633719B - 壓接連接器及其製造方法 - Google Patents

壓接連接器及其製造方法 Download PDF

Info

Publication number
TWI633719B
TWI633719B TW106126643A TW106126643A TWI633719B TW I633719 B TWI633719 B TW I633719B TW 106126643 A TW106126643 A TW 106126643A TW 106126643 A TW106126643 A TW 106126643A TW I633719 B TWI633719 B TW I633719B
Authority
TW
Taiwan
Prior art keywords
spiral
base
contact
support
crimp connector
Prior art date
Application number
TW106126643A
Other languages
English (en)
Chinese (zh)
Other versions
TW201822411A (zh
Inventor
村山丈剛
佐藤一樹
前田征宣
佐野浩典
Original Assignee
日商阿爾普士電氣股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商阿爾普士電氣股份有限公司 filed Critical 日商阿爾普士電氣股份有限公司
Publication of TW201822411A publication Critical patent/TW201822411A/zh
Application granted granted Critical
Publication of TWI633719B publication Critical patent/TWI633719B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716Coupling device provided on the PCB
    • H01R12/718Contact members provided on the PCB without an insulating housing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02Soldered or welded connections
    • H01R4/029Welded connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0221Laser welding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
TW106126643A 2016-11-30 2017-08-08 壓接連接器及其製造方法 TWI633719B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016232042A JP6778596B2 (ja) 2016-11-30 2016-11-30 圧接コネクタおよびその製造方法
JP??2016-232042 2016-11-30

Publications (2)

Publication Number Publication Date
TW201822411A TW201822411A (zh) 2018-06-16
TWI633719B true TWI633719B (zh) 2018-08-21

Family

ID=62228232

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106126643A TWI633719B (zh) 2016-11-30 2017-08-08 壓接連接器及其製造方法

Country Status (4)

Country Link
JP (1) JP6778596B2 (ja)
KR (1) KR101977245B1 (ja)
CN (1) CN108123241B (ja)
TW (1) TWI633719B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112055905B (zh) 2018-05-01 2023-09-12 住友电气工业株式会社 燃料电池
JP6823229B2 (ja) * 2018-07-31 2021-01-27 株式会社T・P・S・クリエーションズ バネコンタクト
CN109713474B (zh) * 2019-02-18 2020-11-27 深圳市精睿兴业科技有限公司 电性连接弹片、连接器及电子设备
JP2021039919A (ja) * 2019-09-05 2021-03-11 株式会社東海理化電機製作所 導電ユニット

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201236278A (en) * 2011-01-18 2012-09-01 Tyco Electronics Corp Electrical contact for interconnect member
US20130109225A1 (en) * 2011-10-27 2013-05-02 Santa Electronics Inc. Electrical connector having low profile characteristics
US20130189880A1 (en) * 2012-01-19 2013-07-25 Ching-Shun Wang Electric connector with multi-transmission interfaces
TWM486871U (zh) * 2014-05-09 2014-09-21 Ching Cheng Rpecision Corp 電接觸元件之改良結構

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5366380A (en) * 1989-06-13 1994-11-22 General Datacomm, Inc. Spring biased tapered contact elements for electrical connectors and integrated circuit packages
KR20050059417A (ko) * 2003-12-12 2005-06-20 스미토모덴키고교가부시키가이샤 소용돌이 단자와 그 제조방법
JP5313156B2 (ja) * 2007-10-19 2013-10-09 日本発條株式会社 接続端子、半導体パッケージ、配線基板、コネクタ、およびマイクロコンタクタ
JP2010040373A (ja) * 2008-08-06 2010-02-18 Advanced Systems Japan Inc スパイラルコンタクタ、及びその製造方法
KR101474395B1 (ko) * 2012-11-15 2014-12-18 주식회사 엘지화학 인쇄 회로 기판, 인쇄 회로 기판 연결 구조 및 인쇄 회로 기판 연결 방법
KR101531868B1 (ko) * 2013-05-28 2015-06-26 (주)우주일렉트로닉스 양방향 입출 제한이 없는 접촉자
JP6224551B2 (ja) * 2014-05-23 2017-11-01 アルプス電気株式会社 圧接コネクタとその製造方法
JP6214053B2 (ja) * 2014-12-15 2017-10-18 アルプス電気株式会社 圧接コネクタ
CN204809469U (zh) * 2015-07-17 2015-11-25 荣益科技股份有限公司 具有回旋辅助支撑的表面安装弹片
TWI649923B (zh) * 2016-06-17 2019-02-01 日商阿爾普士電氣股份有限公司 Crimp type joint and manufacturing method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201236278A (en) * 2011-01-18 2012-09-01 Tyco Electronics Corp Electrical contact for interconnect member
US20130109225A1 (en) * 2011-10-27 2013-05-02 Santa Electronics Inc. Electrical connector having low profile characteristics
US20130189880A1 (en) * 2012-01-19 2013-07-25 Ching-Shun Wang Electric connector with multi-transmission interfaces
TWM486871U (zh) * 2014-05-09 2014-09-21 Ching Cheng Rpecision Corp 電接觸元件之改良結構

Also Published As

Publication number Publication date
KR101977245B1 (ko) 2019-05-10
JP6778596B2 (ja) 2020-11-04
CN108123241A (zh) 2018-06-05
JP2018088377A (ja) 2018-06-07
CN108123241B (zh) 2020-02-07
KR20180062346A (ko) 2018-06-08
TW201822411A (zh) 2018-06-16

Similar Documents

Publication Publication Date Title
TWI633719B (zh) 壓接連接器及其製造方法
US6730134B2 (en) Interposer assembly
JP4588711B2 (ja) 接続ピンの形成方法,プローブ,接続ピン,プローブカード及びプローブカードの製造方法
US7625216B2 (en) Electrical connector
US11824298B2 (en) Multi-part contact
WO2016199832A1 (ja) 接触部材
JP4957792B2 (ja) コネクタ、電子装置、及び、電子装置の製造方法
US10034373B2 (en) Circuit board secured to battery cell using a circuit board through hole and methods for welding the circuit board
US20180233839A1 (en) Press fit terminal
US9570827B2 (en) Contact member
KR102172785B1 (ko) 랜싱 프레스를 이용한 번-인 테스트 소켓용 랜스 콘택 핀 및 그 제조 방법
JP5078655B2 (ja) 接続端子、コネクタおよび半導体パッケージ
WO2019142745A1 (ja) コンタクト
JP2018045929A (ja) 接触端子
US6723950B1 (en) Method for welding thin tabs in wide slots
TWI616032B (zh) 壓接連接器
US9595491B2 (en) Apparatus for manufacturing semiconductor device and the semiconductor device
JP4943959B2 (ja) 半導体装置
CN210723469U (zh) 电连接器
JP6894632B2 (ja) コンタクト
US20240145957A1 (en) Board-to-board connector
WO2024219063A1 (ja) 半導体装置
CN108306128B (zh) 电连接器组件
JP2018073759A (ja) 圧接コネクタ
TWI442874B (zh) 彈片結構及應用該彈片結構之陣列式彈片裝置