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TWI318902B - Camera-assisted adjustment of bonding head elements - Google Patents

Camera-assisted adjustment of bonding head elements

Info

Publication number
TWI318902B
TWI318902B TW093123803A TW93123803A TWI318902B TW I318902 B TWI318902 B TW I318902B TW 093123803 A TW093123803 A TW 093123803A TW 93123803 A TW93123803 A TW 93123803A TW I318902 B TWI318902 B TW I318902B
Authority
TW
Taiwan
Prior art keywords
camera
bonding head
head elements
assisted adjustment
assisted
Prior art date
Application number
TW093123803A
Other languages
English (en)
Other versions
TW200513332A (en
Inventor
Frank Walther
Original Assignee
Hesse & Knipps Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hesse & Knipps Gmbh filed Critical Hesse & Knipps Gmbh
Publication of TW200513332A publication Critical patent/TW200513332A/zh
Application granted granted Critical
Publication of TWI318902B publication Critical patent/TWI318902B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
TW093123803A 2003-08-21 2004-08-09 Camera-assisted adjustment of bonding head elements TWI318902B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10338809A DE10338809B4 (de) 2003-08-21 2003-08-21 Verfahren und Vorrichtung zur Justage von Bondkopfelementen

Publications (2)

Publication Number Publication Date
TW200513332A TW200513332A (en) 2005-04-16
TWI318902B true TWI318902B (en) 2010-01-01

Family

ID=34201923

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093123803A TWI318902B (en) 2003-08-21 2004-08-09 Camera-assisted adjustment of bonding head elements

Country Status (10)

Country Link
US (2) US7461768B2 (zh)
EP (1) EP1656230B1 (zh)
JP (2) JP4685773B2 (zh)
KR (1) KR101118858B1 (zh)
CN (2) CN101992347B (zh)
DE (1) DE10338809B4 (zh)
HK (1) HK1152008A1 (zh)
MY (1) MY142885A (zh)
TW (1) TWI318902B (zh)
WO (1) WO2005028150A1 (zh)

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DE10338809B4 (de) 2003-08-21 2008-05-21 Hesse & Knipps Gmbh Verfahren und Vorrichtung zur Justage von Bondkopfelementen
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JP2007214342A (ja) * 2006-02-09 2007-08-23 Shinkawa Ltd ワイヤボンディング装置のキャピラリ接地位置データ設定方法
US20080197461A1 (en) * 2007-02-15 2008-08-21 Taiwan Semiconductor Manufacturing Co.,Ltd. Apparatus for wire bonding and integrated circuit chip package
US7597235B2 (en) * 2007-11-15 2009-10-06 Infineon Technologies Ag Apparatus and method for producing a bonding connection
US8847100B2 (en) * 2008-01-08 2014-09-30 Fanuc America Corporation Weld cap and tip inspection method and apparatus
JP4343985B2 (ja) * 2008-01-24 2009-10-14 株式会社新川 ボンディング装置及びボンディング装置のボンディングステージ高さ調整方法
US7810698B2 (en) * 2008-11-20 2010-10-12 Asm Assembly Automation Ltd. Vision system for positioning a bonding tool
WO2010090778A2 (en) * 2009-01-20 2010-08-12 Orthodyne Electronics Corporation Cutting blade for a wire bonding system
US8091762B1 (en) * 2010-12-08 2012-01-10 Asm Assembly Automation Ltd Wedge bonding method incorporating remote pattern recognition system
CN103229287B (zh) 2010-12-29 2017-02-01 奥瑟戴尼电子公司 用于对准超声键合系统的工装元件的方法及系统
US8777086B2 (en) * 2012-04-20 2014-07-15 Asm Technology Singapore Pte. Ltd. Image-assisted system for adjusting a bonding tool
US9136243B2 (en) 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
JP6339651B1 (ja) * 2016-12-02 2018-06-06 ファナック株式会社 アーク溶接ロボットシステム
DE102017204657A1 (de) 2017-03-21 2018-09-27 Schunk Sonosystems Gmbh Verfahren und Vorrichtung zur Herstellung einer Schweißbaugruppe
DE102017124303A1 (de) * 2017-10-18 2019-04-18 Grob-Werke Gmbh & Co. Kg Verfahren und Vorrichtung zur Montage einer Drahtführung an einem Brennerkopf für eine Beschichtungsanlage
US11205634B2 (en) * 2018-07-16 2021-12-21 Asm Technology Singapore Pte Ltd Bonding apparatus with replaceable bonding tool
CN111938450B (zh) * 2019-05-15 2023-08-22 广东美的生活电器制造有限公司 上盖组件及加热容器
US20220295931A1 (en) * 2019-06-04 2022-09-22 Snaps Ventures Inc. Attachment for caps
CN113411515A (zh) * 2021-06-18 2021-09-17 吉林大学 基于摄像头的tip头辅助定位系统及其定位和信息采集处理方法

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JP3416091B2 (ja) * 2000-01-21 2003-06-16 株式会社新川 ボンディング装置およびボンディング方法
JP3967518B2 (ja) * 2000-03-06 2007-08-29 株式会社新川 オフセット測定方法、ツール位置検出方法およびボンディング装置
JP4074426B2 (ja) * 2000-07-06 2008-04-09 三菱電機株式会社 半導体モジュール製造方法
DE10133885A1 (de) * 2000-07-21 2002-03-21 Esec Trading Sa Vorrichtung zur Herstellung von Drahtverbindungen
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JP4761672B2 (ja) * 2001-09-05 2011-08-31 株式会社東芝 ボンディング方法及びボンディング装置
JP3802403B2 (ja) * 2001-11-27 2006-07-26 株式会社新川 ワイヤボンディング方法及び装置
IL151255A0 (en) * 2002-08-14 2003-04-10 Ariel Yedidya System and method for interacting with computer using a video-camera image on screen and appurtenances useful therewith
JP4105926B2 (ja) * 2002-09-30 2008-06-25 株式会社新川 ボンディング装置におけるオフセット測定機構及びボンディング装置におけるオフセット測定方法
JP3941706B2 (ja) * 2003-02-17 2007-07-04 トヨタ自動車株式会社 調整方法と冶具
JP4128540B2 (ja) * 2003-06-05 2008-07-30 株式会社新川 ボンディング装置
DE10338809B4 (de) * 2003-08-21 2008-05-21 Hesse & Knipps Gmbh Verfahren und Vorrichtung zur Justage von Bondkopfelementen
WO2006023612A2 (en) * 2004-08-19 2006-03-02 Zetetic Institute Sub-nanometer overlay, critical dimension, and lithography tool projection optic metrology systems based on measurement of exposure induced changes in photoresist on wafers

Also Published As

Publication number Publication date
CN101992347B (zh) 2012-02-15
JP2007503111A (ja) 2007-02-15
DE10338809B4 (de) 2008-05-21
US20060157537A1 (en) 2006-07-20
WO2005028150A1 (de) 2005-03-31
CN1839010A (zh) 2006-09-27
KR20060060692A (ko) 2006-06-05
CN1839010B (zh) 2011-06-29
US20060255097A1 (en) 2006-11-16
MY142885A (en) 2011-01-31
KR101118858B1 (ko) 2012-03-19
JP5921062B2 (ja) 2016-05-24
DE10338809A1 (de) 2005-03-24
EP1656230A1 (de) 2006-05-17
TW200513332A (en) 2005-04-16
CN101992347A (zh) 2011-03-30
JP2011040780A (ja) 2011-02-24
HK1152008A1 (en) 2012-02-17
US7591408B2 (en) 2009-09-22
EP1656230B1 (de) 2017-04-05
JP4685773B2 (ja) 2011-05-18
US7461768B2 (en) 2008-12-09

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Legal Events

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