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TW201416822A - 散熱裝置組合 - Google Patents

散熱裝置組合 Download PDF

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Publication number
TW201416822A
TW201416822A TW101138177A TW101138177A TW201416822A TW 201416822 A TW201416822 A TW 201416822A TW 101138177 A TW101138177 A TW 101138177A TW 101138177 A TW101138177 A TW 101138177A TW 201416822 A TW201416822 A TW 201416822A
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Taiwan
Prior art keywords
air outlet
fins
heat
air inlet
heat sink
Prior art date
Application number
TW101138177A
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English (en)
Inventor
Shun-Siang Tu
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW101138177A priority Critical patent/TW201416822A/zh
Priority to US13/915,793 priority patent/US20140102670A1/en
Publication of TW201416822A publication Critical patent/TW201416822A/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Geometry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一種散熱裝置，包括複數平行設置之散熱片，複數散熱片之一側形成一第一進風口，複數散熱片之另一側形成一第一出風口，每一散熱片上斜向開設一開口，每一開口之上邊緣水平延伸出一擋風片，該擋風片連接於相鄰之兩散熱片之間，複數散熱片之間之擋風片形成一斜向之擋風壁，複數散熱片之底部形成一第二出風口，來自於該第一進風口之一部分風流經過複數散熱片後自該第一出風口流出，來自於該第一進風口之另一部分風流經過複數散熱片後被該擋風壁導向該第二出風口。

Description

散熱裝置組合
本發明涉及一種散熱裝置組合，尤指一種具有多個出風方向之散熱裝置組合。
隨著中央處理器等電子元件之輸出功率和工作頻率之不斷提高，其相應產生之熱量亦明顯增多，若不及時排除其產生之熱量，將導致熱量累積引起溫度升高，而嚴重影響電子元件之正常運行。為此，業界通常於該等發熱電子元件表面安裝一散熱器進行輔助散熱，同時於散熱器上加裝一風扇，以加強散熱效果。習知之散熱器只能從單一之出風方向將升溫後之風流排出，散熱效率不高。
鑒於以上內容，有必要提供一種具有多個出風方向之散熱裝置組合。
一種散熱裝置，包括一底板、一平行於該底板之頂板、及複數平行設置於該底板和頂板之間之散熱片，該底板和頂板之間於複數散熱片之一側形成一第一進風口，該底板和頂板之間於複數散熱片之另一側形成一第一出風口，每一散熱片上斜向開設一開口，每一開口之上邊緣水平延伸出一擋風片，該擋風片連接於相鄰之兩散熱片之間，複數散熱片之間之擋風片形成一斜向之擋風壁，該底板之一側於複數散熱片之底部形成一第二出風口，來自於該第一進風口之一部分風流經過複數散熱片後自該第一出風口流出，來自於該第一進風口之另一部分風流經過複數散熱片後被該擋風壁導向該第二出風口。
一種散熱裝置組合，包括一熱源、一散熱器、一連接該熱源和散熱器之熱管、及一安裝於該散熱器上之風扇，該散熱器包括複數平行設置之散熱片，複數散熱片之一側形成一第一進風口，複數散熱片之另一側形成一第一出風口，每一散熱片上斜向開設一開口，每一開口之上邊緣水平延伸出一擋風片，該擋風片連接於相鄰之兩散熱片之間，複數散熱片之間之擋風片形成一斜向之擋風壁，複數散熱片之底部形成一第二出風口，來自於該第一進風口之一部分風流經過複數散熱片後自該第一出風口流出，來自於該第一進風口之另一部分風流經過複數散熱片後被該擋風壁導向該第二出風口。
相較於習知技術，上述散熱裝置組合可將來自於該第一進風口之一部分風流經過複數散熱片後自該第一出風口流出，來自於該第一進風口之另一部分風流經過複數散熱片後被該擋風壁導向該第二出風口，提高了散熱效率。
請一併參閱圖1至圖3，於本發明一較佳實施方式中，一散熱裝置組合包括一熱源10、一散熱器20、一連接該熱源10和散熱器20之熱管30、及一安裝於該散熱器20上之風扇40。
該散熱器20包括一底板21、一平行於該底板21之頂板22、及複數平行設置於該底板21和頂板22之間之散熱片23。該底板21和頂板22之間於複數散熱片23之一側形成一第一進風口24。該底板21和頂板22之間於複數散熱片23之另一側形成一第一出風口25。每一散熱片23上斜向開設一開口231。每一開口231之上邊緣水平延伸出一擋風片232。該擋風片232連接於相鄰之兩散熱片23之間。複數散熱片23之間之擋風片232形成一斜向之擋風壁233。該底板21之一側於複數散熱片23之底部形成一第二出風口26。其中，該開口231呈矩形，複數散熱片23於該第一出風口25位置處呈一弧形面。該擋風片232於豎直方向上之尺寸等於相鄰兩散熱片23之間之間距。
該風扇40包括一殼體41和一安裝於該殼體41內可旋轉之葉輪42。該殼體41上開設一第二進風口43和一第三出風口44。該第二進風口43形成之進風通道與該風扇40之轉軸同向，該第三出風口44形成之出風通道與該風扇40之轉軸垂直。
請參閱圖4，安裝時，將該熱管30之一端安裝於該熱源10之底部，將該熱管30之另一端安裝於該散熱器20之底板21上。然後將該風扇40之第三出風口44正對該散熱器20之第一進風口24。
工作時，該熱源10產生之熱量經由該熱管30傳導至該散熱器20。來自該風扇40外部之氣流自該第二進風口43沿一第一方向流進該風扇40。該風扇40產生之氣流沿一第二方向流出該第三出風口44並進入該第一進風口24。來自於該第一進風口24之一部分風流經過複數散熱片23後自該第一出風口25流出，來自於該第一進風口24之另一部分風流經過複數散熱片23後被該擋風壁233導向該第二出風口26。來自於該風扇40外部之較低溫度之氣流被源源不斷之吹向該散熱器20，較低溫度之氣流在吸收了該散熱器20上之熱量後可經由該第一出風口25和該第二出風口26流出，提高了該散熱器20之散熱效率。
該散熱裝置組合可將來自於該第一進風口24之一部分風流經過複數散熱片23後自該第一出風口25流出，來自於該第一進風口24之另一部分風流經過複數散熱片23後被該擋風壁233導向該第二出風口26，提高了散熱效率。
綜上所述，本發明係合乎發明專利申請條件，爰依法提出專利申請。惟，以上所述僅為本發明之較佳實施例，舉凡熟悉本案技藝之人士其所爰依本案之創作精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍內。
10．．．熱源
20．．．散熱器
21．．．底板
22．．．頂板
23．．．散熱片
231．．．開口
232．．．擋風片
233．．．擋風壁
24．．．第一進風口
25．．．第一出風口
26．．．第二出風口
30．．．熱管
40．．．風扇
41．．．殼體
42．．．葉輪
43．．．第二進風口
44．．．第三出風口
圖1係本發明散熱裝置組合一較佳實施例之一分解圖，該散熱裝置組合包括一散熱器。
圖2係圖1之散熱器之一立體圖。
圖3係圖2沿III-III方向之剖視圖。
圖4係圖1之一立體組裝圖。
10．．．熱源
20．．．散熱器
30．．．熱管
40．．．風扇
41．．．殼體
42．．．葉輪
43．．．第二進風口
44．．．第三出風口

Claims (8)

  1. 一種散熱裝置，包括一底板、一平行於該底板之頂板、及複數平行設置於該底板和頂板之間之散熱片，該底板和頂板之間於複數散熱片之一側形成一第一進風口，該底板和頂板之間於複數散熱片之另一側形成一第一出風口，每一散熱片上斜向開設一開口，每一開口之上邊緣水平延伸出一擋風片，該擋風片連接於相鄰之兩散熱片之間，複數散熱片之間之擋風片形成一斜向之擋風壁，該底板之一側於複數散熱片之底部形成一第二出風口，來自於該第一進風口之一部分風流經過複數散熱片後自該第一出風口流出，來自於該第一進風口之另一部分風流經過複數散熱片後被該擋風壁導向該第二出風口。
  2. 如申請專利範圍第1項所述之散熱裝置，其中該擋風片於豎直方向上之尺寸等於相鄰兩散熱片之間之間距。
  3. 如申請專利範圍第1項所述之散熱裝置，其中該開口呈矩形，複數散熱片於該第一出風口位置處呈一弧形面。
  4. 一種散熱裝置組合，包括一熱源、一散熱器、一連接該熱源和散熱器之熱管、及一安裝於該散熱器上之風扇，該散熱器包括複數平行設置之散熱片，複數散熱片之一側形成一第一進風口，複數散熱片之另一側形成一第一出風口，其中每一散熱片上斜向開設一開口，每一開口之上邊緣水平延伸出一擋風片，該擋風片連接於相鄰之兩散熱片之間，複數散熱片之間之擋風片形成一斜向之擋風壁，複數散熱片之底部形成一第二出風口，來自於該第一進風口之一部分風流經過複數散熱片後自該第一出風口流出，來自於該第一進風口之另一部分風流經過複數散熱片後被該擋風壁導向該第二出風口。
  5. 如申請專利範圍第4項所述之散熱裝置組合，其中該擋風片於豎直方向上之尺寸等於相鄰兩散熱片之間之間距。
  6. 如申請專利範圍第4項所述之散熱裝置組合，其中該開口呈矩形，複數散熱片於該第一出風口位置處呈一弧形面。
  7. 如申請專利範圍第4項所述之散熱裝置組合，其中該風扇包括一第二進風口和一第三出風口，來自該風扇外部之氣流自該第二進風口沿一第一方向流進該風扇，該風扇產生之氣流沿一第二方向流出該第三出風口，該第三出風口和該第一進風口相連通。
  8. 如申請專利範圍第7項所述之散熱裝置組合，其中該第一方向垂直於該第二方向。
TW101138177A 2012-10-17 2012-10-17 散熱裝置組合 TW201416822A (zh)

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TW101138177A TW201416822A (zh) 2012-10-17 2012-10-17 散熱裝置組合
US13/915,793 US20140102670A1 (en) 2012-10-17 2013-06-12 Heat dissipating apparatus

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