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TR22838A - Bir ultra kesif entegre devre seklinde mikroelektronik cipler arasi ve cipten cipe ara baglanularini saglamak icin cihaz - Google Patents

Bir ultra kesif entegre devre seklinde mikroelektronik cipler arasi ve cipten cipe ara baglanularini saglamak icin cihaz

Info

Publication number
TR22838A
TR22838A TR695/86A TR69586A TR22838A TR 22838 A TR22838 A TR 22838A TR 695/86 A TR695/86 A TR 695/86A TR 69586 A TR69586 A TR 69586A TR 22838 A TR22838 A TR 22838A
Authority
TR
Turkey
Prior art keywords
chip
mesa
interface
ultra
integrated circuit
Prior art date
Application number
TR695/86A
Other languages
English (en)
Turkish (tr)
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of TR22838A publication Critical patent/TR22838A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Die Bonding (AREA)
TR695/86A 1985-12-20 1986-12-16 Bir ultra kesif entegre devre seklinde mikroelektronik cipler arasi ve cipten cipe ara baglanularini saglamak icin cihaz TR22838A (tr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81123985A 1985-12-20 1985-12-20

Publications (1)

Publication Number Publication Date
TR22838A true TR22838A (tr) 1988-08-22

Family

ID=25205984

Family Applications (1)

Application Number Title Priority Date Filing Date
TR695/86A TR22838A (tr) 1985-12-20 1986-12-16 Bir ultra kesif entegre devre seklinde mikroelektronik cipler arasi ve cipten cipe ara baglanularini saglamak icin cihaz

Country Status (7)

Country Link
EP (1) EP0250541A1 (xx)
JP (1) JPS63502071A (xx)
KR (1) KR900004719B1 (xx)
ES (1) ES2002443A6 (xx)
IL (1) IL80683A0 (xx)
TR (1) TR22838A (xx)
WO (1) WO1987004010A1 (xx)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3923533A1 (de) * 1989-07-15 1991-01-24 Diehl Gmbh & Co Anordnung eines integrierten schaltkreises auf einem schaltungstraeger
US5504035A (en) * 1989-08-28 1996-04-02 Lsi Logic Corporation Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate
US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
US5489804A (en) * 1989-08-28 1996-02-06 Lsi Logic Corporation Flexible preformed planar structures for interposing between a chip and a substrate
US5834799A (en) * 1989-08-28 1998-11-10 Lsi Logic Optically transmissive preformed planar structures
US5770889A (en) * 1995-12-29 1998-06-23 Lsi Logic Corporation Systems having advanced pre-formed planar structures

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1258660A (xx) * 1969-12-19 1971-12-30
JPS58151B2 (ja) * 1978-09-14 1983-01-05 宮川化成工業株式会社 蓄電池の端子導出部の製造方法
US4352449A (en) * 1979-12-26 1982-10-05 Bell Telephone Laboratories, Incorporated Fabrication of circuit packages
US4549247A (en) * 1980-11-21 1985-10-22 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for IC-modules
GB2144907A (en) * 1983-08-09 1985-03-13 Standard Telephones Cables Ltd Mounting integrated circuit devices
KR900001273B1 (ko) * 1983-12-23 1990-03-05 후지쑤 가부시끼가이샤 반도체 집적회로 장치

Also Published As

Publication number Publication date
WO1987004010A1 (en) 1987-07-02
JPS63502071A (ja) 1988-08-11
KR880701020A (ko) 1988-04-13
KR900004719B1 (ko) 1990-07-05
EP0250541A1 (en) 1988-01-07
ES2002443A6 (es) 1988-08-01
IL80683A0 (en) 1987-02-27

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