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IL80683A0 - Chip interface mesa - Google Patents

Chip interface mesa

Info

Publication number
IL80683A0
IL80683A0 IL80683A IL8068386A IL80683A0 IL 80683 A0 IL80683 A0 IL 80683A0 IL 80683 A IL80683 A IL 80683A IL 8068386 A IL8068386 A IL 8068386A IL 80683 A0 IL80683 A0 IL 80683A0
Authority
IL
Israel
Prior art keywords
chip interface
interface mesa
mesa
chip
interface
Prior art date
Application number
IL80683A
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of IL80683A0 publication Critical patent/IL80683A0/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492Bases or plates or solder therefor
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    • H01L2924/151Die mounting substrate
    • H01L2924/156Material
    • H01L2924/15786Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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    • H01L2924/30107Inductance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Die Bonding (AREA)
IL80683A 1985-12-20 1986-11-08 Chip interface mesa IL80683A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US81123985A 1985-12-20 1985-12-20

Publications (1)

Publication Number Publication Date
IL80683A0 true IL80683A0 (en) 1987-02-27

Family

ID=25205984

Family Applications (1)

Application Number Title Priority Date Filing Date
IL80683A IL80683A0 (en) 1985-12-20 1986-11-08 Chip interface mesa

Country Status (7)

Country Link
EP (1) EP0250541A1 (en)
JP (1) JPS63502071A (en)
KR (1) KR900004719B1 (en)
ES (1) ES2002443A6 (en)
IL (1) IL80683A0 (en)
TR (1) TR22838A (en)
WO (1) WO1987004010A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3923533A1 (en) * 1989-07-15 1991-01-24 Diehl Gmbh & Co ARRANGEMENT OF AN INTEGRATED CIRCUIT ON A CIRCUIT BOARD
US5504035A (en) * 1989-08-28 1996-04-02 Lsi Logic Corporation Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate
US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
US5489804A (en) * 1989-08-28 1996-02-06 Lsi Logic Corporation Flexible preformed planar structures for interposing between a chip and a substrate
US5834799A (en) * 1989-08-28 1998-11-10 Lsi Logic Optically transmissive preformed planar structures
US5770889A (en) * 1995-12-29 1998-06-23 Lsi Logic Corporation Systems having advanced pre-formed planar structures

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1258660A (en) * 1969-12-19 1971-12-30
JPS58151B2 (en) * 1978-09-14 1983-01-05 宮川化成工業株式会社 Method for manufacturing terminal lead-out portion of storage battery
US4352449A (en) * 1979-12-26 1982-10-05 Bell Telephone Laboratories, Incorporated Fabrication of circuit packages
US4549247A (en) * 1980-11-21 1985-10-22 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for IC-modules
GB2144907A (en) * 1983-08-09 1985-03-13 Standard Telephones Cables Ltd Mounting integrated circuit devices
KR900001273B1 (en) * 1983-12-23 1990-03-05 후지쑤 가부시끼가이샤 Semiconductor integrated circuit device

Also Published As

Publication number Publication date
WO1987004010A1 (en) 1987-07-02
JPS63502071A (en) 1988-08-11
KR880701020A (en) 1988-04-13
KR900004719B1 (en) 1990-07-05
EP0250541A1 (en) 1988-01-07
TR22838A (en) 1988-08-22
ES2002443A6 (en) 1988-08-01

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