SK287455B6 - Zariadenie a spôsob čistenia, leptania, aktivácie a následné úpravy povrchu skla, povrchu skla pokrytého kysličníkmi kovov a povrchu iných materiálov pokrytých SiO2 - Google Patents
Zariadenie a spôsob čistenia, leptania, aktivácie a následné úpravy povrchu skla, povrchu skla pokrytého kysličníkmi kovov a povrchu iných materiálov pokrytých SiO2 Download PDFInfo
- Publication number
- SK287455B6 SK287455B6 SK5052-2006A SK50522006A SK287455B6 SK 287455 B6 SK287455 B6 SK 287455B6 SK 50522006 A SK50522006 A SK 50522006A SK 287455 B6 SK287455 B6 SK 287455B6
- Authority
- SK
- Slovakia
- Prior art keywords
- layer
- glass
- coated
- plasma
- sio
- Prior art date
Links
- 239000011521 glass Substances 0.000 title claims abstract description 94
- 239000000463 material Substances 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 38
- 229910044991 metal oxide Inorganic materials 0.000 title claims abstract description 25
- 150000004706 metal oxides Chemical class 0.000 title claims abstract description 25
- 238000004140 cleaning Methods 0.000 title claims abstract description 19
- 238000001994 activation Methods 0.000 title claims abstract description 9
- 230000004913 activation Effects 0.000 title claims abstract description 9
- 238000005530 etching Methods 0.000 title claims abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract 18
- 229910052681 coesite Inorganic materials 0.000 title claims abstract 9
- 229910052906 cristobalite Inorganic materials 0.000 title claims abstract 9
- 239000000377 silicon dioxide Substances 0.000 title claims abstract 9
- 235000012239 silicon dioxide Nutrition 0.000 title claims abstract 9
- 229910052682 stishovite Inorganic materials 0.000 title claims abstract 9
- 229910052905 tridymite Inorganic materials 0.000 title claims abstract 9
- 238000011282 treatment Methods 0.000 title abstract description 11
- 239000003989 dielectric material Substances 0.000 claims abstract description 12
- 230000000737 periodic effect Effects 0.000 claims abstract description 3
- 239000011368 organic material Substances 0.000 claims abstract 13
- 239000000178 monomer Substances 0.000 claims abstract 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 46
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 238000000576 coating method Methods 0.000 claims description 12
- 238000004381 surface treatment Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 239000000443 aerosol Substances 0.000 claims description 5
- 229910001868 water Inorganic materials 0.000 claims description 5
- 230000003213 activating effect Effects 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 2
- 230000000712 assembly Effects 0.000 claims 3
- 238000000429 assembly Methods 0.000 claims 3
- 239000000839 emulsion Substances 0.000 claims 1
- 239000006260 foam Substances 0.000 claims 1
- 150000005826 halohydrocarbons Chemical class 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 238000007639 printing Methods 0.000 claims 1
- 239000011343 solid material Substances 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 239000000725 suspension Substances 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 3
- 210000002381 plasma Anatomy 0.000 description 65
- 239000010410 layer Substances 0.000 description 39
- 239000007789 gas Substances 0.000 description 16
- 239000000243 solution Substances 0.000 description 14
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 238000009832 plasma treatment Methods 0.000 description 7
- 229910010413 TiO 2 Inorganic materials 0.000 description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000012153 distilled water Substances 0.000 description 4
- 239000001307 helium Substances 0.000 description 4
- 229910052734 helium Inorganic materials 0.000 description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 101000580353 Rhea americana Rheacalcin-1 Proteins 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- VXUYXOFXAQZZMF-UHFFFAOYSA-N titanium(IV) isopropoxide Chemical compound CC(C)O[Ti](OC(C)C)(OC(C)C)OC(C)C VXUYXOFXAQZZMF-UHFFFAOYSA-N 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229910020175 SiOH Inorganic materials 0.000 description 1
- 241000700605 Viruses Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000012620 biological material Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- 238000004573 interface analysis Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000000678 plasma activation Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 238000005211 surface analysis Methods 0.000 description 1
- 238000004347 surface barrier Methods 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- QHGNHLZPVBIIPX-UHFFFAOYSA-N tin(ii) oxide Chemical class [Sn]=O QHGNHLZPVBIIPX-UHFFFAOYSA-N 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32825—Working under atmospheric pressure or higher
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32348—Dielectric barrier discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32559—Protection means, e.g. coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Surface Treatment Of Glass (AREA)
- Cleaning In General (AREA)
- Laminated Bodies (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SK5052-2006A SK287455B6 (sk) | 2006-06-08 | 2006-06-08 | Zariadenie a spôsob čistenia, leptania, aktivácie a následné úpravy povrchu skla, povrchu skla pokrytého kysličníkmi kovov a povrchu iných materiálov pokrytých SiO2 |
PCT/SK2007/050013 WO2007142612A1 (en) | 2006-06-08 | 2007-06-07 | Apparatus and method for cleaning, etching, activation and subsequent treatment of glass surfaces, glass surfaces coated by metal oxides, and surfaces of other sio2-coated materials |
EP07748765.0A EP2033207B1 (en) | 2006-06-08 | 2007-06-07 | Method for cleaning, etching, activation and subsequent treatment of glass surfaces, glass surfaces coated by metal oxides, and surfaces of other sio2-coated materials |
CN2007800211547A CN101473404B (zh) | 2006-06-08 | 2007-06-07 | 对玻璃表面,涂有金属氧化物的玻璃表面,和其他SiO2涂覆材料的表面进行清洗、蚀刻、活化和后续处理的装置和方法 |
US12/303,482 US20090194507A1 (en) | 2006-06-08 | 2007-06-07 | Apparatus and method for cleaning, etching, activation and subsequent treatment of glass surfaces, glass surfaces coated by metal oxides, and surfaces of other si02-coated materials |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SK5052-2006A SK287455B6 (sk) | 2006-06-08 | 2006-06-08 | Zariadenie a spôsob čistenia, leptania, aktivácie a následné úpravy povrchu skla, povrchu skla pokrytého kysličníkmi kovov a povrchu iných materiálov pokrytých SiO2 |
Publications (2)
Publication Number | Publication Date |
---|---|
SK50522006A3 SK50522006A3 (sk) | 2008-02-05 |
SK287455B6 true SK287455B6 (sk) | 2010-10-07 |
Family
ID=38519777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SK5052-2006A SK287455B6 (sk) | 2006-06-08 | 2006-06-08 | Zariadenie a spôsob čistenia, leptania, aktivácie a následné úpravy povrchu skla, povrchu skla pokrytého kysličníkmi kovov a povrchu iných materiálov pokrytých SiO2 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20090194507A1 (zh) |
EP (1) | EP2033207B1 (zh) |
CN (1) | CN101473404B (zh) |
SK (1) | SK287455B6 (zh) |
WO (1) | WO2007142612A1 (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SK51082006A3 (sk) * | 2006-12-05 | 2008-07-07 | Fakulta Matematiky, Fyziky A Informatiky Univerzitfakulta Matematiky, Fyziky A Informatiky Univerzity Komensk�Hoy Komensk�Ho | Zariadenie a spôsob úpravy povrchov kovov a metaloZariadenie a spôsob úpravy povrchov kovov a metaloidov, oxidov kovov a oxidov metaloidov a nitridovidov, oxidov kovov a oxidov metaloidov a nitridovkovov a nitridov metaloidovkovov a nitridov metaloidov |
TW201109285A (en) * | 2009-09-10 | 2011-03-16 | Applied Vacuum Coating Technologies Co Ltd | Method of strengthening glass plate |
JP2012033689A (ja) * | 2010-07-30 | 2012-02-16 | Sumitomo Electric Device Innovations Inc | 半導体装置の製造方法 |
US10161934B2 (en) | 2011-08-26 | 2018-12-25 | Aviana Molecular Technologies, Llc | Biocoated piezoelectric biosensor platform for point-of-care diagnostic use |
GB201202307D0 (en) * | 2012-02-10 | 2012-03-28 | Univ Bangor | Low temperture sintering of dye-sensitised solar cells using metal peroxide |
CN103500804B (zh) * | 2013-08-28 | 2016-03-16 | 京东方科技集团股份有限公司 | 一种薄膜及其制备方法、发光显示器件 |
US10703653B2 (en) * | 2016-02-17 | 2020-07-07 | Panasonic Intellectual Property Management Co., Ltd. | Liquid treatment device utilizing plasma |
TWI620228B (zh) | 2016-12-29 | 2018-04-01 | 財團法人工業技術研究院 | 電漿處理裝置與電漿處理方法 |
EP3585136A1 (en) * | 2018-06-20 | 2019-12-25 | Masarykova Univerzita | A method and device for generating low-temperature electrical water-based plasma at near-atmospheric pressures and its use |
EP3831792A4 (en) * | 2018-08-02 | 2022-05-11 | BYD Company Limited | GLASS COMPOSITE, HOUSING, DISPLAY DEVICE AND TERMINAL DEVICE |
CN112758887B (zh) * | 2021-01-05 | 2024-09-13 | 墨光新能科技(苏州)有限公司 | 一种掩膜刻蚀制备亚波长周期性阵列的方法 |
CN117510097A (zh) * | 2023-12-29 | 2024-02-06 | 核工业西南物理研究院 | 一种硅基陶瓷表面金属化方法及应用 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US265505A (en) * | 1882-10-03 | Eaphael josia | ||
US8229A (en) * | 1851-07-15 | Improvement in | ||
US45103A (en) * | 1864-11-15 | Morris wells | ||
US248A (en) * | 1837-06-30 | Lamps and lamp-torches | ||
US161433A (en) * | 1875-03-30 | Improvement in coal-hods | ||
US145174A (en) * | 1873-12-02 | Improvement in drawing-board trestles | ||
US76394A (en) * | 1868-04-07 | brock | ||
GB8909685D0 (en) * | 1989-04-27 | 1989-06-14 | British Petroleum Co Plc | Method for reducing fouling |
US5792517A (en) * | 1996-04-25 | 1998-08-11 | Japan Vilene Company | Process for treating the outer-inner surfaces of a porous non-conductor |
US6441553B1 (en) | 1999-02-01 | 2002-08-27 | Sigma Technologies International, Inc. | Electrode for glow-discharge atmospheric-pressure plasma treatment |
EP1073091A3 (en) * | 1999-07-27 | 2004-10-06 | Matsushita Electric Works, Ltd. | Electrode for plasma generation, plasma treatment apparatus using the electrode, and plasma treatment with the apparatus |
SK6292001A3 (en) * | 2001-05-04 | 2002-11-06 | Mirko Cernak | Method and device for the treatment of textile materials |
FR2836157B1 (fr) * | 2002-02-19 | 2004-04-09 | Usinor | Procede de nettoyage de la surface d'un materiau enduit d'une susbstance organique, generateur et dispositif de mise en oeuvre |
FR2836158B1 (fr) * | 2002-02-19 | 2005-01-07 | Usinor | Procede de nettoyage par plasma de la surface d'un materiau enduit d'une substance organique, et installation de mise en oeuvre |
WO2005062338A1 (en) * | 2003-12-22 | 2005-07-07 | Fuji Photo Film B. V. | Method of and arrangement for removing contaminants from a substrate surface using an atmospheric pressure glow plasma |
EP1548795A1 (en) * | 2003-12-22 | 2005-06-29 | Fuji Photo Film B.V. | Method and apparatus for stabilizing a glow discharge plasma under atmospheric conditions |
-
2006
- 2006-06-08 SK SK5052-2006A patent/SK287455B6/sk not_active IP Right Cessation
-
2007
- 2007-06-07 EP EP07748765.0A patent/EP2033207B1/en active Active
- 2007-06-07 CN CN2007800211547A patent/CN101473404B/zh not_active Expired - Fee Related
- 2007-06-07 US US12/303,482 patent/US20090194507A1/en not_active Abandoned
- 2007-06-07 WO PCT/SK2007/050013 patent/WO2007142612A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP2033207B1 (en) | 2017-11-01 |
CN101473404B (zh) | 2012-06-20 |
CN101473404A (zh) | 2009-07-01 |
WO2007142612A1 (en) | 2007-12-13 |
US20090194507A1 (en) | 2009-08-06 |
WO2007142612B1 (en) | 2008-01-31 |
EP2033207A1 (en) | 2009-03-11 |
SK50522006A3 (sk) | 2008-02-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SK287455B6 (sk) | Zariadenie a spôsob čistenia, leptania, aktivácie a následné úpravy povrchu skla, povrchu skla pokrytého kysličníkmi kovov a povrchu iných materiálov pokrytých SiO2 | |
US9132609B2 (en) | Method for fixation onto layer comprising amorphous carbon film, and laminate | |
US20100015358A1 (en) | Apparatus and method for surface finishing of metals and metalloids, metal oxides and metalloid oxides, and metal nitrides and metalloid nitrides | |
WO1996038311A1 (en) | Method and apparatus for cleaning surfaces with a glow discharge plasma at one atmosphere of pressure | |
US20090102886A1 (en) | Ambient plasma treatment of printer components | |
EP1913996A1 (en) | Surface modified member, surface treating method and surface treating system | |
EP2665091A2 (en) | Equipment for substrate surface treatment | |
JP5798747B2 (ja) | 積層体の製造方法 | |
JP2002509852A (ja) | ガラス表面の水蒸気プラズマ処理 | |
US20100186671A1 (en) | Arrangement for working substrates by means of plasma | |
JP4728306B2 (ja) | 静電チャック部材およびその製造方法 | |
JP2006520088A (ja) | 接着される基板を前処理するための方法および装置 | |
KR101341452B1 (ko) | 플라즈마 애싱 건식 초음파세정기 및 그 플라즈마 헤드 | |
EP2211369A1 (en) | Arrangement for working substrates by means of plasma | |
JP2018202308A (ja) | シランカップリング剤処理方法、シランカップリング剤処理基材の製造方法および積層体の製造方法 | |
JP2011108615A (ja) | プラズマ処理装置 | |
WO2010058648A1 (ja) | マイクロプラズマを用いた表面改質処理方法及び接合方法 | |
JP2013065433A (ja) | プラズマ照射装置及び表面改質方法 | |
WO2004028220A1 (en) | Method and apparatus for generating and maintaining a plasma | |
JP2006236747A (ja) | 透明電極及び透明電極の製造方法 | |
JP4420116B2 (ja) | プラズマ処理装置及びプラズマ処理方法 | |
JP6953823B2 (ja) | 液体塗布装置、および液体塗布方法。 | |
JP5598659B2 (ja) | コロナ放電装置およびその利用 | |
GB2458256A (en) | Surface activation and direct bonding of semiconductor wafers | |
JP2021030707A (ja) | ノズルプレート用積層体及びその製造方法、並びに該積層体を用いたノズルプレート及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Patent lapsed due to non-payment of maintenance fees |
Effective date: 20230608 |