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KR920020800A - Laser diode chip separator - Google Patents

Laser diode chip separator Download PDF

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Publication number
KR920020800A
KR920020800A KR1019910006054A KR910006054A KR920020800A KR 920020800 A KR920020800 A KR 920020800A KR 1019910006054 A KR1019910006054 A KR 1019910006054A KR 910006054 A KR910006054 A KR 910006054A KR 920020800 A KR920020800 A KR 920020800A
Authority
KR
South Korea
Prior art keywords
chip
vacuum
laser diode
bar
diode chip
Prior art date
Application number
KR1019910006054A
Other languages
Korean (ko)
Inventor
이상호
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019910006054A priority Critical patent/KR920020800A/en
Publication of KR920020800A publication Critical patent/KR920020800A/en

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

내용 없음No content

Description

레이저 다이오드 칩 분리장치Laser diode chip separator

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 웨이퍼에서 바(Bar)형태로 분리한 상태를 나타낸 사시도.1 is a perspective view showing a state in which the wafer is separated in the form of a bar.

제2도는 이 발명에 따른 칩 분리장치의 개략단면도.2 is a schematic cross-sectional view of a chip separating apparatus according to the present invention.

제3도는 제2도의 요부 확대 단면도.3 is an enlarged cross-sectional view of the main portion of FIG.

제4도는 종래의 칩 분리 상태도.4 is a conventional chip detachment state diagram.

Claims (5)

웨이퍼 상태에서 분리된 바형태의 칩을 날개로 분리하기 위한 레이저 다이오드 칩 분리장치에 있어서, 상면에 바형태의 칩이 놓여지고 이 칩을 고정시키도록된 고정수단과, 상기 고정수단에 의해 고정된 칩의 상부에 설치되어 좌, 우로 이송하면서 분리하고자 하는 부위에 순차적으로 흠집을 내는 커터와, 상기 펀치에 의해 분리된 칩을 흡착하여 분리위치로부터 이송시키는 진공편과, 상기 고정수단상에 고정된 바형태의 칩을 밀어 선단의 칩을 분리위치에 오도록하는 푸쉬바로 됨을 특징으로 하는 레이저 다이오드 칩 분리장치.A laser diode chip separating device for separating bar-shaped chips separated in a wafer state by a wing, comprising: fixing means for placing a bar-shaped chip on an upper surface and fixing the chip, and fixed by the fixing means. A cutter which is installed on the top of the chip and sequentially scratches the portion to be separated while transferring to the left and right, a vacuum piece for sucking the chip separated by the punch and transporting it from the separation position, and fixed on the fixing means. Laser diode chip separation device characterized in that it is a push bar for pushing the chip of the bar to bring the tip of the chip to the separation position. 제1항에 있어서, 상기 고정수단은, 2단의 상, 하측 스테이지와 이들을 상면에 설치하는 본체로 이루어지고, 상기 스테이지상에 놓여진 바형태의 칩을 흡입하여 고정시키는 진공흡입라인이 형성되는 레이저 다이오드 칩 분리장치.The laser beam of claim 1, wherein the fixing means comprises two stages of upper and lower stages and a main body for installing the upper and lower stages, and a vacuum suction line for sucking and fixing a bar-shaped chip placed on the stage. Diode chip separator. 제2항에 있어서, 상기 진공흡입라인은, 2단의 상, 하측 스테이지에 바형태의 칩간격과 동일한 간격으로 형성한 진공홀과, 본체에 형성한 하나의 진공라인으로 되는 레이저 다이오드 칩 분리장치.The laser diode chip separating apparatus of claim 2, wherein the vacuum suction line comprises vacuum holes formed in two stages at upper and lower stages at intervals identical to bar-shaped chip spacing, and one vacuum line formed in the main body. . 제3항에 있어서, 상기 상측 스테이지 진공홀이 하측 스테이지의 진공홀보다 작은 직경으로 되는 레이저 다이오드 칩 분리장치.The laser diode chip separating apparatus of claim 3, wherein the upper stage vacuum hole is smaller in diameter than the vacuum hole of the lower stage. 제1항에 있어서, 상기 진공핀은 끝단에 칩이 안착되는 요홈이 형성되고, 이 요홈은 진공판 내부에 형성된 진공홀과 연결되는 레이저 다이오드 칩 분리장치.The laser diode chip separating apparatus of claim 1, wherein the vacuum pin has a recess formed at a tip thereof, the recess being connected to a vacuum hole formed in the vacuum plate. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019910006054A 1991-04-16 1991-04-16 Laser diode chip separator KR920020800A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019910006054A KR920020800A (en) 1991-04-16 1991-04-16 Laser diode chip separator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910006054A KR920020800A (en) 1991-04-16 1991-04-16 Laser diode chip separator

Publications (1)

Publication Number Publication Date
KR920020800A true KR920020800A (en) 1992-11-21

Family

ID=67432891

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910006054A KR920020800A (en) 1991-04-16 1991-04-16 Laser diode chip separator

Country Status (1)

Country Link
KR (1) KR920020800A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100249700B1 (en) * 1996-12-23 2000-04-01 정몽규 Laser cutting device attachment cutting chip processing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100249700B1 (en) * 1996-12-23 2000-04-01 정몽규 Laser cutting device attachment cutting chip processing

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