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KR870002752A - 수평 안내회로 기판내에 천공된 구멍을 청소, 활성화, 금속 피복하는 방법 및 장치 - Google Patents

수평 안내회로 기판내에 천공된 구멍을 청소, 활성화, 금속 피복하는 방법 및 장치 Download PDF

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Publication number
KR870002752A
KR870002752A KR1019860006487A KR860006487A KR870002752A KR 870002752 A KR870002752 A KR 870002752A KR 1019860006487 A KR1019860006487 A KR 1019860006487A KR 860006487 A KR860006487 A KR 860006487A KR 870002752 A KR870002752 A KR 870002752A
Authority
KR
South Korea
Prior art keywords
nozzle
circuit board
activating
cleaning
circuit boards
Prior art date
Application number
KR1019860006487A
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English (en)
Other versions
KR930010062B1 (ko
Inventor
블래싱 호르스트
마이어 발터
Original Assignee
한스 뮐러, 게르하르트 리트케
쉐링 악티엔 게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6278093&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR870002752(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 한스 뮐러, 게르하르트 리트케, 쉐링 악티엔 게젤샤프트 filed Critical 한스 뮐러, 게르하르트 리트케
Publication of KR870002752A publication Critical patent/KR870002752A/ko
Application granted granted Critical
Publication of KR930010062B1 publication Critical patent/KR930010062B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S239/00—Fluid sprinkling, spraying, and diffusing
    • Y10S239/19—Nozzle materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S239/00—Fluid sprinkling, spraying, and diffusing
    • Y10S239/22—Safety air nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

내용 없음

Description

수평 안내회로 기판내에 천공된 구멍을 청소, 활성화, 금속 피복하는 방법 및 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 장치의 단면도.
제2도는 본 발명에 의한 장치의 사시도.
제3도는 처리단계의 개략도.
*도면의 주요 부분에 대한 부호의 설명
1:노즐하우징 2: 예비실 3: 천공된 마스크
4:노즐 내부 공간 5:노즐 6:양극
7:노즐 하우징과 회로 기판 사이의 간극 8: 회로 기판
9:초음파 진동기 10:입구 노즐 11:슬라이딩 접점
12:처리용액 13:펌프 14:탱크
15:안내롤러
A:회로 기판 하방의 노즐
A+B:초음파 진동기(9)를 가진 노즐
A+C:서로 수직으로 또는 엇갈리게 배치된 두 노즐
A+B+C:초음파 진동기(9)와 서로 대향 배치된 두 노즐
A+D:전해노즐(D)(양극+음극)
A+C+D:서로 대향된 전해노즐(D)(양극+음극)

Claims (8)

  1. 수평으로 안내되는 회로기판에 천공된 구멍을 청소, 활성화 또는 금속 피복하는 방법에 있어서, 회로기판이 일정한 속도로 운반 방향에 수직인 콘베이어 통로 하방에 위치된 노즐로 형성되어 있는 파형성부위를 횡단하여 이동하고, 이 노즐로부터 처리 용액이 일정한 파형으로 회로 기판 하부로 흐르는 것을 특징으로 하는 수평 안내 회로 기판내에 천공된 구멍을 청소, 활성화, 금속 피복하는 방법.
  2. 제1항에 있어서, 회로기판이 노즐 위쪽 1mm 거리에 배치되는 것을 특징으로 하는 방법.
  3. 제1항 또는 제2항중 어느 하나에 의한 방법을 실시하기 위한 장치에 있어서, 노즐이 입구 노즐을 가진 예비실에 의해 형성된 노즐 하우징의 상부에 배치되어 있고, 그 예비실은 천공된 마스크에 의하여 노즐 내부 공간의 상부와 분리되어 있는 것을 특징으로 하는 장치.
  4. 제3항에 있어서, 노즐이 홈구멍이 천공되거나, 구멍이 대칭 또는 비대칭으로 천공 또는 제공되어 있는 천공 평면의 형태로 되어 있는 것을 특징으로 하는 장치.
  5. 제3항에 있어서, 노즐 하우징의 상부가 노즐에 대하여 경사진 평면을 갖고 있는 것을 특징으로 하는 장치.
  6. 제3항에 있어서, 노즐 하우징의 내부, 특히 그 상부에 초음파 진동기가 배치되어 있을 것을 특징으로 하는 장치.
  7. 제3항에 있어서, 회전기판의 상, 하부측에 엇갈리게 배치된 2개의 노즐이 제공되어 있는 것을 특징으로 하는 장치.
  8. 제3항에 있어서, 노즐 하우징내에, 특히 그 하부에 양극이 고정되어 있는 것을 특징으로 하는 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860006487A 1985-08-06 1986-08-06 수평 안내 회로 기판내에 천공된 구멍을 청소, 활성화, 금속 피복하는 방법 및 장치 KR930010062B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DEP3528575.3 1985-08-06
DE19853528575 DE3528575A1 (de) 1985-08-06 1985-08-06 Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten
DE3528575.3 1985-08-06

Publications (2)

Publication Number Publication Date
KR870002752A true KR870002752A (ko) 1987-04-06
KR930010062B1 KR930010062B1 (ko) 1993-10-14

Family

ID=6278093

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860006487A KR930010062B1 (ko) 1985-08-06 1986-08-06 수평 안내 회로 기판내에 천공된 구멍을 청소, 활성화, 금속 피복하는 방법 및 장치

Country Status (11)

Country Link
US (1) US4789405A (ko)
EP (1) EP0212253B2 (ko)
JP (1) JPS6297396A (ko)
KR (1) KR930010062B1 (ko)
CN (1) CN1016483B (ko)
AT (1) AT397011B (ko)
BG (1) BG49390A3 (ko)
CA (1) CA1276528C (ko)
CZ (1) CZ278956B6 (ko)
DE (2) DE3528575A1 (ko)
SK (1) SK278074B6 (ko)

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DE3821980A1 (de) * 1988-06-29 1990-01-11 Schering Ag Vorrichtung und verfahren zur reinigung und behandlung von horizontal bewegten leiterplatten
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DE3916693A1 (de) * 1989-05-23 1990-11-29 Schering Ag Anordnung zur behandlung und/oder reinigung von gut, insbesondere von mit bohrungen versehenen leiterplatten
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Also Published As

Publication number Publication date
CN86105385A (zh) 1987-04-01
ATA209586A (de) 1993-05-15
BG49390A3 (en) 1991-10-15
AT397011B (de) 1994-01-25
CZ278956B6 (en) 1994-10-19
CN1016483B (zh) 1992-04-29
CA1276528C (en) 1990-11-20
EP0212253B1 (de) 1990-02-28
EP0212253A3 (en) 1987-08-12
SK278074B6 (en) 1995-12-06
US4789405A (en) 1988-12-06
KR930010062B1 (ko) 1993-10-14
JPS6297396A (ja) 1987-05-06
EP0212253B2 (de) 1998-11-11
DE3528575A1 (de) 1987-02-19
JPH0445996B2 (ko) 1992-07-28
DE3669256D1 (de) 1990-04-05
EP0212253A2 (de) 1987-03-04

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