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IT1256443B - Impianto galvanico a celle elettrolitiche contrapposte con alimentazione in continuo delle superfici da trattare - Google Patents

Impianto galvanico a celle elettrolitiche contrapposte con alimentazione in continuo delle superfici da trattare

Info

Publication number
IT1256443B
IT1256443B ITMI922679A ITMI922679A IT1256443B IT 1256443 B IT1256443 B IT 1256443B IT MI922679 A ITMI922679 A IT MI922679A IT MI922679 A ITMI922679 A IT MI922679A IT 1256443 B IT1256443 B IT 1256443B
Authority
IT
Italy
Prior art keywords
cell
electrolytic
solution
electrolytic cells
treated
Prior art date
Application number
ITMI922679A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to ITMI922679A priority Critical patent/IT1256443B/it
Publication of ITMI922679A0 publication Critical patent/ITMI922679A0/it
Priority to ES93203246T priority patent/ES2089701T3/es
Priority to EP93203246A priority patent/EP0599416B1/en
Priority to DE69302663T priority patent/DE69302663T2/de
Priority to US08/156,096 priority patent/US5417828A/en
Publication of ITMI922679A1 publication Critical patent/ITMI922679A1/it
Application granted granted Critical
Publication of IT1256443B publication Critical patent/IT1256443B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Impianto galvanico (1) per la deposizione elettrolitica di metalli su elementi piani quali piastre (3) di circuiti stampati e simili, orientate parallelamente alla direzione di avanzamento e alimentate in continuo tramite una apparecchiatura (4) di trasporto e alimentazione di corrente catodica alle piastre (3) stesse, caratterizzato dal fatto che presenta almeno una coppia di celle elettrolitiche (8) ciascuna dotata di una apertura (9c) di alimentazione e di una apertura (9a) di fuoriuscita della soluzione elettrolitica alimentata in continuo tramite relativi mezzi (7) di prelievo della medesima da un serbatoio di recupero (6), ciascuna cella essendo dotata di anodi (10) e di mezzi (12) di regolazione della portata della soluzione elettrolitica, ciascuna cella di detta almeno una coppia essendo disposta con la rispettiva apertura (9a) di fuoriuscita contrapposta a quella dell'altra cella in modo da determinare uno spazio vuoto attraverso il quale viene fatta passare la piastra (3) che viene in tal modo in contatto con la soluzione elettrolitica, essendo anche previsti elementi (11) di contenimento della caduta della soluzione atti a determinare il passaggio della soluzione stessa attraverso fori (3a) attraversanti la piastra (3) per la loro metallizzazione.
ITMI922679A 1992-11-23 1992-11-23 Impianto galvanico a celle elettrolitiche contrapposte con alimentazione in continuo delle superfici da trattare IT1256443B (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
ITMI922679A IT1256443B (it) 1992-11-23 1992-11-23 Impianto galvanico a celle elettrolitiche contrapposte con alimentazione in continuo delle superfici da trattare
ES93203246T ES2089701T3 (es) 1992-11-23 1993-11-19 Instalacion de electrodeposicion con celdas electroliticas opuestas y alimentacion continua de superficie a tratar.
EP93203246A EP0599416B1 (en) 1992-11-23 1993-11-19 Electroplating plant with opposed electrolitic cells and continuous feed of the surfaces to be treated
DE69302663T DE69302663T2 (de) 1992-11-23 1993-11-19 Elektroplattierungsanlage mit gegenüberliegenden elektrolytischen Zellen und kontinuierlicher Beschickung mit den zu behandelnden Oberflächen
US08/156,096 US5417828A (en) 1992-11-23 1993-11-22 Electroplating plant with opposed electrolitic cells and continuous feed of the workpieces to be plated

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI922679A IT1256443B (it) 1992-11-23 1992-11-23 Impianto galvanico a celle elettrolitiche contrapposte con alimentazione in continuo delle superfici da trattare

Publications (3)

Publication Number Publication Date
ITMI922679A0 ITMI922679A0 (it) 1992-11-23
ITMI922679A1 ITMI922679A1 (it) 1994-05-23
IT1256443B true IT1256443B (it) 1995-12-05

Family

ID=11364336

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI922679A IT1256443B (it) 1992-11-23 1992-11-23 Impianto galvanico a celle elettrolitiche contrapposte con alimentazione in continuo delle superfici da trattare

Country Status (5)

Country Link
US (1) US5417828A (it)
EP (1) EP0599416B1 (it)
DE (1) DE69302663T2 (it)
ES (1) ES2089701T3 (it)
IT (1) IT1256443B (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE59501606D1 (de) * 1994-05-11 1998-04-16 Siemens Sa Vorrichtung zur behandlung von leiterplatten
JP3043319B2 (ja) * 1998-09-25 2000-05-22 栄電子工業株式会社 連続メッキ装置
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
US6676820B2 (en) 2001-03-02 2004-01-13 Ppg Industries Ohio, Inc. Process for electrocoating metal blanks and coiled metal substrates
US7204918B2 (en) * 2003-03-10 2007-04-17 Modular Components National, Inc. High efficiency plating apparatus and method
CN114540933B (zh) * 2022-03-03 2023-04-25 常熟市新达模塑成型有限公司 一种无测量装置可连续控制电解液深度的电解池及其调节方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4401522A (en) * 1980-09-29 1983-08-30 Micro-Plate, Inc. Plating method and apparatus
US4402800A (en) * 1981-10-02 1983-09-06 Ash James J Apparatus and method of treating tabs of printed circuit boards and the like
US4587000A (en) * 1984-11-19 1986-05-06 Pellegrino Peter P Electroplating method and apparatus for electroplating high aspect ratio thru-holes
DE3528575A1 (de) * 1985-08-06 1987-02-19 Schering Ag Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten
JPH0765209B2 (ja) * 1985-12-06 1995-07-12 ヤマハ発動機株式会社 電気めっき装置
US4755271A (en) * 1986-07-28 1988-07-05 Siemens Aktiengesellschaft Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
US4761213A (en) * 1986-07-28 1988-08-02 Siemens Aktiengesellschaft Treatment facility particularly for printed circuit boards to be treated while in a horizontal plane
US4871435A (en) * 1988-10-14 1989-10-03 Charles Denofrio Electroplating apparatus

Also Published As

Publication number Publication date
ITMI922679A0 (it) 1992-11-23
US5417828A (en) 1995-05-23
DE69302663D1 (de) 1996-06-20
ITMI922679A1 (it) 1994-05-23
EP0599416A1 (en) 1994-06-01
EP0599416B1 (en) 1996-05-15
DE69302663T2 (de) 1996-12-05
ES2089701T3 (es) 1996-10-01

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19951129