KR20190013498A - Device for preventing dust scattering and substrate machining apparatus having the same - Google Patents

Abstract

Disclosed are a device for preventing dust scattering and substrate processing device having the same, capable of preventing minute foreign substances such as dust from adhering to a substrate, thereby obtaining a high quality product. The device (14A, 15A, 16A) for preventing dust scattering to prevent dust from adhering to a surface of a substrate (W) to be processed includes: covers (14, 16) covering the surface of the substrate (W) with a space therebetween; and a pressing means for always pressing the space in the cover, wherein the pressing means is configured to inject pressurized air into the covers (14, 16) from an air inlet (17) opened to the covers (14, 16).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate processing apparatus having a dust scattering preventing device and a dust scattering preventing device.

The present invention relates to a dust scattering prevention device applied to a substrate processing apparatus for processing a scribe line (cutting groove) on a brittle material substrate such as glass or dividing a substrate along a scribe line, And a substrate processing apparatus equipped with the apparatus.

Particularly, the present invention relates to a method of manufacturing a flexible OLED (Organic Light Emitting Diode) display, in which a resin substrate (a polyimide film (also referred to as a PI film)) serving as a flexible substrate is laminated on a glass substrate, 0001] The present invention relates to a dust scattering prevention device used in a substrate processing apparatus for processing or dividing a line.

Conventionally, the scribe line is formed by pressing the cutter wheel against the surface of the substrate, and then an external force is applied from the surface opposite to the scribe line formation surface along the scribe line in the process of dividing the brittle material substrate such as the glass substrate And the substrate is divided by unit substrate by bending the substrate (see Patent Document 1).

In recent years, it has become necessary to further improve the surface quality of the substrate and the strength of the end face since the display is required to have a finer definition. In addition, there is also a demand for a flexible display from the viewpoint of expanding the use of displays, and OLEDs using flexible substrates are being manufactured. In such an OLED display, a resin film (PI film) is formed on a glass substrate in the manufacturing process, and an organic film having an electrode layer or an organic EL layer is formed thereon. The film thickness of the electrode layer, the organic EL layer, and the like is thin and the composition is very delicate. Even if a very small foreign matter is adhered to the surface of the resin film, defects are generated, which affects the yield reduction.

In order to obtain a high-quality, high-productivity OLED display manufacturing technique, it is necessary to avoid the occurrence of scratches or adherence of minute foreign substances such as dust to a glass plate on which a resin film (PI film) is formed before the organic film formation. That is, scratches on the glass plate cause deterioration in strength, and foreign substances adhered to the glass plate are transferred to the organic film forming process, which causes deterioration of the working environment.

In addition, if scratches or minute foreign matter adhere to the back surface of the glass plate, it may cause a peeling failure in the Lift-Off process of separating the glass substrate and the resin film of the product after formation of the organic film, It is necessary to avoid occurrence of scratches and attachment of dust to the back side as much as possible in addition to the above (the organic film formation side).

Japanese Patent Publication No. 5210356

In a general substrate processing apparatus, dust such as fine cutting powder generated during scribing line processing or division is transferred to the next step while being attached to both sides of the substrate, and this is a major cause of deterioration of product quality. Further, when the substrate to be processed is moved to the scribing position, the substrate is transported to the upper surface of the conveyor or the table, so that the back surface of the substrate always comes into contact with the surface of the conveyor or the table. Also, during the scribing, since the scribe lines are sandwiched between the left and right sides and the back side of both sides is held by the conveyor or the table, the back surface of the substrate is also in contact. In such a case, the longer the contact time and the longer the moving distance in the contact state, the greater the probability of occurrence of small scratches on the back surface of the substrate and the probability of adhesion of minute foreign substances such as dust on the conveyor or table And the yield is deteriorated, resulting in a problem of manufacturing a high-precision and high-quality product.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a dust scattering prevention device capable of efficiently preventing micro-foreign matter such as dust from adhering to a substrate in the process of transporting or processing a substrate, And to provide a substrate processing apparatus equipped therewith.

In order to solve the above-mentioned problems, the present invention takes the following technical means. That is, the dust-scattering prevention device of the present invention is a dust-scattering prevention device for preventing dust from adhering to the surface of a substrate to be processed. The dust-scattering prevention device includes a cover for covering a surface of a substrate to be processed with a space therebetween, And the pressurizing means is configured to inject pressure air into the cover from the air inlet opening on the cover.

According to the present invention, since the space in the cover is always pressed as described above, it is possible to prevent the dust from the outside from flowing into the cover. As a result, internal scattering of minute foreign matter such as dust can be reduced to prevent dust from adhering to the substrate, and a product with high precision and high quality can be obtained.

According to another aspect of the present invention, there is provided a substrate processing apparatus for processing a scribe line on a substrate, comprising: a scribe mechanism for processing a scribe line on a substrate; and the dust scattering prevention device as set forth in claim 1, An upstream conveying section for conveying the substrate to the scribing mechanism, or a downstream conveying section for conveying the substrate from the scribing mechanism, or both. In this case, a brake mechanism may be used instead of the scribe mechanism, or a substrate processing apparatus provided with both mechanisms may be used.

Accordingly, the space in the cover covering the substrate in the conveying process is pressurized to prevent the dust from flowing, and the scattering of dust inside the dust can be reduced to prevent the dust from adhering to the substrate, and a high- can do.

As a substrate to be processed in the present invention, a mother substrate for an OLED display in which a resin film for forming an organic film is laminated on the upper surface of a glass plate is suitable.

1 is a schematic side view of a substrate processing apparatus including a dust scattering prevention device according to the present invention;
Fig. 2 is a schematic plan view of the substrate processing apparatus in Fig. 1; Fig.
3 is an enlarged front view of a scribe / break mechanism portion of the substrate processing apparatus in Fig.
Fig. 4 is an enlarged side view similar to Fig. 3; Fig.
5 is a perspective view showing a substrate to be processed according to the present invention;
6 is a cross-sectional view and a bottom view showing a cleaner according to the present invention.
7 is a perspective view showing a state in which a substrate is gripped by an upstream clamp and a downstream clamp.
8 is a cross-sectional view showing a scribe line processing time of the scribe / break mechanism portion.
9 is a cross-sectional view showing the brake operation of the scribe / break mechanism portion.
10 is a cross-sectional view showing the operation of the cleaner.
11 is a plan view showing a first step of the operation of the substrate processing apparatus;
12 is a plan view showing a second step of the operation of the substrate processing apparatus;
13 is a plan view showing a third step of the operation of the substrate processing apparatus;
14 is a plan view showing a fourth step of the operation of the substrate processing apparatus;
15 is a plan view showing a fifth step of the operation of the substrate processing apparatus;
16 is a plan view showing a sixth step of the operation of the substrate processing apparatus;
17 is a plan view showing a seventh step of the operation of the substrate processing apparatus.

Hereinafter, one embodiment of the dust scattering prevention device and the substrate processing apparatus according to the present invention will be described in detail with reference to the drawings.

Fig. 1 is a side view schematically showing the entire substrate processing apparatus A including the dust scattering prevention devices 14A, 15A and 16A according to the present invention, and Fig. 2 is a plan view thereof.

The substrate processing apparatus A includes an upstream conveying section B that linearly conveys the substrate W to be processed in a horizontal posture from the upstream to the downstream in a straight line, A scribing / breaking mechanism section C as a substrate processing section for dividing the substrate W along the scribing line while processing the scribing line in the direction orthogonal to the scribing line and a scribing / And a carry section D as shown in FIG. A substrate feeding portion E for feeding the substrate W to be machined to the upstream carrying portion B of the substrate processing apparatus A is disposed on the upstream side of the upstream carrying portion B. In the following description, the carrying direction of the substrate W is the X direction, and the direction orthogonal to the X direction is the Y direction.

The substrate W processed by the substrate processing apparatus A is used as a mother substrate in the manufacturing process of the OLED display. As shown in Fig. 5, the substrate W is an organic A thin resin film W1 for film formation is formed. An area where the resin film W1 is not formed along the line to be scribed L is formed in a strip shape. For the resin film W1, a polyimide film (PI film) is used.

The upstream conveying section B of the substrate processing apparatus A includes a float table 1 for floating the substrate W in a horizontal posture by the jet air pressure and a float table 1 for moving the upstream end edge portion of the floated substrate W And a clamp 2 that grips and carries it to the downstream side. The clamp 2 is supported by a transverse member 2a extending in the Y direction and the transverse member 2a is supported by left and right rails 2b arranged in parallel along the conveying direction And 2b. In the present embodiment, a floating mechanism (air float means) for blowing air out of the float table 1 to float the substrate W to float the substrate W is provided with a plurality of small openings Holes 1a are formed so as to form the nozzles for jetting the air, but an air jet nozzle may be formed along the float table 1. In addition, the float table 1 is provided on a pedestal 10.

The scribing / breaking mechanism portion C is provided with a gate-shaped bridge 3 arranged so as to extend over the substrate W to be transferred. 3 and 4, a pair of upper and lower guide rails 4a and 4b are arranged along the Y direction so as to sandwich the transferred substrate W from above and below, The upper scribe head 5a is movable on the upper guide rail 4a and the lower scribe head 5b is movable on the lower guide rail 4b in the Y direction. Respectively.

The lower scribing head 5b is provided with a cutter wheel 7 for cutting a scribe line. The upper scribing head 5a is fixed to the upper scribing head 5a by a receiving roller 6 having a flat outer circumferential surface, And a separating roller 8 are vertically movably mounted by an elevating mechanism (not shown). The dividing roller 8 is provided with a V-shaped groove 8a (see FIG. 9) on its outer peripheral surface.

The upper guide rail 4a is formed with a cleaner 9 for sucking and removing micro-particles after the scribing line is formed to be movable in the Y direction through the head 9a. 6, the cleaner 9 has an elongated air suction port 9b having a longitudinal direction in the X direction and a plurality of air blow-out ports 9c for blowing air around the air suction port 9b The cleaner 9 is moved above the scribe line of the substrate W along the scribing line to suck micro-foreign substances such as dust and the like through the air suction port 9b, The substrate W is prevented from coming into close contact with the lower surface of the cleaner 9 by the blow-out air from the cleaner 9. Thus, by preventing the dust from flowing into the cover, it is possible to prevent scattering of minute particles such as dust inside the dust, thereby preventing dust from adhering to the substrate, and obtaining a product with high precision and high quality.

The downstream conveying section D of the substrate processing apparatus A is configured to raise the substrate W in a horizontal posture by the ejection air pressure from the small hole 11a in the same manner as the upstream conveyance section B described above A float table 11 and a clamp 12 holding the downstream side end portion of the floated substrate W and carrying it to the downstream side. The clamp 12 is supported by a transverse member 12a extending in the Y direction and the transverse member 12a is movably assembled to the left and right rails 12b and 12b arranged in parallel along the X direction. On the downstream side of the float table 11, a discharge conveyor 13 for discharging the divided substrates Wa and Wb to the outside of the substrate processing apparatus A is formed.

The substrate processing apparatus A further includes a dust scattering prevention device 14A for preventing scattering of minute foreign matter such as dust to the upstream conveying section B, the scribing / breaking mechanism section C and the downstream conveying section D, , 15A and 16A are formed. The dust scattering prevention devices 14A, 15A and 16A are provided with covers 14, 15 and 16 for individually covering the upstream conveying section B, the scribing / breaking mechanism section C and the downstream conveying section D, The covers 14, 15 and 16 are provided with entrance and exit ports 14a, 15a and 16a for loading and unloading the substrate W, respectively. Shutters 14b, 15b, and 16b that can be opened and closed are attached to the respective ports.

The upstream side transfer portion B and the downstream side transfer portion D of the scattering prevention devices 14A and 16A are provided with pressing means for always pressing the inner space of the covers 14 and 16. Pressure air inlets 17 and 18 for injecting pressure air are formed in the ceiling of the covers 14 and 16 and the pressure applied from the pressure air inlets 17 and 18 And air is injected into the covers 14 and 16. Further, in order to supply air continuously, a small slit-shaped opening (not shown) is formed on the side walls of the covers 14 and 16 so that a part of the air is discharged. Accordingly, dust from the scribe / break mechanism portion C or the outside is prevented from flowing, and scattering of minute foreign substances such as dust is reduced, and dust or the like is prevented from adhering to the substrate W.

In the scattering prevention device 15A of the scribing / breaking mechanism portion C, the inner space of the cover 15 is always reduced in pressure by the decompression means. In this embodiment as the decompression means, an air evacuation mechanism 19 is arranged in the internal space, and the inside of the cover 15 is depressurized by air suction by the air evacuation mechanism 19. As a result, the inside of the cover 15 is prevented from being contaminated by aspiration and removal of minute foreign matter such as dust generated during the processing and the dividing step of the scribe line.

An ionizer 20 for preventing electrification of the substrate W is formed in the covers 14 and 16 of the upstream carry section B and the downstream carry section D. The static eliminator 20 is preferably a photo-ionizer using soft X-rays that do not generate ozone. A plurality of static eliminators 20 are provided along the conveying direction of the substrate W at the ceiling bottom of the covers 14 and 16. By providing the static eliminator 20 in the sealed covers 14 and 16, efficiency of erasing can be improved and external leakage of soft X-rays can be prevented.

The sensor 21 for detecting the distance between the floated tables 1 and 11, that is, the floating amount, on the floated substrate W is set to be constant in the substrate carrying area of the upstream carrying section B and the downstream carrying section D There are a plurality of installed at intervals. When an abnormality of the floating amount is detected, the ejection pressure of the air is increased or decreased to maintain the floating position at all times.

If the float tables 1 and 11 are divided into a plurality of blocks and the sensors 21 and the plurality of small holes 1a are formed in each block and the amount of air blown for each block can be adjusted, The posture can be adjusted more finely.

The substrate supply section E for supplying the substrate W to the float table 1 of the upstream carry section B is movable up and down and back and forth by a drive mechanism And a fork pawl 22 having a small contact surface with the fork pawl 22 is used. Alternatively, the substrate W may be sent by, for example, a conveyor, a crankpole, or the like.

The small holes 1a and 11a for blowing air in the float tables 1 and 11 in the substrate processing apparatus A described above, the air suction port 9b of the cleaner 9 and the air outlet 9c, The pressure air inflow ports 17 and 18 of the upstream conveying section B and the covers 14 and 16 of the downstream conveyance section D and the air venting mechanism 19 of the cover 15 are connected to the air circulation passage (Not shown).

Next, the operation of the substrate processing apparatus A will be described with reference to Figs. 2 and 8 to 17 in order.

2 shows a state immediately before the substrate W is sent to the substrate processing apparatus A. The substrate W is moved in the Y direction with the planned scribing line L and the glass plate W2 5) is placed on the fork pole 22 of the substrate supply section E with the lower side thereof facing downward. The shutter 14b of the upstream side entrance port 14a of the upstream transfer section B is opened to insert the fork pole 22 and the substrate W is placed on the float table 1 of the upstream transfer section B, Lt; / RTI > Thereafter, the fork pole 22 is returned to its original position, the shutter 14b is closed, the substrate W is floated, and the upstream end thereof is held by the clamp 2 (see Fig. 11).

Next, the shutters of the upstream side entrance / exit port 14a of the upstream conveyance section B, the entrance / exit ports 15a and 15a of both sides of the scribing / breaking mechanism section C and the upstream side entrance / exit port 16a of the downstream conveyance section D are opened By moving the clamp 2 in the downstream direction to lift the substrate W to a position where the line to be scribed on the substrate W is directly above the cutter wheel 7 of the scribing / Return. At this position, the downstream end of the substrate W is gripped by the clamp 12 on the downstream side, and the substrate W is stably held on the upstream side and the downstream side in a posture in which the substrate W floats horizontally And Fig. 7).

8, the cutter wheel 7 of the scribing / breaking mechanism portion C and the receiving roller 6 are brought into contact with the surface of the substrate W in a floating state, and the cutter wheel 7 is pressed By moving the upper and lower scribe heads 5a and 5b along the guide rails 4a and 4b, the scribe line L1 along the Y direction is processed (see Fig. 13).

9, the cutter wheel 7 is retreated to press the division rollers 8 against the scribe line L1 while moving the scribe heads 5a and 5b together with the upper reception rollers 6 to the original position . Thus, the substrate W is divided along the bending scribe line L1 (see Fig. 14).

In this manner, the scribing line L1 can be processed and divided along the scribing line L1 by one reciprocating movement of the scribing heads 5a and 5b.

10 and 15, the cleaner 9 travels in the Y direction along the scribe line L1 of the substrate W in a noncontact manner, so that the scribe line 9 can be moved along the scribe line L1, Such as dust, generated in the air suction port 9b. At this time, the substrate W is prevented from being brought into close contact with the lower surface of the cleaner 9 by the blow-out air from the air blow-out port 9c.

The downstream divided substrate Wa is conveyed in the downstream direction by the clamp 12 while being held in a floating posture and discharged from the downstream side entrance and exit port 16b by the discharge conveyor 13 ). The divided upstream substrate Wb is taken over by the downstream clamp 12 and discharged by the discharging conveyor 13 in the same manner as the preceding downstream substrate Wa (see FIG. 17).

As described above, in the upstream conveying section B and the downstream conveying section D, the substrate to be conveyed is floated by the floating mechanism (air float means), that is, the pressure air ejected from the plurality of small holes 1a It is possible to minimize the occurrence of scratches due to contact with the back surface of the glass plate before the formation of the organic film and the adhesion of minute foreign substances.

The dust scattering prevention devices 14A and 16A are formed in the upstream carry section B and the downstream carry section D and the inside of the covers 14 and 16 are always pressurized by the pressure air, It is possible to prevent the inflow of floating dust from the brake mechanism (C) or from the outside, and it is possible to prevent the minute foreign matter from adhering to the surface of the substrate in the transportation process.

In addition, in the scribing / breaking mechanism portion C, the dust scattering prevention device 15A is formed and the inside of the cover 15 is always depressurized by the air evacuation mechanism 19, Foreign matter is sucked and removed by the air discharging mechanism 19, and the inside of the cover 15 can be kept clean. This makes it possible to prevent the adhesion of micro-foreign substances to the surface of the substrate, in addition to the operation of directly removing dust and dirt on the scribe line L1 by the cleaner 9 described above.

Although the exemplary embodiments of the present invention have been described above, the present invention is not necessarily limited to the above embodiments. For example, in the above embodiment, the cleaner 9 is disposed on the upper side of the substrate W, but may be on the lower side. The cutter wheel 7 and the dividing roller 8 are arranged on the upper side of the substrate W and the receiving roller 6 is arranged on the lower side in the scribing / It is possible to perform scribing and division.

In the above embodiment, the scribing line L1 is processed by the scribing / breaking mechanism section C and the dividing is performed along the scribing line L1. However, after the scribing line is processed to expose the substrate, The substrate may be divided along the scribe line with another braking device. Conversely, only the brake mechanism may be provided and the scribing mechanism may be omitted. In this case, the scribe line is processed by another scribe apparatus.

In the above-described embodiment, a processing example of a mother substrate for an OLED in which a resin film (PI film) W1 serving as a flexible substrate is formed on the upper surface of the glass substrate W2 has been described. However, For example.

In addition, in the present invention, it is possible to appropriately modify or change the scope of the present invention without departing from the scope of the present invention.

The dust scattering prevention device of the present invention is mainly used for a substrate processing apparatus which processes a scribe line on a brittle material substrate such as glass or divides the scribe line along a scribe line.

A: Substrate processing apparatus
B: upstream conveying section
C: Scribe / Brake mechanism
D: downstream conveying section
W: substrate
1: Float table
2: Clamp
5a: Upper scribe head
5b: Lower scribe head
6: Receiver roller
7: Cutter wheel
8: Roller for separation
9: Cleaner
9b: Air suction
9c: Air outlet
11: Float table
12: Clamp
14: Cover of upstream conveying part
14A: dust scattering prevention device of upstream conveying part
15: Cover of scribe / brake mechanism
15A: Scattering prevention device of scribe / brake mechanism
16: Cover of downstream conveying part
16A: dust scattering prevention device of the downstream conveyance part
17: Pressure air inlet
19: Airbag mechanism
20: Antistatic device

Claims (5)

A dust scattering prevention device for preventing dust from adhering to a surface of a substrate to be processed,
A cover for covering the surface of the substrate to be processed with a space,
And a pressing means for always pressing the space in the cover,
Wherein the pressurizing means injects pressure air from the air inlet opening into the cover into the cover. A substrate processing apparatus for processing a scribe line on a substrate,
A scribe mechanism for processing a scribe line on a substrate,
A dust scattering prevention device according to claim 1,
Wherein the dust scattering prevention device is disposed upstream of the scribing mechanism or downstream of the scribing mechanism, or both. A substrate processing apparatus for dividing a substrate,
A brake mechanism for dividing the substrate along a scribe line formed on the substrate,
A dust scattering prevention device according to claim 1,
Wherein the dust scattering prevention device is disposed at an upstream conveying portion that conveys the substrate to the braking mechanism or a downstream conveying portion that conveys the substrate from the braking mechanism or both. A substrate processing apparatus for dividing a substrate,
A scribe mechanism for processing a scribe line on a substrate,
A braking mechanism for dividing the substrate along a scribe line processed by the scribing mechanism,
A dust scattering prevention device according to claim 1,
Wherein the dust scattering prevention device is disposed upstream of the scribing mechanism and the braking mechanism, or downstream of the scribing mechanism and the braking mechanism, or both. 5. The method according to any one of claims 2 to 4,
Wherein the substrate is a mother substrate for an OLED display in which a resin film for forming an organic film is laminated on an upper surface of a glass plate.

Images