CN109318387A - Dust, which disperses, anti-locking apparatus and to be had the dust and disperses the base plate processing device of anti-locking apparatus - Google Patents
Dust, which disperses, anti-locking apparatus and to be had the dust and disperses the base plate processing device of anti-locking apparatus Download PDFInfo
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- CN109318387A CN109318387A CN201810808653.0A CN201810808653A CN109318387A CN 109318387 A CN109318387 A CN 109318387A CN 201810808653 A CN201810808653 A CN 201810808653A CN 109318387 A CN109318387 A CN 109318387A
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- locking apparatus
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Cleaning In General (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The dust that the present invention provides a kind of product that the small foreign matter such as dust can be prevented to be attached to substrate and obtain high-quality, which disperses, anti-locking apparatus and to be had the dust and disperses the base plate processing device of anti-locking apparatus.Dust of the invention disperses the surface that anti-locking apparatus (14A, 15A, 16A) prevents dust to be attached to processed substrate (W), and have: cover (14,16) covers the surface of substrate (W) in a manner of separating space；And pressing mechanism, it pressurizes always to the space in the cover, the pressing mechanism is from the gas inflow entrance (17) being open in cover (14,16) to cover (14,16) interior injection pressure gas.
Description
Technical field
The present invention relates to be applied to process score line (grooving) on the brittle material substrates such as glass or along delineation
Line, which disperses the dust of the base plate processing device of substrate cutting, anti-locking apparatus and to be had the dust and disperses the substrate of anti-locking apparatus
Processing unit (plant).
In particular, the present invention relates in OLED flexible (Organic Light Emitting Diode: You Jifa
Optical diode) display manufacturing process in, in the resin film (polyimide film (also referred to as PI film)) that will be used as flexible parent metal
It is laminated in the base plate processing device for processing score line on motherboard made of the upper surface of glass substrate or cutting off the motherboard
Dust disperse anti-locking apparatus.
Background technique
In the processing of the brittle material substrates such as breaking glass substrate, in the past, cutting wheel is crimped on substrate surface and shape
At score line, later, applies external force from the face of the side opposite with score line forming face along score line and bend substrate, by
This is cut to each unit substrate (referring to patent document 1).
In recent years, due to requiring the High precision of display, thus need the surface quality of substrate, end face strength into one
The improvement of step.In addition, the widened viewpoint of purposes based on display, there is also the needs for being set as display flexible, manufactures
Use the OLED of flexible base board.For such OLED display, in the fabrication process, resin film is formed on the glass substrate
(PI film), and the organic film with electrode layer, organic EL layer is formed on resin film.Due to the film of electrode layer, organic EL layer etc.
Thickness, and composition is very very thin, even so extremely small foreign matter, can also become when being attached to surface resin film and produce
The reason of raw defect, lead to the decline of yield rate.
High-quality and the high OLED display manufacturing technology of productivity in order to obtain, it is necessary to avoid for being formed with organic film
The attachment of the small foreign matters such as generation, the dust of scratch of glass plate of resin film (PI film) before formation.That is, the scratch of glass plate
The reason of strength deterioration can be become, and the foreign matter adhered to can be transported to organic film formation process and becoming keeps operating environment bad
The reason of change.
In addition, if in glass back generation scratch, small foreign matter is attached with, after formed as organic film
In the glass substrate of product and isolated removing (Lift-Off) process of resin film, it is possible to can become and remove undesirable original
Therefore cause is not only the surface side (organic film formation side) of glass substrate, back side is also required to strongly to avoid the production of scratch
Raw, dust attachment.
Citation
Patent document
Patent document 1: No. 5210356 bulletins of Japanese Patent Publication No.
Summary of the invention
Subject to be solved by the invention
In general base plate processing device, what is generated in score line processing, when cutting subtle cuts the dust meeting such as powder
It is transported in subsequent processing in the state of being attached to the front and back sides of substrate, therefore becomes the important original of product quality deterioration
Cause.In addition, being placed in the upper surface of conveyer, workbench due to when keeping the substrate to be processed mobile to delineation position
And carried, so the back side of substrate is contacted with the surface of conveyer, workbench always.In addition, due to also sharp in delineation
The back side at left and right sides of it is kept across score line with conveyer, workbench, so substrate back still can be with conveyer, work
Platform contact.In this case, time of contact is longer, in addition, the moving distance under contact condition is longer, then in substrate back
The generation probability of small scratch more will increase, and be located at the general of the small foreign matter attachments such as conveyer, dust on workbench
Rate more will increase, and lead to decrease in yield, and to high-precision and the manufacture of product best in quality brings obstacle.
Therefore, the purpose of the present invention is to provide one kind to be effectively prevented during the carrying of substrate, processing
The small foreign matter such as dust is attached to substrate and the dust of the product that obtains high-quality disperses anti-locking apparatus and has the dust and fly
Dissipate the base plate processing device of anti-locking apparatus.
Solution for solving the problem
In order to solve the above problems, it adopts the following technical scheme that in the present invention.That is, dust of the invention, which disperses, to be prevented
Device prevents dust to be attached to the surface of processed substrate, wherein the dust anti-locking apparatus that disperses has: cover, with every
The mode for opening space covers the surface of the substrate to be processed；And pressing mechanism, the space in the cover is added always
Pressure, pressing mechanism injection pressure gas into cover from the gas inflow entrance in the cover opening.
Invention effect
Since the present invention as described above always pressurizes to the space in cover, so can prevent from external powder
Dirt flows into cover.Have the effect that the inside that can reduce the small foreign matter such as dust disperses and dust is prevented to be attached to as a result,
Substrate, thus, it is possible to obtain high-precision and product best in quality.
Moreover, it relates to the base plate processing device for processing score line on substrate, which is characterized in that described
Base plate processing device has: delineation mechanism processes score line on substrate；And dust described in claim 1 disperses
Anti- locking apparatus, the dust disperse anti-locking apparatus be configured to it is described delineation mechanism handling substrate upstream trucking department or from
Delineation mechanism moves out downstream trucking department or the upstream trucking department and the downstream trucking department this two side of substrate.In the feelings
Under condition, it also can replace the delineation mechanism and be set as release mechanism, be set as having the release mechanism and the dust disperses
The base plate processing device of the mechanism of this two side of anti-locking apparatus.
It is pressurizeed thereby, it is possible to the space in the cover of the substrate to covering in handling process and prevents dust stream
Enter, and the inside for mitigating dust disperses and it is prevented to be attached to substrate, thus, it is possible to machining high-precision and products best in quality.
As the substrate of processing object of the invention, the tree of organic film generation is preferably folded in the upper surface layer of glass plate
The motherboard of OLED display made of adipose membrane.
Detailed description of the invention
Fig. 1 be include dust of the invention disperse anti-locking apparatus base plate processing device schematic side view.
Fig. 2 is the schematic top of the base plate processing device of Fig. 1.
Fig. 3 is delineation/release mechanism portion enlarged front view of the base plate processing device of Fig. 1.
Fig. 4 is enlarged side view identical with Fig. 3.
Fig. 5 is the perspective view for showing processing object substrate of the invention.
Fig. 6 is the cross-sectional view and bottom view for showing cleaner of the invention.
Fig. 7 is the perspective view for showing the state that substrate is held using upstream side clamping element and downstream side clamping element.
Fig. 8 is cross-sectional view when showing the processing of delineation/release mechanism portion score line.
Fig. 9 is cross-sectional view when showing delineation/release mechanism portion disconnection movement.
Cross-sectional view when Figure 10 is the movement for showing cleaner.
Figure 11 is the top view for showing the first step of movement of base plate processing device.
Figure 12 is the top view for showing the second step of movement of base plate processing device.
Figure 13 is the top view for showing the third step of movement of base plate processing device.
Figure 14 is the top view for showing the four steps of movement of base plate processing device.
Figure 15 is the top view for showing the 5th step of movement of base plate processing device.
Figure 16 is the top view for showing the 6th step of movement of base plate processing device.
Figure 17 is the top view for showing the 7th step of movement of base plate processing device.
Description of symbols:
A base plate processing device；
The upstream B trucking department；
C delineation/release mechanism portion；
The downstream D trucking department；
W substrate；
1 floating work bench；
2 clamping elements；
The top 5a engraving head；
The lower part 5b engraving head；
6 accept roller；
7 cutting wheels；
Roller is used in 8 cuttings；
9 cleaners；
9b gas pump orifice；
9c gas blow-off outlet；
11 floating work bench；
12 clamping elements；
The cover of 14 upstream trucking departments；
The dust of the upstream 14A trucking department disperses anti-locking apparatus；
15 delineations/release mechanism portion cover；
15A delineation/release mechanism portion dust disperses anti-locking apparatus；
The cover of 16 downstream trucking departments；
The dust of the downstream 16A trucking department disperses anti-locking apparatus；
17 pressed gas inflow entrances；
19 gas vacuum mechanisms；
20 neutralizers.
Specific embodiment
Hereinafter, on one side referring to attached drawing, explains dust of the invention in detail on one side and disperse anti-locking apparatus and substrate processing dress
The one embodiment set.
Fig. 1 be briefly show include dust of the invention disperse anti-locking apparatus 14A, 15A, 16A substrate processing dress
The whole side view of A is set, Fig. 2 is its top view.
Base plate processing device A has: upstream trucking department B, is linearly removed from upstream towards downstream with horizontal posture
Transport the substrate W to be processed；As delineation/release mechanism portion C of substrate processing department, the back side for carrying the substrate W come along
The direction orthogonal with carry direction processes score line, and cuts off substrate W along the score line；And downstream trucking department D, court
Downstream carry the substrate W after cutting.Also, for supplying the substrate to be processed to the upstream trucking department B of base plate processing device A
The substrate supply unit E of W is configured at the upstream side of upstream trucking department B.It should be noted that hereinafter, the carry direction of substrate W is set
For X-direction, orthogonal direction is set as Y-direction.
It is used as motherboard, such as Fig. 5 in the manufacturing process of OLED display by the substrate W that base plate processing device A is processed
It is shown, the thin resin film W1 of the organic film generation as flexible parent metal is formed in the upper surface of glass plate W2.It needs
Bright, L is not provided with the region of resin film W1 in zonally formation along delineation preset line.As resin film W1, using poly-
Acid imide film (PI film).
The upstream trucking department B of base plate processing device A has: floating work bench 1, makes substrate W by spraying gas pressure
Floated with horizontal posture；And clamping element 2, it holds the upstream side end edge portion of the substrate W floated and downstream carries.Folder
Tight part 2 is supported on the beam member 2a extended along the Y direction, and beam member 2a is assembled into can be relative to along the defeated of substrate W
Send track 2b, 2b of the direction left and right that (X-direction) configures in parallel mobile.In the present embodiment, as in order to float substrate W
And gas is sprayed and make substrate floating float mechanism (air floating mechanism) from floating work bench 1, it is formed in floating work bench 1
Upper surface opening multiple aperture 1a and be set as the nozzle of gas ejection, but can also separately be set along floating work bench 1
Set gas jetting nozzle.It should be noted that floating work bench 1 is arranged on pallet 10.
Delineation/release mechanism portion C has the bridge 3 of the gate configured in a manner of the substrate W come across conveying.Such as Fig. 3 and
Shown in Fig. 4, it is configured with a pair of guide rails up and down along the Y direction in a manner of clipping the substrate W that conveying comes from up and down direction on bridge 3
4a, 4b, in upper rall 4a can move and can be moved up and down by elevating mechanism (not shown) along the Y direction
The mode of adjustment is equipped with top engraving head 5a, in lower guide 4b at can move along the Y direction and can pass through lifting
The mode that mechanism (not shown) moves up and down adjustment is equipped with lower part engraving head 5b.
In addition, being pacified in a manner of it adjustment can be moved up and down by elevating mechanism (not shown) in top engraving head 5a
Equipped with the undertaking roller 6 with smooth outer peripheral surface, in lower part engraving head 5b can be carried out by elevating mechanism (not shown)
The mode of lower mobile adjustment is equipped with the cutting wheel 7 and cutting roller 8 of score line processing.Cutting roller 8 has V in outer peripheral surface
The slot 8a of font (referring to Fig. 9).
Moreover, being provided with suction in a manner of it can move along the Y direction by head 9a in upper rall 4a removes quarter
The cleaner 9 of small foreign matter after scribing line formation.As shown in fig. 6, cleaner 9 has using X-direction as the elongated of longitudinal direction
Multiple gas blow-off outlet 9c of gas pump orifice 9b and the periphery blow gas in gas pump orifice 9b, by making cleaner 9
It is shifted in the top of the score line of substrate W along score line, thus using small foreign matters such as gas pump orifice 9b suction dust, and
And substrate W and the lower surface of cleaner 9 is prevented to be close to using the blow gas from gas blow-off outlet 9c.Pass through resistance as a result,
Only dust flows into cover, disperses so as to mitigate the inside of the small foreign matter such as dust and dust is prevented to be attached to substrate, thus
It can obtain high-precision and product best in quality.
In the same manner as above-mentioned upstream trucking department B, the downstream trucking department D of base plate processing device A has: floating work bench 11,
It floats substrate W with horizontal posture by the ejection gas pressure from aperture 11a；And clamping element 12, it holds floating
It simultaneously downstream carries the downstream side side end of the substrate W risen.Clamping element 12 is supported on the beam member extended along the Y direction
12a, beam member 12a are assembled into can be mobile relative to track 12b, 12b of the left and right configured in parallel along the X direction.Separately
Outside, it is provided in the downstream side of floating work bench 11 for sending substrate Wa, Wb after cutting to the outside of base plate processing device A
The conveyer 13 of discharge out.
Also, in base plate processing device A, trucking department B, delineation/release mechanism portion C and downstream trucking department D in upstream
Being provided with prevents the dust of the small foreign matter such as dust to disperse from dispersing anti-locking apparatus 14A, 15A, 16A.Dispersing in dust prevents from filling
Set 14A, 15A, 16A be provided be individually covering upstream trucking department B, delineation/release mechanism portion C and downstream trucking department D cover 14,
15,16, each cover 14,15,16 is provided with entrance 14a, 15a, 16a of substrate W disengaging.In addition, pacifying in each entrance
Equipped with gate 14b, 15b, the 16b that can be opened and closed.
In upstream, disperse anti-locking apparatus 14A, 16A of trucking department B and downstream trucking department D is provided with always to cover 14,16
The pressing mechanism that inner space is pressurizeed.As the pressing mechanism, it is configured in the present embodiment, injection pressure gas will be used for
The pressed gas inflow entrance 17,18 of body is set to the top plate of cover 14,16, and from the pressed gas inflow entrance 17,18 to cover 14,16
Pressed gas after interior injection pressurization.In addition, forming small slit in the side wall of cover 14,16 in order to sustainable supply gas
The opening (not shown) of shape and by gas a part be discharged.It is prevented as a result, from delineation/release mechanism portion C, external dust
It flows into, the inside for mitigating the small foreign matters such as dust is dispersed, and dust etc. is prevented to be attached to substrate W.
In addition, dispersing in anti-locking apparatus 15A in delineation/release mechanism portion C, always by the mechanism of decompressor in cover 15
It is depressurized in space in portion.As the mechanism of decompressor, it is configured in the present embodiment, in internal space configuration gas vacuum mechanism
19, using the gas suction based on the gas vacuum mechanism 19 to being depressurized inside cover 15.As a result, by adding in score line
Working hour and the dust generated in cut off operation etc., small foreign matter suction removed, and prevented the pollution inside cover 15.
Also, being internally provided with for the cover 14,16 of trucking department B and downstream trucking department D prevents removing for substrate W electrification in upstream
Electric installation (Ionizer: ion generator) 20.Neutralizer 20 is preferably using the photoelectricity that will not produce ozoniferous grenz ray
From device (Photo-Ionizer), and it is provided with along the carry direction of substrate W in the top plate lower surface of cover 14,16 multiple.Pass through
Neutralizer 20 is arranged in closed cover 14,16, so as to realize the high efficiency for removing electricity, and can prevent soft X from penetrating
The External leakage of line.
In addition, being set in a manner of separating certain intervals in the board carrying region of upstream trucking department B and downstream trucking department D
It is equipped with the interval of multiple substrate W and floating work bench 1,11 for detecting and floating, the i.e. sensor 21 of floatation volume.Float detecting
When the exception of amount, by increasing and decreasing the ejection pressure of gas, float posture so as to remain.
It should be noted that if being divided into multiple by floating work bench 1,11 and carrying out modularization, formed in each module
Sensor 21 and multiple aperture 1a, and can be for the gas flow that modules adjustment sprays, then it can further subtly
Adjustment floats posture.
In the present embodiment, upstream the substrate supply unit E use of the 1 supplying substrate W of floating work bench of trucking department B has
Pitch the elevator of pawl 22, the fork pawl 22 can using driving mechanism (not shown) up and down and front and back it is mobile and connect with substrate W
Contacting surface is small.It should be noted that also can replace elevator, substrate W is sent into using such as conveyer, crankshaft pawl etc..
Aperture 1a, 11a of gas ejection in the floating work bench 1,11 of aforesaid substrate processing unit (plant) A, cleaner 9
The pressed gas inflow entrance of the cover 14,16 of gas pump orifice 9b and gas blow-off outlet 9c, upstream trucking department B and downstream trucking department D
17, it 18 and covers 15 gas vacuum mechanism 19 and connect respectively via piping with gas source (not shown).
Next, being based on Fig. 2, Fig. 8~Figure 17, successively the movement of base plate processing device A is illustrated.
Fig. 2 shows the states before will being sent into substrate W to base plate processing device A, make to delineate preset lines L towards Y-direction
Posture under, regard the glass plate W2 of substrate W (referring to Fig. 5) as downside, and substrate W is placed in the fork pawl of substrate supply unit E
22.Then, the gate 14b of the upstream side entrance 14a of upstream trucking department B is opened to and is inserted into fork pawl 22, substrate W is sent to
On the floating work bench 1 of upstream trucking department B.Later, make to pitch pawl 22 back to original position and close gate 14b, make base
The upstream side end (referring to Fig.1 1) that plate W floats and clamping element 2 is utilized to keep substrate W.
Next, by by the downstream side entrance 14a of upstream trucking department B, the two sides delineation/release mechanism portion C go out
The gate of the upstream side entrance 16a of entrance 15a, 15a and downstream trucking department D are opened and move clamping element 2 downstream,
To which the substrate W delineation preset lines L for being carried to substrate W is reached delineation/release mechanism portion C while floating substrate W
The position of the surface of cutting wheel 7.At this location, the side in the downstream side of substrate W is held using the clamping element 12 in downstream side
Portion so that the posture that horizontally floats of substrate W upstream side and downstream side keep with having good stability substrate W (referring to Fig.1 2 and
Fig. 7).
Next, as shown in figure 8, making delineation/release mechanism portion C cutting wheel 7 and accepting the substrate of roller 6 and float state
The surface of W contacts, and presses cutting wheel 7 on one side, moves upper and lower engraving head 5a, 5b along guide rail 4a, 4b, thus process
Score line L1 (referring to Fig.1 3) out along the Y direction.
Next, as shown in figure 9, make on one side cutting wheel 7 retreat and cutting roller 8 is crimped on score line L1, make on one side
Engraving head 5a, 5b and the undertaking roller 6 on top move together original position.As a result, substrate W flexure and along score line L1 and
It is cut off (referring to Fig.1 4).
It like this, can be using the primary reciprocating movement of engraving head 5a, 5b to carry out the processing of score line L1 and along this
The cutting of score line L1.
Later, as shown in Figure 10 and Figure 15, by make cleaner 9 along substrate W score line L1 in the Y direction with substrate
W non-contactly advances, thus using gas pump orifice 9b by when score line is processed, cutting when the small foreign matter such as the dust that generates
Suction removes.At this point, substrate W and the lower surface of cleaner 9 is prevented to be close to using the blow gas from gas blow-off outlet 9c.
The substrate Wa in the downstream side after cutting is removed in the state of keeping the posture floated by clamping element 12 downstream
Fortune, and (referring to Fig.1 6) are discharged from downstream side entrance 16b with conveyer 13 using discharge.The substrate Wb of upstream side after cutting
Also it is transferred to the downstream side clamping element 12 of return, in the same manner as downstream side substrate Wa before, utilizes discharge conveyer 13
It is discharged (referring to Fig.1 7).
As described above, in upstream trucking department B and downstream trucking department D, due to using from floating mechanism (air floating machine
Structure), i.e. the pressed gas that sprays of multiple aperture 1a make the substrate floating being handled upside down, therefore, can will be because before organic film be formed
Glass back contact caused by the generation of scratch, small foreign matter attachment inhibition be minimum limit.
In addition, in upstream trucking department B and downstream trucking department D, disperse anti-locking apparatus 14A, 16A due to being provided with dust,
And the inside for covering 14,16 is pressurizeed by pressed gas always, so can prevent from delineation/release mechanism portion C, external floating
The inflow for swimming dust, can prevent small foreign matter to be attached to the substrate surface of handling process.
Also, in delineation/release mechanism portion C, disperse anti-locking apparatus 15A due to being provided with dust, and cover 15 it is interior
Portion is depressurized by gas vacuum mechanism 19 always, so can be small by the dust to swim in inside etc. using gas vacuum mechanism 19
Foreign matter suction removes, and the inside for being able to maintain cover 15 is clean.As a result, with it is direct on the score line L1 based on the cleaner 9
Dust and dirt object suction removing movement combine, attachment of the small foreign matter to substrate surface can be prevented.
More than, the representative embodiment of the present invention is described, but the present invention might not be limited to above-mentioned reality
Apply mode.For example, in the above-described embodiments, cleaner 9 is configured in the upside of substrate W, but it also can be only fitted to downside.Separately
Outside, about delineation/release mechanism portion C, cutting wheel 7 and cutting roller 8 can also be configured in base in contrast with the previous embodimently
Simultaneously the undertaking configuration of roller 6 is delineated and cut off in downside in the upside of plate W.
In addition, in the above-described embodiments, carrying out the processing of score line L1 using delineation/release mechanism portion C and along the quarter
The cutting of scribing line L1, but the processing of score line can also be only carried out, after sending out substrate, devices are disconnected along quarter using other
Substrate is cut off in scribing line.In addition, on the contrary, release mechanism can also only be arranged, and omit delineation mechanism.In this case, it carves
Scribing line is processed by other scoring devices.
In addition, in the above-described embodiments, to the resin film being formed in the upper surface of glass substrate W2 as flexible parent metal
The processing example of the motherboard of the OLED of (PI film) W1 is illustrated, but also being capable of adding in the glass substrate for other purposes
It is used in work.
In addition, in the present invention, appropriate repair can be carried out in the range of realizing its purpose and not departing from technical solution
Just, it changes.
Industrial availability
Dust of the invention disperse anti-locking apparatus be mainly used for processing on the brittle material substrates such as glass score line or
The base plate processing device that person cuts off substrate along score line.
Claims (5)
- The anti-locking apparatus 1. a kind of dust disperses, prevents dust to be attached to the surface of processed substrate, which is characterized in thatThe dust anti-locking apparatus that disperses has:Cover, covers the surface of the substrate to be processed in a manner of separating space；AndPressing mechanism always pressurizes to the space in the cover,Pressing mechanism injection pressure gas into cover from the gas inflow entrance in the cover opening.
- 2. a kind of base plate processing device is used to process score line on substrate, which is characterized in thatThe base plate processing device has:Mechanism is delineated, score line is processed on substrate；AndDust described in claim 1 disperses anti-locking apparatus,The dust anti-locking apparatus that disperses is configured to the upstream trucking department of the delineation mechanism handling substrate or from rose engine Structure moves out downstream trucking department or the upstream trucking department and the downstream trucking department this two side of substrate.
- 3. a kind of base plate processing device is used to cut off substrate, which is characterized in thatThe base plate processing device has:Release mechanism cuts off the substrate along the score line for being formed in substrate；AndDust described in claim 1 disperses anti-locking apparatus,The dust anti-locking apparatus that disperses is configured to the upstream trucking department of the release mechanism handling substrate or from described disconnected Opening mechanism moves out downstream trucking department or the upstream trucking department and the downstream trucking department this two side of substrate.
- 4. a kind of base plate processing device is used to cut off substrate, which is characterized in thatThe base plate processing device has:Mechanism is delineated, score line is processed on substrate；Release mechanism cuts off the substrate along the score line processed by the delineation mechanism；AndDust described in claim 1 disperses anti-locking apparatus,The dust disperse anti-locking apparatus be configured to it is described delineation mechanism and the release mechanism handling substrate upstream carry Portion or from it is described delineation mechanism and the release mechanism move out substrate downstream trucking department or the upstream trucking department and This two side of the downstream trucking department.
- 5. base plate processing device according to any one of claim 2 to 4, whereinThe substrate is the mother of the OLED display made of the resin film of the folded organic film generation of upper surface layer of glass plate Plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017148006A JP2019026513A (en) | 2017-07-31 | 2017-07-31 | Dust splash prevention device, and substrate processing device including dust splash prevention device |
| JP2017-148006 | 2017-07-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109318387A true CN109318387A (en) | 2019-02-12 |
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ID=65264077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810808653.0A Withdrawn CN109318387A (en) | 2017-07-31 | 2018-07-18 | Dust, which disperses, anti-locking apparatus and to be had the dust and disperses the base plate processing device of anti-locking apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2019026513A (en) |
| KR (1) | KR20190013498A (en) |
| CN (1) | CN109318387A (en) |
| TW (1) | TW201921422A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111653195A (en) * | 2020-06-09 | 2020-09-11 | 汤军文 | Outdoor advertising display screen convenient for dust removal |
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|---|---|---|---|---|
| JP3018964B2 (en) * | 1995-11-24 | 2000-03-13 | 双葉電子工業株式会社 | Cleaning method and cleaning device |
| JPH1111966A (en) * | 1997-06-20 | 1999-01-19 | Toshiba Corp | Scribing device and scribing |
| JPH11105833A (en) * | 1997-10-09 | 1999-04-20 | Toyo Seikan Kaisha Ltd | Method for transferring container inside/outside clean room |
| CN100430327C (en) * | 2001-04-02 | 2008-11-05 | 三星钻石工业股份有限公司 | Cutter wheel, device and method using cutter wheel, method of dividing laminated substrate, and method and device for mfg. cutter wheel |
| JP4029968B2 (en) * | 2002-07-01 | 2008-01-09 | 株式会社アドバンスト・ディスプレイ | Transport vehicle, manufacturing apparatus and transport system |
| JP4509613B2 (en) * | 2004-03-19 | 2010-07-21 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP5434578B2 (en) * | 2009-12-25 | 2014-03-05 | 旭硝子株式会社 | Cooling rare of float glass manufacturing equipment |
| JP2014201449A (en) * | 2013-04-01 | 2014-10-27 | 日本電気硝子株式会社 | Glass plate transportation device and glass plate transportation method |
| JP2015078254A (en) * | 2013-10-15 | 2015-04-23 | 東レ株式会社 | Resin composition, polyimide resin film using the same, color filter, tft substrate and display device including the same, and their production method |
| JP6364789B2 (en) * | 2014-01-29 | 2018-08-01 | 三星ダイヤモンド工業株式会社 | Scribing equipment |
| JP2017113880A (en) * | 2014-04-28 | 2017-06-29 | 旭硝子株式会社 | Glass laminate, glass substrate with resin layer, and support base material with resin layer |
| JP2015217603A (en) * | 2014-05-16 | 2015-12-07 | 三星ダイヤモンド工業株式会社 | Breaking method and breaking device |
| JP6539965B2 (en) * | 2014-09-16 | 2019-07-10 | 宇部興産株式会社 | Method of manufacturing flexible device |
| JP6577714B2 (en) * | 2015-02-04 | 2019-09-18 | 株式会社 ハリーズ | Transparent plate inspection apparatus and transparent plate cleaning inspection system |
-
2017
- 2017-07-31 JP JP2017148006A patent/JP2019026513A/en active Pending
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2018
- 2018-07-04 TW TW107123063A patent/TW201921422A/en unknown
- 2018-07-16 KR KR1020180082212A patent/KR20190013498A/en unknown
- 2018-07-18 CN CN201810808653.0A patent/CN109318387A/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| TW201921422A (en) | 2019-06-01 |
| KR20190013498A (en) | 2019-02-11 |
| JP2019026513A (en) | 2019-02-21 |
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