KR102643433B1 - Line type LED array manufacturing method - Google Patents

Abstract

The present invention includes the steps of a) preparing a PCB in which a plurality of LEDs are aligned and spaced apart from each other at regular intervals, and a mold forming a molding groove to accommodate the LEDs mounted on the PCB; b) filling each of the molding grooves of the mold with the first resin forming a diffusion layer to a corresponding height; c) forming a diffusion layer by curing the first resin filled in the molding grooves of the mold; d) filling the second resin to the corresponding height on the upper side of the diffusion layer formed in the molding grooves of the mold; e) loading the PCB on the upper surface of the mold so that the LEDs mounted on the PCB are each submerged in the second resin accommodated in the corresponding molding groove; f) curing the second resin to form a transparent layer; and g) releasing the PCB from the mold when the transparent layer is formed; by heating/cooling the thermosetting resin undergoing heat curing, curing during injection of the resin can be prevented, thereby preventing the product from curing. A line type LED that can be implemented in various shapes and sizes regardless of size, can process various layers without an air gap between the LED light source and the light emitting surface, and forms all surfaces laminated on the LED light source in the same mold. A method for manufacturing an array is provided.

Description

Line type LED array manufacturing method

The present invention relates to a line-type LED array manufacturing method. More specifically, by manufacturing the LED array with a single mold, various shapes and sizes can be realized regardless of the size of the product, and there is a gap between the LED light source and the light irradiation surface. This relates to a line-type LED array manufacturing method that can process various layers without an air gap.

In general, automobiles are equipped with lighting devices to ensure stable visibility of the driver even when the surrounding illumination level is low while driving.

Head lamp devices are divided into high beam devices and low beam devices depending on the irradiation angle and amount of light emitted from the lamp, and these high beam devices and low beam devices each have a steering function. The operation is controlled by switching the multi-function switch provided on the side of the wheel.

Incandescent lamps, halogen lamps, etc. have been used as light sources for such headlamps, but recently, light-emitting devices such as light-emitting diodes (hereinafter referred to as “LEDs”) using semiconductors have been attracting attention.

As prior art related to LED headlamps, “LED light source module” has been disclosed in Korean Patent Publication No. 2009-0049474.

Light source modules using LEDs as light sources have the advantage of consuming less power and being more compact than light source modules using incandescent lamps or halogen lamps, allowing the entire lighting device to be miniaturized.

Meanwhile, in the conventional LED array module for automobile lights, a plurality of metal plates are attached at regular intervals to the lower part of a soft substrate having a certain length, and a plurality of LEDs are formed on the upper part, and a plurality of mounting holes are formed in the soft substrate and the metal plate. It is done.

Therefore, the prior art required a work process of attaching a plurality of metal plates formed as unit blocks to each substrate at regular intervals, so there was a problem in that it required a lot of manufacturing man-hours.

In addition, since the area where the metal plate is attached cannot be bent, there is a problem in that the process of appropriately changing the shape of the substrate is limited.

To solve this problem, previously registered patent number 10-1542945 (2015.08.03) was provided.

However, the conventional technology has the disadvantage that the manufacturing process is very complicated and the process of cutting and processing the arrayed chip LEDs is complicated, which increases the manufacturing cost. In particular, it is difficult to mold the reflector of the chip because the resin mold and body are molded together, which reduces product quality. There was a downside.

In addition, there was a problem in that the mold corresponding to the LED array being manufactured had to be replaced, and in the process of injecting the thermosetting resin into the mold, the thermosetting resin hardened and was not molded properly.

The present invention utilizes the high heat resistance and high transmittance characteristics of thermosetting resins. By heating/cooling thermosetting resins that are cured by heat, curing during injection can be prevented, which is related to the size of the product. A line-type LED array manufacturing method in which various shapes and sizes can be realized without any molding, various layers can be processed without an air gap between the LED light source and the light emitting surface, and all surfaces laminated on the LED light source are formed in the same mold. The purpose is to provide.

The line-type LED array manufacturing method according to the present invention is a) a PCB on which a plurality of LEDs are aligned and spaced apart from each other at regular intervals, and a molded groove is formed to accommodate the LEDs mounted on the PCB. Preparing a mold; b) filling each of the molding grooves of the mold with the first resin forming a diffusion layer to a corresponding height; c) forming a diffusion layer by curing the first resin filled in the molding grooves of the mold; d) filling the second resin to the corresponding height on the upper side of the diffusion layer formed in the molding grooves of the mold; e) loading the PCB on the upper surface of the mold so that the LEDs mounted on the PCB are each submerged in the second resin accommodated in the corresponding molding groove; f) curing the second resin to form a transparent layer; and g) releasing the PCB from the mold once the transparent layer is formed.

At this time, it is preferable that the first resin according to the present invention is a resin in which a diffusion agent (particles) is mixed at a corresponding concentration with a corresponding amount of transparent thermosetting resin.

And it is preferable that the second resin according to the present invention is a transparent thermosetting resin.

In addition, the mold according to the present invention is made of aluminum, and the molding groove for accommodating the LED mounted on the PCB is preferably formed as a long groove to accommodate a plurality of LEDs spaced apart from each other at regular intervals to accommodate a row of LEDs. .

Here, the mold according to the present invention includes a heating plate provided at the bottom of the mold to heat the mold to a corresponding temperature, a cooling plate provided at the bottom of the heating plate to cool the mold to a corresponding temperature, and Includes a temperature sensor that measures the temperature of the mold.

In addition, when the transparent layer is formed in step g) according to the present invention, the PCB is released from the mold, and then in step h), the PCB is divided into lie shapes along the cutting line formed on the PCB to form a line type LED array. It is desirable to complete .

The line-type LED array manufacturing method according to the present invention has the following effects.

By heating/cooling the thermosetting resin, which undergoes heat curing, curing of the thermosetting resin during resin injection can be prevented, making it possible to implement various shapes and sizes regardless of the size of the product.

Various layers can be processed without an air gap between the LED light source and the light emitting surface, and since all surfaces laminated on the LED light source are molded in the same mold, changes in the primary and secondary thickness of the product can be made without changing the mold. It is possible to form diffusion layers, color change layers, and transparent layers laminated on LEDs.

LED light sources can produce LED arrays of various colors by applying color conversion layers such as red, white, and blue.

Figure 1 is an exemplary diagram showing a mold and PCB according to a line-type LED array manufacturing method according to an embodiment of the present invention.
Figure 2 is an exemplary diagram showing step by step the manufacturing process of a line-type LED array manufactured by a line-type LED array manufacturing method according to an embodiment of the present invention.
Figure 3 is an illustration of a line type LED array manufactured by a line type LED array manufacturing method according to an embodiment of the present invention.
Figure 4 is an exemplary diagram showing another example of a line-type LED array manufacturing method according to an embodiment of the present invention.

Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the attached drawings. Prior to this, the terms or words used in this specification and claims should not be construed as limited to their usual or dictionary meanings, and the inventor should appropriately define the concept of terms in order to explain his or her invention in the best way. Based on the principle of definability, it must be interpreted with meaning and concept consistent with the technical idea of the present invention.

Therefore, the embodiments described in this specification and the configurations shown in the drawings are only the most preferred embodiments of the present invention, and do not represent the entire technical idea of the present invention, so at the time of filing this application, they can be replaced by equivalent equivalents. It should be understood that variations may exist.

The present invention relates to a method of manufacturing a line-type LED array that can emit surface light in the form of a line and whose thickness can be significantly thinner than before. When examined with reference to the drawings, the present invention is as follows.

The method of manufacturing a line-type LED array according to an embodiment of the present invention with reference to FIGS. 1 to 4 includes a) a PCB in which a plurality of LEDs are arranged in a row and spaced apart from each other at regular intervals, and the LED array is mounted on the PCB. preparing a mold with molding grooves to accommodate the LEDs; b) filling each of the molding grooves of the mold with the first resin forming a diffusion layer to the corresponding height; and c) forming the molding grooves of the mold. forming a diffusion layer by curing the first resin filled in, d) filling the second resin to a corresponding height on the upper side of the diffusion layer formed in the molding grooves of the mold, and e) the LED mounted on the PCB. loading the PCB on the upper surface of the mold so that they are each accommodated in the corresponding molding groove; f) curing the second resin to form a transparent layer; and g) releasing the PCB from the mold once the transparent layer is formed. Includes.

The line-type LED array manufacturing method according to the above-described embodiment of the present invention will be examined step by step in more detail as follows.

First, in step a), a PCB (PCB: 10) in which a plurality of LEDs (11) are aligned in a row and spaced apart from each other at regular intervals, and a molded groove in which the LEDs (11) mounted on the PCB (10) are accommodated. Prepare a mold (100) forming (101).

At this time, the PCB 10 forms a transparent layer 30 and a diffusion layer 20 around the mounted LEDs 11, and then separates the cutting lines 12 at regular intervals so that the LEDs 11 can be divided into lines. It is desirable to form it as

In addition, the mold 100 is preferably made of an aluminum material with excellent thermal conductivity, and the molding groove 101 formed in the mold 100 is located at a position corresponding to the position of the LED 11 mounted on the PCB 10. It is preferable that each of the tops is formed with an engraved long groove.

Therefore, the molding groove 101 formed as a long groove accommodates the LEDs 11 that are spaced apart from each other at regular intervals and form a row.

In addition, the lower part of the mold 100 is provided with a heating plate 110 that heats the mold 100 to a corresponding temperature and a cooling plate 120 that cools the mold 100 to a corresponding temperature, and the mold It is provided with a temperature sensor 130 that measures the temperature of 100.

At this time, the heating plate 110 is provided with a heating wire that generates heat with an externally applied power source along the area of the heating plate 110, so that the mold 100 is heated by the heat generation of the heating wire, and the cooling plate 120 ) is a line through which coolant circulates is provided along the area of the cooling plate 120, and the mold 100 is cooled as the coolant supplied from an external pump circulates along the line.

Therefore, it is preferable that the driving control of the heating wire and pump is performed based on the temperature of the mold 100 measured by the temperature sensor 130.

Next, in step b), each of the molding grooves 101 of the mold 100 is filled with the first resin forming the diffusion layer 20 to the corresponding height.

At this time, the first resin is a mixture of a transparent thermosetting resin and a diffusion agent, and the liquid thermosetting resin and the particle-shaped diffusion agent powder are mixed at the corresponding concentration to form the first resin.

Here, the diffusion agent diffuses the light emitted from the LED 11 and is made of particle powder such as TiO₂, BaSo₄, and beads.

In addition, the first resin is preferably dispensed in a fixed amount by a dispenser having a plurality of discharge holes through which the first resin is discharged, so that the first resin is simultaneously filled in the plurality of molding grooves.

Next is step c), where the diffusion layer 20 is formed by curing the first resin filled in the molding grooves 101 of the mold 100.

At this time, curing of the first resin is achieved by heating the first resin to a corresponding temperature, and each of the molding grooves 101 of the mold 100 is filled with the first resin to a corresponding height. When this happens, degassing of the first resin is preceded to remove microbubbles contained in the first resin.

The degassing uses vacuum pressure. After the mold 100, in which each molding groove 101 is filled with the first resin, is accommodated inside a vacuum chamber, vacuum pressure is applied inside the vacuum chamber for the corresponding time. The first resin is degassed by vacuum pressure.

Alternatively, the first resin is filled in each of the molding grooves 101 of the mold 100 by attaching a cover to the top of the mold 100 to seal the top of the mold and applying vacuum pressure between the mold and the cover. Degassing can also be achieved.

When degassing of the first resin is completed, the mold 100 is heated by driving the heating plate 110 provided at the bottom of the mold 100, thereby curing the first resin.

Here, the heating plate 110 heats the mold 100 at a temperature of 80°C to 150°C for 2 to 10 minutes to harden the first resin filled in the molding grooves 101 of the mold 100 to the corresponding thickness. A diffusion layer 20 is formed.

When the diffusion layer 20 is formed by curing the first resin filled in the molding grooves 101 of the mold 100, the heating plate 110 is stopped, and the cooling plate 120 is driven. The mold 100 is cooled to 50°C or lower.

At this time, it is preferable that the cooling plate 120 is formed by circulating cooling water.

Next, in step d), the second resin is filled to the corresponding height on the upper side of the diffusion layer 20 formed in the molding grooves 101 of the mold 100.

At this time, it is preferable that the temperature of the mold 100 is below 50°C, and the second resin is made only of a transparent thermosetting resin, and is formed on the upper side of the diffusion layer 20 formed in the molding grooves 101 of the mold 100. is filled to the corresponding height.

The filling of the second resin is also preferably dispensed in a fixed amount by a dispenser having a plurality of discharge ports through which the second resin is discharged so that the plurality of molding grooves are simultaneously filled.

And when the filling of the second resin is completed, the second resin is degassed to remove microbubbles contained in the second resin.

Defoaming of the second resin also uses vacuum pressure. After the mold 100, in which each molding groove 101 is filled with the second resin, is accommodated inside the vacuum chamber, the mold 100 is placed inside the vacuum chamber for a corresponding period of time. Apply vacuum pressure to defoame the second resin with vacuum pressure, or attach a cover to the top of the mold 100 to seal the top of the mold 100 and then apply vacuum pressure between the mold 100 and the cover. It is possible to defoame the second resin filled in each of the molding grooves 101 of the mold 100.

When the degassing of the second resin is completed, the next step is e), where the PCB 10 is placed on the upper surface of the mold 100 so that the LEDs 11 mounted on the PCB 10 are each accommodated in the corresponding molding groove. Loading.

At this time, the loading of the PCB 10 is carried out by lowering the upper mold on the upper side of the mold 100 and loading the PCB 10 on the upper surface of the mold 100. The forming groove 101 of the mold 100 It is desirable to completely adhere the PCB 10 to the upper surface of the mold 100 so that the LED 11 is completely submerged in the second resin filled in the mold.

Next is step f), where the transparent layer 30 is formed by curing the second resin.

At this time, the hardening of the second resin is also achieved by heating the mold 100 by driving the heating plate 110 provided at the bottom of the mold 100.

The heating plate 110 heats the mold 100 at a temperature of 80°C to 150°C for 2 to 10 minutes to harden the second resin filled in the molding grooves 101 of the mold 100 to form a mold of the corresponding thickness. A transparent layer 30 is formed.

Here, the upper mold that descends to the upper side of the mold 100 helps increase the heat of the mold 100 as heat is always provided at 80 to 120°C, and the mold 100 is formed in the molding grooves 101 of the mold 100. When the filled second resin is cured and the transparent layer 30 is formed, the heating plate 110 is stopped, and the cooling plate 120 is operated to cool the mold 100 to 50° C. or lower.

At this time, it is preferable that the cooling plate 120 is formed by circulating cooling water.

Next is step g), when the transparent layer 30 is formed, the PCB 10 is released from the mold 100.

The transparent layer 30 and the diffusion layer 20 are integrally formed in the LED mounted on the PCB 10 released from the mold 100.

In addition, in step h), the PCB 10 is divided to complete the line type LED array.

At this time, the PCB 10 can be divided into a lie shape along the cutting line formed on the PCB 10 to complete a line type LED array.

In addition, the present invention is not limited to the above-described embodiments, and the diffusion layer 20 is formed singly, the color conversion layer 40 is formed, or the transparent layer 30 is formed as a high-refractive transparent layer ( 31) and a low-refractive transparent layer 32.

Looking at this with reference to FIG. 4, in another embodiment of the present invention, a line type LED array in which the diffusion layer 20 is formed as a single unit can be manufactured.

In this case, after filling each of the molding grooves 101 of the mold 100 with the first resin forming the diffusion layer 20 to the corresponding height, the LEDs 11 mounted on the PCB 10 are each molded. The PCB 10 is loaded on the upper surface of the mold 100 so as to be immersed in the first resin accommodated in the groove 101, and when the loading of the PCB 10 is completed, the first resin is cured to form the PCB 10. ) A single diffusion layer 20 is formed on the LED 11 mounted on the LED.

When the diffusion layer 20 is formed as a single piece, the PCB 10 is released from the mold, and then the PCB 10 is divided into lie shapes along the cutting line formed on the PCB 10 to complete the line type LED array. .

As another example, a line type LED array can be manufactured in which a color conversion layer 40 is further formed between the diffusion layer 20 and the transparent layer 30.

In this case, after filling each of the molding grooves 101 of the mold 100 with the first resin forming the diffusion layer 20 to the corresponding height, the agent filled in the molding grooves 101 of the mold 100 1 Resin is cured to form the diffusion layer 20, and when the diffusion layer 20 is formed by curing the first resin, the third resin forming the color conversion layer 40 is filled to the corresponding height, and then the third resin is is cured to form the color conversion layer 40.

At this time, the third resin forming the color conversion layer 40 is a transparent thermosetting resin mixed with a dye of the corresponding color at the corresponding concentration, and the curing process of the third resin is the curing of the first resin and the second resin. It is desirable to carry out the same process as the process.

When the color conversion layer 40 is formed by curing the third resin, the upper side of the color conversion layer 40 is filled with the second resin to the corresponding height, and the LEDs 11 mounted on the PCB 10 are The PCB 10 is loaded on the upper surface of the mold 100 so as to be immersed in the second resin contained in each molding groove 101, and then the second resin is cured to form a transparent layer 30.

When the transparent layer 30 is formed, the PCB 10 is released from the mold 100, and then the PCB 10 is divided into lie shapes along the cutting lines formed on the PCB 10 to complete a line type LED array. do.

In addition, the transparent layer 30 may be formed of a high refractive index transparent layer 31 and a low refractive index transparent layer 32. In this case, when forming the transparent layer 30, the 2-1 layer forming the high refractive index transparent layer 31 After filling the resin to the corresponding height on the diffusion layer 20 and curing it to form the high refractive index transparent layer 31, the 2-2 resin forming the low refractive index transparent layer 32 is applied to the high refractive index transparent layer 31. Filled to a height, the PCB 10 is loaded on the upper surface of the mold 100 so that the LEDs 11 mounted on the PCB 10 are each submerged in the 2-2 resin accommodated in the corresponding molding groove 101. After that, the 2-2 resin is cured to form a low refractive index transparent layer 32.

Therefore, the line-type LED array manufacturing method according to the embodiment of the present invention utilizes the high heat resistance and high transmittance characteristics of the thermosetting resin. The thermosetting resin, which is cured by heat, is heated to the corresponding temperature and then cooled to the corresponding temperature. It is possible to prevent thermosetting resin from hardening during resin filling.

By manufacturing the LED array using the above method, various shapes and sizes can be realized regardless of the size of the product.

In addition, various layers can be processed without an air gap between the LED light source and the light emitting surface, and since all molding (diffusion side and transparent layer) is done in the same mold, changes in the primary and secondary thickness of the product can be made by changing the mold. As it is possible without it, various performance implementations are possible.

The present invention has been described with reference to the embodiments shown in the drawings, but these are merely illustrative, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true scope of technical protection of the present invention should be determined by the technical spirit of the attached patent claims.

10: PCB
11: LED
20: diffusion layer
30: transparent layer
31: High refractive index transparent layer
32: low refractive index transparent layer
40: Color conversion layer
100: mold
101: Molding groove
110: Heating plate
120: Cooling plate
130: Temperature sensor

Claims (6)

The molding groove, which is made of aluminum and accommodates the LED mounted on the PCB, has a long groove formed to accommodate the LEDs that form a row with a plurality of LEDs spaced apart from each other at regular intervals, and is provided at the bottom to form the molding groove at the corresponding temperature. A line-type LED array manufacturing method using a mold including a heating plate for heating, a cooling plate provided at the bottom of the heating plate to cool the molding groove to the corresponding temperature, and a temperature sensor for measuring the temperature of the molding groove. Because,
a) Preparing a PCB in which a plurality of LEDs are aligned and spaced apart from each other at regular intervals, and a mold forming a molding groove to accommodate the LEDs mounted on the PCB;
b) filling each of the molding grooves of the mold with the first resin forming a diffusion layer to a corresponding height;
c) heating the molding grooves filled with the first resin to form a diffusion layer by curing the filled first resin;
d) When a diffusion layer is formed in the molding grooves, cooling the molding groove and then filling the upper side of the diffusion layer with a second resin to the corresponding height;
e) loading the PCB on the upper surface of the mold so that the LEDs mounted on the PCB are each submerged in the second resin accommodated in the corresponding molding groove;
f) curing the second resin to form a transparent layer;
g) releasing the PCB from the mold once the transparent layer is formed; and
h) A line-type LED array manufacturing method comprising the step of dividing the PCB into lines along a cutting line formed on the PCB to complete the line-type LED array.
In claim 1,
The first resin is
A line-type LED array manufacturing method, characterized in that the resin is mixed with a corresponding amount of transparent thermosetting resin and diffusion agent particles at a corresponding concentration.
In claim 1,
The second resin is
A method of manufacturing a line type LED array, characterized in that it is made of a transparent thermosetting resin.
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