TWM514537U - Automotive LED headlights - Google Patents

Description

Automotive LED headlights

The present invention relates to a light-emitting diode headlight, and more particularly to a light-emitting diode headlight for a vehicle.

According to the fact that Light Emitting Diode (LED) has become an important source of light energy in recent years, LED has the advantages of power saving, carbon reduction and long service life, so it is more and more widely used in lighting sources. The light source for the headlights for vehicles is very easy to replace and replace the traditional light source. However, the vehicle is highly dangerous to drive. Especially when driving at night, the illumination of the headlights for the vehicle must of course conform to the bright areas and illumination of the international standard. The maximum illuminance and other requirements.

A conventional vehicle headlight includes a light-emitting component and a reflector body disposed behind the light-emitting component. The inside of the reflector body forms a curved surface having a specific curvature, and the light-emitting component is disposed on the reflective component. The focus of the cover, the light generated by the light-emitting component is reflected by the reflector body and emitted forward for illumination, and a lens is disposed in front of the reflector body, so that the light reflected by the reflector body is transmitted through the lens for light correction. A vehicle light shape conforming to the international standard specification. However, after the light is reflected and refracted, the required focal length of the lamp is long, and the lamp is composed of The volume is not easy to be miniaturized and the manufacturing cost of the lamp is large, which will also cause loss of light, so it is necessary to improve it.

In order to avoid direct light on the driving of the car, the lights are cut off. The shape of the wire also has a specific shape. The conventional headlight for a vehicle is used to produce a vehicle light shape having a clear cut-off line in accordance with international standard specifications, and includes a light-emitting component and a reflective cover disposed behind the light-emitting component. a cover body, a curved surface having a specific curvature is formed on the inner side of the reflector body, and the light-emitting component is disposed at a focus of the reflector body, and the light generated by the light-emitting component is reflected by the reflector body and is emitted forward for illumination. And a light shielding sheet is additionally disposed in front of the reflector body, so that the light reflected by the reflector body is blocked by the light shielding sheet to block a part of the light, so that a vertical and asymmetrical car light shape conforming to the specification is generated, and the light shielding film may cause The utilization of light is reduced, so there is a need for improvement.

The LED headlight structure that is now applied to the lamp, such as the Taiwan Patent No. No. I354746, the application date is May 14, 2008, the "LED lighting device and the lamp" disclosed is an LED lighting device comprising: an LED light source comprising at least one LED component, the illumination of the at least one LED component The mask is facing a reflector; the reflector is disposed outside the at least one LED component and includes a plurality of reflective surfaces having different curvatures; and a mask for adjusting the light concentrated from the plurality of reflective surfaces to a predetermined light shape; and a projection lens for projecting the predetermined light shape outward; however, the reflective cover of the reflective light lamp occupies a volume of the light, and the light emitting surface of the LED elements faces a reflector It will cause the hot gas to rise upwards, and the heat conduction is not easy, so it is necessary to improve it.

Therefore, the creator has improved the existing LED lights. In view of the necessity, 遂 has been engaged in the research and design and professional manufacturing experience of related fields for many years, and actively researched and improved the LED light-emitting diode headlights. Finally, under the careful consideration of various conditions, the author finally developed this creation.

In view of the above shortcomings, the purpose of this creation is to provide a vehicle The LED headlight includes a body, a light-emitting diode package module, a stop, and an optical imaging lens. The light-emitting diode headlight of the present invention has a simple structure and is not used. Reflector, to avoid the loss of light after reflection, refraction or light blocking, can reduce the focal length required by the lamp, and reduce the lamp by using the body, the LED package module, the light bar and the optical imaging lens. The volume of the composition and the volume of the lamp are reduced, and the manufacturing cost of the lamp is reduced. At least one molding lens (Molding Lens) or a collimating lens group, a stop, and a light-emitting diode package module are used. Optical components such as optical imaging lenses or imaging lens groups directly modify their beam pattern and illuminate the beam to a specified location, producing a specific light shape that conforms to international standard specifications.

Another purpose of the creation is that the LED package has The thermoelectric separation function achieves the effect of heat conduction and circuit separation by modularly combining a metal substrate, a light-emitting diode ceramic package component, an electrical connector and an electrical connection plate, thereby effectively reducing the thermal resistance value. And by using the LED package component with the electrical connector and the electrical connection board, the plurality of electrodes of the LED package component in the entire LED package module need not be soldered and externally The power supply device is electrically connected to simplify the assembly of the LED package module Process and subsequent maintenance costs.

A further object of the present invention is to further include a heat dissipating component, The heat dissipation metal substrate is disposed on the bottom surface of the LED package, and each heat pipe has a heat absorption section and a heat release section, and the heat absorption section comprises a heat dissipation metal substrate, at least one heat pipe, and at least one heat dissipation fin. The heat dissipating segment is attached to the heat dissipating metal substrate, and the heat dissipating segment is attached to the heat dissipating fins, and the LED light emitting heat source of the LED package module solves the heat dissipation problem of the lamp by the heat dissipating component. The heat dissipation module of the vehicle is moved from the internal space, which also solves the problem that the space of the LED lamp is too large and the process is complicated, so that the LED light-emitting diode head lamp of the present invention has the advantages of power saving and heat dissipation.

The effect of the creation gain (1) is that the LED package module Coating the at least one phosphor and the at least one LED wafer in a continuous non-separating manner or an individual separation manner by using the at least one molding lens (Molding Lens), and by surface curvature of the at least one molding lens Adjusting and guiding the beam of the at least one LED chip to collimate and illuminate the specified position, thereby improving the disadvantage that the prior art reflective lamp occupies the volume of the lamp.

The effect of the creation gain (2) is that the stop is used The hole produces a specific light shape, and the concentrated illumination beam output from the at least one molded lens passes through the light bar to repair the spot shape of the light shape and control the total length of the optical system.

The effect of the creation gain (3) is to use the optical imaging lens to adjust The uniform light forms the light intensity of the image size and the test position, meets the international standard specification LED headlight regulations and can shorten the total length of the optical system.

The effect of the creation gain (4) is that the LED package module The heat dissipation path is separated from the circuit by combining the light emitting diode ceramic package component and the metal substrate, and the heat conduction path is used by the at least one light emitting diode chip in the light emitting diode ceramic package component to the ceramic substrate, and then utilized. The solder paste is thermally conductive to the metal substrate to achieve a function of reducing thermal resistance and enhancing module strength.

The effect of the creation gain (5) is to use the LED package One end of the electrical connector of the module has an electrical plug port electrically connected to an external power source to obtain power operation, and does not need to be electrically connected by using multiple bonding wires to improve the efficiency of subsequent assembly and maintenance. Convenience.

The effect of this creative gain (six) is that the use of heat dissipation components, including a heat dissipating metal substrate, at least one heat pipe, and at least one heat dissipating fin, the heat dissipating metal substrate is attached to the bottom surface of the LED package, each heat pipe has a heat absorption section and a heat release section, and the heat absorption section includes However, it is not limited to being adhered or soldered to the heat dissipating metal substrate, and the heat dissipating section is attached to the heat dissipating fin, and the space of the light emitting diode is removed from the internal space to solve the problem of excessive space and process of the LED lamp. complicated question.

In order to achieve the above objectives, the technical means adopted by this creation (1) The utility model provides a light emitting diode headlight for a vehicle, comprising a body, a light emitting diode package module, a light bar and an optical imaging lens, the body comprising a through slot, a casing, a head end seat and a tail end An end seat, the housing enclosing the through slot, the head end seat having a first open end at one end of the through slot, the tail end seat having a second open end at the other end of the through slot, the light pole is emitted Body package module, the light bar and the optical The imaging lens is sequentially disposed on the body, and the LED package is disposed at the second open end of the body end seat, and the light bar is disposed in the through slot and adjacent to the body end The two open ends and the optical imaging lens are disposed at the first open end of the body head end seat; the LED package module includes at least one circuit layer, at least one LED chip, and at least one phosphor And at least one die-casting lens, the at least one light-emitting diode chip is disposed on the circuit layer, electrically coupled to the circuit layer, and the at least one phosphor covers the at least one light-emitting diode chip, and the The at least one light emitting diode and the at least one light emitting diode wafer are coated by the at least one molded lens to enable the at least one light emitting diode to emit light having a collimating characteristic, and the at least one light emitting diode chip The illumination angle is reduced and concentrated to a specified position; the optical column is a through hole of a specific optical shape (for example, a trapezoid or a cut-off profile, etc.), the through hole has a third open end and a fourth open end, the light has a light The fourth through end of the column through hole The second open end of the body end socket is adjacent to the connection, and the at least one molded lens of the LED package module is received at the fourth open end, and the at least one mode can be adjusted by adjusting the proper length of the through hole. The concentrated illumination beam of the output of the lens passes through the through hole of the diaphragm to repair the shape of the spot of the light, and the third open end of the through hole forms an accommodation space between the optical imaging lens and the optical imaging lens. The appropriate length of space allows the light source exiting the light source to reinforce the resulting light shape through the optical imaging lens to conform to regulatory specifications.

The at least one LED chip of the LED package module Suitable for a vertical structure of a light-emitting diode chip and/or a horizontal structure of a light-emitting diode chip, and further, the at least one light-emitting diode chip is arranged at least one column or more, and each column emits light. The diode wafers are electrically connected to the circuit layer with equal or unequal numbers.

The at least one molded lens of the LED package module is connected The at least one phosphor and the at least one LED chip are coated in a non-separating manner or in an individual separation manner, and the at least one molded lens may be combined with other collimating lenses to form a first lens group. The arrangement between the at least one die-cast lens column and the column may be parallel to each other or inclined obliquely to each other or all inclined upward or all downward, etc., in order to achieve light-emitting efficiency and reduce the light-emitting angle of the light-emitting diode wafer to generate a concentrated illumination beam. It is possible to select different refractive indices by material, or to adjust the surface curvature of the molded lens, and generally classify a symmetric surface or an asymmetrical surface.

The optical imaging lens can also be combined with other imaging lenses to form a second lens group that complements the light intensity at the test location.

The technical means adopted by the present invention (2) is to provide a light-emitting diode headlight for a vehicle, which differs from the technical means (1) in that the light-emitting diode package module comprises a metal substrate and a light-emitting diode ceramic package. a metal substrate having a heat dissipation property and composed of a metal material; the electrical connector attached to the first surface of the metal substrate, the electrical connector One end has a plurality of electrical connection portions, and the electrical connector has a boring hole; the illuminating diode ceramic package component is disposed in the boring of the electrical connector and is attached to the metal substrate, the illuminating The diode ceramic package component mainly comprises a ceramic substrate, a circuit layer, at least one light emitting diode chip, and a light transmissive package covering the at least one light emitting diode chip, the ceramic substrate having a circuit layer, the at least A light-emitting diode chip is disposed on the circuit layer, electrically coupled to the circuit layer, and the circuit layer has one end a plurality of electrode portions are provided, and at least one positive electrode connection pad and at least one negative electrode connection pad are disposed, and different light shapes are controlled by different lines; and the electrical connection plate forms a plurality of conductive portions on the inner surface, and is coated on the inner surface The surface solder paste has one end for bonding the plurality of electrode portions of the light-emitting diode package component, and the other end for bonding the plurality of power-on portions of the electrical connector to be electrically connected to each other.

Further, as described later, the light transmissive package is formed on the ceramic base The surface of the board is composed of at least one encapsulant, the at least one phosphor and the at least one molded lens, the at least one molded lens coating the at least one phosphor, the at least one encapsulant and the at least a light-emitting diode chip, wherein the light-permeable package is formed, but not limited to, the package body covers the phosphor body, and the light-transmissive package body is formed to cover the package body with the phosphor body, and the light-transmissive package is coated with the package body. The package body may be formed by mixing the phosphor (for example, phosphor powder) with the encapsulant (for example, silicone or epoxy resin), the metal substrate has heat dissipation characteristics and is composed of a metal material, and the metal material may be selected from copper, One of copper alloys, aluminum, aluminum alloys, magnesium alloys, aluminum-rhodium carbides, and carbon composites. Furthermore, the ceramic substrate has electrical insulation and heat dissipation characteristics and is composed of a ceramic material selected from the group consisting of alumina, aluminum nitride, zirconium oxide, tantalum carbide, hexagonal boron nitride and calcium fluoride. Furthermore, the LED chip is suitable for a vertical structure of a light-emitting diode chip and/or a horizontal structure of a light-emitting diode chip; further, the at least one light-emitting diode chip is arranged at least one column or more. The light-emitting diode chips are fixed to the surface of the ceramic substrate with equal or different numbers, and are electrically connected to the circuit layer. The at least one encapsulant in the LED package component has high light transmittance and Electrical insulation, which may be composed of a material including silicone or epoxy resin, The at least one phosphor may be selected from a fluorescent glue or a fluorescent film, and the at least one light-emitting diode wafer is arranged in a side-by-side manner in order to produce a light shape and a brightness distribution complying with the international standard specification LED headlight regulations. The at least one light-emitting diode wafer is equal or unequal, and the at least one phosphor, the at least one encapsulant, and the at least one light-emitting diode wafer may be coated by the at least one molded lens. A light-emitting diode chip emits a light fixture collimating characteristic, and the at least one light-emitting diode wafer is reduced in illumination angle to a specified position, and the at least one molded lens can be combined with other collimating lenses to form a first A lens group is a collimating device, and the arrangement between the columns and the columns may be parallel to each other or inclined to each other or all inclined upwards or all downwards, etc., in order to achieve light efficiency, which may be selected by materials. The refractive index can also be adjusted by the surface curvature of the molded lenses, and is usually classified into a symmetric curved surface or an asymmetric curved surface.

The at least one molded lens is continuously separated or separated separately Forming the at least one phosphor, the at least one encapsulant, and the at least one LED chip, and guiding the at least one LED wafer by adjusting a surface curvature of the at least one molding lens The emitted light beam is concentratedly irradiated to a specified position, and the shape of the at least one molded lens may be parallel, obliquely inclined, upwardly inclined or downwardly inclined, etc., in a continuous non-separating manner.

Cooperating with international standard specification LED headlight regulations, the optical imaging lens The light can be adjusted to form a light intensity of the image size and the test position, and the total length of the optical system can be shortened. The optical imaging lens can be combined with other imaging lenses to form a second lens group, and the complementary light forms a light intensity like a test position. The optical imaging Lens including aspherical mirror Head, hyperbolic lens or microstructured lens.

The technical means adopted by this creation (3) is to provide a kind of vehicle illumination The difference between the diode headlamp and the technical means (2) is that at least one recess is formed around the pupil of the electrical connector of the LED package module; the LED package component is disposed on the electrical component a boring hole is formed in the boring hole of the connector and is attached to the metal substrate to form a vent hole in the process of high-temperature processing on the metal substrate, and the solder paste is combined with the electrical connector and the ceramic package component to generate a bubble squeezing The venting hole reduces the adverse effect of air bubbles on heat conduction and enhances heat transfer.

The technical means adopted by this creation (4) is to provide a kind of vehicle illumination The difference between the diode headlight and the technical means (2) is that the two sides of the electrical connector can have a plurality of positioning slots, and the positioning slots are recessed on both sides of the electrical connector and cooperate with the buckle slot of the external power source. The electrical connector can also be provided with at least one third through hole, and is fixedly supported by a pin opposite to the external power source, and the electrical connector can be effectively fixed to the external power source without being affected by external environmental vibration.

The technical means adopted by this creation (5) is to provide a kind of vehicle illumination The diode headlight is different from the technical means (1) in that it further comprises a heat dissipating component, the heat dissipating component comprises a heat dissipating metal substrate, at least one heat pipe and at least one heat dissipating fin, wherein the heat dissipating metal substrate can be attached to the light emitting diode The polar package module is configured to efficiently dissipate the light emitting diode package module to the heat dissipation component, wherein the at least one heat pipe has a heat absorption section and a heat release section, and the heat absorption section includes but is not limited to being stuck or soldered in the heat dissipation The metal substrate is attached to the heat dissipating fins, and the heat dissipation module of the lamp is moved from the internal space to solve the problem that the space of the LED lamp is too large and the process is complicated. The heat dissipating metal substrate is also configured to be locked by the body end end to fix and fix the main body and the heat dissipating component. The back end of the main body has a plurality of fifth through holes, and the heat dissipating metal substrate of the heat dissipating component has a plurality of sixth locking holes. The fifth through hole is penetrated by a fixing member (including but not limited to a screw), and is locked and fixed with a plurality of sixth locking holes of the heat dissipation metal substrate.

The technical means adopted by this creation (6) is to provide a kind of vehicle illumination The diode headlight is different from the technical means (2) in that it further comprises a heat dissipating component, comprising a heat dissipating metal substrate, at least one heat pipe and at least one heat dissipating fin, wherein the LED package module is on the metal substrate Opening a plurality of first through holes corresponding to the electrical connector to open a plurality of second through holes, and fixing the components (including but not limited to screws) through each of the opposite first and second through holes, and dissipating heat on the bottom surface of the metal substrate The component is locked without causing the LED package component to be broken, and the heat conduction path is thermally conducted to the ceramic substrate by at least one light emitting diode heat source in the LED package component, and then the solder paste is used to conduct heat to the metal. The substrate is further thermally conductive in the heat dissipating component to achieve multiple heat dissipation effects and enhance the strength of the module; the heat dissipation metal substrate and the rear end seat of the body have a locking function, and the rear end seat of the body has a plurality of fifth perforations. The heat dissipating metal substrate of the heat dissipating component has a plurality of sixth locking holes, and the fixing component (including but not limited to the screw) penetrates the fifth through hole, and the heat dissipating metal substrate A plurality of fixed attachment sixth keyhole lock.

This creation is not limited to the above various technical means, and can be applied for in the patent scope. It is also within the technical scope of the present invention to make various modifications within the scope of the invention and to disclose the appropriate combination of technical features in each of the technical means.

For the sake of your review, the purpose, technical features and merits of this creation For the sake of further understanding and understanding, the specific embodiments described below are only used to explain the present invention, and are not intended to limit the scope of the present invention. The embodiments are in conjunction with the drawings, and the details are as follows:

1,1a‧‧‧Light LED headlights for vehicles

100‧‧‧Light Emitting Diode Module

443‧‧·Molded lens

20‧‧‧ ray

21‧‧‧through holes

22‧‧‧ third open end

23‧‧‧fourth open end

30‧‧‧Optical imaging lens

50‧‧‧ body

501‧‧‧through slot

51‧‧‧Shell

52‧‧‧ head end seat

521‧‧‧first open end

53‧‧‧Tail end seat

531‧‧‧second open end

54‧‧‧ fifth perforation

55‧‧‧ accommodating space

10,10a,10b,10c‧‧‧Light Emitting Diode Module

200‧‧‧Metal substrate

210‧‧‧ first surface

220‧‧‧ second surface

230‧‧‧First perforation

300‧‧‧Electrical connector

310,320‧‧‧Power Department

330‧‧‧镂孔

340‧‧‧Second perforation

350‧‧‧ recess

360‧‧‧ positioning slot

370‧‧‧ third perforation

400‧‧‧Light Emitting Diode Ceramic Packaging Components

410‧‧‧ceramic substrate

420‧‧‧Line layer

421,422‧‧‧Electrode

423‧‧‧ protective elements

430‧‧‧Light Emitter Wafer

440‧‧‧Light permeable package

441‧‧‧Package colloid

442‧‧‧Fluorite

500‧‧‧Electrical connecting plate

510,520‧‧‧Electrical Department

600‧‧‧Fixed components

700‧‧‧External power supply

40‧‧‧Heat components

41‧‧‧heated metal substrate

411‧‧‧ third surface

412‧‧‧ fourth surface

42‧‧‧heat pipe

43‧‧‧inhalation section

44‧‧‧heating section

45‧‧‧Heat fins

46‧‧‧fourth keyhole

47‧‧‧ sixth keyhole

1 is a perspective exploded perspective view of a light-emitting diode headlight for a vehicle according to a preferred embodiment of the present invention.

2 is an exploded perspective view of a light emitting diode package module according to a second embodiment of the present invention.

Figure 3 is a partial cross-sectional view showing the light emitting diode ceramic package component of the second embodiment of the present invention.

4 is an exploded perspective view of a light emitting diode package module according to a third embodiment of the present invention.

FIG. 5 is an exploded perspective view of a light emitting diode package module according to a fourth embodiment of the present invention.

Fig. 6 is a perspective exploded perspective view of a light-emitting diode headlight for a vehicle according to a fifth embodiment of the present invention.

FIG. 7 is an exploded perspective view of a light emitting diode package module according to a fifth embodiment of the present invention.

In order to further understand the features, technical means, and specific functions and purposes of the present invention, more specific embodiments are listed, followed by a detailed description of the drawings.

Referring to FIG. 1 , in the preferred embodiment, the LED light-emitting diode headlight 1 of the present invention comprises a body 50 , a light-emitting diode package module 100 , a light bar 20 and an optical device. The imaging lens 30.

In the preferred embodiment, the body 50 has a through slot 501, a housing 51, a head end 52 and a tail end 53. The head end 52 is located in the through slot 501. The first open end 521 has a first open end 521 for receiving the optical imaging lens 30. The rear end of the through hole 501 has a second open end 531 for receiving the LED package module 100. The second open end 531 of the end portion 53 of the main body 50 is disposed in the through slot 501, and the LED package module 100, the optical column 20 and the optical imaging lens 30 are sequentially disposed on the body. The inner surface of the body 50 is provided with a black absorption surface or a white diffusion surface or a specular reflection surface (not shown). The LED package module 100 includes at least one circuit layer (not shown) and at least one illumination. a diode chip (not shown), at least one phosphor (not shown), and at least one molded lens 443, the at least one LED chip (not shown) being disposed on the circuit layer (not shown) And electrically coupled to the circuit layer (not shown), the at least one phosphor (not shown) covering the at least one LED chip (not shown), and then by the at least one die casting The lens 443 covers the at least one phosphor (not shown) and the at least one LED chip (not shown) to enable the at least one light emitting diode The body wafer (not shown) emits light having a collimating characteristic, and the at least one light emitting diode chip (not shown) is condensed and concentrated to a specified position; the light bar 20 is an optical component having a specific light shape a through hole 21 having a third open end 22 and a fourth open end 23, the through hole 21 having a fourth open end 23 and a rear end of the body 50 The second open end 531 of the pedestal 53 is adjacent to the second open end 23 of the illuminating diode 20, and the through hole 21 is appropriately adjusted by the at least one molded lens 443 of the illuminating diode package module 100. The length of the concentrated illumination beam outputted by the at least one molded lens 443 can be passed through the through hole 21 of the diaphragm 20 to repair the shape of the spot of the light, and the optical column 20 penetrates the third open end 22 of the hole 21 and the optical imaging An accommodating space 55 is formed between the lenses 30, and the accommodating space 55 is adjusted. The appropriate length allows the light source 20 to emit light through the optical imaging lens 30 to reinforce the resulting light shape to conform to regulatory specifications.

The at least one light-emitting diode chip (not shown) is suitable for a vertical structure of a light-emitting diode chip and/or a horizontal structure of a light-emitting diode chip (not shown), and further, the at least one light-emitting diode The wafers (not shown) are arranged in at least one column or more, and each column of light-emitting diode chips (not shown) is electrically connected to the circuit layer (not shown) with equal or unequal numbers.

The at least one molded lens 443 is coated with the at least one phosphor (not shown) and the at least one LED chip (not shown) in a continuous separation manner or in an individual separation manner, and the at least one mold The cast lens 443 can also be combined with other collimating lenses (not shown) to form a first lens group (not shown) for concentrating the emitted light angle of the at least one LED chip to a specified position, the at least The arrangement between the columns and columns of a die-cast lens 443 may be parallel to each other or inclined obliquely to each other or all inclined upwards or all downwards, etc., in order to achieve light-emitting efficiency and reduce the light-emitting angle of the light-emitting diode wafer to generate a concentrated illumination beam. The refractive index can be selected by the material, or can be adjusted by the surface curvature of the molded lens 443, and is usually classified into a symmetric curved surface or an asymmetric curved surface.

The through hole 21 of the diaphragm 20 has a cut-off rectangular shape, and the concentrated illumination beam outputted by the at least one molding lens 443 can pass through the diaphragm 20 to repair the shape of the light spot and control the total length of the optical system; The through hole 21 of the diaphragm 20 is formed into a trapezoidal shape with a cut-off shape or the like in a specific light shape, and only a rectangular shape having a cut-off line is displayed in the drawing, thereby facilitating the description of the technical feature of the present invention. It is not intended to limit the scope of this creation.

The optical imaging lens 30 includes an aspherical lens, a hyperbolic lens or a microstructured lens, etc., which can adjust the light intensity of the image forming image size and the test position, and can shorten the total length of the optical system, and the optical imaging lens 30 can also be combined with other imaging. The lenses (not shown) are combined to form a second lens group (not shown) that fills the light intensity at the test location.

Referring to FIG. 2 and FIG. 3, in the second embodiment, the LED light-emitting diode headlight of the present invention is substantially the same as the preferred embodiment, and the difference is only in the light-emitting diode. The package module 10 includes a metal substrate 200, a light-emitting diode ceramic package component 400, an electrical connector 300, and an electrical connection board 500. The metal substrate 200 has heat dissipation characteristics and is made of a metal material (aluminum). The electrical connector 300 is attached to the first surface 210 of the metal substrate 200. The electrical connector 300 has a plurality of electrical terminals 310, 320 at one end, and the electrical connection The device 300 is provided with a boring hole 330. The illuminating diode package component 400 is disposed in the boring hole 330 of the electrical connector 300 and is attached to the first surface 210 of the metal substrate 200. The bulk ceramic package component 400 mainly includes a ceramic substrate 410, a circuit layer 420, at least one light emitting diode wafer 430, and a light transmissive package 440 covering the at least one light emitting diode wafer 430. The ceramic substrate 410 has a a circuit layer 420, the at least one light emitting diode The body wafer 430 is disposed on the circuit layer 420, and is electrically coupled to the circuit layer 420. The circuit layer 420 has a shielding element 423, and one end is further provided with a plurality of electrode portions 421, 422, and may have at least one positive electrode connection pad (Fig. Not shown) and at least one negative electrode connection pad (not shown), different lights are controlled by different lines And a plurality of conductive portions 510, 520 formed on the surface of the electrical connecting plate 500, one end of which is used for bonding the plurality of electrode portions 421, 422 of the light emitting diode package component 400, and the other end is used for bonding The plurality of power receiving portions 310, 320 of the electrical connector 300 are electrically connected to each other.

After further describing the second embodiment, the metal substrate 200 has heat dissipation characteristics and is composed of a metal material, and the metal material may be selected from the group consisting of copper, copper alloy, aluminum, aluminum alloy, magnesium alloy, aluminum lanthanum carbide, and carbon composite. In addition, the ceramic substrate 410 has electrical insulation and heat dissipation characteristics and is composed of a ceramic material selected from the group consisting of alumina, aluminum nitride, zirconium oxide, tantalum carbide, hexagonal boron nitride, and fluorination. One of the calcium; further, the at least one LED chip 430 is suitable for a vertical structure of the LED chip and/or the horizontal structure of the LED chip; further, the at least one LED The wafer 430 is arranged in at least one column or more, and each of the columns of the light-emitting diodes 430 is fixed to the surface of the ceramic substrate 410 with an equal or different number, and is electrically connected to the circuit layer 420, and the light-permeable package 440 is formed. The surface of the ceramic substrate 410 is composed of at least one encapsulant 441, the at least one phosphor 442 and the at least one molded lens 443. The at least one molding lens 443 covers the at least one phosphor 442. , The at least one encapsulant 441 and the at least one illuminating diode 430 are formed by the opaque package 440, but are not limited to the encapsulant 441, and the opaque package 440 is formed by the 442. The encapsulating colloid 441 is coated, and the transparent transparent package 440 is formed to be a mixture of the phosphor 442 (for example, phosphor powder) and the encapsulant 441 (for example, silicone or epoxy resin), and the LED package is packaged in the LED package 400. Colloid 441 has high light transmission and electrical insulation, and can be made of silicone or epoxy resin. The phosphor 442 may be selected from a fluorescent glue or a fluorescent film, and the at least one molded lens 443 is coated in the continuous non-separating manner or in an individual separation manner to cover the at least one phosphor 442, the at least one encapsulant. 441 and the at least one LED wafer 430, and the surface curvature of the at least one LED lens 430 is adjusted to guide the light beam emitted by the at least one LED wafer 430 to a specified position, the at least The shape of a cast lens 443 column and the column includes parallel, obliquely opposite, upwardly inclined or downwardly inclined.

Referring to FIG. 4, in the third embodiment, the LED light-emitting diode headlight of the present invention is substantially the same as that of the second embodiment, and the difference between the two is only: the light-emitting diode package module The electrical connector 300 of the 10a is provided with at least one recess 350 around the bore 330. The LED package component 400 is disposed in the bore 330 of the electrical connector 300 and is attached to the metal substrate. At least one venting hole is formed on the first surface 210 of the 200, and the solder paste applied on the metal substrate 200 during high-temperature processing in the process is combined with the electrical connector 300 and the luminescent ceramic package component 400 to generate bubble squeezing. To these vent holes, the adverse effects of air bubbles on heat conduction are reduced, and the heat conduction effect is enhanced.

Referring to FIG. 5, in the fourth embodiment, the LED light-emitting diode headlight of the present invention is substantially the same as that of the second embodiment, and the difference between the two is only in the light-emitting diode package module. The plurality of positioning slots 360 are recessed on both sides of the electrical connector 300, and are engaged with the buckle slots (not shown) of the external power source 700. The electrical connector 300 can also include at least one third through hole 370. The at least one third through hole 370 passes through the electrical connector 300 and is coupled to a pin (not shown) opposite to the external power source 700. With the electrical connection The connector 300 can be effectively and efficiently fixed to the external power source 700 without being affected by external environmental vibration.

Referring to FIG. 6 and FIG. 7, in the fifth embodiment, the LED light-emitting diode headlight 1a of the present invention is substantially the same as the second embodiment, and the difference between the two is only that: another heat dissipation is included. The component 40 includes a heat dissipation metal substrate 41, at least one heat pipe 42 and at least one heat dissipation fin 45.

The heat dissipating metal substrate 41 has a third surface 411 and a fourth surface 412. The third surface 411 of the heat dissipating metal substrate 41 is attached to the metal substrate 200 of the LED package module 10c. The second surface 220 is attached to the fourth surface 412 of the heat dissipation metal substrate 41. The at least one heat dissipation fin 45 is attached to the heat pipes 42.

Each of the heat pipes 42 has a heat absorbing section 43 and a heat releasing section 44. The heat absorbing section 43 includes, but is not limited to, being bonded or welded to the fourth surface 412 of the heat dissipation metal substrate 41. The heat releasing section 44 is attached to the heat dissipation fins. The heat dissipation metal substrate 41 has a plurality of fourth locking holes 46. The metal substrate 200 of the LED package module 10c has a plurality of first through holes 230, and the electrical connector 300 has a plurality of second through holes 340. The plurality of fixing elements 600 (including but not limited to screws) respectively penetrate the channel and correspond to the heat dissipation metal substrate 41 of the heat dissipation component 40 attached to the second surface 220 of the metal substrate 200. The four locking holes 46 are locked and fixed, wherein the second through holes 340 have apertures greater than or equal to the apertures of the first through holes 230, so that the fixing elements 600 are buried or attached to the surface of the electrical connector 300 without Causing the light-emitting diode ceramic package component 400 to be broken, and the heat conduction path is formed by the light-emitting diode The heat source of the light-emitting diode wafer 430 in the porcelain package component 400 is conducted to the ceramic substrate 410, and then the solder paste is used to conduct heat to the metal substrate 200, and then the heat-dissipating metal substrate 41 of the heat-dissipating component 40 is thermally absorbed by the heat-absorbing section 43 of the heat pipe 42. Conducted to the heat release section 44 of the heat pipe 42, and then thermally transferred to the heat sink fins 45, to achieve the function of reducing the thermal resistance and enhancing the strength of the module.

The heat-dissipating metal substrate 41 is locked to the end portion 53 of the body 50. The end portion 53 of the body 50 has a plurality of fifth through holes 54. The heat-dissipating metal substrate 41 corresponding to the heat-dissipating component 40 has a plurality of sixth locking holes 47. The plurality of fixing members (not shown) respectively penetrate the fifth through holes 54, and the sixth locking holes 47 corresponding to the heat dissipation metal substrate 41 are locked and fixed.

Although the present invention is described by way of example, those skilled in the art can make various forms of changes without departing from the spirit and scope of the present invention. The above embodiments are only used to illustrate the creation, and are not intended to limit the creation. The scope of the present invention is not limited to the above embodiments, and various modifications can be made within the scope of the patent application scope, and embodiments obtained by appropriately combining technical means disclosed in different embodiments are also included in the present creation. Within the technical scope, the equal changes and modifications made by the patent application scope of this creation shall remain within the scope of the patent of this creation. This creation has already met the requirements of the new patent and submitted the application according to law.

1‧‧‧Light LED headlights for vehicles

100‧‧‧Light Emitting Diode Module

443‧‧·Molded lens

20‧‧‧ ray

21‧‧‧through holes

22‧‧‧ third open end

23‧‧‧fourth open end

30‧‧‧Optical imaging lens

50‧‧‧ body

501‧‧‧through slot

51‧‧‧Shell

52‧‧‧ head end seat

521‧‧‧first open end

53‧‧‧Tail end seat

531‧‧‧second open end

55‧‧‧ accommodating space

Claims (20)

A light-emitting diode headlight for a vehicle, comprising: a body, comprising a through slot, a casing, a head end seat and a tail end seat, the casing enclosing the through slot, the head end seat being located in the through slot One end has a first open end, and the rear end has a second open end at the other end of the through slot; a light emitting diode package module is received at the second open end of the tail end, at least a circuit layer, at least one light emitting diode chip is electrically connected to the circuit layer, at least one phosphor is coated on the surface of the at least one light emitting diode wafer, and the at least one molded lens comprises a continuous non-separating manner or an individual Separatingly coating the at least one phosphor and the at least one LED wafer, and adjusting the surface curvature of the at least one die-cast lens to cause the at least one LED chip to emit light fixtures; a light barrier is disposed in the through slot and adjacent to the second open end of the tail end seat, and has a continuous through hole. The through hole has a third open end and a fourth open end, and the light emitting diode package mold The at least one molded lens of the group is placed in the fourth At the mouth end, by adjusting the length of the through hole, the emitted light is emitted from the light bar for repairing the spot shape of the light shape; and an optical imaging lens is located at the first open end of the head end seat, and the light bar The third open end forms an accommodating space for repairing the shape of the light spot emitted from the light bar, and adjusting the light intensity of the image forming image size and the test position. The illuminating diode headlight for a vehicle of claim 1, further comprising at least one collimating lens combined with the at least one die-cast lens to form a first lens group for the two light-emitting diodes The polar body wafer emits light at a reduced angle and concentrates on the specified position. The illuminating diode headlight for a vehicle of claim 1, further comprising at least one imaging lens, combined with the optical imaging lens to form a second lens group for supplementing the light to form light at a test position. strength. The illuminating diode headlight for a vehicle according to claim 1, wherein the Optical imaging lenses include aspherical lenses, hyperbolic lenses, or microstructured lenses. The illuminating diode headlamp for a vehicle according to claim 1, wherein the at least one illuminating diode chip is arranged in at least one column, and the number of the illuminating diode chips in each column is equal or unequal. The illuminating diode headlight for a vehicle of claim 5, wherein the at least one molded lens row and the inter-column arrangement shape comprise parallel, obliquely opposite, upwardly inclined or downwardly inclined. The illuminating diode headlight for a vehicle according to claim 1, wherein the inner surface of the casing comprises a black absorbing surface, a white diffusing surface or a specular reflecting surface. The illuminating diode headlamp of the vehicle of claim 1, wherein the LED package further comprises: a metal substrate having a first surface and a second surface. The electrical connector is attached to the first surface of the metal substrate, the electrical connector has a plurality of electrical connection portions at one end, and the electrical connector has a pupil; a light emitting diode ceramic package component for emitting light, disposed in the pupil of the electrical connector, and attached to the first surface of the metal substrate, the LED package component comprising: a ceramic substrate having electrical insulation properties and comprising a ceramic material, the circuit layer being formed on a surface of the ceramic substrate, the circuit layer further comprising a plurality of electrode portions at one end, the at least one LED chip being fixed to the ceramic substrate On the surface of the ceramic substrate, the light-permeable package is formed on the surface of the ceramic substrate, and comprises at least one encapsulant, the at least one phosphor and the at least one molded lens. to One less die cast lens Coating the at least one phosphor, the at least one encapsulant and the at least one LED wafer; and an electrical connection plate having a plurality of conductive portions formed on the surface and one end for attaching the LED The circuit layer of the ceramic package component is electrically connected to the electrode portions of the circuit layer, and the other end is used for attaching the power connection portions of the electrical connector, and electrically connecting the power connection portions. The illuminating diode headlight for a vehicle of claim 8, wherein the electrical connector further comprises at least one recess, the at least one recess being disposed around the periphery of the bore. The illuminating diode headlight for a vehicle of claim 8, wherein the electrical connector further comprises a plurality of positioning slots, the positioning slots are recessed on both sides of the power receiving portion for an external Power plug connection. The illuminating diode headlamp for a vehicle according to claim 8, wherein the at least one illuminating diode chip is arranged in at least one column, and the number of the illuminating diode chips in each column is equal or unequal. The illuminating diode headlight for a vehicle of claim 8, wherein the at least one phosphor is formed on the surface of the at least one encapsulant. The illuminating diode headlamp for a vehicle according to claim 8, wherein the at least one encapsulant is coated on the at least one phosphor coated on the surface of the at least one illuminating diode wafer. The illuminating diode headlight for a vehicle according to claim 8, wherein the at least one phosphor is mixed with the at least one encapsulant and is formed on the surface of the at least one illuminating diode. The illuminating diode headlight for a vehicle of claim 8, further comprising a heat dissipating component, comprising a heat dissipating metal substrate having a third surface and a fourth surface, at least one heat pipe, and at least a heat dissipating fin, the third surface of the heat dissipating metal substrate is attached to the metal substrate of the LED package module The at least one heat pipe is attached to the fourth surface of the heat dissipation metal substrate, and the at least one heat dissipation fin is attached to the at least one heat pipe. The illuminating diode headlamp for a vehicle according to claim 15, wherein the at least one heat pipe comprises a heat absorbing section and a heat releasing section, and the heat absorbing section is attached to the fourth surface of the heat dissipation metal substrate. The heat release section is attached to the at least one heat dissipation fin. The illuminating diode headlight for a vehicle of claim 15, wherein the metal substrate further comprises a plurality of first through holes, the electrical connector further comprising a plurality of second through holes, the heat dissipation metal substrate further comprising a plurality of fourth keyholes, wherein the plurality of fixing elements are locked by the fourth locking holes opposite to the heat dissipating metal substrate by the plurality of fixing holes, and the second holes are larger than the second hole Or equal to the first perforated apertures. The illuminating diode headlight for a vehicle of claim 17, wherein the tail end seat further comprises a plurality of fifth perforations, the heat dissipating metal substrate further comprising a plurality of sixth locking holes, wherein the plurality of fixing elements pass through The fifth through hole is locked with the sixth keyhole opposite to the heat dissipation metal substrate. The illuminating diode headlight for a vehicle of claim 8, further comprising at least one collimating lens combined with the at least one molded lens to form a first lens group for the at least one illuminating The diode wafer emits light at a reduced angle and concentrates on the specified position. The illuminating diode headlight for a vehicle of claim 8, further comprising at least one imaging lens, combined with the optical imaging lens to form a second lens group for reinforcing light to form light at a test position. strength.