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KR102291194B9 - 미세 피치를 갖는 디바이스의 얼라인장치 및 그 방법 - Google Patents

미세 피치를 갖는 디바이스의 얼라인장치 및 그 방법

Info

Publication number
KR102291194B9
KR102291194B9 KR20200029083A KR20200029083A KR102291194B9 KR 102291194 B9 KR102291194 B9 KR 102291194B9 KR 20200029083 A KR20200029083 A KR 20200029083A KR 20200029083 A KR20200029083 A KR 20200029083A KR 102291194 B9 KR102291194 B9 KR 102291194B9
Authority
KR
South Korea
Prior art keywords
method therefor
fine pitch
aligning devices
aligning
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR20200029083A
Other languages
English (en)
Other versions
KR102291194B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR1020200029083A priority Critical patent/KR102291194B1/ko
Priority to US17/783,923 priority patent/US12019116B2/en
Priority to JP2022528318A priority patent/JP7313748B2/ja
Priority to PCT/KR2020/012674 priority patent/WO2021182699A1/ko
Priority to CN202080083496.7A priority patent/CN114729964A/zh
Priority to TW109142146A priority patent/TWI764398B/zh
Application granted granted Critical
Publication of KR102291194B1 publication Critical patent/KR102291194B1/ko
Publication of KR102291194B9 publication Critical patent/KR102291194B9/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2877—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to cooling
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020200029083A 2020-03-09 2020-03-09 미세 피치를 갖는 디바이스의 얼라인장치 및 그 방법 Active KR102291194B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020200029083A KR102291194B1 (ko) 2020-03-09 2020-03-09 미세 피치를 갖는 디바이스의 얼라인장치 및 그 방법
US17/783,923 US12019116B2 (en) 2020-03-09 2020-11-05 Apparatus for aligning device having fine pitch and method therefor
JP2022528318A JP7313748B2 (ja) 2020-03-09 2020-11-05 微細ピッチを有するデバイスのアライン装置及びその方法
PCT/KR2020/012674 WO2021182699A1 (ko) 2020-03-09 2020-11-05 미세 피치를 갖는 디바이스의 얼라인장치 및 그 방법
CN202080083496.7A CN114729964A (zh) 2020-03-09 2020-11-05 具有细小间距的器件测试装置及其方法
TW109142146A TWI764398B (zh) 2020-03-09 2020-12-01 具有細間距的設備的對準裝置及其方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020200029083A KR102291194B1 (ko) 2020-03-09 2020-03-09 미세 피치를 갖는 디바이스의 얼라인장치 및 그 방법

Publications (2)

Publication Number Publication Date
KR102291194B1 KR102291194B1 (ko) 2021-08-20
KR102291194B9 true KR102291194B9 (ko) 2021-10-27

Family

ID=77466469

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200029083A Active KR102291194B1 (ko) 2020-03-09 2020-03-09 미세 피치를 갖는 디바이스의 얼라인장치 및 그 방법

Country Status (6)

Country Link
US (1) US12019116B2 (ko)
JP (1) JP7313748B2 (ko)
KR (1) KR102291194B1 (ko)
CN (1) CN114729964A (ko)
TW (1) TWI764398B (ko)
WO (1) WO2021182699A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1044723B1 (en) * 2023-10-25 2025-05-07 Jpe Cryogenic Probing Station

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4891526A (en) * 1986-12-29 1990-01-02 Hughes Aircraft Company X-Y-θ-Z positioning stage
US5481202A (en) * 1993-06-17 1996-01-02 Vlsi Technology, Inc. Optical scan and alignment of devices under test
JPH07263517A (ja) * 1994-03-24 1995-10-13 Hitachi Electron Eng Co Ltd Ｉｃソケットの位置決め装置
US6051067A (en) * 1998-04-23 2000-04-18 Microjet Technology Co., Ltd. Wafer securing device and method
KR100495819B1 (ko) * 2003-06-14 2005-06-16 미래산업 주식회사 반도체 소자 테스트 핸들러의 소자 안착장치
US7258703B2 (en) * 2005-01-07 2007-08-21 Asm Assembly Automation Ltd. Apparatus and method for aligning devices on carriers
JP4647335B2 (ja) 2005-02-22 2011-03-09 ルネサスエレクトロニクス株式会社 Ｉｃソケット
JP4698407B2 (ja) * 2005-12-20 2011-06-08 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
US7842912B2 (en) 2008-05-23 2010-11-30 Delta Design, Inc. Camera based vision alignment with device group guiding for semiconductor device testing handlers
JP5511790B2 (ja) * 2009-03-25 2014-06-04 東北精機工業株式会社 位置補正機能を有するハンドラ
TWM441124U (en) * 2012-05-03 2012-11-11 E Max Prec Technology Co Ltd Chip tester
KR102041182B1 (ko) * 2013-08-13 2019-11-06 세메스 주식회사 반도체 패키지의 검사 방법
KR101464990B1 (ko) 2013-12-24 2014-11-26 주식회사 아이에스시 반도체 디바이스 얼라인 소켓유닛 및 이를 포함하는 반도체 디바이스 검사장치
WO2015173865A1 (ja) 2014-05-12 2015-11-19 三菱電機株式会社 位置決め装置
KR101779172B1 (ko) 2015-08-04 2017-09-15 주식회사 아이에스시 미세 피치용 테스트 소켓
CN105304541A (zh) * 2015-09-30 2016-02-03 秦皇岛视听机械研究所 一种半导体晶圆自动定位装置
KR101804051B1 (ko) * 2016-05-17 2017-12-01 유광룡 대상체 검사를 위한 센터링장치
JP2017212255A (ja) * 2016-05-23 2017-11-30 株式会社ジェイデバイス 半導体製造装置及び製造方法
AT527530B1 (de) * 2017-02-22 2025-04-15 Sintokogio Ltd Prüfsystem
JP2018200314A (ja) * 2017-05-25 2018-12-20 秀雄 西川 基板検査装置、検査治具、及びその相対的位置合せ方法
JP7281250B2 (ja) * 2018-05-11 2023-05-25 株式会社アドバンテスト 試験用キャリア
CN110504203B (zh) * 2018-05-18 2024-11-22 上海微电子装备（集团）股份有限公司 一种工作台及背面对准装置
KR102045506B1 (ko) * 2018-06-25 2019-11-18 주식회사에이치티엔씨 미세 피치 회로 검사 장치
US11693026B2 (en) * 2021-10-22 2023-07-04 Advantest Corporation Test carrier
US20230393188A1 (en) * 2022-01-26 2023-12-07 Advantest Test Solutions, Inc. Tension-based socket gimbal for engaging device under test with thermal array

Also Published As

Publication number Publication date
TW202134659A (zh) 2021-09-16
KR102291194B1 (ko) 2021-08-20
US12019116B2 (en) 2024-06-25
JP2023505946A (ja) 2023-02-14
WO2021182699A1 (ko) 2021-09-16
US20230051231A1 (en) 2023-02-16
JP7313748B2 (ja) 2023-07-25
CN114729964A (zh) 2022-07-08
TWI764398B (zh) 2022-05-11

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Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
G170 Re-publication after modification of scope of protection [patent]