KR102251723B1 - 절삭 장치 - Google Patents
절삭 장치 Download PDFInfo
- Publication number
- KR102251723B1 KR102251723B1 KR1020170084142A KR20170084142A KR102251723B1 KR 102251723 B1 KR102251723 B1 KR 102251723B1 KR 1020170084142 A KR1020170084142 A KR 1020170084142A KR 20170084142 A KR20170084142 A KR 20170084142A KR 102251723 B1 KR102251723 B1 KR 102251723B1
- Authority
- KR
- South Korea
- Prior art keywords
- cutting
- load current
- current value
- nozzle
- cutting blade
- Prior art date
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 184
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 51
- 238000001816 cooling Methods 0.000 claims abstract description 34
- 238000001514 detection method Methods 0.000 claims abstract description 18
- 230000002159 abnormal effect Effects 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 230000005856 abnormality Effects 0.000 abstract description 6
- 238000003384 imaging method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/04—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs
- B28D1/044—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs the saw blade being movable on slide ways
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/04—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs
- B28D1/046—Sawing in a plane parallel to the work table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/005—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
- B26D1/46—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having an endless band-knife or the like
- B26D1/54—Guides for band-knives or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Dicing (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Laser Beam Processing (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
(해결 수단) 절삭 장치 (1) 는, 절삭 블레이드 (41) 에 절삭수를 공급하는 냉각 노즐 (46) 및 샤워 노즐 (47) 을 갖는 절삭 수단 (4) 과, 절삭 블레이드를 회전 구동시키는 모터 (44) 의 부하 전류치를 검출하는 부하 전류치 검출 수단 (48) 과, 절삭 수단 및 부하 전류치 검출 수단을 제어하는 제어 수단 (9) 을 구비하고 있다. 제어 수단은, 각 노즐이 적정한 위치에 위치 결정된 상태에서, 소정량의 절삭수를 공급하면서 소정 스핀들 회전 수로 절삭 블레이드를 회전시켰을 때의 모터의 부하 전류치에 기초하는 임의의 값을 임계치로서 미리 기억하는 기억부 (91) 와, 소정량의 절삭수를 공급하면서 소정 스핀들 회전 수로 절삭 블레이드를 회전시켰을 때에 검출한 부하 전류치와 기억부가 기억한 임계치의 비교 결과에 따라 정상 또는 이상을 판단하는 판단부 (92) 를 구비하고 있다.
Description
도 2 는, 본 실시형태의 절삭 수단의 정면도이다.
도 3 은, 본 실시형태에서의 디바이스 데이터의 일례를 나타내는 표이다.
도 4 는, 본 실시형태의 냉각 노즐 (도 4A) 및 샤워 노즐 (도 4B) 의 모식도이다.
도 5 는, 냉각 노즐로 절삭수를 공급하였을 때의 노즐 위치와 부하 전류치의 관계를 나타내는 그래프이다.
도 6 은, 샤워 노즐로 절삭수를 공급하였을 때의 노즐 위치와 부하 전류치의 관계를 나타내는 그래프이다.
4 : 절삭 수단
41 : 절삭 블레이드
42 : 스핀들
44 : 모터
46 : 냉각 노즐 (절삭수 공급 노즐)
47 : 샤워 노즐 (절삭수 공급 노즐)
48 : 부하 전류치 검출 수단
9 : 제어 수단
91 : 기억부
92 : 판단부
W : 피가공물
Claims (2)
- 회전 가능하게 지지된 스핀들과, 상기 스핀들을 회전 구동시키는 모터와, 상기 스핀들의 선단부에 장착된 절삭 블레이드와, 상기 절삭 블레이드에 절삭수를 공급하는 절삭수 공급 노즐을 포함하는 절삭 수단과,
상기 모터의 부하 전류치를 검출하는 부하 전류치 검출 수단과,
상기 절삭 수단 및 상기 부하 전류치 검출 수단을 제어하는 제어 수단을 구비하는, 피가공물을 절삭 가공하는 절삭 장치로서,
상기 절삭수 공급 노즐은, 상기 절삭 블레이드를 사이에 두고 위치하여 절삭수를 공급하는 냉각 노즐과, 상기 절삭 블레이드에 분사한 절삭수를 혼입시키는 샤워 노즐을 구비하고,
상기 제어 수단은,
상기 냉각 노즐이 적정한 위치에 위치 결정된 상태와, 상기 샤워 노즐이 적정한 위치에 위치 결정된 상태의 각각에서, 소정량의 절삭수를 공급하면서 소정 스핀들 회전 수로 절삭 블레이드를 회전시켰을 때의, 상기 부하 전류치 검출 수단으로 검출한 부하 전류치에 기초하는 임의의 값을 임계치로서 미리 기억하는 기억부와,
상기 냉각 노즐로부터 상기 소정량의 절삭수를 공급하면서 소정 스핀들 회전 수로 상기 절삭 블레이드를 회전시켰을 때의 상기 부하 전류치 검출 수단으로 검출한 부하 전류치와 상기 기억부가 기억한 상기 임계치의 비교 결과에 따라, 상기 냉각 노즐의 위치의 정상 또는 이상을 판단하고, 상기 샤워 노즐로부터 상기 소정량의 절삭수를 공급하면서 소정 스핀들 회전수로 상기 절삭 블레이드를 회전시켰을 때의 상기 부하 전류치 검출 수단으로 검출한 부하 전류치와 상기 기억부가 기억한 상기 임계치의 비교 결과에 따라, 상기 샤워 노즐의 위치의 정상 또는 이상을 판단하는 판단부를 구비하는, 절삭 장치. - 제 1 항에 있어서,
상기 기억부에는, 피가공물을 가공하는 디바이스 데이터마다 상기 임계치를 기억시키는, 절삭 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2016-138338 | 2016-07-13 | ||
JP2016138338A JP6815770B2 (ja) | 2016-07-13 | 2016-07-13 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20180007671A KR20180007671A (ko) | 2018-01-23 |
KR102251723B1 true KR102251723B1 (ko) | 2021-05-12 |
Family
ID=60942443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020170084142A KR102251723B1 (ko) | 2016-07-13 | 2017-07-03 | 절삭 장치 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10328606B2 (ko) |
JP (1) | JP6815770B2 (ko) |
KR (1) | KR102251723B1 (ko) |
CN (1) | CN107618118B (ko) |
MY (1) | MY183734A (ko) |
SG (1) | SG10201705191RA (ko) |
TW (1) | TWI739849B (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7001493B2 (ja) * | 2018-02-26 | 2022-01-19 | 株式会社ディスコ | 撮像画像形成ユニット |
CN108415366B (zh) * | 2018-03-05 | 2021-01-29 | 高邑县云发专用机床厂 | 基于伺服技术的切削深度反馈方法及智能切削方法及系统 |
JP7072986B2 (ja) * | 2018-05-29 | 2022-05-23 | 株式会社ディスコ | ウォータージェット加工装置 |
JP7206065B2 (ja) * | 2018-07-26 | 2023-01-17 | 株式会社ディスコ | 切削装置 |
JP7098239B2 (ja) * | 2018-08-13 | 2022-07-11 | 株式会社ディスコ | ノズル高さ検査方法及び切削装置 |
LU101065B1 (en) * | 2018-12-21 | 2020-06-24 | Univ Luxembourg | Machining system and monitoring method |
CN110281409B (zh) * | 2019-06-13 | 2021-06-11 | 菏泽城建工程发展集团有限公司 | 一种切割cf墙板用自动降尘装置 |
JP7461132B2 (ja) * | 2019-11-27 | 2024-04-03 | 株式会社ディスコ | 切削装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006100539A (ja) * | 2004-09-29 | 2006-04-13 | Toshiba Corp | 加工装置及び加工方法 |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6043114B2 (ja) * | 1982-12-24 | 1985-09-26 | 日本たばこ産業株式会社 | 裁断装置 |
JP3792266B2 (ja) * | 1994-06-16 | 2006-07-05 | 森精機興産株式会社 | 工作機械の熱変位補正方法及びその装置 |
JP3071107B2 (ja) * | 1994-09-28 | 2000-07-31 | 株式会社日平トヤマ | ワイヤソーにおけるワイヤ洗浄装置 |
JPH10202496A (ja) * | 1997-01-13 | 1998-08-04 | Mitsubishi Materials Corp | ワイヤ式切断装置 |
JP2000176836A (ja) * | 1998-12-17 | 2000-06-27 | Mitsubishi Material Kenzai Corp | 研磨方法及び装置 |
JP4215228B2 (ja) * | 1999-10-26 | 2009-01-28 | 独立行政法人理化学研究所 | 卓上4軸鏡面加工装置 |
JP2001259961A (ja) * | 2000-03-15 | 2001-09-25 | Disco Abrasive Syst Ltd | 加工装置 |
JP3763734B2 (ja) * | 2000-10-27 | 2006-04-05 | 株式会社日立製作所 | パネル部材の加工方法 |
DE10349088A1 (de) * | 2002-10-22 | 2004-09-09 | Hitachi Koki Co., Ltd. | Elektrische Handschneidvorrichtung mit Gebläsemechanismus |
JP4506126B2 (ja) * | 2003-08-27 | 2010-07-21 | 株式会社ジェイテクト | 研削装置 |
JP4694210B2 (ja) | 2005-01-07 | 2011-06-08 | 株式会社ディスコ | ブレードカバー装置 |
US7771249B2 (en) * | 2007-03-30 | 2010-08-10 | Park Industries, Inc. | Corner saw |
JP2009285769A (ja) * | 2008-05-28 | 2009-12-10 | Disco Abrasive Syst Ltd | 切削装置 |
JP2010228048A (ja) * | 2009-03-27 | 2010-10-14 | Disco Abrasive Syst Ltd | 切削装置 |
JP2011040511A (ja) * | 2009-08-10 | 2011-02-24 | Disco Abrasive Syst Ltd | ウエーハの研削方法 |
JP2011189411A (ja) * | 2010-03-11 | 2011-09-29 | Renesas Electronics Corp | ウェハ研削装置、ウェハ研削方法、ウェハ研削プログラム、及び、ウェハ研削制御装置 |
KR101297306B1 (ko) * | 2011-06-10 | 2013-08-14 | 손원호 | 물통이 구비된 탁상용 그라인더 |
JP5947605B2 (ja) * | 2012-04-17 | 2016-07-06 | 株式会社ディスコ | ノズル調整治具 |
KR102003997B1 (ko) * | 2012-11-22 | 2019-07-30 | 두산공작기계 주식회사 | 공작기계의 절삭유 분사 제어장치 및 제어방법 |
JP2014108463A (ja) * | 2012-11-30 | 2014-06-12 | Disco Abrasive Syst Ltd | 切削装置 |
JP2014108471A (ja) * | 2012-11-30 | 2014-06-12 | Takada Corp | 超音波振動切断機 |
CN103072084B (zh) * | 2013-02-04 | 2015-09-09 | 青岛理工大学 | 纳米流体静电雾化可控射流微量润滑磨削系统 |
CN103147756B (zh) * | 2013-03-20 | 2017-03-29 | 中国矿业大学(北京) | 一种掘进机记忆截割控制系统及其方法 |
CN203579423U (zh) * | 2013-12-02 | 2014-05-07 | 青岛理工大学 | 磁增强电场下纳米粒子射流可控输运微量润滑磨削装备 |
JP2015138950A (ja) * | 2014-01-24 | 2015-07-30 | 株式会社ディスコ | 切削装置 |
JP6223239B2 (ja) * | 2014-03-07 | 2017-11-01 | 株式会社ディスコ | 切削装置 |
JP6302732B2 (ja) * | 2014-04-22 | 2018-03-28 | 株式会社ディスコ | 切削方法 |
EP2960012A1 (de) * | 2014-06-25 | 2015-12-30 | HILTI Aktiengesellschaft | Automatische Regelung von Aggregaten einer Wasserversorgungsanlage |
US20160311127A1 (en) * | 2015-04-24 | 2016-10-27 | Disco Corporation | Cutting apparatus and cutting method |
JP6695102B2 (ja) * | 2015-05-26 | 2020-05-20 | 株式会社ディスコ | 加工システム |
CN105666254B (zh) * | 2016-03-15 | 2017-12-01 | 河南理工大学 | 一种可控化的多维超声elid复合内圆磨削试验装置 |
-
2016
- 2016-07-13 JP JP2016138338A patent/JP6815770B2/ja active Active
-
2017
- 2017-06-09 TW TW106119305A patent/TWI739849B/zh active
- 2017-06-22 MY MYPI2017702337A patent/MY183734A/en unknown
- 2017-06-22 SG SG10201705191RA patent/SG10201705191RA/en unknown
- 2017-07-03 KR KR1020170084142A patent/KR102251723B1/ko active IP Right Grant
- 2017-07-11 CN CN201710560879.9A patent/CN107618118B/zh active Active
- 2017-07-12 US US15/647,938 patent/US10328606B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006100539A (ja) * | 2004-09-29 | 2006-04-13 | Toshiba Corp | 加工装置及び加工方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI739849B (zh) | 2021-09-21 |
MY183734A (en) | 2021-03-10 |
CN107618118B (zh) | 2021-03-26 |
US20180015638A1 (en) | 2018-01-18 |
US10328606B2 (en) | 2019-06-25 |
KR20180007671A (ko) | 2018-01-23 |
CN107618118A (zh) | 2018-01-23 |
TW201808522A (zh) | 2018-03-16 |
JP2018010952A (ja) | 2018-01-18 |
SG10201705191RA (en) | 2018-02-27 |
JP6815770B2 (ja) | 2021-01-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102251723B1 (ko) | 절삭 장치 | |
US11171056B2 (en) | Wafer processing method | |
JP6441056B2 (ja) | 研削装置 | |
JP2018062052A (ja) | 切削方法及び切削装置 | |
JP5762005B2 (ja) | 加工位置調製方法及び加工装置 | |
CN108527678B (zh) | 被加工物的切削方法 | |
JP2019115961A (ja) | 切削装置 | |
JP2015093341A (ja) | ドレッサーボード及びドレス方法 | |
JP4966069B2 (ja) | 加工装置 | |
JP2015138950A (ja) | 切削装置 | |
KR102551970B1 (ko) | 절삭 장치의 셋업 방법 | |
JP6205231B2 (ja) | 切削装置 | |
TWI793147B (zh) | 加工方法 | |
JP6774263B2 (ja) | 切削装置 | |
JP5947026B2 (ja) | 切削装置 | |
JP6791552B2 (ja) | 切削装置 | |
JP2019046923A (ja) | ウエーハの加工方法 | |
JP6808292B2 (ja) | 加工装置の診断方法 | |
JP6811951B2 (ja) | 搬送機構 | |
JP6830731B2 (ja) | 切削装置 | |
JP6537423B2 (ja) | 切削ブレードの屈折検出方法 | |
JP2024043556A (ja) | 切削方法 | |
JP2021041474A (ja) | 切削装置 | |
JP2020098817A (ja) | 切削水ノズルの状態確認方法及び基準ブロック | |
CN116475863A (zh) | 磨削装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20170703 |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20190702 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20170703 Comment text: Patent Application |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20200826 Patent event code: PE09021S01D |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20201214 Patent event code: PE09021S01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20210305 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20210507 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20210507 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20240408 Start annual number: 4 End annual number: 4 |