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SG10201705191RA - Cutting apparatus - Google Patents

Cutting apparatus

Info

Publication number
SG10201705191RA
SG10201705191RA SG10201705191RA SG10201705191RA SG10201705191RA SG 10201705191R A SG10201705191R A SG 10201705191RA SG 10201705191R A SG10201705191R A SG 10201705191RA SG 10201705191R A SG10201705191R A SG 10201705191RA SG 10201705191R A SG10201705191R A SG 10201705191RA
Authority
SG
Singapore
Prior art keywords
cutting apparatus
cutting
Prior art date
Application number
SG10201705191RA
Inventor
Uchida Fumio
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of SG10201705191RA publication Critical patent/SG10201705191RA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/04Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs
    • B28D1/044Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs the saw blade being movable on slide ways
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/04Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs
    • B28D1/046Sawing in a plane parallel to the work table
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064Devices for the automatic drive or the program control of the machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/005Devices for the automatic drive or the program control of the machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/46Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having an endless band-knife or the like
    • B26D1/54Guides for band-knives or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Laser Beam Processing (AREA)
SG10201705191RA 2016-07-13 2017-06-22 Cutting apparatus SG10201705191RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016138338A JP6815770B2 (en) 2016-07-13 2016-07-13 Cutting equipment

Publications (1)

Publication Number Publication Date
SG10201705191RA true SG10201705191RA (en) 2018-02-27

Family

ID=60942443

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201705191RA SG10201705191RA (en) 2016-07-13 2017-06-22 Cutting apparatus

Country Status (7)

Country Link
US (1) US10328606B2 (en)
JP (1) JP6815770B2 (en)
KR (1) KR102251723B1 (en)
CN (1) CN107618118B (en)
MY (1) MY183734A (en)
SG (1) SG10201705191RA (en)
TW (1) TWI739849B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7001493B2 (en) * 2018-02-26 2022-01-19 株式会社ディスコ Captured image formation unit
CN108415366B (en) * 2018-03-05 2021-01-29 高邑县云发专用机床厂 Cutting depth feedback method based on servo technology and intelligent cutting method and system
JP7072986B2 (en) * 2018-05-29 2022-05-23 株式会社ディスコ Water jet processing equipment
JP7206065B2 (en) * 2018-07-26 2023-01-17 株式会社ディスコ cutting equipment
JP7098239B2 (en) * 2018-08-13 2022-07-11 株式会社ディスコ Nozzle height inspection method and cutting equipment
LU101065B1 (en) * 2018-12-21 2020-06-24 Univ Luxembourg Machining system and monitoring method
CN110281409B (en) * 2019-06-13 2021-06-11 菏泽城建工程发展集团有限公司 Automatic dust device for cutting CF wallboard
JP7461132B2 (en) * 2019-11-27 2024-04-03 株式会社ディスコ Cutting Equipment

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6043114B2 (en) * 1982-12-24 1985-09-26 日本たばこ産業株式会社 cutting device
JP3792266B2 (en) * 1994-06-16 2006-07-05 森精機興産株式会社 Method and apparatus for correcting thermal displacement of machine tool
JP3071107B2 (en) * 1994-09-28 2000-07-31 株式会社日平トヤマ Wire cleaning equipment for wire saws
JPH10202496A (en) * 1997-01-13 1998-08-04 Mitsubishi Materials Corp Wire type cutting device
JP2000176836A (en) * 1998-12-17 2000-06-27 Mitsubishi Material Kenzai Corp Polishing method and device
JP4215228B2 (en) * 1999-10-26 2009-01-28 独立行政法人理化学研究所 Desktop 4-axis mirror finishing machine
JP2001259961A (en) * 2000-03-15 2001-09-25 Disco Abrasive Syst Ltd Processing device
JP3763734B2 (en) * 2000-10-27 2006-04-05 株式会社日立製作所 Panel member processing method
TWI256334B (en) * 2002-10-22 2006-06-11 Hitachi Koki Kk Portable electric cutting device with blower mechanism
JP4506126B2 (en) * 2003-08-27 2010-07-21 株式会社ジェイテクト Grinding equipment
JP4192135B2 (en) * 2004-09-29 2008-12-03 株式会社東芝 Processing apparatus and processing method
JP4694210B2 (en) 2005-01-07 2011-06-08 株式会社ディスコ Blade cover device
US7771249B2 (en) * 2007-03-30 2010-08-10 Park Industries, Inc. Corner saw
JP2009285769A (en) * 2008-05-28 2009-12-10 Disco Abrasive Syst Ltd Cutting device
JP2010228048A (en) * 2009-03-27 2010-10-14 Disco Abrasive Syst Ltd Cutting device
JP2011040511A (en) * 2009-08-10 2011-02-24 Disco Abrasive Syst Ltd Method of grinding wafer
JP2011189411A (en) * 2010-03-11 2011-09-29 Renesas Electronics Corp Wafer grinding device, wafer grinding method, wafer grinding program and wafer grinding control device
KR101297306B1 (en) * 2011-06-10 2013-08-14 손원호 Bench Grinder with Water Container
JP5947605B2 (en) * 2012-04-17 2016-07-06 株式会社ディスコ Nozzle adjustment jig
KR102003997B1 (en) * 2012-11-22 2019-07-30 두산공작기계 주식회사 Apparatus for controlling cutting oil injection of machine tool and method thereof
JP2014108471A (en) * 2012-11-30 2014-06-12 Takada Corp Ultrasonic vibration cutter
JP2014108463A (en) * 2012-11-30 2014-06-12 Disco Abrasive Syst Ltd Cutting device
CN103072084B (en) * 2013-02-04 2015-09-09 青岛理工大学 Nano-fluid electrostatic atomization controllable jet flow trace lubrication grinding system
CN103147756B (en) * 2013-03-20 2017-03-29 中国矿业大学(北京) A kind of heading machine memory cutting control system and method thereof
CN203579423U (en) * 2013-12-02 2014-05-07 青岛理工大学 Nano particle jet flow controllable transportation trace lubrication grinding equipment in magnetic enhanced electric field
JP2015138950A (en) * 2014-01-24 2015-07-30 株式会社ディスコ Cutting device
JP6223239B2 (en) * 2014-03-07 2017-11-01 株式会社ディスコ Cutting equipment
JP6302732B2 (en) * 2014-04-22 2018-03-28 株式会社ディスコ Cutting method
EP2960012A1 (en) * 2014-06-25 2015-12-30 HILTI Aktiengesellschaft Automatic adjustment of units in a water supply installation
US20160311127A1 (en) * 2015-04-24 2016-10-27 Disco Corporation Cutting apparatus and cutting method
JP6695102B2 (en) * 2015-05-26 2020-05-20 株式会社ディスコ Processing system
CN105666254B (en) * 2016-03-15 2017-12-01 河南理工大学 A kind of multi-dimensional ultrasound ELID compound internal grinding experimental rigs of controllableization

Also Published As

Publication number Publication date
JP6815770B2 (en) 2021-01-20
US10328606B2 (en) 2019-06-25
TW201808522A (en) 2018-03-16
CN107618118A (en) 2018-01-23
KR20180007671A (en) 2018-01-23
US20180015638A1 (en) 2018-01-18
JP2018010952A (en) 2018-01-18
TWI739849B (en) 2021-09-21
MY183734A (en) 2021-03-10
KR102251723B1 (en) 2021-05-12
CN107618118B (en) 2021-03-26

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